CN110165085B - Display panel and preparation method thereof - Google Patents
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- CN110165085B CN110165085B CN201910569224.7A CN201910569224A CN110165085B CN 110165085 B CN110165085 B CN 110165085B CN 201910569224 A CN201910569224 A CN 201910569224A CN 110165085 B CN110165085 B CN 110165085B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Abstract
The application discloses display panel and preparation method thereof, display panel includes: a substrate; the light-emitting layer is arranged on one side of the substrate and comprises a plurality of pixel defining blocks and light-emitting units positioned between the pixel defining blocks; the packaging layer is positioned on one side of the light-emitting layer, which is far away from the substrate; the touch layer is positioned on one side, away from the light emitting layer, of the packaging layer; and a black insulating block is arranged in the area of the packaging layer and/or the touch layer corresponding to the pixel defining block. In this way, this application can utilize black insulating block to absorb external environment light, and then reduces display panel's reflectivity.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
At present, the display panel generally includes a metal layer, such as an anode in a top emission display panel, a cathode in a bottom emission display panel, and the like. In order to reduce the reflection of the surface of the metal layer to the external ambient light, a polarizer may be disposed on one side of the light emitting surface of the display panel. The polaroid can reduce the reflection of the metal layer to the external environment light, and improve the contrast of the display panel under strong light.
In the long-term research process, the inventor of the present application finds that the improvement of each layer of material in the existing polarizer is not mature, and the display panel still has the problem of high reflectivity, and needs to take further measures to reduce the reflectivity of the display panel.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a display panel and a preparation method thereof, wherein the black insulating block can be used for absorbing external environment light, and then the reflectivity of the display panel is reduced.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a display panel including: a substrate; the light-emitting layer is arranged on one side of the substrate and comprises a plurality of pixel defining blocks and light-emitting units positioned between the pixel defining blocks; the packaging layer is positioned on one side of the light-emitting layer, which is far away from the substrate; the touch layer is positioned on one side, away from the light emitting layer, of the packaging layer; and a black insulating block is arranged in the area of the packaging layer and/or the touch layer corresponding to the pixel defining block.
Wherein the touch layer comprises: a plurality of touch electrodes; the insulating layer covers the touch electrodes and is filled between the touch electrodes; wherein the black insulating block is located in the insulating layer.
The touch control device comprises a plurality of touch control electrodes, a plurality of touch control electrodes and a plurality of touch control circuit, wherein the touch control electrodes comprise a plurality of transmitting electrodes, a plurality of receiving electrodes and a plurality of bridging electrodes, the transmitting electrodes and the receiving electrodes are positioned on a first metal layer and are arranged in a crossed mode, one of the transmitting electrodes and the receiving electrodes is disconnected at the crossed position of the transmitting electrodes and the receiving electrodes, and the bridging electrodes are connected across the other of the transmitting electrodes and the receiving electrodes; the insulating layer includes a first sub-insulating layer covering the first metal layer and a second sub-insulating layer covering the bridge electrode and a region between the bridge electrode and the first metal layer.
And the black insulating block is arranged in the area, corresponding to the pixel defining block, of the first sub insulating layer and/or the second sub insulating layer.
The bridging electrode is arranged far away from the packaging layer relative to the first metal layer.
Wherein the packaging layer comprises an organic layer, and the black insulating block is positioned in the organic layer.
Wherein the display panel further comprises: and the polaroid is positioned on one side of the touch layer, which is far away from the packaging layer, and is formed on the touch layer in a coating or ink-jet printing mode.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method of manufacturing a display panel, the method including: forming a light emitting layer on a substrate, the light emitting layer including a plurality of pixel defining blocks and light emitting cells between the pixel defining blocks; forming an encapsulation layer on one side of the light-emitting layer, which is far away from the substrate; forming a touch layer on one side of the packaging layer, which is far away from the substrate; and a black insulating block is formed in the area, corresponding to the pixel defining block, of the packaging layer and/or the touch layer.
Wherein, the forming of the touch layer on the side of the encapsulation layer away from the substrate comprises: forming a patterned first metal layer on the side of the packaging layer far away from the light-emitting layer, wherein the first metal layer comprises a plurality of transmitting electrodes and a plurality of receiving electrodes which are arranged in a crossed manner, and one of the transmitting electrodes and the receiving electrodes is disconnected at the crossed position; forming a first sub-insulating layer on one side of the first metal layer, which is far away from the packaging layer, wherein the first sub-insulating layer covers the first metal layer; forming a patterned second metal layer on one side of the first sub-insulating layer, which is far away from the packaging layer, wherein the second metal layer comprises a plurality of bridge electrodes, the bridge electrodes are correspondingly arranged at the intersections of the transmitting electrodes and the receiving electrodes, and two ends of the bridge electrodes are connected with the transmitting electrodes and the receiving electrodes in a disconnected manner through the first sub-insulating layer; forming a second sub-insulating layer on one side, far away from the packaging layer, of the first sub-insulating layer, wherein the second sub-insulating layer covers the second metal layer and an area between the first metal layer and the second metal layer; wherein the black insulating block is formed in a region of the first sub-insulating layer and/or the second sub-insulating layer corresponding to the pixel defining block.
Wherein, the forming of the encapsulation layer on the side of the light-emitting layer far away from the substrate comprises: and forming an organic layer on one side of the light-emitting layer, which is far away from the substrate, wherein a black insulating block is formed in the region of the organic layer, which corresponds to the pixel defining block.
The beneficial effect of this application is: different from the prior art, the display panel provided by the application comprises the packaging layer and the touch layer, and the black insulating block is arranged in the area of the packaging layer and/or the touch layer corresponding to the pixel defining block. On one hand, the black insulating block is correspondingly arranged at the position of the pixel defining block which does not emit light, so that the black insulating block does not influence the light emitting effect of the light emitting unit; on the other hand, the black insulating block may absorb a portion of the external ambient light, thereby reducing the external ambient light incident on a metal layer of the display panel (e.g., an anode in a top emission display panel, a cathode in a bottom emission display panel, etc.), and further reducing the reflected light reflected by the metal layer, thereby reducing the reflectivity of the display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic top view of one embodiment of a display panel according to the present application;
FIG. 2 is a schematic cross-sectional view of one embodiment of the display panel of FIG. 1 along line A-A;
FIG. 3 is a schematic cross-sectional view of the touch layer of FIG. 1 taken along line B-B according to one embodiment;
FIG. 4 is a schematic cross-sectional view of another embodiment of the display panel of FIG. 1 along line A-A;
FIG. 5 is a schematic cross-sectional view of another embodiment of the display panel of FIG. 1 along line A-A;
FIG. 6 is a schematic cross-sectional view of another embodiment of the display panel of FIG. 1 along line A-A;
FIG. 7 is a schematic cross-sectional view of another embodiment of the display panel of FIG. 1 along line A-A;
FIG. 8 is a schematic cross-sectional view of another embodiment of the display panel of FIG. 1 along line A-A;
fig. 9 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1-2, fig. 1 is a schematic top view of a display panel according to an embodiment of the present disclosure, and fig. 2 is a schematic cross-sectional view of the display panel shown in fig. 1 along the line a-a. The display panel may be an OLED display panel, a Micro-OLED display panel, or the like, the display panel including:
a substrate 10; in this embodiment, the substrate 10 may be a flexible substrate, and the material thereof may be polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like; of course, in other embodiments, the substrate 10 may be a rigid substrate, and the material thereof may be silicon or the like.
The light emitting layer 12 is disposed on one side of the substrate 10, and includes a plurality of pixel defining blocks 120 and light emitting cells 122 between the pixel defining blocks 120. The pixel defining block 120 may be made of a photoresist, and the photoresist may include at least one of polyimide, polymethyl methacrylate, and organic silane. The cross section of the pixel defining block 120 in the direction perpendicular to the substrate 10 may be rectangular in fig. 2, trapezoidal, or the like. The light emitting unit 122 may include a red light emitting unit R, a blue light emitting unit B, and a green light emitting unit G, which may be sequentially formed in an area defined by the pixel defining block 120 by a metal or non-metal mask, and the heights of the formed red light emitting unit R, blue light emitting unit B, and green light emitting unit G do not exceed the height of the pixel defining block 120. In addition, in the present embodiment, the light emitting areas of the red light emitting unit R, the blue light emitting unit B, and the green light emitting unit G may be different, for example, the light emitting area of the blue light emitting unit B is larger than the light emitting areas of the red light emitting unit R and the green light emitting unit G in consideration of the light emitting life. In addition, in this embodiment, the light emitting layer 12 may further include an anode in a top emission display panel or a cathode in a bottom emission display panel, and the material of the anode or the cathode may include metal. When the external ambient light is incident on the metal layer in the light-emitting layer 12, the surface of the metal layer generates reflected light. In addition, in other embodiments, a thin film transistor layer may be further included between the substrate 10 and the light emitting layer 12 of the display panel.
The packaging layer 14 is positioned on one side of the light-emitting layer 12, which is far away from the substrate 10, and is used for isolating external water and oxygen so as to reduce the corrosion of the external water and oxygen to the light-emitting layer 12; in this embodiment, the encapsulation layer 14 may take the form of a thin film encapsulation, which may be formed by a first inorganic layer-organic layer-second inorganic layer stack. The method for forming the first inorganic layer and the second inorganic layer may be a chemical vapor deposition method, and the like, and the material of the first inorganic layer and the second inorganic layer may be a non-metal oxide or a metal oxide, and the non-metal oxide includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the metal oxide includes at least one of alumina, zirconia, and titania. The method for forming the organic layer may be ink-jet printing, coating, or the like, and the material of the organic layer may be acrylic (for example, polymethyl methacrylate or the like), silicone (for example, polymethyl monophenyl vinyl siloxane or the like), epoxy (for example, epoxy resin or the like) organic material, or the like.
The touch layer 16 is positioned on one side of the packaging layer 14 away from the light-emitting layer 12; the touch layer 16 may be a resistive touch layer or a capacitive touch layer, and the structure of the touch layer 16 will be described later.
In this embodiment, the black insulating block 18 is disposed in a region of the encapsulation layer 14 and/or the touch layer 16 of the display panel corresponding to the pixel defining block 120, and the material of the black insulating block 18 may be a low temperature organic insulating layer material OC, resin, or the like. On one hand, since the black insulating block 18 is correspondingly disposed at the position of the pixel defining block 120 which does not emit light, the black insulating block 18 does not affect the light emitting effect of the light emitting unit 122; on the other hand, the black insulating block 18 may absorb a portion of the ambient light, so that the ambient light incident on the metal layer of the display panel is reduced, and the reflected light reflected by the metal layer is further reduced, thereby reducing the reflectivity of the display panel.
In one embodiment, the touch layer 16 includes: a plurality of touch electrodes 160; an insulating layer 162 covering the touch electrodes 160 and filling the space between the touch electrodes 160; wherein the black insulating block 18 is located in the insulating layer 162. The design method and the process of the black insulating block 18 are simple and easy to realize.
In an application scenario, as shown in fig. 1 and fig. 2, the touch electrodes 160 include a plurality of transmitting electrodes TX, a plurality of receiving electrodes RX, and a plurality of bridging electrodes 1600, where the transmitting electrodes TX and the receiving electrodes RX are located in the first metal layer M1 and are arranged in a crossed manner; in this embodiment, the plurality of transmitting electrodes TX may be arranged at intervals and extend along a first direction, and the plurality of receiving electrodes RX may be arranged at intervals and extend along a second direction, where the first direction may be perpendicular to the second direction or form an acute angle. In order to prevent mutual insulation between the transmitting electrode TX and the receiving electrode RX disposed on the same layer from being affected, as shown in fig. 3, fig. 3 is a schematic cross-sectional view of the touch layer along line B-B in fig. 1. One of the transmit electrode TX and the receive electrode RX is disconnected at the intersection of the two and connected across the other of the transmit electrode TX and the receive electrode RX by the bridge electrode 1600; that is, both ends of the bridge electrode 1600 may be connected to the disconnected transmitting electrode TX or the disconnected receiving electrode RX, and the bridge electrode 1600 is disposed at a different layer from the first metal layer M1 where the transmitting electrode TX and the receiving electrode RX are located.
With reference to fig. 2 or fig. 3, the insulating layer 162 includes a first sub-insulating layer 1620 and a second sub-insulating layer 1622, the first sub-insulating layer 1620 covers the first metal layer M1, and the second sub-insulating layer 1622 covers the bridge electrode 1600 and the region between the bridge electrode 1600 and the first metal layer M1.
In the present embodiment, the touch electrode 160 and the insulating layer 162 are simple in design, mature in process and easy to implement.
Further, in the present embodiment, as shown in fig. 2 or fig. 3, the black insulating block 18 is provided in the second sub insulating layer 1622 in a region corresponding to the pixel defining block 120; the design mode has a simple structure, mature process and easy realization; when the bridge electrode 1600 is made of metal and the black insulating block 18 covers the bridge electrode 1600, the design method can further reduce the reflection of the bridge electrode 1600 to the external ambient light, thereby further reducing the reflectivity of the display panel. The maximum height of the black insulating block 18 may be less than or equal to the maximum height of the second sub-insulating layer 1622 at other positions, a projection of the black insulating block 18 on the plane of the substrate 10 is located within a projection of the pixel defining block 120 on the plane of the substrate 10, and a projection area of the black insulating block 18 may be less than or equal to a projection area of the pixel defining block 120 at the corresponding position.
Of course, in other embodiments, as shown in fig. 4, the black insulating block 18a may also be located in the area of the first sub-insulating layer 1620a corresponding to the pixel defining block 120a, and this design is simple in structure, mature in process, and easy to implement; when the black insulating block 18a covers the first metal layer M1a, the design can reduce the reflection of the first metal layer M1a to the external ambient light, thereby further reducing the reflectivity of the display panel. Alternatively, as shown in fig. 5, the black insulating block 18b may also be located in an area corresponding to the pixel defining block 120b in the first and second sub-insulating layers 1620b and 1622 b. The design mode has a simple structure, a mature process and easy realization; and when the black insulating block 18b covers the bridge electrode 1600b and the first metal layer M1b, the reflection of the bridge electrode 1600b and the first metal layer M1b to the external ambient light can be further reduced.
In addition, referring to fig. 2 again, the first metal layer M1 is far away from the package layer 14 relative to the bridge electrode 1600 in fig. 2; in other embodiments, as shown in fig. 6, the bridge electrode 1600c is disposed away from the package layer 14c relative to the first metal layer M1 c. The design mode can reduce the area of the top layer metal so as to further reduce the reflectivity of the display panel. Also, on the basis of fig. 6, the black insulating block 18c may be located in the first sub-insulating layer 1620c and/or the second sub-insulating layer 1622 c.
In another embodiment, as shown in fig. 7, the encapsulation layer 14d includes an organic layer 140d therein, and the black insulating block 18d is located in the organic layer 140 d; the design mode has the advantages of simple structure, mature process and easy realization.
In yet another embodiment, as shown in fig. 8, the display panel provided by the present application may further include a polarizer 11e located on a side of the touch layer 16e away from the encapsulation layer 14e, and the polarizer 11e is formed on the touch layer 16e by a coating or inkjet printing method, which may reduce the thickness of the polarizer 11e and improve the optical effect thereof. In this embodiment, the polarizer 11e may include a linear polarizing film and a phase difference film, which are stacked, and the phase difference film is close to the touch layer 16e relative to the linear polarizing film; in order to avoid the polar interference between the linear polarizing film and the phase difference film, a layer of low-temperature organic insulating layer material OC can be arranged between the linear polarizing film and the phase difference film to be used as an anti-interference layer.
Referring to fig. 1 and 9 together, fig. 9 is a schematic flow chart of an embodiment of a method for manufacturing a display panel according to the present application, where the method can be used to form the display panel according to any of the above embodiments, and the method includes:
s101: a light emitting layer 12 is formed on a substrate 10, and the light emitting layer 12 includes a plurality of pixel defining blocks 120 and light emitting cells 122 located between the pixel defining blocks 120.
Specifically, the step S101 includes: a plurality of pixel defining blocks 120 are formed on a substrate 10; then, the light emitting units 122 having different colors are sequentially formed in the regions between the plurality of pixel defining blocks 120 by evaporation.
In addition, before the step S101, the preparation method provided by the present application may further include forming a thin film transistor layer on the substrate 10; step S101 specifically includes forming light-emitting layer 12 on the side of the thin-film transistor layer away from substrate 10.
S102: an encapsulation layer 14 is formed on the side of the light-emitting layer 12 remote from the substrate 10.
Specifically, in the present embodiment, the encapsulation layer 14 includes a first inorganic layer, an organic layer, and a second inorganic layer that are stacked. The step S102 includes: forming a first inorganic layer on the side of the light-emitting layer 12 away from the substrate 10; forming an organic layer on the side of the first inorganic layer away from the light-emitting layer 12; and forming a second inorganic layer on the side of the organic layer far away from the first inorganic layer.
When the black insulating block 18 is located in the encapsulation layer 14, the step S102 specifically includes: an organic layer is formed on the side of the light-emitting layer 12 remote from the substrate 10, wherein a black insulating block 18 is formed in the organic layer in a region corresponding to the pixel defining block 120. The implementation mode can be as follows: firstly, forming a black insulating block 18 in a region, corresponding to the pixel defining block 120, on one side of the first inorganic layer far away from the substrate 10 by using a first mask; a transparent insulating block is then formed in the other region of the first inorganic remote substrate 10 side using a second mask, at which time the black insulating block 18 and the transparent insulating block form an organic layer.
S103: forming a touch layer 16 on the side of the encapsulation layer 14 away from the substrate 10; the black insulating block 18 is formed in the area of the packaging layer 14 and/or the touch layer 16 corresponding to the pixel defining block 120.
In one embodiment, when the structure of the display panel is as shown in fig. 2, the step S103 includes:
A. forming a patterned second metal layer M2 on a side of the encapsulation layer 14 away from the light-emitting layer 12, wherein the second metal layer M2 includes a plurality of bridge electrodes 1600;
B. forming a second sub-insulating layer 1622 on the side of the second metal layer M2 away from the package layer 14; at this time, if the black insulating block 18 is located in the second sub-insulating layer 1622, the step of forming the second sub-insulating layer 1622 is: forming a black insulating block 18 at a position corresponding to the pixel defining block 120 using a first mask; forming a transparent insulating block at other positions using a second mask, the black insulating block 18 and the transparent insulating block forming a second sub-insulating layer 1622; of course, the order of forming the black insulating block 18 and the transparent insulating block may be reversed.
C. Forming a patterned first metal layer M1 on a side of the second sub-insulating layer 1622 away from the encapsulation layer 14, wherein the first metal layer M1 includes a plurality of transmitting electrodes and a plurality of receiving electrodes arranged in a crossing manner, and one of the transmitting electrodes and the receiving electrodes is disconnected at the crossing of the transmitting electrodes and the receiving electrodes; the bridging electrode 1600 is correspondingly disposed at the intersection of the transmitting electrode and the receiving electrode, and a via hole may be formed at a position corresponding to the second sub-insulating layer 1622, so that the disconnected transmitting electrode or receiving electrode is connected to the bridging electrode 1600 at the corresponding position through the second sub-insulating layer 1622.
D. Forming a first sub-insulating layer 1620 on the side of the first metal layer M1 away from the package layer 14, wherein the first sub-insulating layer 1620 covers the first metal layer M1; at this time, if the black insulating block 18 is located in the first sub-insulating layer 1620, the implementation is similar to the step B.
In another embodiment, when the structure of the display panel is as shown in fig. 6, the step S103 includes:
a1: a patterned first metal layer M1c is formed on the side of the encapsulation layer 14c away from the light-emitting layer 12c, the first metal layer M1c includes a plurality of transmitting electrodes and a plurality of receiving electrodes arranged crosswise, and one of the transmitting electrodes and the receiving electrodes is disconnected at the intersection of the two.
B1: forming a first sub-insulating layer 1620c on a side of the first metal layer M1c away from the package layer 14c, wherein the first sub-insulating layer 1620c covers the first metal layer M1 c; at this time, if the black insulating block 18c is located in the first sub-insulating layer 1620c, the implementation is similar to the step B.
C1: a patterned second metal layer M2c is formed on a side of the first sub-insulating layer 1620c away from the package layer 14c, the second metal layer M2c includes a plurality of bridge electrodes 1600c, the bridge electrodes 1600c are correspondingly disposed at the intersections of the transmitting electrodes and the receiving electrodes, and vias may be formed at corresponding positions of the first sub-insulating layer 1620c, so that two ends of the bridge electrode 1600c are disconnected from the transmitting electrodes and the receiving electrodes through the first sub-insulating layer 1620 c.
D1: the second sub-insulating layer 1622c is formed on the side of the first sub-insulating layer 1620c away from the package layer 14c, and the second sub-insulating layer 1622c covers the second metal layer M2c and the region between the first metal layer M1c and the second metal layer M2 c. At this time, if the black insulating block 18c is located in the second sub-insulating layer 1622c, it is implemented in a manner similar to the above-described step B.
In yet another embodiment, when the structure of the display panel is as shown in fig. 8, after the step S103, the preparation method provided by the present application further includes: a polarizer 11e is formed on the side of the touch layer 16e away from the encapsulation layer 14e by coating, ink-jet printing or other methods. A specific process may be to form a phase difference film on the side of the touch layer 16e away from the encapsulation layer 14 e; then forming an anti-interference layer on one side of the phase difference film, which is far away from the packaging layer 14e, wherein the anti-interference layer can be made of a low-temperature organic insulating layer material; and finally, forming a linear polarizing film on the side of the anti-interference layer away from the packaging layer 14 e. In this embodiment, the thickness of the polarizer 11e may be further reduced by reducing the thickness of the anti-interference layer, so as to improve the bending performance of the display panel.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (7)
1. A display panel, comprising:
a substrate;
the light-emitting layer is arranged on one side of the substrate and comprises a plurality of pixel defining blocks and light-emitting units positioned between the pixel defining blocks;
the packaging layer is positioned on one side of the light-emitting layer, which is far away from the substrate;
the touch layer is positioned on one side, away from the light emitting layer, of the packaging layer;
the packaging layer and/or the touch layer are/is provided with a pixel defining block, wherein the area of the packaging layer and/or the touch layer corresponding to the pixel defining block is provided with a black insulating block for absorbing external environment light;
the touch layer includes: a plurality of touch electrodes; the insulating layer covers the touch electrodes and is filled between the touch electrodes; wherein the black insulating block is located in the insulating layer;
the touch control device comprises a plurality of touch control electrodes, a plurality of touch control electrodes and a plurality of touch control circuit, wherein the touch control electrodes comprise a plurality of transmitting electrodes, a plurality of receiving electrodes and a plurality of bridging electrodes, the transmitting electrodes and the receiving electrodes are positioned on a first metal layer and are arranged in a crossed mode, one of the transmitting electrodes and the receiving electrodes is disconnected at the crossed position of the transmitting electrodes and the receiving electrodes, and the bridging electrodes are connected across the other of the transmitting electrodes and the receiving electrodes; the bridging electrode is arranged opposite to the first metal layer and far away from the packaging layer;
the insulating layer includes a first sub-insulating layer covering the first metal layer and a second sub-insulating layer covering the bridge electrode and a region between the bridge electrode and the first metal layer.
2. The display panel according to claim 1,
the black insulating block is arranged in a region, corresponding to the pixel defining block, of the first sub insulating layer and/or the second sub insulating layer.
3. The display panel according to claim 1,
the packaging layer comprises an organic layer, and the black insulating block is positioned in the organic layer.
4. The display panel according to claim 1, characterized in that the display panel further comprises:
and the polaroid is positioned on one side of the touch layer, which is far away from the packaging layer, and is formed on the touch layer in a coating or ink-jet printing mode.
5. A method for manufacturing a display panel, the method comprising:
forming a light emitting layer on a substrate, the light emitting layer including a plurality of pixel defining blocks and light emitting cells between the pixel defining blocks;
forming an encapsulation layer on one side of the light-emitting layer, which is far away from the substrate;
forming a touch layer on one side of the packaging layer, which is far away from the substrate;
a black insulating block is formed in the area, corresponding to the pixel defining block, of the packaging layer and/or the touch layer and is used for absorbing external environment light;
the forming of the touch layer on the side of the encapsulation layer away from the substrate comprises:
forming a patterned first metal layer on the side of the packaging layer far away from the light-emitting layer, wherein the first metal layer comprises a plurality of transmitting electrodes and a plurality of receiving electrodes which are arranged in a crossed manner, and one of the transmitting electrodes and the receiving electrodes is disconnected at the crossed position;
forming a first sub-insulating layer on one side of the first metal layer, which is far away from the packaging layer, wherein the first sub-insulating layer covers the first metal layer;
forming a patterned second metal layer on one side of the first sub-insulating layer, which is far away from the packaging layer, wherein the second metal layer comprises a plurality of bridge electrodes, the bridge electrodes are correspondingly arranged at the intersections of the transmitting electrodes and the receiving electrodes, and two ends of the bridge electrodes are connected with the transmitting electrodes and the receiving electrodes in a disconnected manner through the first sub-insulating layer;
and forming a second sub-insulating layer on one side of the first sub-insulating layer, which is far away from the packaging layer, wherein the second sub-insulating layer covers the second metal layer and the area between the first metal layer and the second metal layer.
6. The production method according to claim 5,
the black insulating block is formed in a region of the first sub insulating layer and/or the second sub insulating layer corresponding to the pixel defining block.
7. The method according to claim 5, wherein the forming of the encapsulation layer on the side of the light-emitting layer away from the substrate comprises:
and forming an organic layer on one side of the light-emitting layer, which is far away from the substrate, wherein a black insulating block is formed in the region of the organic layer, which corresponds to the pixel defining block.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910569224.7A CN110165085B (en) | 2019-06-27 | 2019-06-27 | Display panel and preparation method thereof |
| PCT/CN2020/072531 WO2020258870A1 (en) | 2019-06-27 | 2020-01-16 | Display panel and preparation method therefor |
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| CN201910569224.7A CN110165085B (en) | 2019-06-27 | 2019-06-27 | Display panel and preparation method thereof |
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| CN110165085A CN110165085A (en) | 2019-08-23 |
| CN110165085B true CN110165085B (en) | 2020-09-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110165085B (en) * | 2019-06-27 | 2020-09-11 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and preparation method thereof |
| CN110690359B (en) * | 2019-09-06 | 2021-03-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and electronic device |
| CN110968218B (en) * | 2019-11-12 | 2024-03-01 | 合肥维信诺科技有限公司 | Touch display panel and preparation method thereof |
| CN110828698B (en) * | 2019-11-21 | 2022-08-16 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and display device |
| CN110989861B (en) * | 2019-11-27 | 2024-03-05 | 合肥维信诺科技有限公司 | Display panel and manufacturing method thereof |
| CN111048575A (en) * | 2020-01-03 | 2020-04-21 | 武汉华星光电半导体显示技术有限公司 | Organic light emitting display panel and method of manufacturing the same |
| CN112750962B (en) * | 2020-12-29 | 2022-06-14 | 湖北长江新型显示产业创新中心有限公司 | Display panel, manufacturing method thereof and display device |
| CN113299700A (en) | 2021-05-08 | 2021-08-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN115377137A (en) * | 2021-05-21 | 2022-11-22 | 深圳市奥视微科技有限公司 | Micro-display array |
| KR20230174330A (en) | 2022-06-17 | 2023-12-28 | 삼성디스플레이 주식회사 | Display device and input system including the same |
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| KR102608416B1 (en) * | 2016-09-06 | 2023-12-01 | 삼성디스플레이 주식회사 | Display device |
| KR102670360B1 (en) * | 2016-12-08 | 2024-05-28 | 엘지디스플레이 주식회사 | Display device with integrated touch screen and method for fabricating the same |
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| KR102387631B1 (en) * | 2017-06-30 | 2022-04-15 | 엘지디스플레이 주식회사 | Display device with integrated touch screen and method for fabricating the same |
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| CN110165085B (en) * | 2019-06-27 | 2020-09-11 | 昆山工研院新型平板显示技术中心有限公司 | Display panel and preparation method thereof |
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| WO2020258870A1 (en) | 2020-12-30 |
| CN110165085A (en) | 2019-08-23 |
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