CN110174408A - A kind of increasing material manufacturing process senses off-axis monitoring system more - Google Patents
A kind of increasing material manufacturing process senses off-axis monitoring system more Download PDFInfo
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- CN110174408A CN110174408A CN201910503158.3A CN201910503158A CN110174408A CN 110174408 A CN110174408 A CN 110174408A CN 201910503158 A CN201910503158 A CN 201910503158A CN 110174408 A CN110174408 A CN 110174408A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000012544 monitoring process Methods 0.000 title claims abstract description 27
- 230000010287 polarization Effects 0.000 claims abstract description 38
- 238000003384 imaging method Methods 0.000 claims abstract description 35
- 230000003595 spectral effect Effects 0.000 claims abstract description 25
- 230000004927 fusion Effects 0.000 claims abstract description 24
- 230000000007 visual effect Effects 0.000 claims abstract description 21
- 238000004458 analytical method Methods 0.000 claims abstract description 16
- 238000003331 infrared imaging Methods 0.000 claims abstract description 16
- 230000010354 integration Effects 0.000 claims abstract description 12
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000000354 decomposition reaction Methods 0.000 claims description 7
- 238000002310 reflectometry Methods 0.000 claims description 6
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 8
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000013097 stability assessment Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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Abstract
The invention belongs to increases material manufacturing technology field, specially a kind of increasing material manufacturing process senses off-axis monitoring system more.Present system includes window protective module, the first spectral module, the second spectral module, infrared imaging module, visual light imaging module, polarization imaging module, signal integration module and data fusion and analysis module;Infrared imaging module includes infrared lens and infrared detector;Visual light imaging module includes High Resolution Visible Light camera lens and high resolution CCD;Polarization imaging module includes polarization camera lens and polarization CCD.The system utilizes high-precision visible light, the infrared and polarised light fusion of imaging off-axis monitoring means of multisensor, it being capable of accurate monitoring workpiece platform surface state and the defects of hole in formation of parts, nodularization, crackle, for monitoring forming defect and parameters revision during increasing material manufacturing in time, it is extremely important.
Description
Technical field
The invention belongs to increases material manufacturing technology fields, and in particular to a kind of increasing material manufacturing process senses off-axis monitoring system more
System.
Background technique
Metal increases material manufacturing technology from specific function components product individually be customized to large-scale production in play to
Important role is closed, giving more sustained attention for industry is caused.The components of increasing material manufacturing production have conventional machining process can not
Unique shape, complex characteristics and the lightweight structure of realization.Although increasing material manufacturing advantage it is clear that realize it is extensive
Industrial applications, it is also necessary to overcome process robustness, stability and the insufficient obstacle of repeatability.In increasing material manufacturing
In the process, the quality of part is joined by device systems stability (such as atmosphere, powder feeding and powder supply mechanism stability), technique
The multiple influences such as number (such as laser power, scanning speed, sweep span, processing thickness), raw material.These influence factors are once
The defects of cannot effectively controlling, hole, nodularization, crackle will be formed in formation of parts, seriously affect workpiece final molding
Quality.Therefore, to the increasing material manufacturing components of acquisition high quality, it is necessary to each layer in process for making of forming process
It is monitored with forming quality.However, increasing material manufacturing process is complicated, phenomena such as splashing with high temperature, Qiang Guang, powder, to add
The monitoring of work process brings very hang-up.In addition, increasing material manufacturing surface characteristics has, multiple dimensioned, reflection characteristic is different, geometry
The features such as feature is complicated and changeable, this Stability Assessment for being also increasing material manufacturing workpiece surface quality and defect recognition propose various choose
War, international at present there has been no unified measurement standards.
In order to monitor the surface state and inside parts defect of workpieces processing, the regulation for increasing material manufacturing technological parameter is provided
Condition, domestic and international industry propose the means of various monitorings.But current research be concentrated mainly on merely using high speed camera,
Pyrometer and photodiode carry out coaxial monitoring molten bath state, and monitoring visual field is minimum, cannot effectively monitor entire work piece platform
Surface state, and for occurring often phenomena such as high temperature bloom under complicated processing environment during increasing material manufacturing, monitoring it is steady
It is qualitative poor.
Summary of the invention
In order to overcome the disadvantages mentioned above and deficiency of the prior art, the purpose of the present invention is to provide a kind of increasing material manufacturing processes
More off-axis monitoring systems of sensing, can either monitoring workpiece molded surface state under big visual field, and can be realized high-precision discriminating zero
Part forming defect effectively overcomes the monitoring of the complex environments bring such as bloom, dust to hinder.
Increasing material manufacturing process provided by the invention senses off-axis monitoring system, including 10, first points of window protective module more
Optical module 20, the second spectral module 30, infrared imaging module 40, visual light imaging module 50, polarization imaging module 60, signal
Integration module 70 and data fusion and analysis module 80;Wherein, the infrared imaging module 40 includes infrared lens 41 and infrared
Detector 42;The visual light imaging module 50 includes High Resolution Visible Light camera lens 51 and high resolution CCD 52;It is described inclined
The image-forming module 60 that shakes includes polarization camera lens 61 and polarization CCD 62;The infrared lens 41 connect infrared detector 42, the height
Resolution ratio visible light lens 51 connect high resolution CCD 52, the connection of the polarization camera lens 61 polarization CCD 62, the signal collection
Infrared detector 42, high resolution CCD 52 and polarization CCD 62, the signal, which are separately connected, at one end of module 70 integrates mould
The other end connection data fusion and analysis module 80 of block 70.
In the present invention, the light transmitted through the first spectral module 20 enters polarization imaging module 60, through the first spectral module
The light of 20 reflections enters the second spectral module 30;The light through the transmission of the second spectral module 30 enters visual light imaging mould
Block 50, the light reflected through the second spectral module 30 enter infrared imaging module 40.
In the present invention, the infrared imaging module 40, visual light imaging module 50 and polarization imaging module 60 obtain respectively
Infrared picture data, visible images data and polarization image data, it is soft to be integrated into computer through signal integration module 70
Part system is realized the DATA REASONING of increasing material manufacturing surface characteristics and microdefect and is divided by data fusion and analysis module 80
Analysis.
In the present invention, the infrared imaging module 40, visual light imaging module 50 and polarization imaging module 60 carry out visual field
Matching, carries out registration fusion convenient for image.
In the present invention, the data fusion uses the Image Fusion of Laplace pyramid decomposition with analysis module 80,
In fusion process, pyramidal Decomposition order is 3, and radio-frequency head region is used and counted using weighted average fusion, low frequency region
Averaging method is merged.It completes to decompose the gaussian pyramid of image first, obtains Laplacian pyramid image;So
The high frequency coefficient of laplacian pyramid and low frequency coefficient are selected afterwards;Finally by laplacian pyramid after fusion,
Reconstruct blending image.
Further, the light transmission of first spectral module 20 and the range of reflectivity are 3:7-5:5;Described
The light transmission of two spectral modules 30 and the range of reflectivity are 3:7-5:5.
Further, the infrared detector 42 specifically can be used the focal plane InGaAs, Chip scale be 9.6mm ×
7.68mm, resolution ratio are 320 × 256 pixels;The pixel dimension of the high resolution CCD 52 is 1.1um, and resolution ratio is
7708×5352 pixels;The pixel dimension of the polarization CCD 62 is 3.45um, and resolution ratio is 2448 × 2048 pixels.
Compared with prior art, the present invention has the following advantages and beneficial effects:
(1) present system monitors hand using high-precision visible light, infrared and polarised light fusion of imaging multisensor off axis
Section, can accurate monitoring workpiece platform surface state and the defects of hole in formation of parts, nodularization, crackle, for increasing material system
Forming defect and parameters revision are monitored during making in time, is extremely important;
(2) present system by acquisition visible light, infrared and polarization image data and carries out image co-registration processing, can be effective
Phenomena such as overcoming process high temperature, Qiang Guang, powder to splash bring monitoring obstacle, guarantees the precision and stability of monitoring;
(3) present system ensure that the compactedness of the system integration by the design that triple channel is total to window, monitor the installation of system
It is more convenient.
Detailed description of the invention
Fig. 1 is that increasing material manufacturing process of the invention senses off-axis monitoring system schematic more.
Fig. 2 is the schematic diagram of the infrared imaging module in the embodiment of the present invention.
Fig. 3 is the schematic diagram of the visual light imaging module in the embodiment of the present invention.
Fig. 4 is the schematic diagram of the polarization imaging module in the embodiment of the present invention.
Specific embodiment
Below with reference to examples and drawings, the present invention is described in further detail, but embodiments of the present invention are not
It is limited to this.
Embodiment, as shown in Figure 1, a kind of increasing material manufacturing process senses off-axis monitoring system, including window protective module more
10, the first spectral module 20, the second spectral module 30, infrared imaging module 40, visual light imaging module 50, polarization imaging mould
Block 60, signal integration module 70 and data fusion and analysis module 80;Further, as shown in Fig. 2, the infrared imaging module
40 include infrared lens 41 and infrared detector 42;Further, as shown in figure 3, the visual light imaging module 50 includes height
Resolution ratio visible light lens 51 and high resolution CCD 52;Further, as shown in figure 4, the polarization imaging module 60 includes
Polarize camera lens 61 and polarization CCD 62;Further, the infrared lens 41 connect infrared detector 42, and the high-resolution can
Light-exposed camera lens 51 connects high resolution CCD 52, the connection of the polarization camera lens 61 polarization CCD 62, the signal integration module 70
One end be separately connected infrared detector 42, high resolution CCD 52 and polarization CCD 62, the signal integration module 70 it is another
One end connects data fusion and analysis module 80.
Further, the focal length of the infrared lens 41 is 50mm, and F number is 1.4;The High Resolution Visible Light camera lens 51
Focal length be 50mm, F number be 2.8;The focal length of the polarization camera lens 61 is 50mm, and F number is 2.8.
Further, the light transmission of first spectral module 20 and reflectivity are 3:7;Second spectral module 30
Light transmission with reflectivity be 5:5;Described first light transmitted through spectral module 20 enters polarization imaging module 60, warp
The light of first spectral module 20 reflection enters the second spectral module 30;The light through the transmission of the second spectral module 30 enters
Visual light imaging module 50, the light reflected through the second spectral module 30 enter infrared imaging module 40.
Further, the infrared detector 42 uses the focal plane InGaAs, and Chip scale is 9.6mm × 7.68mm, point
Resolution is 320 × 256 pixels;The pixel dimension of the high resolution CCD 52 is 1.1um, and resolution ratio is 7708 × 5352
pixels;The pixel dimension of the polarization CCD 62 is 3.45um, and resolution ratio is 2448 × 2048 pixels.
Further, the infrared imaging module 40, visual light imaging module 50 and polarization imaging module 60 obtain respectively
Infrared picture data, visible images data and polarization image data be integrated into computer software through signal integration module 70
System realizes the DATA REASONING of increasing material manufacturing surface characteristics and microdefect by the data fusion and analysis module 80 of exploitation
With analysis.
Further, the data fusion and analysis module 80 use the image interfusion method of Laplace pyramid decomposition,
In fusion process, pyramidal Decomposition order is 3, and radio-frequency head region is used and counted using weighted average fusion, low frequency region
Averaging method is merged.It completes to decompose the gaussian pyramid of image first, obtains Laplacian pyramid image;So
The high frequency coefficient of laplacian pyramid and low frequency coefficient are selected afterwards;Finally by laplacian pyramid after fusion,
Reconstruct blending image.
Further, the infrared imaging module 40, visual light imaging module 50 and polarization imaging module 60 carry out visual field
Matching, carries out registration fusion convenient for image.
Above-described embodiment is only one embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications it is equal
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (6)
1. a kind of increasing material manufacturing process senses off-axis monitoring system more, which is characterized in that including window protective module (10), first
Spectral module (20), the second spectral module (30), infrared imaging module (40), visual light imaging module (50), polarization imaging mould
Block (60), signal integration module (70) and data fusion and analysis module (80);Wherein, the infrared imaging module (40) includes
Infrared lens (41) and infrared detector (42);The visual light imaging module (50) includes High Resolution Visible Light camera lens (51)
With high resolution CCD (52);The polarization imaging module (60) includes polarization camera lens (61) and polarization CCD(62);It is described infrared
Camera lens (41) connects infrared detector (42), and the High Resolution Visible Light camera lens (51) connects high resolution CCD (52), described
Polarize camera lens (61) connection polarization CCD(62), one end of the signal integration module (70) be separately connected infrared detector (42),
High resolution CCD (52) and polarization CCD(62), the other end connection data fusion and analysis mould of the signal integration module (70)
Block (80).
2. increasing material manufacturing process according to claim 1 senses off-axis monitoring system more, which is characterized in that through the first light splitting
The light of module (20) transmission enters polarization imaging module (60), and the light through the first spectral module (20) reflection enters second point
Optical module (30);Described second light through spectral module (30) transmission enters visual light imaging module (50), through the second light splitting
The light of module (30) reflection enters infrared imaging module (40).
3. increasing material manufacturing process according to claim 2 senses off-axis monitoring system more, which is characterized in that it is described it is infrared at
The infrared picture data that is obtained respectively as module (40), visual light imaging module (50) and polarization imaging module (60), visible light
Image data and polarization image data are integrated into computer software through signal integration module (70), by data fusion with
Analysis module (80) realizes the measurement and analysis of data of increasing material manufacturing surface characteristics and microdefect.
4. increasing material manufacturing process according to claim 3 senses off-axis monitoring system more, which is characterized in that the data are melted
Close the Image Fusion that Laplace pyramid decomposition is used with analysis module (80);Pyramidal Decomposition order is 3, high frequency
It is merged using weighted average fusion, low frequency region using arithmetic mean method in portion region;The Gauss to image is completed first
Pyramid decomposition obtains Laplacian pyramid image;Then to the high frequency coefficient of laplacian pyramid and low frequency system
Number is selected;Finally by laplacian pyramid after fusion, blending image is reconstructed.
5. increasing material manufacturing process described in one of -4 senses off-axis monitoring system more according to claim 1, which is characterized in that described
The light transmission of first spectral module (20) and the range of reflectivity are 3:7-5:5;The light of second spectral module (30)
Transmission and the range of reflectivity are 3:7-5:5.
6. increasing material manufacturing process described in one of -4 senses off-axis monitoring system more according to claim 1, which is characterized in that institute
Stating infrared detector (42) is the focal plane InGaAs, and Chip scale is 9.6mm × 7.68mm, and resolution ratio is 320 × 256
pixels;The pixel dimension of the high resolution CCD (52) is 1.1um, and resolution ratio is 7708 × 5352 pixels;It is described inclined
Vibration CCD(62) pixel dimension be 3.45um, resolution ratio is 2448 × 2048 pixels.
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TWI811926B (en) * | 2021-12-28 | 2023-08-11 | 國家中山科學研究院 | Additive Manufacturing Dust Surface Monitoring System |
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