CN110183837A - High-modulus low-k basalt fibre enhances PC material and preparation method thereof - Google Patents
High-modulus low-k basalt fibre enhances PC material and preparation method thereof Download PDFInfo
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- CN110183837A CN110183837A CN201910536963.6A CN201910536963A CN110183837A CN 110183837 A CN110183837 A CN 110183837A CN 201910536963 A CN201910536963 A CN 201910536963A CN 110183837 A CN110183837 A CN 110183837A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/04—Homopolymers or copolymers of ethene
- C08J2423/08—Copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2435/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
- C08J2435/06—Copolymers with vinyl aromatic monomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2451/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2451/04—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
- C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Abstract
The present invention relates to technical field of polymer materials, a kind of high-modulus low-k basalt fibre enhancing PC material and preparation method thereof is specifically disclosed.It includes polycarbonate 800-900 parts by weight that the high-modulus low-k basalt fibre, which enhances PC material, basalt fibre 50-100 parts by weight, compatilizer 5-10 parts by weight, toughener 40-45 parts by weight, coupling agent 1-2 parts by weight, 2-4 parts of antioxidant and lubricant 5-10 parts by weight.The present invention keeps the mechanical property of product by using toughener, compatilizer, simultaneously by using coupling agent, increase the binding force of PC and basalt fibre, solve the problems, such as the compatible of PC and basalt fibre, co-mixing system is set to keep good comprehensive performance, by adjusting the content of basalt fibre, low-k index is realized.
Description
Technical field
The present invention relates to technical field of polymer materials, are specifically related to a kind of high-modulus low-k basalt fibre
Enhance PC material and preparation method thereof.
Background technique
With the raising of ULSI device integration, resistance and the insulating medium layer electricity of nanoscale devices interior metal line
Appearance, which is formed by delay, crosstalk, power consumption caused by capacitance-resistance, just becomes the principal element of limit device performance, and microelectronic component is decent
It goes through the major transformation of a material: replacing the silica generallyd use to make dielectric layer with advanced low-k materials.These are low
Dielectric constant material must have following property: in terms of electrical property, there is low-loss and low current leakage；In mechanical performance side
Face will have high-intensitive and high tenacity；In terms of chemical property, there is corrosion-resistant and low water absorbable；In terms of hot property, Yao Yougao
Stability and low-shrinkage.
Polycarbonate (hereinafter referred to as PC) is a kind of amorphous polymer of almost colourless glassy state, has good light
The property learned, electrical insulation capability, molecular weight is higher, and impact resistance is good, and tool is high-intensitive and coefficient of elasticity, processing performance are good, does not need
Additive just has UL94V-2 grades of flame retardant properties, and shaping shrinkage rate is low, dimensional stability is good, and it is some right to be adapted to manufacture
The more demanding product of size, use temperature range is wide, is widely used in the neck such as Automobile Transportation, electric and machine-building
Domain.
Basalt fibre is a kind of emerging novel inorganic environment-friendly and green high performance fibre material, it is by titanium dioxide
The basalt building stones of the oxides such as silicon, aluminium oxide, calcium oxide, iron oxide and titanium dioxide composition pass through spinning after high-temperature fusion
What technique was prepared.Not only stability is good for basalt fibre, also has electrical insulating property, anticorrosive, flame resistant, high temperature resistant etc. more
Kind excellent properties.Basalt fibre high-low temperature resistant, mechanics, electricity, acoustical behavior and in terms of all have compared with
Big advantage, it is the new product of high-tech content and high added value that substitution potentiality are big.
In PC and basalt fiber composite material, since basalt surface is smooth, surface-active site is few, the Black Warrior is caused
Rock fiber and PC poor compatibility weaken the modification humidification of PC, poor toughness, make answering for PC and basalt fiber composite material
It is significantly limited with field.It is disclosed patent CN201510732770.X and mentions a kind of basalt fibre enhancing PC/ABS composite wood
Material and preparation method thereof, the production method are one-pass molding, can reduce material water absorption rate, creep properties, molding shrinkage, but press
The strength and toughness of the material of method preparation and dielectric strength properties are undesirable like this, and dielectric constant is up to 3.7-3.9.Therefore it opens
Sending out one kind has low-k, while the basalt fibre enhancing PC material with good mechanical performance is necessary again.
Summary of the invention
The purpose of the invention is to overcome the shortcomings of above-mentioned background technique, provide it is a kind of have very good mechanical properties and
The basalt fibre of low-k enhances PC material, which passes through the selection and compounding of toughener, compatilizer, and addition is even
Connection agent solves the basalt enhancing PC material that PC resin is combined with the basalt fibre of modification and made.
To achieve the object of the present invention, high-modulus low-k basalt fibre of the invention enhancing PC material includes poly-
Carbonic ether (PC resin) 800-900 parts by weight, basalt fibre 50-100 parts by weight, compatilizer 5-10 parts by weight, toughener 40-
45 parts by weight, coupling agent 1-2 parts by weight, 2-4 parts of antioxidant and lubricant 5-10 parts by weight.
In the present invention, the PC resin is that melt flow rate (MFR) is resin between 15-20g/10min, preferably melt flow
The PC resin that dynamic rate is 20g/10min.
In the present invention, the basalt fibre is the yarn fiber that is chopped, and preferably polycarbonate-based polyaminoester emulsion is processed
Fiber.
In the present invention, the toughener, compatilizer are selected from Methyl Methacrylate-Butadiene-Styrene Copolymer, second
Alkene-methyl acrylate-glycidyl methacrylate copolymer, styrene-acrylonitrile-maleic anhydride random copolymer.
In the present invention, the coupling agent is gamma-aminopropyl-triethoxy-silane, γ-glycidyl propane trimethoxy
One of silane.
In the present invention, the antioxidant is bis- (2,4-DTBP) pentaerythritol diphosphites, pentaerythrite
Class 12 is thio and four [β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol esters in two kinds.
In the present invention, the lubricant is that dipentaerythritol stearate, oxidized polyethylene wax and hard component saponification are covered
One of denier ester type waxes；It is preferred that one of denier ester type waxes and pentaerythritol stearate are covered in hard component saponification.
To achieve the object of the present invention, the present invention also provides a kind of high-modulus low-k basalt to enhance PC
The preparation method of material, this method comprises the following steps:
(1) PC resin is put into drying box and carries out drying and processing；
(2) by formulation weight than weighed PC resin, basalt fibre, coupling agent, toughener, compatilizer, antioxidant and
Lubricant；
(3) PC resin, coupling agent, toughener, compatilizer, antioxidant and lubricant are added to high-speed mixer, mixed
20-30 seconds；
(4) raw material mixed through step (3) is added in double screw extruder, basalt fibre is passed through into side feed material
Double screw extruder is fed, 250 DEG C of -280 DEG C of melting extrusions carry out pelletizing after cooling and high-modulus low-k basalt is made
Enhance PC material.
Preferably, in the present invention, drying and processing in the step (1), process conditions are as follows: 115-125 DEG C of temperature, time 4-
8h。
Basalt fibre enhancing PC material combines the low-k feature of basalt fibre in the present invention, and has both
The toughness and dimensional stability of PC.But since basalt surface is smooth, surface-active site is few, cause basalt fibre and PC phase
Capacitive is poor, weakens to the modification humidification of PC, poor toughness, keeps the application field of material significantly limited.The present invention by using
Toughener, compatilizer keep the mechanical property of product, while by using coupling agent, increasing the combination of PC and basalt fibre
Power solves the problems, such as the compatible of PC and basalt fibre, so that co-mixing system is kept good comprehensive performance, by adjusting basalt
The content of fiber realizes low-k index.
Compared with the existing technology, advantages of the present invention and effect are as follows:
1, high-modulus low-k basalt fibre enhancing PC material prepared by the present invention has the spy of low-k
Point.
2, high-modulus low-k basalt fibre prepared by the present invention enhances the accessible bending strength of PC material
130.3MPa, bending modulus 4323MPa, Notched Charpy impact intensity 19.3kJ/m2, dielectric constant 2.9；Any surface finish simultaneously
It spends, appearance is soft, and comprehensive performance is better than the common glass fiber reinforced PC material of the prior art.
3, it is multiple to have widened basalt fibre enhancing PC particularly suitable for mobile phone onboard motherboard product for composite material of the present invention
The application field of condensation material.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.Additional aspect and advantage of the invention will be set forth in part in the description, partially will be under
Become obvious in the description in face, or practice through the invention is recognized.It is only used to explain this hair it should be appreciated that being described below
It is bright, it is not intended to limit the present invention.
Term "comprising" used herein, " comprising ", " having ", " containing " or its any other deformation, it is intended that covering
Non-exclusionism includes.For example, composition, step, method, product or device comprising listed elements are not necessarily limited to those and want
Element, but may include not expressly listed other elements or such composition, step, method, product or device it is intrinsic
Element.
Equivalent, concentration or other values or parameter are excellent with range, preferred scope or a series of upper limit preferred values and lower limit
When the Range Representation that choosing value limits, this should be understood as specifically disclosing by any range limit or preferred value and any range
Any pairing of lower limit or preferred value is formed by all ranges, regardless of whether the range separately discloses.For example, when open
When range " 1 to 5 ", described range should be interpreted as including range " 1 to 4 ", " 1 to 3 ", " 1 to 2 ", " 1 to 2 and 4 to
5 ", " 1 to 3 and 5 " etc..When numberical range is described herein, unless otherwise stated, otherwise the range is intended to include its end
Value and all integers and score in the range.
Indefinite article "an" before element or component of the present invention (goes out the quantitative requirement of element or component with "one"
Occurrence number) unrestriction.Therefore "one" or "an" should be read as including one or at least one, and singular
Element or component also include plural form, unless the quantity obviously only refers to singular.
Moreover, technical characteristic involved in each embodiment of the present invention as long as they do not conflict with each other can
To be combined with each other.
High-modulus low-k basalt of the present invention enhancing PC material required with some strength, toughness reguirements
And it is applied in the electronic apparatus component of low-k requirement.The high-modulus low-k basalt enhances PC material
Mechanical property, low-k method of evaluating performance it is as follows: a, basalt enhancing PC material in 120 DEG C of air dry ovens do
Injection molding prepares iso standard Mechanics Performance Testing batten after 4-8 hours dry；B, basalt enhances PC material in 120 DEG C of forced air dryings
Injection molding prepares 60mm × 60mm × 1mm template, testing standard IEC60243 after drying 4-8 hours in case.
Unless otherwise noted, raw material used by the following embodiments of the present invention are as described in summary of the invention of the present invention, if having
Preferred material, in the case where being not particularly illustrated, following embodiments use preferred material, and producer and the trade mark are specific as follows:
Embodiment 1-4
High-modulus low-k basalt fibre, which is made, using material and method of the invention enhances PC material, preparation side
Steps are as follows for method:
1) PC resin is put into drying box and carries out drying and processing, process conditions are as follows: 120 DEG C of temperature, time 4-8h；
2) by formulation weight than having weighed PC resin, basalt fibre, coupling agent, toughener, compatilizer, antioxidant and profit
Lubrication prescription；
3) PC resin, coupling agent, toughener, compatilizer, antioxidant and lubricant are added to high-speed mixer, mixed
20-30 seconds；
4) raw material mixed is added in double screw extruder, basalt fibre selects side feed material feeding twin-screw to squeeze
Machine out, 250 DEG C of -280 DEG C of melting extrusions carry out pelletizing and high-modulus low-k basalt enhancing PC material are made after cooling.
Extruder processing temperature is set as 230 DEG C of area's temperature, two 260 DEG C of area's temperature, three 255 DEG C of area's temperature, four Qu Wen
255 DEG C of degree, five 250 DEG C of area's temperature, six 250 DEG C of area's temperature, seven 250 DEG C of area's temperature, eight 250 DEG C of area's temperature, die head temperature 260
℃。
The additional amount of each ingredient of embodiment 1- embodiment 4 is as shown in table 1.
1 embodiment 1- embodiment of table, 4 specific formula (unit: Kg)
Injection molding preparation test bars after obtained material is 4-8 hours dry in 120 DEG C of air dry ovens.
Comparative example 1
Using existing glass fiber reinforcement PC material on the market, infused after 4-8 hours dry in 120 DEG C of air dry ovens
Modeling preparation test bars.
The results are shown in Table 2 for embodiment 1- embodiment 4 and the obtained composite material test of comparative example 1.
2 1~embodiment of embodiment 4 of table and the obtained composite material test result of comparative example 1
In above-mentioned test: tensile strength is according to 527 standard testing of ISO；Bending modulus, bending strength are marked according to ISO 178
Quasi- test；Notched Charpy impact intensity is according to 179 standard testing of ISO；Dielectric constant test is surveyed according to IEC20643 standard
Examination.
The bending strength 130.3MPa of embodiment 4 (basalt of high-modulus low-k enhances PC), bending modulus
4323MPa, Notched Charpy impact intensity 19.3kJ/m2, dielectric constant 2.9.Surface smoothness is good simultaneously, and comprehensive performance is obvious
Better than the simple glass fiber-reinforced PC material of the prior art (comparative example 1).
It is concluded that from the test data of embodiment and comparative example
1. greatly promoting the intensity of product by the basalt fibre substitution glass fibre for adding modification of the present invention
And modulus, while reducing the dielectric constant of material；
2. passing through addition styrene-acrylonitrile-maleic anhydride random copolymer and methyl methacrylate-butadiene-benzene
Ethylene copolymer greatly promotes the mechanical property of material；
3. it is fine can obviously to optimize macromolecule and basalt in composite material by addition gamma-aminopropyl-triethoxy-silane
The compatibility of dimension significantly improves the mechanical performance of material；
4, the PC of middle-molecular-weihydroxyethyl is used in combination to improve the mobility of material, to guarantee product mechanical property realizing
Meanwhile improving the appearance and machine-shaping property of material.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of high-modulus low-k basalt fibre enhances PC material, which is characterized in that the low dielectric of the high-modulus is normal
Number basalt fibre enhancing PC material includes PC resin 800-900 parts by weight, basalt fibre 50-100 parts by weight, compatilizer 5-
10 parts by weight, toughener 40-45 parts by weight, coupling agent 1-2 parts by weight, 2-4 parts of antioxidant and lubricant 5-10 parts by weight.
2. high-modulus low-k basalt fibre according to claim 1 enhances PC material, which is characterized in that described
PC resin is that melt flow rate (MFR) is resin between 15-20g/10min.
3. high-modulus low-k basalt fibre according to claim 2 enhances PC material, which is characterized in that described
PC resin is the PC resin that melt flow rate (MFR) is 20g/10min.
4. high-modulus low-k basalt fibre according to claim 1 enhances PC material, which is characterized in that described
Basalt fibre is the yarn fiber that is chopped.
5. high-modulus low-k basalt fibre according to claim 4 enhances PC material, which is characterized in that described
Basalt fibre is the processed fiber of polycarbonate-based polyaminoester emulsion.
6. high-modulus low-k basalt fibre according to claim 1 enhances PC material, which is characterized in that described
Toughener, compatilizer are selected from Methyl Methacrylate-Butadiene-Styrene Copolymer, ethylene-methyl acrylate-metering system
Acid glycidyl ester copolymer, styrene-acrylonitrile-maleic anhydride random copolymer.
7. high-modulus low-k basalt fibre according to claim 1 enhances PC material, which is characterized in that described
Coupling agent is one of gamma-aminopropyl-triethoxy-silane, γ-glycidyl propane trimethoxy silane.
8. high-modulus low-k basalt fibre according to claim 1 enhances PC material, which is characterized in that described
Antioxidant is bis- (2,4- DI-tert-butylphenol compounds) pentaerythritol diphosphites, Pentaerythritols 12 are thio and four [β-(3,5-
Di-tert-butyl-hydroxy phenyl) propionic acid] two kinds in pentaerythritol ester；Preferably, the lubricant is that dipentaerythritol is stearic
One of denier ester type waxes is covered in acid esters, oxidized polyethylene wax and hard component saponification；It is preferred that denier ester type waxes and season are covered in hard component saponification
One of penta tetrol stearate.
9. the preparation method of the described in any item high-modulus low-k basalt fibre enhancing PC materials of claim 1-8,
This method comprises the following steps:
(1) PC resin is put into drying box and carries out drying and processing；
(2) by formulation weight than having weighed PC resin, basalt fibre, coupling agent, toughener, compatilizer, antioxidant and lubrication
Agent；
(3) PC resin, coupling agent, toughener, compatilizer, antioxidant and lubricant are added to high-speed mixer, mix 20-30
Second；
(4) raw material mixed through step (3) is added in double screw extruder, basalt fibre is fed by side feed material
Double screw extruder, 250 DEG C of -280 DEG C of melting extrusions carry out pelletizing and the enhancing of high-modulus low-k basalt are made after cooling
PC material.
10. the preparation method of high-modulus low-k basalt fibre enhancing PC material according to claim 9, special
Sign is, the process conditions of drying and processing in the step (1) are as follows: 115-125 DEG C of temperature, time 4-8h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536963.6A CN110183837A (en) | 2019-06-20 | 2019-06-20 | High-modulus low-k basalt fibre enhances PC material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536963.6A CN110183837A (en) | 2019-06-20 | 2019-06-20 | High-modulus low-k basalt fibre enhances PC material and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110183837A true CN110183837A (en) | 2019-08-30 |
Family
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| CN201910536963.6A Pending CN110183837A (en) | 2019-06-20 | 2019-06-20 | High-modulus low-k basalt fibre enhances PC material and preparation method thereof |
Country Status (1)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105385136A (en) * | 2015-11-03 | 2016-03-09 | 浙江理工大学 | Basalt fiber reinforced halogen-free flame-retardant polycarbonate composite and preparation method thereof |
| CN106366611A (en) * | 2016-09-14 | 2017-02-01 | 四川力久云智知识产权运营有限公司 | Special impregnating agent for polycarbonate material reinforced basalt fibers and preparation method of impregnating agent |
-
2019
- 2019-06-20 CN CN201910536963.6A patent/CN110183837A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105385136A (en) * | 2015-11-03 | 2016-03-09 | 浙江理工大学 | Basalt fiber reinforced halogen-free flame-retardant polycarbonate composite and preparation method thereof |
| CN106366611A (en) * | 2016-09-14 | 2017-02-01 | 四川力久云智知识产权运营有限公司 | Special impregnating agent for polycarbonate material reinforced basalt fibers and preparation method of impregnating agent |
Non-Patent Citations (1)
| Title |
|---|
| 姚勇等: ""玄武岩纤维及其复合材料的微波介电性能"", 《玻璃钢/复合材料》 * |
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Application publication date: 20190830 |