CN110158001A - A kind of method of anti-hydrogen disease - Google Patents
A kind of method of anti-hydrogen disease Download PDFInfo
- Publication number
- CN110158001A CN110158001A CN201910412472.0A CN201910412472A CN110158001A CN 110158001 A CN110158001 A CN 110158001A CN 201910412472 A CN201910412472 A CN 201910412472A CN 110158001 A CN110158001 A CN 110158001A
- Authority
- CN
- China
- Prior art keywords
- copper
- measured
- container
- method described
- testing container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
A kind of method of anti-hydrogen disease, the method are applied to copper, which comprises copper to be measured are placed in testing container, wherein the testing container is placed in default low temperature environment；Testing container locating for the copper to be measured is dry anhydrous container；Stating testing container is rustless device.
Description
Technical field
This application involves the technologies of a kind of method of fine copper anti-" hydrogen disease ", especially crimping terminal of wire anti-" hydrogen disease "
Research.
Background technique
Crimp type terminal is the union piece of a kind of connecting wire and barrel, makes to realize that electric current passes between conducting wire and barrel
It leads, is widely used in the connection of electric elements.The material of crimp type terminal generally uses oxygen-free copper.Oxygen-free copper refer to high-purity,
Oxygen content and all few copper of other impurity, but actually oxygen-free copper contains micro oxygen.The crimp type terminal bendability of manufacture
Can be bad, occur handle for connection and crimp barrel rupture often after mounting or there is different degrees of crackle (to obtain " hydrogen
Disease ").
Apply for content
In order to which the crimp type terminal bending property for solving manufacture is bad, occurs handle for connection often after mounting and crimp barrel is bent
Place's fracture has different degrees of crackle.Prevent crimp type terminal " hydrogen disease " technical method this application provides a kind of.
In a first aspect, the application provides a kind of method of anti-hydrogen disease, the method is applied to copper, which comprises
Copper to be measured is placed in testing container, wherein the testing container is placed in default low temperature environment；It is described to
Surveying testing container locating for copper is dry anhydrous container；Stating testing container is rustless device.
Optionally, the method also includes:
Subsequent processing is carried out to the copper to be measured.
Optionally, the copper to be measured is fine copper.
Optionally, the testing container is hydrogen-free environment.
Optionally, the default low temperature environment is the heat-treatment furnace that furnace temperature is 620 DEG C.
Optionally, described that subsequent processing is carried out to the copper to be measured, it specifically includes:
Cripping test is carried out to the copper to be measured.
Optionally, described that cripping test is carried out to the copper to be measured, it specifically includes:
The union piece of connecting wire and barrel is manufactured using copper to be measured；
Cripping test is carried out to the union piece.
Optionally, described that cripping test is carried out to the copper to be measured, it specifically includes:
The copper to be measured is bent, and is made annealing treatment；
Count the bending number of the copper to be measured；
When the bending number is greater than preset times, determine that the method can be to prevent hydrogen disease.
In conclusion may accidentally occur terminal " hydrogen disease " in the heat treatment process of conductor terminal, and strict control
The cleaning and drying of part and tooling container, tooling container cannot have iron rust, heat treatment temperature before aircraft crimp type terminal is heat-treated
Inclined lower limit temperature is preferably used, terminal " hydrogen disease " can be prevented and occurred.
Specific embodiment
In practical application, even oxygen-free copper generally also contains micro oxygen, generally with Cu2O exists, and contains Cu2O's is pure
Copper is in H2、CH4, when heating in the reducing atmospheres such as CO, these gases are easy to diffuse to material internal and Cu2O reacts, and generates
Vapor or CO2, material internal is caused cavity and surface layer occur along the cracking of crystal boundary, i.e., " hydrogen disease ".
By comparative test, determines and cause " hydrogen disease " influence factor.
Some iron rust and a small amount of water are artificially added in container, the container equipped with terminal, iron rust and a small amount of water is put into
Furnace temperature is to keep the temperature middle cooling of falling back in 45 minutes in 620 DEG C of heat-treatment furnaces.Crimp type terminal after taking heat treatment is bent
Test has carried out comparison cripping test with normal heat treatment crimp type terminal.
Embodiment one
T2 red copper testpieces is chosen in test, is made annealing treatment, and some iron rust and a small amount of are artificially added in container
Water, it is in 620 DEG C of heat-treatment furnaces that the container equipped with terminal, iron rust and a small amount of water, which is put into furnace temperature, and heat preservation is fallen back for 45 minutes
Middle cooling.5 terminals are extracted after cooling has carried out cripping test, wherein 4 terminals are broken within bending 3 times, 1
Terminal is broken after bending 8 times.
T2 red copper testpieces, the cleaning and drying of strict control part and tooling container are chosen, tooling container there cannot be iron
Rust, being put into furnace temperature is to keep the temperature middle cooling of falling back in 45 minutes in 620 DEG C of heat-treatment furnaces, appoints and takes 5 to carry out cripping test,
5 testpieces bending numbers are broken after being all larger than 12 bendings.
Analysis of experiments proves that crimp type terminal carries out heat treatment in humid atmosphere and the container to get rusty and terminal can be caused to obtain " hydrogen
Gas disease ", and the cleaning and drying of strict control part and tooling container, tooling container cannot have iron rust, can effectively prevent " hydrogen
The generation of disease ".
This application discloses the test methods that a kind of conductor terminal obtains " hydrogen disease ".By comparative test, conductor wire end is determined
The sub formation key factor for obtaining " hydrogen disease ", and the presence of these factors is avoided, the hair that conductor terminal obtains " hydrogen disease " can be prevented
It is raw.
Embodiment two
The application provides a kind of method of anti-hydrogen disease, and the method is applied to copper, which comprises
Copper to be measured is placed in testing container, wherein the testing container is placed in default low temperature environment；It is described to
Surveying testing container locating for copper is dry anhydrous container；Stating testing container is rustless device.
Optionally, the method also includes:
Subsequent processing is carried out to the copper to be measured.
Optionally, the copper to be measured is fine copper.
Optionally, the testing container is hydrogen-free environment.
Optionally, the default low temperature environment is the heat-treatment furnace that furnace temperature is 620 DEG C.
Optionally, described that subsequent processing is carried out to the copper to be measured, it specifically includes:
Cripping test is carried out to the copper to be measured.
Optionally, described that cripping test is carried out to the copper to be measured, it specifically includes:
The union piece of connecting wire and barrel is manufactured using copper to be measured；
Cripping test is carried out to the union piece.
Optionally, described that cripping test is carried out to the copper to be measured, it specifically includes:
The copper to be measured is bent, and is made annealing treatment；
Count the bending number of the copper to be measured；
When the bending number is greater than preset times, determine that the method can be to prevent hydrogen disease.
In conclusion may accidentally occur terminal " hydrogen disease " in the heat treatment process of conductor terminal, and strict control
The cleaning and drying of part and tooling container, tooling container cannot have iron rust, heat treatment temperature before aircraft crimp type terminal is heat-treated
Inclined lower limit temperature is preferably used, terminal " hydrogen disease " can be prevented and occurred.
Claims (8)
1. a kind of method of anti-hydrogen disease, it is characterised in that: the method is applied to copper, which comprises
Copper to be measured is placed in testing container, wherein the testing container is placed in default low temperature environment；The copper to be measured
Locating testing container is dry anhydrous container；Stating testing container is rustless device.
2. according to the method described in claim 1, it is characterized by: the method also includes:
Subsequent processing is carried out to the copper to be measured.
3. according to the method described in claim 1, it is characterized by: the copper to be measured is fine copper.
4. according to the method described in claim 1, it is characterized by: the testing container is hydrogen-free environment.
5. according to the method described in claim 1, it is characterized by: the default low temperature environment be furnace temperature be 620 DEG C heat at
Manage furnace.
6. according to the method described in claim 2, it is characterized by: described carry out subsequent processing, specific packet to the copper to be measured
It includes:
Cripping test is carried out to the copper to be measured.
7. according to the method described in claim 6, it is characterized by: described carry out cripping test, specific packet to the copper to be measured
It includes:
The union piece of connecting wire and barrel is manufactured using copper to be measured；
Cripping test is carried out to the union piece.
8. according to the method described in claim 6, it is characterized by: described carry out cripping test, specific packet to the copper to be measured
It includes:
The copper to be measured is bent, and is made annealing treatment；
Count the bending number of the copper to be measured；
When the bending number is greater than preset times, determine that the method can be to prevent hydrogen disease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910412472.0A CN110158001A (en) | 2019-05-17 | 2019-05-17 | A kind of method of anti-hydrogen disease |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910412472.0A CN110158001A (en) | 2019-05-17 | 2019-05-17 | A kind of method of anti-hydrogen disease |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110158001A true CN110158001A (en) | 2019-08-23 |
Family
ID=67631237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910412472.0A Pending CN110158001A (en) | 2019-05-17 | 2019-05-17 | A kind of method of anti-hydrogen disease |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110158001A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345408A (en) * | 2015-12-02 | 2016-02-24 | 芜湖楚江合金铜材有限公司 | Producing and processing technology for red copper alloy wires |
| CN109465414A (en) * | 2018-12-28 | 2019-03-15 | 江阴华瑞电工科技股份有限公司 | A method of preparing oxygen-free copper bar |
-
2019
- 2019-05-17 CN CN201910412472.0A patent/CN110158001A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105345408A (en) * | 2015-12-02 | 2016-02-24 | 芜湖楚江合金铜材有限公司 | Producing and processing technology for red copper alloy wires |
| CN109465414A (en) * | 2018-12-28 | 2019-03-15 | 江阴华瑞电工科技股份有限公司 | A method of preparing oxygen-free copper bar |
Non-Patent Citations (1)
| Title |
|---|
| 谢燮揆等: "电器零件的热处理 (二 )", 《热处理工艺》 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190823 |
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| RJ01 | Rejection of invention patent application after publication |