CN110174970A - A kind of patterned circuit and preparation method thereof, touch sensing - Google Patents
A kind of patterned circuit and preparation method thereof, touch sensing Download PDFInfo
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- CN110174970A CN110174970A CN201910459774.3A CN201910459774A CN110174970A CN 110174970 A CN110174970 A CN 110174970A CN 201910459774 A CN201910459774 A CN 201910459774A CN 110174970 A CN110174970 A CN 110174970A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Abstract
The present invention relates to touch screen technology fields, and in particular to a kind of patterned circuit and preparation method thereof, touch sensing.Patterned circuit of the invention, including substrate, the one side of substrate is equipped with the first transparency conducting layer, first transparency conducting layer is equipped with the first frame conducting wire, first frame conducting wire is equipped with the first barrier layer, the region that do not covered by first barrier layer on first transparency conducting layer forms the first non-conducting areas, first non-conducting areas and the surface of the first barrier layer are equipped with the second barrier layer, the smooth surface of second barrier layer, the first barrier layer and the second barrier layer are the refractive index difference of transparent material and the two less than 0.5.Second barrier layer has wellability and dissolubility to the first barrier layer, second barrier layer and the first barrier layer can form one with interface fusion, the optical difference at interface is extremely low, second barrier layer can eliminate the first barrier layer bring refractive power difference, make touch sensing transmitance with higher obtained and lower mist degree.
Description
Technical field
The present invention relates to touch screen technology fields, and in particular to a kind of patterned circuit and preparation method thereof, touch-control sensing
Device.
Background technique
With the development of electronic technology and information technology, the use of electronic device in daily life is also being continuously increased.
Touch screen is favored as the input mode for being suitable for portable device, so that the demand of touch sensing and day are all
Increase.
The circuit structure of capacitance plate touch sensing is generally divided into emission layer and receiving layer, thin in two electrically conducting transparents respectively
Patterned circuit is completed on film, and has frame lead to export signal, and surface is fitted with cover board as needed.Electrically conducting transparent is thin
The method that patterned circuit is formed on film has the laser-induced thermal etching etc. of chemical etching or physics；When saturating using nanometer silver wire material
When bright conductive film, traditional solution chemistry etching, using acid-proof ink, photoresist etc. as in solution chemical etching it is interim
Protection, is removed after the etch is completed.Nano-silver thread transparent conductive film is using such as gas etch dry etching work
When skill, because existing without solution, lateral etch is not present, thus without cleaning link, it is more environmentally-friendly, the as protection
One barrier layer can be retained on film surface and not do removing processing, but affect the optical difference of film surface, make conductive region and non-lead
Electric region is according to the difference of processing technology, and there are the optical differences such as reflectivity, refractive index, transmitance, mist degree, and screen is caused to be atomized
And display image especially text when generate fuzzy sense, granular sensation and distortion sense, and this can be to the whole display effect of touch screen
And aesthetics generates certain influence.
In conclusion how to improve the long-time stability of film layer, and the production cost of touch sensing is reduced, and improved
The whole display effect and aesthetics of touch screen are current those skilled in the art technical problems urgently to be resolved.
Summary of the invention
The purpose of the present invention is to provide the patterned circuits that one kind can eliminate interference light influence.
Second object of the present invention is to provide a kind of preparation method of above-mentioned patterned circuit.
Third object of the present invention is to provide a kind of touch sensing.
To achieve the above object, the technical scheme is that
The one side of a kind of patterned circuit, including substrate, the substrate is equipped with the first transparency conducting layer, and described first is transparent
Conductive layer is equipped with the first frame conducting wire, and the first frame conducting wire is equipped with the first barrier layer, first transparency conducting layer
On not by first barrier layer cover region formed the first non-conducting areas, first non-conducting areas and first barrier
The surface of layer is equipped with the second barrier layer, the smooth surface of second barrier layer, first barrier layer and the second barrier
Layer is transparent material, and the refractive index difference of first barrier layer and second barrier layer is less than 0.5.
Above-mentioned patterned circuit, second barrier layer are equipped with the second transparency conducting layer, second transparency conducting layer
It is equipped with the second frame conducting wire, the second frame conducting wire is equipped with third barrier layer, and second transparency conducting layer is not by institute
The region for stating the masking of third barrier layer forms the second non-conducting areas, the surface of second non-conducting areas and third barrier layer
Equipped with the 4th barrier layer, the smooth surface of the 4th barrier layer, the third barrier layer and the 4th barrier layer are
The refractive index difference of bright material, the third barrier layer and the 4th barrier layer is less than 0.5.
Another surface of above-mentioned patterned circuit, the substrate is equipped with the second transparency conducting layer, second electrically conducting transparent
Layer be equipped with the second frame conducting wire, the second frame conducting wire be equipped with third barrier layer, second transparency conducting layer not by
The region of the third barrier layer masking forms the second non-conducting areas, the table of second non-conducting areas and third barrier layer
Face is equipped with the 4th barrier layer, and the smooth surface of the 4th barrier layer, the third barrier layer and the 4th barrier layer are
The refractive index difference of transparent material, the third barrier layer and the 4th barrier layer is less than 0.5.
There are two above-mentioned patterned circuits, and the structure of two patterned circuits is identical and passes through gluing knot therebetween
It is fixed.
First barrier layer, the second barrier layer, third barrier layer and the 4th barrier layer visible light transmittance be all larger than
90%, refractive index 1.2-2.0, mist degree are lower than 0.5%.
The preparation method of above-mentioned patterned circuit, includes following steps:
1) the first transparency conducting layer is coated on substrate；
2) the first conductive silver slurry layer is printed in frame lead areas, laser-induced thermal etching later forms the first frame conducting wire；
3) masking is patterned to form the first barrier layer and be covered on the first frame conducting wire to the first transparency conducting layer
On, the first transparency conducting layer not covered by the first barrier layer forms conversion zone；
4) conversion zone in step 3) is etched, forms the first non-conducting areas；
5) the first non-conducting areas and first barrier layer surface lay the second barrier layer so that the first non-conducting areas and
The flush of first barrier layer to get.
First transparency conducting layer is nano-silver thread conductive layer.
The generation type of first barrier layer and the second barrier layer be masking plated film, printing, inkjet printing, thermal transfer or
Thermoprint.
The generation type of the third barrier layer and the 4th barrier layer be masking plated film, printing, inkjet printing, thermal transfer or
Thermoprint.
Chemical etching or physical etch are etched in step 4).
The chemical etching is solution etching or gas etch.
Above-mentioned steps 5) in the first non-conducting areas and first barrier layer surface lay the second barrier layer so that first is non-
The flush of conductive region and the first barrier layer, the smooth surface of as described second barrier layer.
A kind of touch sensing, including cover board and above-mentioned patterned circuit.
It is fixed between the cover board and the patterned circuit by gluing knot.The glue is hot melt adhesive, pressure sensitive adhesive, silicon
Any one of glue, UV liquid glue, UV solidified pressure-sensitive film.
First barrier layer and third barrier layer have vertical conduction, and first barrier layer and third barrier layer are
Transparent conductive material.
Patterned circuit of the invention, is equipped with the first barrier layer and the second barrier layer, and the first barrier layer transparent is led to first
Electric layer is patterned masking, and not shielded region is etched to form the first non-conducting areas, and shaded areas is first conductive
Region, and the first non-conducting areas and the surface of the first barrier layer are equipped with the second barrier layer, the second barrier layer make first non-to lead
The flush in electric region and the first barrier layer, the second barrier layer are filled with the step of the first barrier layer formation, the second barrier layer
There is wellability and dissolubility to the first barrier layer, the second barrier layer and the first barrier layer can form one, boundary with interface fusion
The optical difference in face is extremely low, and the refractive index of the first barrier layer and the second barrier layer is very close, and the difference between the two is less than 0.5, and
Two barrier layers can eliminate the first barrier layer bring refractive power difference, so that touch sensing obtained transmitance with higher
And lower mist degree, it apparently seems relatively sharp, moire-free, improves whole display effect and aesthetics.In addition, this hair
Bright first barrier layer and the second barrier layer used are transparent material, so subsequent without being removed, preparation process is simple.
Touch sensing of the invention, using patterned circuit of the invention, transmitance with higher and lower
Mist degree apparently seems relatively sharp, moire-free, can be improved whole display effect and aesthetics.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structure schematic diagram of touch sensing in the embodiment of the present invention 1；
Fig. 2 is that patterned circuit prepares decomposition diagram in the embodiment of the present invention 1；
Fig. 3 is the structure schematic diagram of touch sensing in the embodiment of the present invention 2；
Fig. 4 is the structure schematic diagram of touch sensing in the embodiment of the present invention 3；
In figure:
1, cover board, 2, patterned circuit, 201, substrate, the 202, first transparency conducting layer, the 203, first frame conducting wire, 204,
First barrier layer, the 205, second barrier layer, the 206, second transparency conducting layer, the 207, second frame conducting wire, 208, third barrier layer,
209, the 4th barrier layer, the 210, first conductive silver slurry layer, 3, pressure sensitive adhesive.
Specific embodiment
Presently in connection with attached drawing, the present invention is described in detail.This figure is simplified schematic diagram, is only illustrated in a schematic way
Basic structure of the invention, therefore it only shows the composition relevant to the invention.
Embodiment 1
The touch sensing of the present embodiment, as shown in Figure 1, including cover board 1 and patterned circuit 2, the patterned circuit 2
Including substrate 201, the substrate 201 is equipped with the first transparency conducting layer 202, and first transparency conducting layer 202 is equipped with the
One frame conducting wire 203, the first frame conducting wire 203 are at least partly covered on first transparency conducting layer 202, and described
One frame conducting wire 203 is equipped with the first barrier layer 204, and first transparency conducting layer 202 is located under first barrier layer 204
The region of side is the first conductive region, the region shape that first transparency conducting layer 202 is not covered by first barrier layer 204
At the first non-conducting areas, the surface of first non-conducting areas and the first barrier layer 204 is equipped with the second barrier layer 205, institute
State the smooth surface of the second barrier layer 205；
The second barrier layer 205 is equipped with the second transparency conducting layer 206 in the present embodiment, sets on the second transparency conducting layer 206
There is the second frame conducting wire 207, the second frame conducting wire 207 is equipped with third barrier layer 208, second transparency conducting layer
206 regions for being located at 208 lower section of third barrier layer are the second conductive region, and second transparency conducting layer 206 is not by institute
The region for stating the masking of third barrier layer 208 forms the second non-conducting areas, second non-conducting areas and third barrier layer 208
Surface be equipped with the 4th barrier layer 209, the smooth surface of the 4th barrier layer 209；The one of 4th barrier layer 209
It is adhesively fixed between side and the cover board 1 by pressure sensitive adhesive 3.
The preparation method of the patterned circuit of the present embodiment, comprising the following steps:
1) the extrusion coated conductive coating containing nano-silver thread of slit is used on 201 surface of 100um PET base material, in PET
The first transparency conducting layer 202 is formed on substrate 1, the first transparency conducting layer 202 is with a thickness of 0.1-0.3um, sheet resistance 50ohm/sq；
2) conductive silver paste is printed using the mode of silk-screen printing in frame lead areas and consolidate in 150 DEG C of sintering 30mi n
Change, form the first conductive silver slurry layer 210 with a thickness of 5-10um, in Fig. 2 shown in (a), passes through semiconductive thin film laser later,
The first conductive silver slurry layer 210 is etched, the first frame conducting wire 203 is formed, in Fig. 2 shown in (b)；
3) the UV transparent ink for printing salic filler with the mode for crossing silk-screen printing forms the first barrier layer 204 and covers
It covers on the first frame conducting wire 203, in Fig. 2 shown in (c)；
4) gas etch is carried out using ozone in gas etch equipment, by chemical reaction, made not by the first barrier layer
The nano-silver thread in the region of 204 coverings reacts and is broken, and forms the first nonconductive regions from the electric conductivity without macroscopic view
The nano-silver thread conductive layer in domain, the region that do not react forms the first conductive region；
5) the second barrier layer 205 is laid in the first non-conducting areas and 204 surface of the first barrier layer, so that first is non-conductive
204 flush of region and the first barrier layer, in Fig. 2 shown in (d)；
6) it is coated with nanometer on the second barrier layer 204 and draws silver wire conductive layer the second transparency conducting layer 206 of formation, in Fig. 2
(f) shown in；
7) conductive silver paste is printed using the mode of silk-screen printing in frame lead areas and solidify in 150 DEG C of sintering 30min,
The second conductive silver slurry layer with a thickness of 5-10um is formed, by semiconductive thin film laser, etches the second conductive silver slurry layer, forms the
Two frame conducting wires 207；
8) the UV transparent ink for printing salic filler with the mode for crossing silk-screen printing forms third barrier layer 208 and covers
On the second frame conducting wire 207；
9) gas etch is carried out using ozone in gas etch equipment, by chemical reaction, made not by third barrier layer
The nano-silver thread in the region of 208 coverings reacts and is broken, and forms the second nonconductive regions from the electric conductivity without macroscopic view
The nano-silver thread conductive layer in domain, the region that do not react forms the second conductive region；
10) the 4th barrier layer 209 is laid on the second non-conducting areas and 208 surface of third barrier layer, so that second non-leads
The flush in electric region and third barrier layer 208, to get the patterned circuit of the present embodiment as shown in Fig. 2 (g).
It will be patterned into circuit 2 to be adhered on cover board 1 equipped with the side pressure sensitive adhesive 3 of the 4th barrier layer 209 to get this implementation
The touch sensing of example single-surface double-layer structure.
The first barrier layer 204, the second barrier layer 205, third barrier layer 208 and the 4th barrier layer 209 are equal in the present embodiment
For transparent material, the specific refractivity of first barrier layer 204 and second barrier layer 205 is less than 0.5, the third resistance
The refringence of interlayer 208 and the 4th barrier layer 209 is worse than 0.5.
The first transparency conducting layer 202 and the second transparency conducting layer 206 are nano-silver thread conductive layer in the present embodiment.
Substrate 201 is PET base material in the present embodiment.
In the present embodiment the first frame conducting wire 203 and the second frame conducting wire 207 can both have concurrently or be substituted for each other or only
Retain one, realizes that signal draws function.
The first barrier layer 204 and third barrier layer 208 can also be electrically conducting transparent in other embodiments of the invention
Ink.
The patterned circuit of the present embodiment, is equipped with the first barrier layer 204 and the second barrier layer 205, and the first barrier layer 204 is right
First transparency conducting layer 202 is patterned masking, and not shielded region is etched to form the first non-conducting areas, shielded area
Domain is the first conductive region, and the first non-conducting areas and the surface of the first barrier layer 204 are equipped with the second barrier layer 205, second
Barrier layer 205 makes the flush of non-conducting areas and the first barrier layer 204, and the second barrier layer 205 is filled with the first barrier
The step that layer 204 is formed, and the refractive index of the first barrier layer 204 and the second barrier layer 205 is very close, the difference between the two is less than
0.5, the second barrier layer 205 can eliminate 204 bring refractive power difference of the first barrier layer, so that touch sensing obtained has
Higher transmitance and lower mist degree apparently seem relatively sharp, moire-free, improve whole display effect and beauty
Degree.In addition, the first barrier layer 204 and the second barrier layer 205 used in the present invention are transparent material, so subsequent without carrying out
Removing, preparation process are simple.The setting of third barrier layer 208 and the 4th barrier layer 209 is the same as 204 He of the first barrier layer in the present invention
The effect having the same of second barrier layer 205.
The patterned circuit of the present embodiment, it is only necessary to which a substrate 201 lays second on the surface of the second barrier layer 205
Transparency conducting layer 206 saves substrate compared to the conductive film in existing, and manufacture craft is more simple, reduces to a certain extent
Cost.
The touch sensing of the present embodiment is a kind of touch sensing with single-surface double-layer structure, with higher
Rate and lower mist degree are crossed, apparently seems relatively sharp, moire-free, improves whole display effect and aesthetics.
In other embodiments of the invention, the first barrier layer 204, the second barrier layer 205, third barrier layer 208 and
The generation type of four barrier layers 209 is masking plated film, inkjet printing, thermal transfer or thermoprint.
First barrier layer 204, the first barrier layer 205, third barrier layer the 208, the 4th in other embodiments of the invention
The material of barrier layer 209 can also be transparent silica or transparent UV resin.
In other embodiments of the invention, according to laser-induced thermal etching in step 4), then the first resistance in step 3) can be saved
The setting of interlayer 204 directly carries out pattern etched on the first transparency conducting layer 202.
In other embodiments of the invention, according to laser-induced thermal etching in step 9), then it can save third in step 8) and hinder
The setting of interlayer 208 directly carries out pattern etched on the second transparency conducting layer 206.
Embodiment 2
The touch sensing of the present embodiment, as shown in figure 3, including cover board 1 and patterned circuit 2, patterned circuit 2 is single
Substrate two-sided structure, the patterned circuit 2 include substrate 201, and a surface of the substrate 201 is equipped with first and transparent leads
Electric layer 202, first transparency conducting layer 202 are equipped with the first frame conducting wire 203, the first frame conducting wire 203 at least portion
It point being covered on first transparency conducting layer 202, the first frame conducting wire 203 is equipped with the first barrier layer 204, and described the
The region that one transparency conducting layer 202 is located at 204 lower section of the first barrier layer is the first conductive region, first electrically conducting transparent
The regions that layer 202 is not covered by first barrier layer 204 form the first non-conducting areas, first non-conducting areas and the
The surface of one barrier layer 204 is equipped with the second barrier layer 205, the smooth surface of second barrier layer 205；
Another surface of substrate 201 described in the present embodiment is equipped with the second transparency conducting layer 206, second electrically conducting transparent
Layer 206 is equipped with the second frame conducting wire 207, and the second frame conducting wire 207 is equipped with third barrier layer 208, and described second thoroughly
The region that bright conductive layer 206 is not covered by the third barrier layer 208 forms the second non-conducting areas, second nonconductive regions
Domain and the surface of third barrier layer 208 are equipped with the 4th barrier layer 209, and the smooth surface of the 4th barrier layer 209 is described
Third barrier layer 208 and the 4th barrier layer 209 are transparent material, the folding of the third barrier layer 208 and the 4th barrier layer 209
Rate difference is penetrated less than 0.5.
The preparation method of the pattern structure of the present embodiment, comprising the following steps:
1) the extrusion coated conductive coating containing nano-silver thread of slit is used on a surface of 100um PET base material,
The first transparency conducting layer is formed in PET base material, the first transparency conducting layer is with a thickness of 0.1-0.3um, sheet resistance 50ohm/sq；
2) conductive silver paste is printed using the mode of silk-screen printing in frame lead areas and solidify in 150 DEG C of sintering 30min,
The first conductive silver slurry layer with a thickness of 5-10um is formed, later by semiconductive thin film laser, etches the first conductive silver slurry layer, shape
At the first frame conducting wire；
3) the UV transparent ink for printing salic filler with the mode for crossing silk-screen printing forms the first barrier layer and covers
On the first frame conducting wire；
4) gas etch is carried out using ozone in gas etch equipment, by chemical reaction, made not by the first barrier layer
The nano-silver thread in the region of covering reacts and is broken, and forms the first non-conducting areas from the electric conductivity without macroscopic view,
Do not react region nano-silver thread conductive layer formed the first conductive region；
5) the first non-conducting areas and first barrier layer surface lay the second barrier layer so that the first non-conducting areas and
The flush of first barrier layer；
6) it is coated with nanometer on another surface of PET base material and draws silver wire conductive layer the second transparency conducting layer of formation；
7) conductive silver paste is printed using the mode of silk-screen printing in frame lead areas and solidify in 150 DEG C of sintering 30min,
The second conductive silver slurry layer with a thickness of 5-10um is formed, by semiconductive thin film laser, etches the second conductive silver slurry layer, forms the
Two frame conducting wires；
8) the UV transparent ink for printing salic filler with the mode for crossing silk-screen printing forms third barrier layer and is covered on
On second frame conducting wire；
9) gas etch is carried out using ozone in gas etch equipment, by chemical reaction, made not by third barrier layer
The nano-silver thread in the region of covering reacts and is broken, and forms the second non-conducting areas from the electric conductivity without macroscopic view,
Do not react region nano-silver thread conductive layer formed the second conductive region；
10) the 4th barrier layer is laid in the second non-conducting areas and third barrier layer surface, so that the second non-conducting areas
With the flush of third barrier layer to get the patterned circuit of the present embodiment.
In the embodiment of other single substrate two-sided structures, according to laser-induced thermal etching in step 4), then step 3) can be saved
In the first barrier layer 204 setting, directly carry out pattern etched on the first transparency conducting layer 202.
In the embodiment of other single substrate two-sided structures, transparent to the first transparency conducting layer 202 and second simultaneously it can lead
Electric layer 206 carries out gas etch.
Embodiment 3
The touch sensing of the present embodiment, as shown in figure 4, including cover board 1 and patterned circuit 2, the patterned circuit 2
Including substrate 201, the substrate 201 is equipped with the first transparency conducting layer 202, and first transparency conducting layer 202 is equipped with
First frame conducting wire 203, the first frame conducting wire 203 is at least partly covered on first transparency conducting layer 202, described
First frame conducting wire 203 is equipped with the first barrier layer 204, and first transparency conducting layer 202 is located at first barrier layer 204
The region of lower section is the first conductive region, the region that first transparency conducting layer 202 is not covered by first barrier layer 204
Forming the first non-conducting areas, the surface of first non-conducting areas and the first barrier layer 204 is equipped with the second barrier layer 205,
The smooth surface of second barrier layer 205；
It include two above-mentioned patterned circuits 2 in the present embodiment, opposite direction fitting between two patterned circuits 2, i.e.,
It is adhesively fixed between second barrier layer 205 of two patterned circuits 2 by pressure sensitive adhesive 3.
It is solid by the bonding of pressure sensitive adhesive 3 between the substrate 201 of the touch sensing of the present embodiment, cover board 1 and patterned circuit 2
It is fixed.
In other embodiments of the invention, it can also be bonded in the same direction between two patterned circuits 2, i.e., one patterning
It is adhesively fixed between second barrier layer 205 of circuit 2 and the substrate 201 of another patterned circuit 2 by pressure sensitive adhesive.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff
Various changes and amendments can be carried out without departing from the scope of the present invention completely.The technical scope of this invention is not
The content being confined on specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (10)
1. a kind of patterned circuit, which is characterized in that including substrate, the one side of the substrate is equipped with the first transparency conducting layer, institute
The first transparency conducting layer is stated equipped with the first frame conducting wire, the first frame conducting wire is equipped with the first barrier layer, and described first
The region that do not covered by first barrier layer on transparency conducting layer forms the first non-conducting areas, first non-conducting areas
The second barrier layer, the smooth surface of second barrier layer, first barrier layer are equipped with the surface of the first barrier layer
It is transparent material with the second barrier layer, the refractive index difference of first barrier layer and second barrier layer is less than 0.5.
2. patterned circuit according to claim 1, which is characterized in that second barrier layer is equipped with second and transparent leads
Electric layer, second transparency conducting layer are equipped with the second frame conducting wire, and the second frame conducting wire is equipped with third barrier layer, institute
It states the region that the second transparency conducting layer is not covered by the third barrier layer and forms the second non-conducting areas, described second is non-conductive
Region and the surface of third barrier layer are equipped with the 4th barrier layer, the smooth surface of the 4th barrier layer, the third resistance
Interlayer and the 4th barrier layer are transparent material, and the refractive index difference of the third barrier layer and the 4th barrier layer is less than 0.5.
3. patterned circuit according to claim 1, which is characterized in that it is transparent that another surface of the substrate is equipped with second
Conductive layer, second transparency conducting layer are equipped with the second frame conducting wire, and the second frame conducting wire is equipped with third barrier layer,
The region that second transparency conducting layer is not covered by the third barrier layer forms the second non-conducting areas, and described second non-leads
Electric region and the surface of third barrier layer are equipped with the 4th barrier layer, the smooth surface of the 4th barrier layer, the third
Barrier layer and the 4th barrier layer are transparent material, and the refractive index difference of the third barrier layer and the 4th barrier layer is less than 0.5.
4. patterned circuit according to claim 1, which is characterized in that there are two the patterned circuits, described in two
The structure of patterned circuit is identical and is fixed by gluing knot therebetween.
5. patterned circuit according to claim 2 or 3, which is characterized in that first barrier layer, the second barrier layer,
The visible light transmittance of third barrier layer and the 4th barrier layer is all larger than 90%, and refractive index 1.2-2.0, mist degree is lower than 0.5%.
6. a kind of preparation method of patterned circuit as described in claim 1, which comprises the following steps:
1) the first transparency conducting layer is coated on substrate；
2) the first conductive silver slurry layer is printed in frame lead areas, laser-induced thermal etching later forms the first frame conducting wire；
3) masking is patterned to form the first barrier layer and be covered on the first frame conducting wire, not to the first transparency conducting layer
The first transparency conducting layer covered by the first barrier layer forms conversion zone；
4) conversion zone in step 3) is etched, forms the first non-conducting areas；
5) the second barrier layer is laid in the first non-conducting areas and the first barrier layer surface, so that the first non-conducting areas and first
The flush of barrier layer to get.
7. the preparation method of patterned circuit according to claim 6, which is characterized in that first transparency conducting layer is
Nano-silver thread conductive layer.
8. the preparation method of patterned circuit according to claim 6, which is characterized in that first barrier layer and second
The generation type of barrier layer is masking plated film, printing, inkjet printing, thermal transfer or thermoprint.
9. the preparation method of patterned circuit according to claim 6, which is characterized in that be etched to chemistry in step 4)
Etching or physical etch.
10. a kind of touch sensing, which is characterized in that including cover board and the described in any item patterned circuits of claim 1-4.
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| CN201910459774.3A CN110174970B (en) | 2019-05-29 | 2019-05-29 | Patterned circuit, preparation method thereof and touch sensor |
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| CN201910459774.3A CN110174970B (en) | 2019-05-29 | 2019-05-29 | Patterned circuit, preparation method thereof and touch sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113990555A (en) * | 2021-11-09 | 2022-01-28 | 惠州市天誉科技有限公司 | ITO conductive film for touch sensor, preparation method of ITO conductive film and application of ITO conductive film to touch screen |
| CN114489361A (en) * | 2020-10-23 | 2022-05-13 | 苏州绘格光电科技有限公司 | Conductive electrode and touch screen with same |
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| CN114489361B (en) * | 2020-10-23 | 2024-01-23 | 苏州绘格光电科技有限公司 | Conductive electrode and touch screen with same |
| CN113990555A (en) * | 2021-11-09 | 2022-01-28 | 惠州市天誉科技有限公司 | ITO conductive film for touch sensor, preparation method of ITO conductive film and application of ITO conductive film to touch screen |
| CN113990555B (en) * | 2021-11-09 | 2024-01-26 | 惠州市天誉科技有限公司 | ITO conductive film for touch sensor, preparation method thereof and touch screen application |
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| CN110174970B (en) | 2022-05-03 |
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