CN110157358A - A kind of high retentivity water-borne pressure sensitive adhesive and preparation method thereof - Google Patents
A kind of high retentivity water-borne pressure sensitive adhesive and preparation method thereof Download PDFInfo
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- CN110157358A CN110157358A CN201910541301.8A CN201910541301A CN110157358A CN 110157358 A CN110157358 A CN 110157358A CN 201910541301 A CN201910541301 A CN 201910541301A CN 110157358 A CN110157358 A CN 110157358A
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- Prior art keywords
- weight ratio
- pressure sensitive
- water
- sensitive adhesive
- glue
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of high retentivity water-borne pressure sensitive adhesives and preparation method thereof, including acrylate monomer, initiator, emulsifier, resin glue, acrylic polymer solution, hot melt adhesive, photosensitive sealing structure glue, water.Preparation method includes the mixing of raw material, and acrylate monomer, resin glue, acrylic polymer solution, hot melt adhesive, initiator, emulsifier, photosensitive sealing structure glue and water are added in reaction kettle and are reacted according to aforementioned proportion.By using the present processes, acrylate monomer, initiator, emulsifier, resin glue, acrylic polymer solution, hot melt adhesive, photosensitive sealing structure glue and water are reacted according to aforementioned proportion, the problem of pressure sensitive adhesive obtained after reaction is the finished product of the application, which finds cracking easily peelable which overcome pressure sensitive adhesive during being detected and used.
Description
Technical field
The present invention relates to a kind of high retentivity water-borne pressure sensitive adhesive and preparation method thereof more particularly to a kind of glue performance are superior
High retentivity water-borne pressure sensitive adhesive and preparation method thereof.
Background technique
Pressure sensitive adhesive is a kind of adhesive for having and having sensibility to pressure, general pressure-sensitive mainly for the preparation of pressure sensitive adhesive tape
Peeling force, that is, adhesive tape of glue is less than glue with the cohesive force for being less than adhesive by the peeling force showed after maxxaedium pressurization stickup
The generation of phenomena such as base adhesion force of stick, such pressure-sensitive adhesive does not just have degumming in use.So use at present
Pressure sensitive adhesive after prolonged use can with the lengthening of the be exposed to the sun frequency and time, cause material adhere to pressure sensitive adhesive removing cracking
The problem of.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of high retentivity water-borne pressure sensitive adhesives and preparation method thereof, have
The superior feature of glue performance.
In order to solve the above technical problems, the technical solution of the present invention is as follows: a kind of high retentivity water-borne pressure sensitive adhesive, innovative point
Be: the high retentivity water-borne pressure sensitive adhesive include the acrylate monomer of weight ratio 15%~25%, weight ratio 5%~
10% initiator, the emulsifier of weight ratio 5%~10%, the resin glue of weight ratio 8%~12%, weight ratio 10%
~20% acrylic polymer solution, the hot melt adhesive of weight ratio 8%~12%, weight ratio 12%~18% it is photosensitive
The water of sealing structure glue, weight ratio 10%~18%.
Preferably, the high retentivity water-borne pressure sensitive adhesive optimum proportioning include weight ratio 20% acrylate monomer,
The initiator of weight ratio 8%, the emulsifier of weight ratio 8%, the resin glue of weight ratio 10%, weight ratio 15% third
Olefin(e) acid quasi polymer solution, the hot melt adhesive of weight ratio 10%, weight ratio 15% photosensitive sealing structure glue, weight ratio
14% water.
Preferably, the initiator is organic peroxide evocating agent, and the organic peroxide evocating agent is carbonic ester
One of peroxide, acyl class peroxide, esters peroxide, dialkyl peroxide, hydroperoxides.
Preferably, the emulsifier is nonylphenol polyoxyethylene ether, octyl phenol polyoxyethylene ether, double butyl phenol polyethenoxies
One of ether, alkyl phenol polyoxyethylene ether, phenethyl phenol poly-oxypropylene polyoxyethylene ether.
Preferably, the resin glue is thermoplastic resin.
Preferably, the hot melt adhesive is EVA hot-melt adhesive, is the one-component structure using Oppanol as base-material.
Preferably, the photosensitive sealing structure glue is the photosensitive sealing structure glue of GBN-503.
A kind of preparation method of high retentivity water-borne pressure sensitive adhesive, is used to prepare high retentivity water-borne pressure sensitive adhesive, including as follows
Step:
Step is 1.: the mixing of raw material, according to aforementioned proportion by acrylate monomer, resin glue, acrylic polymer
Solution, hot melt adhesive, photosensitive sealing structure glue and water are added in reaction kettle, and reaction temperature is 80-90 degrees Celsius, and the reaction time is
20-30min obtains semi-product material after reaction;
Step is 2.: initiator, emulsifier are added in reaction kettle according to aforementioned proportion and react, instead by glue preparation
Answering temperature is 60-70 degrees Celsius, and reaction time 10min obtains finished product materials after reaction.
The present invention has the advantages that by using the present processes, according to aforementioned proportion by acrylate monomer, cause
Agent, emulsifier, resin glue, acrylic polymer solution, hot melt adhesive, photosensitive sealing structure glue and water are reacted, after reaction
The pressure sensitive adhesive of acquisition is the finished product of the application, and it is easily peelable which finds which overcome pressure sensitive adhesives during being detected and used
The problem of cracking.
Specific embodiment
Embodiment 1
High retentivity water-borne pressure sensitive adhesive of the invention includes the acrylate monomer of weight ratio 15%, weight ratio 5%
Initiator, the emulsifier of weight ratio 10%, the resin glue of weight ratio 12%, weight ratio 10% acrylic
Object solution, the hot melt adhesive of weight ratio 12%, the photosensitive sealing structure glue of weight ratio 18%, weight ratio 18% water.It is logical
It crosses using the present processes, according to aforementioned proportion by acrylate monomer, initiator, emulsifier, resin glue, acrylic polymer
Polymer solution, hot melt adhesive, photosensitive sealing structure glue and water are reacted, the pressure sensitive adhesive obtained after reaction be the application at
The problem of product, which finds cracking easily peelable which overcome pressure sensitive adhesive during being detected and used.
Above-mentioned initiator is organic peroxide evocating agent, and the organic peroxide evocating agent is carbonic ester peroxidating
One of object, acyl class peroxide, esters peroxide, dialkyl peroxide, hydroperoxides.Emulsifier is nonyl phenol
Polyoxyethylene ether, octyl phenol polyoxyethylene ether, double butyl phenol polyethenoxy ethers, alkyl phenol polyoxyethylene ether, phenethyl phenol polyoxy
One of propylene polyoxyethylene ether.Resin glue is thermoplastic resin, and it is with Oppanol that hot melt adhesive, which is EVA hot-melt adhesive,
For the one-component structure of base-material.Photosensitive sealing structure glue is the photosensitive sealing structure glue of GBN-503.
A kind of preparation method of high retentivity water-borne pressure sensitive adhesive, is used to prepare high retentivity water-borne pressure sensitive adhesive, including as follows
Step: step 1.: the mixing of raw material, it is according to aforementioned proportion that acrylate monomer, resin glue, acrylic polymer is molten
Liquid, hot melt adhesive, photosensitive sealing structure glue and water are added in reaction kettle, and reaction temperature is 80-90 degrees Celsius, and the reaction time is
20-30min obtains semi-product material after reaction;Step is 2.: glue preparation, by initiator, emulsifier according to aforementioned proportion
It is added in reaction kettle and is reacted, reaction temperature is 60-70 degrees Celsius, and reaction time 10min is obtained into after reaction
Product material.
Embodiment 2
High retentivity water-borne pressure sensitive adhesive optimum proportioning of the invention includes the acrylate monomer of weight ratio 20%, weight
The initiator of ratio 8%, the emulsifier of weight ratio 8%, the resin glue of weight ratio 10%, weight ratio 15% acrylic acid
Quasi polymer solution, the hot melt adhesive of weight ratio 10%, the photosensitive sealing structure glue of weight ratio 15%, weight ratio 14%
Water.By using the present processes, according to aforementioned proportion by acrylate monomer, initiator, emulsifier, resin glue, propylene
Acids polymers solution, hot melt adhesive, photosensitive sealing structure glue and water are reacted, and the pressure sensitive adhesive obtained after reaction is the application
Finished product, the problem of which finds cracking easily peelable which overcome pressure sensitive adhesive during being detected and used.
Above-mentioned initiator is organic peroxide evocating agent, and the organic peroxide evocating agent is carbonic ester peroxidating
One of object, acyl class peroxide, esters peroxide, dialkyl peroxide, hydroperoxides.Emulsifier is nonyl phenol
Polyoxyethylene ether, octyl phenol polyoxyethylene ether, double butyl phenol polyethenoxy ethers, alkyl phenol polyoxyethylene ether, phenethyl phenol polyoxy
One of propylene polyoxyethylene ether.Resin glue is thermoplastic resin, and it is with Oppanol that hot melt adhesive, which is EVA hot-melt adhesive,
For the one-component structure of base-material.Photosensitive sealing structure glue is the photosensitive sealing structure glue of GBN-503.
A kind of preparation method of high retentivity water-borne pressure sensitive adhesive, is used to prepare high retentivity water-borne pressure sensitive adhesive, including as follows
Step: step 1.: the mixing of raw material, it is according to aforementioned proportion that acrylate monomer, resin glue, acrylic polymer is molten
Liquid, hot melt adhesive, photosensitive sealing structure glue and water are added in reaction kettle, and reaction temperature is 80-90 degrees Celsius, and the reaction time is
20-30min obtains semi-product material after reaction;Step is 2.: glue preparation, by initiator, emulsifier according to aforementioned proportion
It is added in reaction kettle and is reacted, reaction temperature is 60-70 degrees Celsius, and reaction time 10min is obtained into after reaction
Product material.
Embodiment 3
High retentivity water-borne pressure sensitive adhesive of the invention includes the acrylate monomer of weight ratio 25%, weight ratio 10%
Initiator, the emulsifier of weight ratio 5%, the resin glue of weight ratio 8%, weight ratio 20% acrylic polymer
Solution, the hot melt adhesive of weight ratio 8%, the photosensitive sealing structure glue of weight ratio 12%, weight ratio 12% water.By adopting
With the present processes, according to aforementioned proportion by acrylate monomer, initiator, emulsifier, resin glue, acrylic polymer
Solution, hot melt adhesive, photosensitive sealing structure glue and water are reacted, and the pressure sensitive adhesive obtained after reaction is the finished product of the application, should
Finished product finds the problem of cracking easily peelable which overcome pressure sensitive adhesive during being detected and used.
Above-mentioned initiator is organic peroxide evocating agent, and the organic peroxide evocating agent is carbonic ester peroxidating
One of object, acyl class peroxide, esters peroxide, dialkyl peroxide, hydroperoxides.Emulsifier is nonyl phenol
Polyoxyethylene ether, octyl phenol polyoxyethylene ether, double butyl phenol polyethenoxy ethers, alkyl phenol polyoxyethylene ether, phenethyl phenol polyoxy
One of propylene polyoxyethylene ether.Resin glue is thermoplastic resin, and it is with Oppanol that hot melt adhesive, which is EVA hot-melt adhesive,
For the one-component structure of base-material.Photosensitive sealing structure glue is the photosensitive sealing structure glue of GBN-503.
A kind of preparation method of high retentivity water-borne pressure sensitive adhesive, is used to prepare high retentivity water-borne pressure sensitive adhesive, including as follows
Step: step 1.: the mixing of raw material, it is according to aforementioned proportion that acrylate monomer, resin glue, acrylic polymer is molten
Liquid, hot melt adhesive, photosensitive sealing structure glue and water are added in reaction kettle, and reaction temperature is 80-90 degrees Celsius, and the reaction time is
20-30min obtains semi-product material after reaction;Step is 2.: glue preparation, by initiator, emulsifier according to aforementioned proportion
It is added in reaction kettle and is reacted, reaction temperature is 60-70 degrees Celsius, and reaction time 10min is obtained into after reaction
Product material.
Finally, it should be noted that property technical side the above examples are only used to illustrate the technical scheme of the present invention and are not limiting
Case, those skilled in the art should understand that, modification or equivalent replacement of the technical solution of the present invention are made for those, and
The objective and range for not departing from the technical program, are intended to be within the scope of the claims of the invention.
Claims (8)
1. a kind of high retentivity water-borne pressure sensitive adhesive, it is characterised in that: the high retentivity water-borne pressure sensitive adhesive includes weight ratio
15%~25% acrylate monomer, the initiator of weight ratio 5%~10%, weight ratio 5%~10% emulsifier,
The resin glue of weight ratio 8%~12%, the acrylic polymer solution of weight ratio 10%~20%, weight ratio 8%
~12% hot melt adhesive, the photosensitive sealing structure glue of weight ratio 12%~18%, weight ratio 10%~18% water.
2. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the high retentivity is aqueous pressure-sensitive
Glue optimum proportioning includes the cream of the acrylate monomer of weight ratio 20%, the initiator of weight ratio 8%, weight ratio 8%
Agent, the resin glue of weight ratio 10%, the acrylic polymer solution of weight ratio 15%, weight ratio 10% hot melt
Glue, the photosensitive sealing structure glue of weight ratio 15%, weight ratio 14% water.
3. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the initiator is organic peroxy
Compound initiator, the organic peroxide evocating agent be carbonic ester peroxide, acyl class peroxide, esters peroxide,
One of dialkyl peroxide, hydroperoxides.
4. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the emulsifier is poly- for nonyl phenol
Ethylene oxide ether, octyl phenol polyoxyethylene ether, double butyl phenol polyethenoxy ethers, alkyl phenol polyoxyethylene ether, phenethyl phenol polyoxy third
One of alkene polyoxyethylene ether.
5. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the resin glue is thermoplastic resin
Rouge.
6. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the hot melt adhesive is EVA hot melt
Glue is the one-component structure using Oppanol as base-material.
7. a kind of high retentivity water-borne pressure sensitive adhesive as described in claim 1, it is characterised in that: the photosensitive sealing structure glue is
The photosensitive sealing structure glue of GBN-503.
8. a kind of preparation method of high retentivity water-borne pressure sensitive adhesive, is used to prepare such as one Xiang Suoshu of claim 1 to 7 any of them
A kind of high retentivity water-borne pressure sensitive adhesive, it is characterised in that include the following steps:
Step is 1.: the mixing of raw material, according to aforementioned proportion by acrylate monomer, resin glue, acrylic polymer solution,
Hot melt adhesive, photosensitive sealing structure glue and water are added in reaction kettle, and reaction temperature is 80-90 degrees Celsius, reaction time 20-
30min obtains semi-product material after reaction;
Step is 2.: initiator, emulsifier are added in reaction kettle according to aforementioned proportion and react by glue preparation, reaction temperature
Degree is 60-70 degrees Celsius, and reaction time 10min obtains finished product materials after reaction.
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CN201910541301.8A CN110157358A (en) | 2019-06-21 | 2019-06-21 | A kind of high retentivity water-borne pressure sensitive adhesive and preparation method thereof |
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Cited By (1)
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CN110982453A (en) * | 2019-12-26 | 2020-04-10 | 无锡达美新材料有限公司 | Rubber type water-based pressure-sensitive adhesive and preparation method and application thereof |
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CN107987757A (en) * | 2017-12-26 | 2018-05-04 | 河南大学 | The plastic bottle environmentally friendly adhesive for labels of series and its preparation method |
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2019
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Patent Citations (8)
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CN1441022A (en) * | 2002-02-27 | 2003-09-10 | 日东电工株式会社 | Pressure sensitive composition and pressure sensitive rebber tape of propenoic acid |
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CN103665253A (en) * | 2013-11-26 | 2014-03-26 | 青岛文创科技有限公司 | High-performance water-based acrylate pressure-sensitive adhesive and manufacturing process thereof |
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CN110982453A (en) * | 2019-12-26 | 2020-04-10 | 无锡达美新材料有限公司 | Rubber type water-based pressure-sensitive adhesive and preparation method and application thereof |
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Application publication date: 20190823 |
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