CN110176189B - Panel, display device and manufacturing method of panel - Google Patents
Panel, display device and manufacturing method of panel Download PDFInfo
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- CN110176189B CN110176189B CN201910598732.8A CN201910598732A CN110176189B CN 110176189 B CN110176189 B CN 110176189B CN 201910598732 A CN201910598732 A CN 201910598732A CN 110176189 B CN110176189 B CN 110176189B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The invention discloses a panel, a display device and a manufacturing method of the panel, which are used for solving the problem that an adhesive in a panel bending area is easy to separate from the panel in the related art. Wherein, the panel includes: the panel comprises a bent part, an edge part, a panel main body and a bonding structure, wherein the bent part is arranged between the edge part and the panel main body; a first face of the edge portion is opposite to a second face of the panel body, the first face and the second face being connected by the bonding structure; a groove is provided on at least one side of the bonding structure. The panel of the invention can improve the adhesive force between the bonding structure and the panel.
Description
Technical Field
The present invention relates to the field of semiconductor display technologies, and in particular, to a panel, a display device, and a method for manufacturing the panel.
Background
At present, some display panels have a bending area, and after the display panel is bent, the upper surface and the lower surface opposite to each other after the display panel is bent are bonded together through a double-sided adhesive tape. Because the bending area of the display panel has a restoring force, the double-sided tape is easily separated from the adhered surface when being pulled by the force (for example, the adhesion of the surface of the double-sided tape is less than the cohesive force of the double-sided tape, which causes peeling of the adhered surface), so that the display panel may have a phenomenon of sharp corners of the bending area or breakage of metal wires inside the bending area, which causes abnormal display of the display device.
Disclosure of Invention
Accordingly, the present invention is directed to a panel, a display device and a method for manufacturing the panel, in which the panel can reduce the cohesion of the bonding structure in the bending region.
According to an aspect of the present invention, there is provided a panel comprising: the panel comprises a bent part, an edge part, a panel main body and a bonding structure, wherein the bent part is arranged between the edge part and the panel main body; a first face of the edge portion is opposite to a second face of the panel body, the first face and the second face being connected by the bonding structure; a groove is provided on at least one side of the bonding structure.
Optionally, the cross section of the groove is U-shaped.
Optionally, the cross section of the groove is V-shaped.
Optionally, the cross section of the bonding structure is in a zigzag shape.
Optionally, the groove comprises at least two discontinuous sub-grooves on the side surface in the length direction of the bonding structure.
Optionally, the depth of the groove is 1/4 to 1/3 of the cross-sectional length of the bonded structure.
Optionally, the width of the groove is 1/3-1/2 of the cross-sectional width of the bonded structure.
Optionally, the length of the groove is not greater than the length of the bonding structure.
Optionally, the bonding structure has the grooves of the structure on both sides in the length direction, respectively.
Optionally, a back membrane is attached to the first surface, a back membrane and a heat dissipation membrane are sequentially attached to the second surface, and the bonding structure is arranged between the back membrane attached to the first surface and the heat dissipation membrane attached to the second surface.
Optionally, the surface of the first surface, which is in contact with the adhesive structure, of the attached back film is a rough surface.
Optionally, the bottom of the groove is arc-shaped.
Optionally, at least one edge of the groove is arc-shaped.
According to a second aspect of the present invention, there is provided a display device comprising any one of the panels provided in the first aspect of the present invention.
According to a third aspect of the present invention, there is provided a panel manufacturing method for manufacturing any one of the panels according to the first aspect of the present invention, comprising: forming a groove on at least one side surface of the bonding structure; after the edge part of the panel is bent along the panel main body, a first face of the edge part is bonded with a second face of the panel main body through the bonding structure, wherein the first face is opposite to the second face.
As can be seen from the above, in the panel according to the embodiment of the present invention, the groove is formed in the bonding structure between the two opposite surfaces after the edge of the panel is bent, so that the cohesive force of the bonding structure can be reduced, and when the bonding structure is pulled by the restoring force of the bending region of the panel, the bonding structure can be deformed to offset the restoring force of the bending region of the panel, so as to enhance the adhesion force of the bonding structure on the attachment surface, and thus the bending structure of the panel is more stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a partial schematic view of a panel shown in accordance with an exemplary embodiment;
FIG. 2 is a partial schematic view of a panel shown in accordance with an exemplary embodiment;
FIG. 3 is a partial schematic view of a panel shown in accordance with an exemplary embodiment;
FIG. 4 is a partial schematic view of a panel shown in accordance with an exemplary embodiment;
FIG. 5 is a partial schematic view of a panel shown in accordance with an exemplary embodiment;
FIG. 6 is a side view of a bonding structure according to an exemplary embodiment;
FIG. 7 is a side view of a bonding structure according to an exemplary embodiment;
FIG. 8 is a side view of a bonding structure according to an exemplary embodiment;
FIG. 9 is a flow chart illustrating a method of manufacturing a panel according to an exemplary embodiment;
FIG. 10A is a schematic diagram illustrating modeling a bonded structure with grooves disposed on the sides using ansys in accordance with an exemplary embodiment;
FIG. 10B is a schematic diagram illustrating modeling of a bonded structure without grooves on the sides using ansys in accordance with an exemplary embodiment;
FIG. 11 is a graph illustrating a stress cloud and a stress distribution of a panel inflection region according to an exemplary embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
FIG. 1 is a partial schematic view of a panel shown in accordance with an exemplary embodiment, the panel including, as shown in FIG. 1:
the panel comprises a bent part 11, an edge part 12, a panel main body 13 and an adhesive structure 14, wherein the bent part 11 is arranged between the edge part 12 and the panel main body 13; the adhesive structure 14 may be a double-sided tape with adhesive on both sides, for example, a long PET (Polyethylene Terephthalate) tape with adhesive on both sides, or a long Foam with adhesive on both sides.
A first face of the edge portion 12 is opposite to a second face of the panel main body 13, the first face and the second face being connected by a bonding structure 14;
the bonding structure 14 is provided with a groove 141 on at least one side thereof.
It should be noted that fig. 1 is only an exemplary structure of a panel according to an embodiment of the present invention, and in fig. 1, the panel is, for example, a display panel, as shown in fig. 1, a first surface of an edge portion 12 of the panel may be provided with a back film, and a second surface of a panel main body 13 may be provided with a back film and a heat insulating film in this order, in which case, an adhesive structure 14 is provided between the back film on the first surface and the heat insulating film on the second surface. The back film is a protective film attached to the non-display surface of the display panel, the protective film can avoid the influence of stress generated in the process of bending the display panel on the leads of the panel main body 13, the protective film attached to the region to be bent of the display panel needs to be removed before the display panel is bent, and the non-display surface of the display panel is also called the back surface of the display panel, so the protective film attached to the non-display surface of the display panel is also called the back film. After removing the protective film of the region to be bent and bending the display panel, as shown in fig. 1, there is a portion of the back film on the first side of the panel main body edge portion 12 and another portion of the back film on the second side of the panel main body 13. In addition, the structure of the symmetrical grooves 141 disposed on both sides of the bonding structure shown in fig. 1 is only one exemplary structure of the grooves, and in the embodiment of the invention, the shape, number and position of the grooves on the bonding structure are not limited, and several existence forms of the grooves on the bonding structure will be exemplarily described later with reference to the drawings.
According to the panel disclosed by the embodiment of the invention, the groove is formed in the bonding structure between the two opposite surfaces after the edge of the panel is bent, so that the cohesive force of the bonding structure can be reduced, the bonding structure can deform when being pulled by the restoring force of the bending area of the panel, the restoring force of the bending area of the panel is offset, the adhesive force of the bonding structure on the attachment surface is enhanced, and the bending structure of the panel is more stable.
In one implementation, the cross section of the groove may be U-shaped, the shape of the groove may be as shown in fig. 1, for example, and the shape of the groove may also be as shown in fig. 2 and 3, in fig. 2, the edge of the notch of the groove 141 on the bonding structure 14 is circular arc, and in fig. 1 and 3, the edge of the notch of the groove 141 on the bonding structure is angular. The bottom of the U-shaped groove is arc-shaped, so that the probability that the bonding structure is torn along the bottom of the groove due to the fact that the bonding structure is pulled by the restoring force of the panel bending area can be reduced.
In one implementation, the cross section of the groove is V-shaped, and as shown in fig. 4, two symmetrical V-shaped grooves 141 may be disposed on two sides of the bonding structure 14 in the length direction. The stability of V-arrangement slot is higher, can make bonding structure receive panel bending region restoring force when dragging, bonding structure's deformation can not too big.
In one implementation, the grooves on both sides of the bonding structure in the length direction may form an asymmetric structure, as shown in fig. 5, and the bonding structure 14 has a zigzag cross section. The cross section of the bonding structure is Z-shaped, so that the bonding structure can have larger deformation amount in the stress direction when being pulled by the restoring force of the panel bending area, and the probability of the occurrence of the condition that the bonding surface of the bonding structure is separated from the attached surface due to the pulling of external force is reduced.
Fig. 6 is a side view of a bonded structure according to an exemplary embodiment, where the trench includes at least two sub-trenches that are discontinuous on the side of the bonded structure (one case of two sub-trenches on the side of the bonded structure is shown in fig. 6), for example, the two sub-trenches are two completely independent trenches, and the at least two sub-trenches may or may not be in a straight line (one case of two sub-trenches in a straight line is shown in fig. 6), as shown in fig. 6. The side face of the bonding structure is provided with the discontinuous sub-grooves, so that the stability of the bonding structure can be improved, and the situation that the bonding structure is torn along the grooves due to excessive deformation in the stress direction when the bonding structure is pulled by the restoring force of the panel bending area can be avoided as much as possible.
In one implementation, the depth of the groove accounts for 1/4-1/3 of the cross-sectional length of the adhesive, and the design can minimize the cohesive force of the bonding structure and ensure the stability of the bonding structure.
In one implementation, the width of the groove accounts for 1/3-1/2 of the cross-sectional width of the adhesive, so that the design can minimize the cohesive force of the bonding structure and ensure the stability of the bonding structure.
For example, the length of the groove is not greater than the length of the bonding structure, and fig. 7 is a side view of a bonding structure according to an exemplary embodiment, and the length of the groove is less than the length of the bonding structure, as shown in fig. 7, so that the stability of the bonding structure can be ensured and the cohesion of the bonding structure can be reduced. Fig. 8 is a side view of another bonding structure according to an exemplary embodiment, and as shown in fig. 8, the length of the groove is the same as the length of the bonding structure, that is, a groove penetrating through the bonding structure is opened on the side surface of the bonding structure.
In an implementation manner, the bonding structure is provided with symmetrical grooves on two side surfaces in the length direction, for example, the grooves shown in fig. 1 to 3 are all a case of symmetrical grooves. Wherein the symmetrical grooves are, for example, symmetrical in position on the sides of the bonding structure, and the grooves are identical in shape and size. Two sides on two length directions of the bonding structure are provided with grooves with symmetrical structures, so that the stress on two sides of the bonding structure is even, the bonding structure is more stable, the bonding surface on one side of the bonding structure is prevented from being separated from the attached surface due to the fact that the stress on one side of the bonding structure is larger, and the adhesive force of the bonding structure is improved.
In one realisation there may be at least two side-by-side grooves on both sides of the length of the bonding structure, respectively, in which case the width of each groove may be correspondingly smaller, for example the width of each groove may be arranged to be 1/8 to 1/4 of the bonding structure width. Therefore, the cohesive force of the bonding structure can be reduced on the basis of obtaining higher stability.
In one implementation, the side of the first side to which the backing film is attached that is in contact with the bonding structure comprises a pre-configured roughened surface, which may increase the adhesion between the backing film and the bonding structure, for example, the side of the first side to which the backing film is attached that is in contact with the bonding structure may be pre-treated to be roughened, or the side of the first side to which the backing film is attached that is in contact with the bonding structure may be frosted.
In one implementation, the bottom of the trench is curved, for example, as shown in fig. 1-3, and the bottom of the trench, which is V-shaped in cross-section in fig. 4, may also be provided in a smaller arc. The bottom of the groove is designed into an arc shape, so that the situation that the groove is torn along the bottom due to the fact that the bonding structure is pulled by restoring force of a panel bending area can be avoided as much as possible, and the stability of the bonding structure is improved.
In one implementation, at least one edge of the groove is arcuate, e.g., as shown in fig. 2, both edges of the groove may be arcuate. At least one edge of the groove is designed to be arc-shaped, so that the condition that the bonding structure is pulled back by a panel bending area to cause the groove to be torn along the edge can be avoided as much as possible.
The present invention also provides a display device which may include any one of the panels as in the embodiments of the present invention.
The present invention also provides a panel manufacturing method, and fig. 9 is a flowchart illustrating the method according to an exemplary embodiment, and as shown in fig. 9, the method includes the processes of:
step 901: forming a groove on at least one side surface of the bonding structure;
for example, grooves may be provided on both sides in the length direction of the bonded structure. The structure of the trench may be any one of the trench structures described above.
For example, the bonding structure may be grooved on at least one side by means of precision die cutting.
Adhesive structures such as double sided tape.
Step 902: after the edge part of the panel is bent along the panel main body, a first face of the edge part is bonded with a second face of the panel main body through the bonding structure, wherein the first face is opposite to the second face.
For example, a back film and a heat dissipation film are sequentially attached to the panel main body, the back film is attached to the edge portion, a bending region is formed after the edge portion of the panel is bent along the panel main body, the heat dissipation film on the panel main body is opposite to the back film on the edge portion, and the back film attached to the edge portion and the heat dissipation film attached to the panel main body can be bonded through a bonding structure.
In the four embodiments of the proposal, the double-sided adhesive tape in the bending area is processed by precision die cutting to form the double-sided adhesive tape with the special-shaped structure. The width of the removed part of the double-sided adhesive tape section accounts for 1/3-1/4 of the total section width, and the total length of the removed part accounts for 1/3 of the total section length. In addition, the surface roughness of the cemented surface can be increased, again increasing the adhesion.
To verify the stability of the panel bending region of the embodiments of the present invention, simulation verification may be performed, for example, using ansys modeling as shown in fig. 10A and 10B. Setting boundary conditions and parameters of the grooves arranged on the corresponding bonding structures, applying 2N equal load tension on the upper ends of the bonding structures, solving and calculating to obtain results, and determining the stability of the panel bending area according to the obtained results.
Fig. 11 is a stress cloud and a stress distribution graph of a panel bending region according to an exemplary embodiment, and it can be seen from a curve S2 in fig. 11 that a bonding structure with grooves on the side surfaces can effectively reduce the stress of the bonding surface, thereby reducing the risk of tearing and warping of the bonding surface, and the strain applied to the bonding structure in a normal range is greater than that applied to the bonding structure without grooves on the side surfaces (as shown by a curve S1 in the figure), so it can be speculated that the bonding structure according to the embodiment of the present invention can increase elastic deformation, reduce the cohesive force of the bonding structure to a certain extent, and offset the restoring force of the bending region formed after bending, thereby improving the reliability of the panel.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
In addition, well known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures for simplicity of illustration and discussion, and so as not to obscure the invention. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the invention, and also in view of the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the present invention is to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that the invention can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
The embodiments of the invention are intended to embrace all such alternatives, modifications and variances that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (15)
1. A panel, comprising:
the panel comprises a bent part, an edge part, a panel main body and a bonding structure, wherein the bent part is arranged between the edge part and the panel main body;
a first face of the edge portion is opposite to a second face of the panel body, the first face and the second face being connected by the bonding structure;
a groove is provided on at least one side of the bonding structure.
2. The panel of claim 1, wherein the channel is U-shaped in cross section.
3. The panel of claim 1, wherein the channel is V-shaped in cross-section.
4. A panel as claimed in claim 1, wherein the bonding structure is Z-shaped in cross-section.
5. The panel of claim 1, wherein the grooves comprise at least two sub-grooves that are discontinuous on the sides in the length direction of the bonded structure.
6. The panel of claim 1 wherein the depth of the groove is 1/4 to 1/3 of the cross-sectional length of the bonded structure.
7. The panel of claim 1 wherein the width of the channel is 1/3-1/2 of the bonding structure cross-sectional width.
8. The panel of claim 1, wherein the length of the channel is no greater than the length of the bonded structure.
9. The panel of claim 1, wherein the bonding structure has symmetrical grooves formed on both sides in a length direction.
10. The panel of claim 1, wherein a backing film is attached to the first surface, a backing film and a heat dissipation film are attached to the second surface in sequence, and the adhesive structure is disposed between the backing film attached to the first surface and the heat dissipation film attached to the second surface.
11. The panel of claim 10, wherein the side of the backing film attached to the first side that contacts the bonding structure is a rough surface.
12. The panel of claim 1, wherein the bottom of the channel is arcuate.
13. The panel of claim 1, wherein at least one edge of the channel is arcuate.
14. A display device, characterized in that it comprises a panel according to any one of claims 1 to 11.
15. A panel manufacturing method according to any one of claims 1 to 13, comprising:
forming a groove on at least one side surface of the bonding structure;
after the edge part of the panel is bent along the panel main body, a first face of the edge part is bonded with a second face of the panel main body through the bonding structure, wherein the first face is opposite to the second face.
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| CN201910598732.8A CN110176189B (en) | 2019-07-04 | 2019-07-04 | Panel, display device and manufacturing method of panel |
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| CN201910598732.8A CN110176189B (en) | 2019-07-04 | 2019-07-04 | Panel, display device and manufacturing method of panel |
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| CN110930879B (en) * | 2019-11-25 | 2020-11-10 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN111477110B (en) * | 2020-05-19 | 2022-09-09 | 京东方科技集团股份有限公司 | Rollable display device |
| CN111667770B (en) * | 2020-07-15 | 2021-10-08 | 武汉华星光电技术有限公司 | Flexible display device |
| CN112420792B (en) * | 2020-11-17 | 2024-01-26 | 武汉华星光电半导体显示技术有限公司 | Display panel, binding method thereof and display device |
| CN114122303A (en) * | 2021-11-26 | 2022-03-01 | 深圳市深科达智能装备股份有限公司 | Attaching process of radiating fin and panel |
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