CN110144103A - Halogen-free flame retardant PC conductive material and products thereof - Google Patents
Halogen-free flame retardant PC conductive material and products thereof Download PDFInfo
- Publication number
- CN110144103A CN110144103A CN201810137210.3A CN201810137210A CN110144103A CN 110144103 A CN110144103 A CN 110144103A CN 201810137210 A CN201810137210 A CN 201810137210A CN 110144103 A CN110144103 A CN 110144103A
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- Prior art keywords
- halogen
- conductive material
- flame retardant
- free flame
- retardant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to technical field of polymer materials, specifically a kind of halogen-free flame retardant PC conductive material and products thereof.The halogen-free flame retardant PC conductive material, indicates in parts by weight, comprising: 80-99.5 parts of PC resin；0.02-0.04 parts of single-walled carbon nanotube；0.2-2 parts of fire retardant.The product, for the product generated after the molding of halogen-free flame retardant PC conductive material.Halogen-free flame retardant PC conductive material of the invention is by being added single-walled carbon nanotube as conducting medium, and fire retardant enhancing flame retardant property is added, a kind of high performance halogen-free flame retardant PC conductive material can be prepared, and it is colour that material is adjustable, meets the needs of existing market is to colorful conductive material.
Description
[technical field]
The present invention relates to technical field of polymer materials, specifically a kind of halogen-free flame retardant PC conductive material and its production
Product.
[background technique]
With plastic cement products multifunction and electronic circuit it is highly integrated, with conductive characteristic material application also get over
Come more extensive, the impact resistant strength of PC material (polycarbonate, Polycarbonate) is high, flame retardant rating itself can reach V-
2, weatherability is good, is widely used in electron and electrician product.
For the sheet resistance of pure PC material more than 10^14 (10 14 powers) ohm, tradition passes through addition carbon black or carbon
Fiber obtains PC conductive material.However, because the wick effect of carbon black aptitude to burn itself and carbon fiber is (when as candle combustion
Candle wick burning is the same), cause the anti-flammability of conductive material to be difficult to do, and the color of carbon black and carbon fiber is entirely black, nothing
Method allotment is in other colors, and existing market is not achieved to the colored demand of halogen-free flame-retardant conductive material.
In view of this, it is really necessary to develop a kind of halogen-free flame retardant PC conductive material, to solve PC conduction material in the prior art
Material can not accomplish fire-retardant and colored problem.
[summary of the invention]
Therefore, the purpose of the present invention is to provide a kind of halogen-free flame retardant PC conductive material, to obtain halogen-free flameproof and colour
PC conductive material.
In order to achieve the above object, halogen-free flame retardant PC conductive material of the invention, indicates in parts by weight, comprising:
80-99.5 parts of PC resin；
0.02-0.04 parts of single-walled carbon nanotube；
0.2-2 parts of fire retardant.
Optionally, the PC resin is bisphenol A polycarbonate, polyester-type polycarbonate, the poly- carbonic acid of hexamethylene bisphenol A-type
At least one of ester, polycarbonate of bis-phenol TMC synthesis.
Optionally, in 300 DEG C of temperature, weight bearing 1.2Kg, the melt mass flow rate of the PC resin is 3-50g/
Between 10min.
Optionally, the single-walled carbon nanotube draw ratio is between 100-10000, and diameter is between 0.4nm-2nm.
Optionally, the fire retardant is compounding for sulfonate salt flame and organic silicon fibre retardant.
Optionally, the addition number of the sulfonate salt flame is 0.1-1 parts, the addition number of the organic silicon fibre retardant
It is 0.1-1 parts.
Optionally, the sulfonate salt flame is potassium phenylsulphonyl benzene sulfonate (KSS), perfluorobutyl potassium sulfonate (PPFBS)
Or 2,4,5- trichlorine benzene sulfonic acid sodium salts (STB), the organic silicon fibre retardant is poly- silicon borine, polymethoxy phenyl silane, methylol
Silane or the dimethyl silicone polymer of crosslinking (PDMS).
Optionally, the halogen-free flame retardant PC conductive material further includes anti-dripping agent, antibacterial agent, ultraviolet absorbing agent and demoulding
At least one of agent.
In addition, the present invention also provides a kind of product, for the product generated after the molding of halogen-free flame retardant PC conductive material.
Compared to the prior art, halogen-free flame retardant PC conductive material of the invention is by being added single-walled carbon nanotube as conductive
Medium, and fire retardant enhancing flame retardant property is added, a kind of high performance halogen-free flame retardant PC conductive material, anti-flammability can be prepared
5VB grade can be reached, and it is colour that material is adjustable, meet the needs of existing market is to conductive material colour.
[specific embodiment]
Halogen-free flame retardant PC conductive material of the invention, indicates in parts by weight, comprising:
80-99.5 parts of PC resin, the PC resin is bisphenol A polycarbonate, polyester-type polycarbonate, hexamethylene bis-phenol
At least one of A type polycarbonate, polycarbonate of bis-phenol TMC synthesis, in 300 DEG C of temperature, weight bearing 1.2Kg, the PC
Melt mass flow rate between 3-50g/10min.
0.02-0.04 parts of single-walled carbon nanotube, the single-walled carbon nanotube (or single-layer carbon nano-tube, Single-
Walled Carbon nanotubes, SWCNTs) there are the performances such as excellent electronics, machinery, mechanics, especially to electronics and
Hole all has a mobility of superelevation, forms conductive path, the single by the single-walled carbon nanotube in the present invention
Pipe draw ratio (draw ratio is are as follows: the ratio between length and diameter) between 100-10000, diameter between 0.4nm-2nm, relative to
100 parts of material, adds the single-walled carbon nanotube of 0.04 parts by weight, and the volume resistance of conductive material can be down to 10^4Ohm~10^
5Ohm (ohm).
0.2-2 parts of fire retardant, the fire retardant described in preferred embodiment is sulfonate salt flame and organic silicon fibre retardant
Compounding, the addition number of the sulfonate salt flame are 0.1-1 parts, and the addition number of the organic silicon fibre retardant is 0.1-1 parts,
Can reach optimal flame retardant effect 5VB grade, (burning that 5VB grade uses 500 watts of flame to carry out sample 5 times 5 seconds is surveyed
After examination, residual flame and Yu Ran extinguish in 60 seconds, and the particle of drippage can not light cotton, and bulk sample permission is burnt), institute
Stating sulfonate salt flame is potassium phenylsulphonyl benzene sulfonate (KSS), perfluorobutyl potassium sulfonate (PPFBS) or 2,4,5- trichlorine benzene sulfonic acid
Sodium (STB), the organic silicon fibre retardant are poly- silicon borine, polymethoxy phenyl silane, methylol silane or the poly- diformazan of crosslinking
Radical siloxane (PDMS).
Wherein, functional composite material in order to obtain, under the premise of not influencing functional effect, the halogen-free flame retardant PC is led
Electric material further includes at least one of anti-dripping agent, antibacterial agent, ultraviolet absorbing agent and release agent.
To have further understanding to the purpose of the present invention, effect and technological means, now in conjunction with comparative example and specific implementation
Example is described as follows.
Embodiment 1
Weigh each component of corresponding weight；Then, each component is stirred using uniaxial agitator；Said mixture is distinguished
Melting extrusion in double screw extruder is added to be granulated.
Embodiment 2
Weigh each component of corresponding weight；Then, each component is stirred using uniaxial agitator；Said mixture is distinguished
Melting extrusion in double screw extruder is added to be granulated.
Comparative example 1
Weigh each component of corresponding weight；Then, each component is stirred using uniaxial agitator；Said mixture is distinguished
Melting extrusion in double screw extruder is added to be granulated.
Comparative example 2
Weigh each component of corresponding weight；Then, each component is stirred using uniaxial agitator；Said mixture is distinguished
Melting extrusion in double screw extruder is added to be granulated.
After the above various embodiments and comparative example melting extrusion are granulated, then the particle in each embodiment is infused on injection molding machine
It is moulded into type standard testing batten, by the mechanical performance of standard testing resulting materials, test result is as shown in table 1:
Table 1: the test result of each embodiment and comparative example
Wherein, wherein according to the numerical value of Δ E Lab color space test resulting materials are as follows: L value is between 25~90, a value
Between -30~40, b value is between -40~70, therefore the material can be allocated as random color, is changed by color matching outer
It sees.
Can learn through the above: by embodiment 1 compared with comparative example 1, embodiment 2 is compared with comparative example 2, in PC
Single-walled carbon nanotube is added in resin compared to carbon black is added in PC resin, in the essentially identical situation of the volume resistance of material
Under, mechanical performance is improved, and especially elongation at break and impact strength have obtained significantly being promoted, and anti-flammability
It can be similarly obtained very big promotion, can only be promoted to 5VB grade from V grades.In addition, material obtained in comparative example is black
Color is not able to satisfy demand of the market to colorful conductive material, and material is adjustable obtained in embodiment 1 and embodiment 2 is
It is colored.Compared with Example 2 by embodiment 1, the fire retardant added in the material is sulfonate salt flame and organic silicon fibre retardant
Compounding when, the flame retardant property of material can be raised to 5VB grade from V-0 grade, and high degree improves flame retardant property.
In addition, the present invention also provides a kind of product, it, should for the product generated after the molding of halogen-free flame retardant PC conductive material
Product can be widely applied in electron and electrician product, such as apply in the fields such as printer, computer CPU conductive component.
Claims (9)
1. a kind of halogen-free flame retardant PC conductive material, which is characterized in that in parts by weight indicate include:
80-99.5 parts of PC resin；
0.02-0.04 parts of single-walled carbon nanotube；
0.2-2 parts of fire retardant.
2. halogen-free flame retardant PC conductive material according to claim 1, which is characterized in that the PC resin is poly- for bisphenol A-type
At least one in polycarbonate that carbonic ester, polyester-type polycarbonate, hexamethylene bisphenol A polycarbonate, bis-phenol TMC are synthesized
Kind.
3. halogen-free flame retardant PC conductive material according to claim 1 or 2, it is characterised in that in 300 DEG C of temperature, weight bearing
When 1.2Kg, the melt mass flow rate of the PC resin is between 3-50g/10min.
4. halogen-free flame retardant PC conductive material according to claim 1, which is characterized in that the single-walled carbon nanotube draw ratio
Between 100-10000, diameter is between 0.4nm-2nm.
5. halogen-free flame retardant PC conductive material according to claim 1, which is characterized in that the fire retardant is that sulfonate is fire-retardant
Agent is compounded with organic silicon fibre retardant.
6. halogen-free flame retardant PC conductive material according to claim 5, which is characterized in that the addition of the sulfonate salt flame
Number is 0.1-1 parts, and the addition number of the organic silicon fibre retardant is 0.1-1 parts.
7. halogen-free flame retardant PC conductive material according to claim 5 or 6, which is characterized in that the sulfonate salt flame is
Potassium phenylsulphonyl benzene sulfonate, perfluorobutyl potassium sulfonate or 2,4,5- trichlorine benzene sulfonic acid sodium salts, the organic silicon fibre retardant are poly- silicon boron
Alkane, polymethoxy phenyl silane, methylol silane or the dimethyl silicone polymer of crosslinking.
8. halogen-free flame retardant PC conductive material according to claim 1, which is characterized in that the halogen-free flame retardant PC conductive material
It further include at least one of anti-dripping agent, antibacterial agent, ultraviolet absorbing agent and release agent.
9. a kind of product, which is characterized in that the product is to lead through halogen-free flame retardant PC described in any item of the claim 1 to 8
The product generated after electric material molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810137210.3A CN110144103A (en) | 2018-02-10 | 2018-02-10 | Halogen-free flame retardant PC conductive material and products thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810137210.3A CN110144103A (en) | 2018-02-10 | 2018-02-10 | Halogen-free flame retardant PC conductive material and products thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110144103A true CN110144103A (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810137210.3A Pending CN110144103A (en) | 2018-02-10 | 2018-02-10 | Halogen-free flame retardant PC conductive material and products thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111875943A (en) * | 2020-08-07 | 2020-11-03 | 宁波耀众模塑科技有限公司 | Carbon-containing high polymer material mixture for flame retardant for polyurethane foaming product |
| CN112920587A (en) * | 2019-12-06 | 2021-06-08 | 汉达精密电子(昆山)有限公司 | Halogen-free flame-retardant antistatic PC material and product thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101280100A (en) * | 2007-04-05 | 2008-10-08 | 帝人化成株式会社 | Conductive resin compound |
| CN102115558A (en) * | 2010-12-29 | 2011-07-06 | 四川大学 | High-conductivity polymer carbon nanotube composite material and micro-processing method thereof |
| CN104650558A (en) * | 2013-11-25 | 2015-05-27 | 青岛同创节能环保工程有限公司 | High efficiency flame retardant reinforced grade PC/PBT alloy and preparation method thereof |
| CN106928679A (en) * | 2015-12-31 | 2017-07-07 | 广州市寅源新材料科技有限公司 | A kind of halogen-free and flame-retardant polycarbonate material and preparation method thereof |
| CN107163532A (en) * | 2017-05-15 | 2017-09-15 | 五行科技股份有限公司 | The polycarbonate film material and preparation method of a kind of resistance to ultraviolet high fire-retardance grade |
-
2018
- 2018-02-10 CN CN201810137210.3A patent/CN110144103A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101280100A (en) * | 2007-04-05 | 2008-10-08 | 帝人化成株式会社 | Conductive resin compound |
| CN102115558A (en) * | 2010-12-29 | 2011-07-06 | 四川大学 | High-conductivity polymer carbon nanotube composite material and micro-processing method thereof |
| CN104650558A (en) * | 2013-11-25 | 2015-05-27 | 青岛同创节能环保工程有限公司 | High efficiency flame retardant reinforced grade PC/PBT alloy and preparation method thereof |
| CN106928679A (en) * | 2015-12-31 | 2017-07-07 | 广州市寅源新材料科技有限公司 | A kind of halogen-free and flame-retardant polycarbonate material and preparation method thereof |
| CN107163532A (en) * | 2017-05-15 | 2017-09-15 | 五行科技股份有限公司 | The polycarbonate film material and preparation method of a kind of resistance to ultraviolet high fire-retardance grade |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112920587A (en) * | 2019-12-06 | 2021-06-08 | 汉达精密电子(昆山)有限公司 | Halogen-free flame-retardant antistatic PC material and product thereof |
| CN111875943A (en) * | 2020-08-07 | 2020-11-03 | 宁波耀众模塑科技有限公司 | Carbon-containing high polymer material mixture for flame retardant for polyurethane foaming product |
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Application publication date: 20190820 |