CN110165543B - Spherical semiconductor laser based on moist heating high temperature cooling - Google Patents

Spherical semiconductor laser based on moist heating high temperature cooling Download PDF

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Publication number
CN110165543B
CN110165543B CN201910436393.3A CN201910436393A CN110165543B CN 110165543 B CN110165543 B CN 110165543B CN 201910436393 A CN201910436393 A CN 201910436393A CN 110165543 B CN110165543 B CN 110165543B
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laser
laser head
frame
head
ball
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CN201910436393.3A
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CN110165543A (en
Inventor
陈玉兰
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Quanzhou Dongai Machinery Manufacturing Co., Ltd
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Quanzhou Dongai Machinery Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment

Abstract

The invention discloses a spherical semiconductor laser based on moist heating and high-temperature cooling, which structurally comprises a laser head and a ball frame, wherein the laser head is arranged on the ball frame and comprises a right laser head, a front laser head, an upper laser head, a rear laser head, a left laser head and a lower laser head; the built-in ball rack is rectangular, the inside of the laser machine is effectively cooled or heated comprehensively through the cooling fan and the heating pipe, and the deformation of the material inside the laser machine caused by overhigh temperature or humidity is prevented; the equipment can stably operate, the service life is effectively prolonged, and the processing quality of products is ensured.

Description

Spherical semiconductor laser based on moist heating high temperature cooling
Technical Field
The invention relates to the field of semiconductors, in particular to a spherical semiconductor laser based on moist heating and high-temperature cooling.
Background
Semiconductor lasers, also known as laser diodes, are lasers using semiconductor materials as working substances; the semiconductor diode laser is the most practical and important laser, has small volume and long service life, can pump the working voltage and current thereof by adopting a simple current injection mode to be compatible with an integrated circuit, and directly carries out current modulation by using the frequency up to GHz to obtain high-speed modulated laser output.
In the prior art, the semiconductor laser chip can cause deformation of the materials in the chip due to high and low temperature, and the electronic product can be afraid of extreme humid weather; the temperature has certain influence on the output power of the semiconductor laser, and because the semiconductor laser can generate certain heat when in operation, the heat is overlarge, the semiconductor is not cooled timely and effectively, the output power of the semiconductor laser is unstable, and the product quality and the service life of the semiconductor laser are directly influenced.
Disclosure of Invention
The invention mainly aims to overcome the defects of the prior art and provide a spherical semiconductor laser based on moist heating and high-temperature cooling, so that the problems that the material in the semiconductor laser chip can be deformed due to high and low temperatures and an electronic product is afraid of extreme moist weather are solved; the temperature has certain influence on the output power of the semiconductor laser, and because the semiconductor laser can generate certain heat when in operation, the heat is overlarge, the semiconductor is not cooled timely and effectively, the output power of the semiconductor laser is unstable, and the product quality and the service life of the semiconductor laser are directly influenced.
The invention is realized by adopting the following technical scheme: the utility model provides a spherical semiconductor laser based on moist heating high temperature cooling, its structure includes laser head, ball-collecting rack, the laser head is installed on the ball-collecting rack and the two constitutes and is the integral structure, the laser head includes right laser head, preceding laser head, goes up laser head, back laser head, left laser head, lower laser head, right laser head is the same with preceding laser head, last laser head, back laser head, left laser head, lower laser head structure.
Further preferred, preceding laser head includes laser circle frame, laser screen, circle magnetism, laser mouth, the locking of laser circle frame and laser screen, the laser screen is located laser circle frame right-hand member, the laser screen is glued with circle magnetism left end and is connected, laser screen mid-mounting has the laser mouth.
Further preferably, movable strips are installed at the upper end and the lower end of the laser circular frame, lenses are installed at the right end of the laser port, and the laser circular frame, the laser screen and the movable strips are locked at the left end and the right end.
Further preferably, the ball rack is provided with a rack ring, a rectangular frame and an integrated device, the front side and the rear side of the rack ring are welded with the rectangular frame, and the front side and the rear side of the integrated device are arranged on the rack ring.
Preferably, the integrated device comprises a cooling fan, a heating pipe, a mounting lock ring and an integrated frame, wherein the cooling fan and the heating pipe are connected with the integrated frame through frame glue, and the mounting lock ring is locked with the front side and the rear side of the integrated frame.
Preferably, the frame ring and the ball frame are in clearance fit and embedded, the front side and the rear side of the rectangular frame are connected with the ball frame through glue, and the center of the frame ring is connected with the installation locking ring shaft.
Further preferably, right laser head, preceding laser head, go up laser head, back laser head, left laser head, lower laser head are the distribution of circle.
Further preferably, the laser head and the ball frame are in concentric circles and form an integrated structure, and the ball frame is of a rectangular structure.
Advantageous effects
The laser is installed on equipment, one of a right laser head, a front laser head, an upper laser head, a rear laser head, a left laser head and a lower laser head is selected according to a required laser point to operate, and if the right laser head is selected, the left laser head is arranged at the position opposite to the right laser head at the installation point of the laser head; the upper laser head further strengthens and secures the mounting point through magnetic adsorption, and the laser port is a laser emitting port; the integrated device rotates on the frame ring in a ring shape, if the temperature of the laser is too high, the cooling fan performs air-out cooling, and if the laser is heated by the moist heating pipe, the laser sends hot air out through the cooling fan; when the laser instrument carries out the laser to the laser point, if the activity duration is longer, laser instrument self temperature can continuously heat up, selects right laser head, preceding laser head promptly, goes up laser head, back laser head, left laser head, one of them with right laser head replacement of laser head down, along with the mounting point also then switches, has avoided the continuation of right laser head to heat up and has also prolonged the life of laser head.
Compared with the prior art, the invention has the beneficial effects that: by installing a plurality of laser heads including a right laser head, a front laser head, an upper laser head, a rear laser head, a left laser head and a lower laser head, when the operating laser heads have longer operating time and are continuously heated, the operating laser heads can be switched to cool the operating laser heads, so that the service life of the laser is effectively prolonged; the built-in ball rack is rectangular, the inside of the laser machine is effectively cooled or heated comprehensively through the cooling fan and the heating pipe, and the deformation of the material inside the laser machine caused by overhigh temperature or humidity is prevented; the equipment can stably operate, the service life is effectively prolonged, and the processing quality of products is ensured.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 shows a schematic structural diagram of a spherical semiconductor laser based on moist heating and high-temperature cooling according to the invention.
Fig. 2 shows a schematic diagram of the front view of the semiconductor laser of the present invention.
Fig. 3 shows a front cut-away schematic view of a semiconductor laser according to the present invention.
Fig. 4 shows a schematic of the structure of the front laser head of the present invention.
Fig. 5 shows a schematic diagram of the structure of the right laser head of the present invention.
Fig. 6 shows a schematic structural view of the rack of the present invention.
Fig. 7 shows a schematic structural view of an integrated device of the present invention.
In the figure: the laser head 2, the ball holder 3, the right laser head 20, the front laser head 21, the upper laser head 22, the rear laser head 23, the left laser head 24, the lower laser head 25, the laser circular frame s20, the laser screen s21, the circular magnet s22, the laser port s23, the movable strip s200, the lens s230, the holder ring 30, the rectangular frame 31, the integrated device 32, the cooling fan 320, the heating pipe 321, the mounting lock ring 322 and the integrated frame 323.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution of a spherical semiconductor laser based on moist heating and high temperature cooling: its structure includes laser head 2, ball frame 3, laser head 2 installs on ball frame 3, laser head 2 includes right laser head 20, preceding laser head 21, goes up laser head 22, back laser head 23, left laser head 24, laser head 25 down, right laser head 20 is the same with preceding laser head 21, goes up laser head 22, back laser head 23, left laser head 24, laser head 25 structure down, preceding laser head 21 includes laser circle frame s20, laser screen s21, circle magnetism s22, laser mouth s23, laser circle frame s20 and laser screen s21 locking, laser screen s21 glues with circle magnetism s22 and is connected, circle magnetism s22 acts on adsorbing on equipment, improves the steadiness that the laser instrument installed on equipment, laser mouth s23 is installed to laser screen s21, laser mouth s23 is the export of taking place the laser, movable strip s200 is installed to laser circle frame s20, laser mouth s23 has installed s230 lens, the laser round frame s20 and the laser screen s21 are locked by a movable bar s200, the s200 plays a role of reinforcement, the ball rack 3 is provided with a frame ring 30, a rectangular frame 31 and an integrated device 32, the frame ring 30 is welded with the rectangular frame 31, the integrated device 32 is arranged on the frame ring 30, the integrated device 32 is distributed in a rectangular shape and the integrated device 32 realizes annular rotation through the frame ring 30, the uniformity of the laser during cooling and heating is improved, the integrated device 32 comprises a cooling fan 320, a heating pipe 321, an installation lock ring 322 and an integrated frame 323, the cooling fan 320 and the heating pipe 321 are arranged on the integrated frame 323, the installation lock ring 322 is locked with the integrated frame 323, the cooling fan 320 is used for blowing cold air, the heating pipe 321 is used for heating to blow hot air out the cooling fan 320, the frame ring 30 is in clearance fit with the ball rack 3, the rectangular frame 31 is connected with the ball rack 3 by glue, the frame ring 30 is connected with the installation lock ring 322 by a, right side laser head 20, preceding laser head 21, go up laser head 22, back laser head 23, left laser head 24, laser head 25 down are the circle form and distribute, possess regularity for it is more convenient to switch and install, laser head 2 is in concentric circles and the two constitutes structure as an organic whole with ball frame 3, ball frame 3 is the rectangle structure, distribution that can be even is in 3, guarantees to the holistic cooling of laser instrument and heating.
The laser is installed on equipment, one of a right laser head 20, a front laser head 21, an upper laser head 22, a rear laser head 23, a left laser head 24 and a lower laser head 25 is selected according to a required laser point to operate, and if the right laser head 20 is selected, the installation point of the laser head 2 is the left laser head 24 at the opposite position of the right laser head 20; the upper laser head 22 further strengthens and secures the mounting point through magnetic adsorption, and the laser port s23 is a laser emitting port; the integrated device 32 rotates on the frame ring 30 in a ring shape, if the temperature of the laser is higher than that of the cooling fan 320, the air is discharged and cooled, and if the laser is heated by the moist heating pipe 321, hot air is sent out by the cooling fan 320; when the laser instrument carries out the laser to the laser point, if the activity duration is longer, laser instrument self temperature can continuously heat up, select right laser head 20 promptly, preceding laser head 21, go up laser head 22, back laser head 23, left laser head 24, one of them of lower laser head 25 with right laser head 20 replacement, along with the mounting point also then switches, avoided the continuation intensification of right laser head 20 also prolonged laser head 2's life.
Compared with the prior art, the invention has the technical progress that: by installing the plurality of laser heads including the right laser head 20, the front laser head 21, the upper laser head 22, the rear laser head 23, the left laser head 24 and the lower laser head 25, when the running laser heads are continuously heated for a long time, the temperature of the running laser heads can be reduced by switching the laser heads, so that the service life of the laser is effectively prolonged; the built-in ball rack 3 is rectangular, the inside of the laser machine is effectively cooled or heated comprehensively through the cooling fan 320 and the heating pipe 321, and the deformation of the material inside the laser machine caused by overhigh temperature or humidity is prevented; the equipment can stably operate, the service life is effectively prolonged, and the processing quality of products is ensured.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims (1)

1. The utility model provides a spherical semiconductor laser based on moist heating high temperature cooling, its structure includes laser head (2), ball frame (3), install on ball frame (3) laser head (2), its characterized in that:
the laser head (2) comprises a right laser head (20), a front laser head (21), an upper laser head (22), a rear laser head (23), a left laser head (24) and a lower laser head (25), and the right laser head (20) has the same structure as the front laser head (21), the upper laser head (22), the rear laser head (23), the left laser head (24) and the lower laser head (25);
the front laser head (21) comprises a laser round frame (s 20), a laser screen (s 21), a round magnet (s 22) and a laser port (s 23), the laser round frame (s 20) is locked with the laser screen (s 21), the laser screen (s 21) is connected with the round magnet (s 22) through glue, and the laser port (s 23) is installed on the laser screen (s 21);
the laser round frame (s 20) is provided with a movable strip (s 200), the laser port (s 23) is provided with a lens (s 230), and the laser round frame (s 20) and the laser screen (s 21) are locked through the movable strip (s 200);
the ball rack (3) is provided with a rack ring (30), a rectangular frame (31) and an integrated device (32), the rack ring (30) is welded with the rectangular frame (31), and the integrated device (32) is arranged on the rack ring (30);
the integrated device (32) comprises a cooling fan (320), a heating pipe (321), an installation lock ring (322) and an integrated frame (323), wherein the cooling fan (320) and the heating pipe (321) are installed on the integrated frame (323), and the installation lock ring (322) is locked with the integrated frame (323);
the frame ring (30) is in clearance fit with the ball frame (3), the rectangular frame (31) is connected with the ball frame (3) through glue, and the frame ring (30) is connected with a mounting lock ring (322) through a shaft;
the right laser head (20), the front laser head (21), the upper laser head (22), the rear laser head (23), the left laser head (24) and the lower laser head (25) are distributed in a circular shape;
laser head (2) and ball frame (3) are in the concentric circles and the two constitutes as integral structure, ball frame (3) are the rectangle structure.
CN201910436393.3A 2019-05-23 2019-05-23 Spherical semiconductor laser based on moist heating high temperature cooling Active CN110165543B (en)

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CN201910436393.3A CN110165543B (en) 2019-05-23 2019-05-23 Spherical semiconductor laser based on moist heating high temperature cooling

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Application Number Priority Date Filing Date Title
CN201910436393.3A CN110165543B (en) 2019-05-23 2019-05-23 Spherical semiconductor laser based on moist heating high temperature cooling

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CN110165543A CN110165543A (en) 2019-08-23
CN110165543B true CN110165543B (en) 2020-10-09

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101701680B (en) * 2009-11-17 2011-04-06 深圳市中照灯具制造有限公司 Multifaceted light-emitting LED light source and manufacturing method thereof
CN202629688U (en) * 2012-05-22 2012-12-26 周志坚 Multipurpose 360 degrees three dimensional luminous light-emitting diode (LED) lamp
CN103227411B (en) * 2013-04-19 2015-08-19 深圳英诺激光科技有限公司 A kind of distinguished and admirable pair causes constant temperature laser and constant temperature method thereof
CN204116999U (en) * 2014-10-08 2015-01-21 北京国科欣翼科技有限公司 Temperature control system of semiconductor laser
CN204611519U (en) * 2015-05-13 2015-09-02 广州市浩洋电子有限公司 A kind of stage lighting of multi-angle luminescence
CN205919824U (en) * 2016-07-28 2017-02-01 扬州全昌江信光电有限公司 Automatic eight line laser line instrument of leveling
CN207474914U (en) * 2017-11-14 2018-06-08 泉州市君贤网络科技有限公司 A kind of spherical semiconductor laser

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Effective date of registration: 20200911

Address after: 362100 West Lake 169, West Lake Town, East Bridge Town, Huian County, Quanzhou, Fujian

Applicant after: Quanzhou Dongai Machinery Manufacturing Co., Ltd

Address before: E5 Business Oasis, Caohe Jingkang Bridge, 2555 Xiupu Road, Pudong New Area, Shanghai, 200120

Applicant before: Chen Yulan

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