CN110181735A - A kind of polyimide resin moulding process - Google Patents
A kind of polyimide resin moulding process Download PDFInfo
- Publication number
- CN110181735A CN110181735A CN201910350653.5A CN201910350653A CN110181735A CN 110181735 A CN110181735 A CN 110181735A CN 201910350653 A CN201910350653 A CN 201910350653A CN 110181735 A CN110181735 A CN 110181735A
- Authority
- CN
- China
- Prior art keywords
- polyimide resin
- moulding process
- mold
- heating
- resin moulding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of polyimide resin moulding process, characterized in that the following steps are included: coating one layer of release agent after mold is preheated, polyimide powder is added in mold, binder, pressurization；Mold after pressurization is continued into heating heating, heat-insulation pressure keeping；After die venting, after warm solidification, demoulding obtains molding polyimide resin.The moulding process of polyimides of the invention is simple, the hot property and good mechanical performance of obtained polyimides；Release agent is added before polyimides is added, so that the destruction of resin will not be caused because of the problems such as bonding when taking out polyimide resin；It by the way of heat-insulation pressure keeping, flows polyimides first under certain temperature and pressure and forms afterwards, be conducive to obtain flat and smooth polyimide resin.
Description
Technical field
The present invention relates to a kind of polyimide resin moulding process, belong to polymer material molding technical field.
Background technique
Polyimides refers to a kind of high-molecular compound in molecular backbone containing imide.In recent years polyimides with
Its excellent mechanical performance, electrical property, radiation resistance and heat resistance are increasingly valued by people, it navigates in aviation
It, electrical, communication and automobile and other industries are widely used.However many polyimide materials are insoluble, do not melt, and are processed into
Type is difficult, limits its scope of application, therefore synthesizes the polyimides of easy processing, further prepares composite polyimide material,
Expand the main trend that application surface is current polyimides research and development.
Existing polyimides complex forming technology, obtained molding polyimides are poor in hot property and mechanical performance
It is different larger, it is therefore, a kind of to be very important guaranteeing polyimides hot property and moulding process on the basis of mechanical performance.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of existing technologies, a kind of polyimide resin molding is provided
Technique, obtained polyimides hot property and good mechanical performance.
Above-mentioned technical purpose of the invention has the technical scheme that
A kind of polyimide resin moulding process, comprising the following steps:
(1) after preheating mold, one layer of release agent is coated, polyimide powder is added in mold, binder, pressurization；
(2) mold after pressurization is continued into heating heating, heat-insulation pressure keeping；
(3) by after die venting, after warm solidification, demoulding obtains molding polyimide resin.
Preferably, the mold preheating temperature is 50 ~ 60 DEG C.
Preferably, the release agent is methyl-silicone oil or polyethylene.
Preferably, the heating mode is temperature programming or gradient increased temperature.
Preferably, described program heating is that 5 DEG C/min is warming up to 200 ~ 220 DEG C.
Preferably, the gradient increased temperature is to use heating frequency for 2 DEG C/min, is warming up to 150 ~ 170 DEG C, continues heating and adopts
It is 4 DEG C/min with heating frequency, is warming up to 200 ~ 220 DEG C.
Preferably, the holding temperature is 200 ~ 220 DEG C, and the dwell pressure is 5 ~ 10MPa.
Preferably, the heat preservation solidification time is 1 ~ 2h.
In conclusion the invention has the following advantages:
(1) moulding process of polyimides of the invention is simple, the hot property and good mechanical performance of obtained polyimides；
(2) release agent is added before polyimides is added in the present invention, so that when taking out polyimide resin, it will not be because of bonding
The problems such as cause the destruction of resin；
(3) present invention flows polyimides first under certain temperature and pressure and forms afterwards, favorably by the way of heat-insulation pressure keeping
In obtaining flat and smooth polyimide resin.
Specific embodiment
The invention will be further described below.Following embodiment is only used for clearly illustrating technical side of the invention
Case, and not intended to limit the protection scope of the present invention.
A kind of polyimide resin moulding process, comprising the following steps:
(1) after preheating mold, one layer of release agent is coated, polyimide powder is added in mold, binder, pressurization；
(2) mold after pressurization is continued into heating heating, heat-insulation pressure keeping；
(3) by after die venting, after warm solidification, demoulding obtains molding polyimide resin.
Embodiment 1
A kind of polyimide resin moulding process, comprising the following steps:
(1) after mold being preheating to 50 DEG C, one layer of methyl-silicone oil is coated, polyimide powder is added in mold, binder adds
Pressure；
(2) mold after pressurization being continued using temperature programming, temperature programming is that 5 DEG C/min is warming up to 200 DEG C, heat-insulation pressure keeping,
Holding temperature is 200 DEG C, dwell pressure 5MPa；
(3) by after die venting, after warm solidification, the heat preservation solidification time is 1h, and demoulding obtains molding polyimides tree
Rouge.
The properties of obtained polyimide resin are as shown in table 1.
Embodiment 2
A kind of polyimide resin moulding process, comprising the following steps:
(1) after mold being preheating to 50 DEG C, one layer of methyl-silicone oil is coated, polyimide powder is added in mold, binder adds
Pressure；
(2) mold after pressurization is continued using gradient increased temperature, gradient increased temperature is to use heating frequency for 2 DEG C/min, is warming up to
150 DEG C, continue heating and use heating frequency for 4 DEG C/min, is warming up to 200 DEG C, heat-insulation pressure keeping, holding temperature is 200 DEG C, pressure maintaining
Pressure is 5MPa；
(3) by after die venting, after warm solidification, the heat preservation solidification time is 1h, and demoulding obtains molding polyimides tree
Rouge.
The properties of obtained polyimide resin are as shown in table 1.
Embodiment 3
A kind of polyimide resin moulding process, comprising the following steps:
(1) after mold being preheating to 60 DEG C, one layer of methyl-silicone oil is coated, polyimide powder is added in mold, binder adds
Pressure；
(2) mold after pressurization being continued using temperature programming, temperature programming is that 5 DEG C/min is warming up to 220 DEG C, heat-insulation pressure keeping,
Holding temperature is 220 DEG C, dwell pressure 10MPa；
(3) by after die venting, after warm solidification, the heat preservation solidification time is 2h, and demoulding obtains molding polyimides tree
Rouge.
The properties of obtained polyimide resin are as shown in table 1.
Embodiment 4
A kind of polyimide resin moulding process, comprising the following steps:
(1) after mold being preheating to 60 DEG C, one layer of methyl-silicone oil is coated, polyimide powder is added in mold, binder adds
Pressure；
(2) mold after pressurization is continued using gradient increased temperature, gradient increased temperature is to use heating frequency for 2 DEG C/min, is warming up to
170 DEG C, continues heating and use heating frequency for 4 DEG C/min, be warming up to 220 DEG C, holding temperature is 220 DEG C, and dwell pressure is
10MPa；
(3) by after die venting, after warm solidification, the heat preservation solidification time is 2h, and demoulding obtains molding polyimides tree
Rouge.
The properties of obtained polyimide resin are as shown in table 1.
Table 1
From table 1 it follows that change heating mode when other reaction conditions are identical, so that polyimides after molding
Tensile strength, glass transition temperature and thermal decomposition temperature increase, and elongation at break reduces, this is because the liter of gradient increased temperature
Warm mode is more advantageous to the enhancing of curing reaction degree.In one timing of heating mode, holding temperature and heat preservation pressure are higher, molding
The tensile strength of polyimides afterwards, glass transition temperature and thermal decomposition temperature are higher, and elongation at break is smaller, this is because
Temperature and pressure increases so that intermolecular reaction is more thorough.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of polyimide resin moulding process, characterized in that the following steps are included:
(1) after preheating mold, one layer of release agent is coated, polyimide powder is added in mold, binder, pressurization；
(2) mold after pressurization is continued into heating heating, heat-insulation pressure keeping；
(3) by after die venting, after warm solidification, demoulding obtains molding polyimide resin.
2. a kind of polyimide resin moulding process according to claim 1, characterized in that the mold preheating temperature is
50~60℃。
3. a kind of polyimide resin moulding process according to claim 1, characterized in that the release agent is methyl silicon
Oil or polyethylene.
4. a kind of polyimide resin moulding process according to claim 1, characterized in that the heating mode is program
Heating or gradient increased temperature.
5. a kind of polyimide resin moulding process according to claim 1, characterized in that described program heating for 5 DEG C/
Min is warming up to 200 ~ 220 DEG C.
6. a kind of polyimide resin moulding process according to claim 1, characterized in that the gradient increased temperature is to use
Heating frequency is 2 DEG C/min, is warming up to 150 ~ 170 DEG C, continues heating and uses heating frequency for 4 DEG C/min, is warming up to 200 ~ 220
℃。
7. a kind of polyimide resin moulding process according to claim 1, characterized in that the holding temperature be 200 ~
220 DEG C, the dwell pressure is 5 ~ 10MPa.
8. a kind of polyimide resin moulding process according to claim 1, characterized in that the heat preservation solidification time is
1~2h。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350653.5A CN110181735A (en) | 2019-04-28 | 2019-04-28 | A kind of polyimide resin moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910350653.5A CN110181735A (en) | 2019-04-28 | 2019-04-28 | A kind of polyimide resin moulding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110181735A true CN110181735A (en) | 2019-08-30 |
Family
ID=67715281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910350653.5A Pending CN110181735A (en) | 2019-04-28 | 2019-04-28 | A kind of polyimide resin moulding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110181735A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111906701A (en) * | 2020-07-02 | 2020-11-10 | 郑州磨料磨具磨削研究所有限公司 | Metal resin binder grinding wheel and preparation method thereof |
-
2019
- 2019-04-28 CN CN201910350653.5A patent/CN110181735A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111906701A (en) * | 2020-07-02 | 2020-11-10 | 郑州磨料磨具磨削研究所有限公司 | Metal resin binder grinding wheel and preparation method thereof |
| CN111906701B (en) * | 2020-07-02 | 2021-09-03 | 郑州磨料磨具磨削研究所有限公司 | Metal resin binder grinding wheel and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190830 |