CN110172310A - A kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape - Google Patents
A kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape Download PDFInfo
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- CN110172310A CN110172310A CN201910412973.9A CN201910412973A CN110172310A CN 110172310 A CN110172310 A CN 110172310A CN 201910412973 A CN201910412973 A CN 201910412973A CN 110172310 A CN110172310 A CN 110172310A
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- Prior art keywords
- melt adhesive
- hot melt
- adhesive tape
- copolyamide
- solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
Abstract
The invention discloses a kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape, the non-solvent Hot melt adhesive tape is made of copolyamide, rubber, polyurethane, paraffin, terpene resin, talcum powder and foaming agent；Wherein the mass ratio of each component is respectively as follows: copolyamide: 40-65%；Rubber: 10-15%；Polyurethane: 5-10%；Paraffin: 1-5%；Terpene resin: 10-15%；Talcum powder: 5-10%；Foaming agent: 4-5%；The invention enables adhesive tapes more flexible, draftability and elasticity, increase the bonding force of layer of PVC, keep machine-shaping more excellent, it joined micro-foaming macromolecular material during the preparation process, so that Ka Ji and chip decompose in heated rear foaming agent and generate gas foaming, adhesive tape layer after foaming thickens, and microcellular structure absorbs heat, prevents chip from burning out；And the thermal resistance effect of foaming agent, package temperature is reduced, it is shorter using upper packaging time, fabrication production capacity 30-50% can be increased after shortening the heat-sealing time.
Description
Technical field
The present invention relates to Hot melt adhesive tapes, heat more particularly to a kind of contact intelligent card base and chip package non-solvent
Adhesive tape.
Background technique
With the development of electronics industry and wireless telecommunications industry, chip application field is greatly increased, therewith high-performance adhesive
Application it is also more and more extensive, hot melt adhesive as an important species in adhesive, characteristic make its effect be not easy by
Replace.Hot melt adhesive has the advantages that hot melt adhesive is a kind of adhesive of plasticity, its physical state in certain temperature range
Change with temperature and changes, and chemical characteristic is constant, it is non-toxic and tasteless, belong to environmental-protecting chemical product；With itself softening point, make
Used time, which is heated to certain temperature to it, can be used；Once heating uses, its stealthy high adhesion is played at once, with affixed object
Tight bond is not readily separated.But nonetheless, in Intelligent card package field, there are still deficiencies for existing Hot melt adhesive tape, specifically
It is embodied in following defect, melting temperature range is high, is easy scald intelligent card matrix PVC, soldering tip heat-sealing ETL estimated time of loading is long, capacity efficiency
Not high, small in the coefficient of heat insulation of heat-insulated aspect, heat transfer passes through card base and is easy scald core when card basal plane does laser bar code
Piece.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of contact intelligent card base and chip package non-solvent
Hot melt adhesive tape, can solve contact intelligent card base and chip be hot bonding do laser bar code again after encapsulation during generate
Heat is absorbed by glue film to be obstructed, and chip thermal damage is prevented.
In order to solve the above technical problems, the invention provides the following technical scheme: a kind of contact intelligent card base and chip seal
Non-solvent Hot melt adhesive tape is filled, the non-solvent Hot melt adhesive tape is by copolyamide, rubber, polyurethane, paraffin, terpenes tree
Rouge, talcum powder and foaming agent composition；Wherein the mass ratio of each component is respectively as follows:
Copolyamide: 40-65%；
Rubber: 10-15%；
Polyurethane: 5-10%；
Paraffin: 1-5%；
Terpene resin: 10-15%；
Talcum powder: 5-10%；
Foaming agent: 4-5%；
Wherein, the copolyamide of 40-65% is as bonding body material, increasing of the rubber of 10-15% as copolyamide
Tough dose, tackifier of the polyurethane of 5-10% as copolyamide, modifying agent of the paraffin of 1-5% as copolyamide, 10-
15% terpene resin is as tackifier, and the talcum powder of 5-10% is as surface thinner, and the foaming agent of 4-5% is as heat absorption
Agent.
As a preferred technical solution of the present invention, the preparation step of the non-solvent Hot melt adhesive tape are as follows:
Step 1: the raw material for standby of non-solvent Hot melt adhesive tape is weighed according to mass ratio；
Step 2: prepare polyamide hot: will weigh up the spare copolyamide of weight ratio, rubber, polyurethane, paraffin,
Terpene resin is added in reaction kettle, starts to stir when reactor temperature is risen to 60-150 DEG C, when temperature reach 200 DEG C with
Started polycondensation reaction when upper, and keeping reaction temperature is 200-320 DEG C, holding reaction pressure is 1.5-2.5MPa, reacts 1.5-
Start to bleed off pressure after 2.5h, pressure is down to normal pressure in 1-2h, the reaction was continued 1-2h obtains polyamide hot A；
Step 3: the talcum powder configured according to weight ratio is added into the reaction kettle of obtained polyamide hot, will react
Temperature in the kettle is increased to start to stir at 60-150 DEG C, keeps reaction 0.5-1h, obtains polyamide hot B；
Step 4: it prepares hot melt adhesive layer: the reaction temperature of polyamide hot B in reaction kettle is warming up to 150-160 DEG C,
Then the foaming agent that micro-foaming macromolecular is introduced in the polyamide hot B of 150-160 DEG C into reaction kettle, is stirred
After, hot melt adhesive layer is obtained within stirring 1-2 hours；
Step 5: thermosol glue-line obtained is subjected to cooling processing to 60-150 DEG C, then by the hot melt adhesive layer after cooling
It is uniformly coated in base and is packaged, non-solvent Hot melt adhesive tape is made.
As a preferred technical solution of the present invention, the copolyamide is the main body being bonded, institute as primary raw material
It states rubber to play a part of preventing low temperature brittleness, hardening, the polyurethane plays the bonding force of increase and layer of PVC, reduces encapsulation
The effect of temperature, the paraffin, which plays, increases mobility effect, and the terpene resin, which plays, increases surface thermoplastic wettability, thickening
Effect.
As a preferred technical solution of the present invention, the talcum powder plays the uniformity for increasing its bonding force, accelerates
Curing rate reduces surface tack, avoids application process because of gum to chip posterior synechia mold.
As a preferred technical solution of the present invention, the package temperature of the non-solvent Hot melt adhesive tape is 170-210
℃。
As a preferred technical solution of the present invention, the heat-sealing ETL estimated time of loading of the non-solvent Hot melt adhesive tape is 1.0-
1.5 the second.
Compared with prior art, the attainable beneficial effect of the present invention is: the present invention uses rubber as toughener, can be with
Play the role of plasticizer completely, avoids adhesive tape low temperature brittleness, hardening, make its more flexible, draftability and elasticity, effectively prevent
It is broken in the bending Qu Yingyong test of card base and Ka Ji and chip is caused to disengage；Increased using polyurethane bonding with layer of PVC
Power uses paraffin to increase mobility as auxiliary agent, keeps machine-shaping more excellent, also, the present invention is added during the preparation process
Micro-foaming macromolecular material, so that Ka Ji and chip decompose in heated rear foaming agent and generate gas foaming, after foaming
Adhesive tape layer thickens, and microcellular structure absorbs heat, prevents chip from burning out；And the thermal resistance effect of foaming agent, package temperature is reduced, is answered
It is shorter with packaging time, fabrication production capacity 30-50% can be increased after shortening the heat-sealing time.
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described, it should be understood that preferred embodiment described herein is only used
In the description and interpretation present invention, it is not intended to limit the present invention.
Embodiment 1
The present invention provides a kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape, non-solvent hot melt adhesive
Band is made of copolyamide, rubber, polyurethane, paraffin, terpene resin, talcum powder and foaming agent；The wherein quality of each component
Than being respectively as follows:
Copolyamide: 40%；
Rubber: 15%；
Polyurethane: 10%；
Paraffin: 5%；
Terpene resin: 15%；
Talcum powder: 10%；
Foaming agent: 5%；
Wherein, 40% copolyamide, which is used as, is bonded body material, toughener of 15% rubber as copolyamide,
Tackifier of 10% polyurethane as copolyamide, modifying agent of 5% paraffin as copolyamide, 15% terpene resin
As tackifier, 10% talcum powder is as surface thinner, and 5% foaming agent is as heat absorbent.
Wherein, the preparation step of non-solvent Hot melt adhesive tape are as follows:
Step 1: the raw material for standby of non-solvent Hot melt adhesive tape is weighed according to mass ratio；
Step 2: prepare polyamide hot: will weigh up the spare copolyamide of weight ratio, rubber, polyurethane, paraffin,
Terpene resin is added in reaction kettle, starts to stir when reactor temperature is risen to 60-150 DEG C, when temperature reach 200 DEG C with
Started polycondensation reaction when upper, and keeping reaction temperature is 200-320 DEG C, holding reaction pressure is 1.5-2.5MPa, reacts 1.5-
Start to bleed off pressure after 2.5h, pressure is down to normal pressure in 1-2h, the reaction was continued 1-2h obtains polyamide hot A；
Step 3: the talcum powder configured according to weight ratio is added into the reaction kettle of obtained polyamide hot, will react
Temperature in the kettle is increased to start to stir at 60-150 DEG C, keeps reaction 0.5-1h, obtains polyamide hot B；
Step 4: it prepares hot melt adhesive layer: the reaction temperature of polyamide hot B in reaction kettle is warming up to 150-160 DEG C,
Then the foaming agent that micro-foaming macromolecular is introduced in the polyamide hot B of 150-160 DEG C into reaction kettle, is stirred
After, hot melt adhesive layer is obtained within stirring 1-2 hours；
Step 5: thermosol glue-line obtained is subjected to cooling processing to 60-150 DEG C, then by the hot melt adhesive layer after cooling
It is uniformly coated in base and is packaged, non-solvent Hot melt adhesive tape is made.
Copolyamide is the main body being bonded as primary raw material, and rubber plays a part of preventing low temperature brittleness, hardening, poly- ammonia
Ester plays a part of the bonding force of increase and layer of PVC, reduces package temperature, and paraffin, which plays, increases mobility effect, terpene resin
It playing and increases surface thermoplastic wettability, tackifying effect, talcum powder plays the uniformity for increasing its bonding force, accelerate curing rate,
Surface tack is reduced, avoids application process because of gum to chip posterior synechia mold, the package temperature of non-solvent Hot melt adhesive tape
It is 170-210 DEG C, the heat-sealing ETL estimated time of loading of non-solvent Hot melt adhesive tape is 1.0-1.5 seconds.
Embodiment 2
The present invention provides a kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape, it is characterised in that: non-
Solvent type Hot melt adhesive tape is made of copolyamide, rubber, polyurethane, paraffin, terpene resin, talcum powder and foaming agent；Wherein
The mass ratio of each component is respectively as follows:
Copolyamide: 65%；
Rubber: 10%；
Polyurethane: 5%；
Paraffin: 1%；
Terpene resin: 10%；
Talcum powder: 5%；
Foaming agent: 4%；
Wherein, 65% copolyamide, which is used as, is bonded body material, toughener of 10% rubber as copolyamide,
Tackifier of 5% polyurethane as copolyamide, modifying agent of 1% paraffin as copolyamide, 10% terpene resin
As tackifier, 5% talcum powder is as surface thinner, and 4% foaming agent is as heat absorbent.
The preparation step of non-solvent Hot melt adhesive tape are as follows:
Step 1: the raw material for standby of non-solvent Hot melt adhesive tape is weighed according to mass ratio；
Step 2: prepare polyamide hot: will weigh up the spare copolyamide of weight ratio, rubber, polyurethane, paraffin,
Terpene resin is added in reaction kettle, starts to stir when reactor temperature is risen to 60-150 DEG C, when temperature reach 200 DEG C with
Started polycondensation reaction when upper, and keeping reaction temperature is 200-320 DEG C, holding reaction pressure is 1.5-2.5MPa, reacts 1.5-
Start to bleed off pressure after 2.5h, pressure is down to normal pressure in 1-2h, the reaction was continued 1-2h obtains polyamide hot A；
Step 3: the talcum powder configured according to weight ratio is added into the reaction kettle of obtained polyamide hot, will react
Temperature in the kettle is increased to start to stir at 60-150 DEG C, keeps reaction 0.5-1h, obtains polyamide hot B；
Step 4: it prepares hot melt adhesive layer: the reaction temperature of polyamide hot B in reaction kettle is warming up to 150-160 DEG C,
Then the foaming agent that micro-foaming macromolecular is introduced in the polyamide hot B of 150-160 DEG C into reaction kettle, is stirred
After, hot melt adhesive layer is obtained within stirring 1-2 hours；
Step 5: thermosol glue-line obtained is subjected to cooling processing to 60-150 DEG C, then by the hot melt adhesive layer after cooling
It is uniformly coated in base and is packaged, non-solvent Hot melt adhesive tape is made.
Copolyamide is the main body being bonded as primary raw material, and rubber plays a part of preventing low temperature brittleness, hardening, poly- ammonia
Ester plays a part of the bonding force of increase and layer of PVC, reduces package temperature, and paraffin, which plays, increases mobility effect, terpene resin
It playing and increases surface thermoplastic wettability, tackifying effect, talcum powder plays the uniformity for increasing its bonding force, accelerate curing rate,
Surface tack is reduced, avoids application process because of gum to chip posterior synechia mold, the package temperature of non-solvent Hot melt adhesive tape
It is 170-210 DEG C, the heat-sealing ETL estimated time of loading of non-solvent Hot melt adhesive tape is 1.0-1.5 seconds.
The present invention uses rubber as toughener, can play the role of plasticizer completely, avoids adhesive tape low temperature brittleness, hard
Change, make its more flexible, draftability and elasticity, effectively prevent card base bending Qu Yingyong test in be broken and cause Ka Ji with
Chip disengages；Increase the bonding force with layer of PVC using polyurethane, uses paraffin to increase mobility as auxiliary agent, make to be processed into
Type is more excellent, also, the present invention joined micro-foaming macromolecular material during the preparation process so that Ka Ji and chip by
Hot rear foaming agent, which decomposes, generates gas foaming, and the adhesive tape layer after foaming thickens, and microcellular structure absorbs heat, prevents chip from burning out；
And the thermal resistance effect of foaming agent, package temperature is reduced, it is shorter using upper packaging time, fabrication can be increased after shortening the heat-sealing time
Production capacity 30-50%.
The implementation of the present invention is not limited to this, and above-described embodiment content according to the invention utilizes the routine of this field
Technological know-how and customary means, under the premise of not departing from above-mentioned basic fundamental thought of the invention, preferred embodiment above can be with
The modification, replacement or combination of other diversified forms are made, other embodiments obtained all fall within rights protection scope of the present invention
Within.
Claims (6)
1. a kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape, it is characterised in that: the non-solvent heat
Melten gel band is made of copolyamide, rubber, polyurethane, paraffin, terpene resin, talcum powder and foaming agent；Wherein each component
Mass ratio is respectively as follows:
Copolyamide: 40-65%；
Rubber: 10-15%；
Polyurethane: 5-10%；
Paraffin: 1-5%；
Terpene resin: 10-15%；
Talcum powder: 5-10%；
Foaming agent: 4-5%；
Wherein, the copolyamide of 40-65%, which is used as, is bonded body material, toughener of the rubber of 10-15% as copolyamide,
Tackifier of the polyurethane of 5-10% as copolyamide, modifying agent of the paraffin of 1-5% as copolyamide, 10-15%'s
Terpene resin is as tackifier, and the talcum powder of 5-10% is as surface thinner, and the foaming agent of 4-5% is as heat absorbent.
2. a kind of contact intelligent card base according to claim 1 and chip package non-solvent Hot melt adhesive tape, feature
It is: the preparation step of the non-solvent Hot melt adhesive tape are as follows:
Step 1: the raw material for standby of non-solvent Hot melt adhesive tape is weighed according to mass ratio；
Step 2: it prepares polyamide hot: the spare copolyamide of weight ratio, rubber, polyurethane, paraffin, terpenes will be weighed up
Resin is added in reaction kettle, starts to stir when reactor temperature is risen to 60-150 DEG C, when temperature reaches 200 DEG C or more
Start polycondensation reaction, and keeping reaction temperature is 200-320 DEG C, holding reaction pressure is 1.5-2.5MPa, reacts 1.5-2.5h
After start to bleed off pressure, pressure is down to normal pressure in 1-2h, the reaction was continued 1-2h obtains polyamide hot A；
Step 3: the talcum powder configured according to weight ratio being added into the reaction kettle of obtained polyamide hot, will be in reaction kettle
Temperature is increased to start to stir at 60-150 DEG C, keeps reaction 0.5-1h, obtains polyamide hot B；
Step 4: it prepares hot melt adhesive layer: the reaction temperature of polyamide hot B in reaction kettle being warming up to 150-160 DEG C, then
The foaming agent that micro-foaming macromolecular is introduced in 150-160 DEG C of the polyamide hot B into reaction kettle, is stirred
Afterwards, hot melt adhesive layer is stirred 1-2 hours to obtain；
Step 5: carrying out cooling for thermosol glue-line obtained and handle to 60-150 DEG C, then that the hot melt adhesive layer after cooling is uniform
Be coated in base and be packaged, non-solvent Hot melt adhesive tape is made.
3. a kind of contact intelligent card base according to claim 1 and chip package non-solvent Hot melt adhesive tape, feature
Be: the copolyamide is the main body being bonded as primary raw material, and the rubber plays the work for preventing low temperature brittleness, hardening
With the polyurethane plays a part of the bonding force of increase and layer of PVC, reduces package temperature, and the paraffin plays increase flowing
Property effect, the terpene resin play increase surface thermoplastic wettability, tackifying effect.
4. a kind of contact intelligent card base according to claim 1 and chip package non-solvent Hot melt adhesive tape, feature
Be: the talcum powder plays the uniformity for increasing its bonding force, accelerates curing rate, reduces surface tack, avoids applying
Process is because of gum to chip posterior synechia mold.
5. a kind of contact intelligent card base according to claim 1 and chip package non-solvent Hot melt adhesive tape, feature
Be: the package temperature of the non-solvent Hot melt adhesive tape is 170-210 DEG C.
6. a kind of contact intelligent card base according to claim 1 and chip package non-solvent Hot melt adhesive tape, feature
Be: the heat-sealing ETL estimated time of loading of the non-solvent Hot melt adhesive tape is 1.0-1.5 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910412973.9A CN110172310A (en) | 2019-05-17 | 2019-05-17 | A kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910412973.9A CN110172310A (en) | 2019-05-17 | 2019-05-17 | A kind of contact intelligent card base and chip package non-solvent Hot melt adhesive tape |
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| CN110172310A true CN110172310A (en) | 2019-08-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110564337A (en) * | 2019-09-12 | 2019-12-13 | 天津伟景诺兰达科技有限公司 | ACF conductive adhesive tape and preparation process and application thereof |
| CN112226176A (en) * | 2020-09-14 | 2021-01-15 | 东莞市新懿电子材料技术有限公司 | Preparation method of hot melt adhesive tape special for electronic chip packaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110564337A (en) * | 2019-09-12 | 2019-12-13 | 天津伟景诺兰达科技有限公司 | ACF conductive adhesive tape and preparation process and application thereof |
| CN112226176A (en) * | 2020-09-14 | 2021-01-15 | 东莞市新懿电子材料技术有限公司 | Preparation method of hot melt adhesive tape special for electronic chip packaging |
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