CN110139760B - Ink jet head, method of manufacturing ink jet head, and image forming apparatus - Google Patents
Ink jet head, method of manufacturing ink jet head, and image forming apparatus Download PDFInfo
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- CN110139760B CN110139760B CN201780081974.9A CN201780081974A CN110139760B CN 110139760 B CN110139760 B CN 110139760B CN 201780081974 A CN201780081974 A CN 201780081974A CN 110139760 B CN110139760 B CN 110139760B
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- substrate
- wiring
- wiring layer
- flow path
- ink
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
Abstract
An ink jet head includes a flow path substrate having a space portion for housing an actuator and a communication flow path for independently communicating a pressure chamber and a common ink chamber, and bonded to a surface on which a wiring layer is formed; the sealing section is provided in a region surrounding the communication flow path on a bonding surface between the flow path substrate and a surface on which the wiring layer is formed, and seals the bonding surface in a liquid-tight manner.
Description
Technical Field
The present invention relates to an ink jet head that discharges ink in a pressure chamber to the outside, a method of manufacturing the ink jet head, and an image forming apparatus including the ink jet head.
Background
High-resolution inkjet heads using MEMS (Micro Electro Mechanical Systems) technology have been developed. A conventional inkjet head includes a plurality of pressure chambers for discharging liquid ink, and an actuator for applying a discharge pressure to the ink supplied to the pressure chambers and a nozzle for discharging the ink in the pressure chambers are provided for each of the pressure chambers. Then, ink is directly supplied from a common ink chamber disposed above all the pressure chambers, and discharge pressure is applied to each pressure chamber, thereby discharging ink from the nozzles (patent document 1). Such inkjet heads have less interference with each other, and high-quality printing can be achieved.
In general, such an ink jet head has a structure in which a nozzle substrate having nozzles and pressure chambers, a flow path substrate housing actuators, and a wiring substrate for supplying power to the actuators are stacked. In the structure in which the nozzle substrate, the flow path substrate, and the wiring substrate are laminated, the substrates are bonded to each other via an adhesive layer, for example, and the ink for the common ink chamber flows through the wiring substrate and the independent flow paths of the flow path substrate and is supplied to the pressure chambers.
Documents of the prior art
Patent document
Patent document 1: japanese unexamined patent application publication No. 2014-83705
Disclosure of Invention
Technical problem to be solved by the invention
In the wiring substrate, however, a wiring layer for supplying power to the upper electrode of the actuator is formed on the bonding surface between the wiring substrate and the flow path substrate, and the wiring layer has a predetermined thickness. In general, an insulating oxide film is formed on the upper surface of the wiring layer, but the insulating oxide film is thinner than the wiring layer and formed so as to follow the shape of the wiring layer. Therefore, unevenness due to the thickness of the wiring layer is present on the wiring layer surface of the wiring substrate. Further, since the wiring substrate is bonded to the flow path substrate in a state having the uneven surface resulting from the wiring layer, there is a problem that a gap is present between the wiring substrate and the flow path substrate in a non-wiring region where no wiring is provided.
In this way, when there is unevenness due to the wiring layer on the bonding surface to be bonded to the channel substrate, there is a concern that the ink supplied from the common ink chamber to the pressure chamber via the individual channels of the wiring substrate and the channel substrate may leak between the channel substrate and the wiring layer.
Accordingly, an object of the present invention is to provide an ink jet head that prevents ink from leaking between a flow path substrate and a wiring layer. It is another object of the present invention to provide a method of manufacturing the ink jet head and an image forming apparatus including the ink jet head.
Technical solution for solving technical problem
In order to solve the above-described problems and achieve the object of the present invention, an ink jet head according to the present invention includes: a pressure chamber substrate having a plurality of pressure chambers and an actuator provided for each pressure chamber and changing a volume of the pressure chamber; and a nozzle substrate which is communicated with each pressure chamber and has a nozzle for discharging liquid by the volume change of the pressure chamber. Further, the apparatus comprises: a common ink chamber that stores ink and supplies the ink to the pressure chambers; a wiring layer having independent wires that independently supply power to the actuators provided for each pressure chamber; and a flow path substrate which has a space portion for accommodating the actuator between the wiring layer and the flow path substrate, and a communication flow path for independently communicating the pressure chamber and the common ink chamber, and is bonded to the surface on which the wiring layer is formed. The sealing section is provided in a region surrounding the communication channel on the bonding surface between the channel substrate and the wiring layer, and seals the bonding surface in a liquid-tight manner.
In the method of manufacturing an ink jet head according to the present invention, the method includes: before the surface of the channel substrate on which the wiring layer is formed is bonded to the channel substrate, a sealing portion for liquid-tightly sealing the bonding surface is formed in a region surrounding the communicating channel on the bonding surface of the channel substrate or the wiring layer.
The image forming apparatus of the present invention includes the inkjet head.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, in the ink jet head in which the passage substrate and the wiring layer are bonded to each other, it is possible to prevent ink from leaking between the passage substrate and the wiring layer.
Drawings
Fig. 1 is a schematic configuration diagram of an image forming apparatus according to a first embodiment of the present invention.
Fig. 2 is a schematic configuration diagram showing an external appearance of an ink jet head according to a first embodiment of the present invention.
Fig. 3 is a schematic configuration diagram showing a cross section of a main part of an ink jet head according to a first embodiment of the present invention.
Fig. 4A is a schematic plan view of the flow path substrate of the ink jet head according to the first embodiment of the present invention, as viewed from the wiring substrate side. Fig. 4B is an enlarged view of the area a1 of fig. 4A.
Fig. 5A is a schematic plan view of the wiring layer in the ink jet head according to the first embodiment of the present invention disposed on the flow path substrate. Fig. 5B is an enlarged view of the area a2 of fig. 5A.
Fig. 6A to 6C are process diagrams for manufacturing when the wiring substrate is bonded to the bonded body of the flow path substrate and the nozzle substrate.
Fig. 7 is a schematic plan view of a main portion of the ink jet head according to the second embodiment of the present invention, in which a wiring layer is disposed on a flow path substrate.
Fig. 8 is a schematic configuration diagram of a plane on which a wiring layer of an ink jet head according to a third embodiment of the present invention is formed.
Fig. 9 is a schematic configuration diagram showing a cross section of a main part of an ink jet head according to a third embodiment of the present invention.
Detailed Description
An inkjet head, a method of manufacturing the inkjet head, and an image forming apparatus including the inkjet head according to embodiments of the present invention will be described below with reference to the drawings. The present invention is not limited to the following examples. In the drawings described below, the same reference numerals are given to the common components. The following procedure is described.
1. First embodiment (example of ink jet head including nozzle substrate, pressure chamber substrate, channel substrate, and wiring substrate)
1-1. Structure of image forming apparatus
1-2. Ink jet head structure and manufacturing method
2. Second embodiment (example of connecting sealing part to independent wire)
3. Third embodiment (example in which a thin film PZT, independent wiring, and sealing portion are directly provided on a pressure chamber substrate in a piezoelectric layer)
1. First embodiment (example of ink jet head including nozzle substrate, pressure chamber substrate, channel substrate, and wiring substrate)
1-1. Structure of image forming apparatus
First, an image forming apparatus according to a first embodiment of the present invention (hereinafter, referred to as the present embodiment) will be described. Fig. 1 is a schematic configuration diagram of an image forming apparatus according to the present embodiment. In the following description, an example of an embodiment in a single pass drawing system in which a line head is used and drawing is performed only by conveying a recording medium is described, but an appropriate drawing system can be adopted. In the following description, the transport direction of the recording medium R is referred to as a front-rear direction, a direction perpendicular to the transport direction on the transport surface of the recording medium is referred to as a left-right direction, and a direction perpendicular to the front-rear direction and the left-right direction (an ejection direction of ink) is referred to as an up-down direction.
As shown in fig. 1, the image forming apparatus 100 of the present embodiment includes a platen 101, a conveying roller 102, and a plurality of line heads 103,104,105,106. The platen 101 is formed of a flat plate-like member, and supports the recording medium R on the upper surface. The platen 101 conveys the recording medium R in the conveying direction (front-rear direction) when the conveying rollers 102 are driven. The line heads 103,104,105,106 are arranged in parallel with the width direction (left-right direction) orthogonal to the conveyance direction from the upstream side to the downstream side in the conveyance direction (front-back direction) of the recording medium R. At least one ink jet head described later is provided inside the line head 103,104,105,106, and discharges, for example, inks of blue (C), magenta (M), yellow (Y), and black (K) to the recording medium R.
1-2. Ink jet head structure and manufacturing method
Next, an ink jet head according to the present embodiment applied to the image forming apparatus 100 will be described. Fig. 2 is a schematic configuration diagram showing an external appearance of the ink jet head 1 used in the image forming apparatus 100 according to the present embodiment. Fig. 3 is a schematic configuration diagram showing a cross section of a main part of the ink jet head 1 according to the present embodiment.
As shown in fig. 2 and 3, the inkjet head 1 includes a holding plate 3, an ink manifold 2 mounted on the holding plate 3, a flexible circuit board 5, and an inkjet head chip 10 mounted on the holding plate 3.
[ ink manifold, holding plate, and Flexible Circuit Board ]
The manifold 2 is formed of a resin such as LCP (Liquid Crystal Plastic), and is formed of a square tubular member having one end closed by a top surface portion and the other end opened. The holding plate 3 is connected to the surface of the opening of the ink manifold 2, and the interior of the ink manifold 2 serves as a common ink chamber 8 for storing ink supplied from the outside. Further, an ink supply port 6 for supplying ink to the common ink chamber 8 and an ink discharge port 7 for discharging ink from the common ink chamber 8 are provided in the top surface portion of the ink manifold 2.
A filter 9 is provided near the opening of the common ink chamber 8, and the filter 9 is disposed so as to divide the common ink chamber 8 into a region on the ink supply port 6 side and a region on the head chip 10 side. The filter 9 is formed of a mesh-like member and is provided to remove foreign matter from the ink supplied from the ink supply port 6 and to supply the ink from which the foreign matter has been removed to the head chip 10 side.
The holding plate 3 is formed of a flat plate-like member having an opening 3b in the center portion thereof, and is formed of 42Ni alloy or the like having a linear expansion coefficient close to that of silicon (Si). The ink manifold 2 is joined to one surface of the holding plate 3, and the head chips 10 are joined to the other surface. The common ink chamber 8 of the ink manifold 2 and the head chips 10 communicate with each other via the opening 3b of the holding plate 3.
An insertion hole 3a into which the flexible circuit board 5 for supplying power to the head chip 10 is inserted is provided in the outer peripheral portion of the holding plate 3. In the present embodiment, the planarity of the inkjet head chip 10 of the present embodiment using the MEMS technology requiring precision can be ensured by constituting the holding plate 3 with a material having a linear expansion coefficient close to that of silicon.
The flexible circuit board 5 is connected to a connection portion 63 (see fig. 5) of the wiring board 30 described later via an anisotropic conductive film. The flexible circuit board 5 is inserted into an insertion hole 3a provided in the holding plate 3 and is drawn out toward the ink manifold 2. In the ink jet head 1 of the present embodiment, power is supplied to the upper electrode 53 and the lower common electrode 51 of the actuator 50, which will be described later, via the wiring board 30 via the flexible circuit board 5.
[ ink jet head chip ]
Although not shown in fig. 1, as shown in fig. 2, the head chips 10 are held on the side of the holding plate 3 opposite to the side holding the ink manifold 2. The head chip 10 includes a nozzle substrate 21, an intermediate substrate 22, a pressure chamber substrate 26, a flow path substrate 29, and a wiring substrate 30, and is stacked in this order from the ink discharge surface side of the ink jet head 1 on the holding plate 3 side.
Fig. 4A is a schematic plan view of the flow path substrate 29 of the ink jet head 1 according to the present embodiment as viewed from the wiring substrate 30 side, and fig. 4B is an enlarged view of a region a1 in fig. 4A. Fig. 5A is a schematic plan view of the wiring layer 31 in the ink jet head 1 of the present embodiment disposed on the flow path substrate 29, and fig. 5B is an enlarged view of a region a2 in fig. 5A.
The nozzle substrate 21 is made of, for example, a 50 to 200 μm silicon substrate, and has a plurality of through holes which are nozzles 40 having an opening diameter of 10 to 30 μm and a depth of about 10 to 40 μm for discharging ink supplied from the common ink chamber 8 to the outside. The nozzle 40 can be formed by removing an unnecessary portion of the silicon substrate by etching using an optical lithography method.
The number of the nozzles 40 is, for example, 500 to 2000, and is arranged in a matrix on the nozzle substrate 21. The nozzle 40 is provided to communicate with a pressure chamber 27 provided in a pressure chamber substrate 26 described later. The nozzles 40 are arranged at a predetermined nozzle pitch in order to ensure a necessary nozzle resolution, and fig. 4A illustrates a case of the nozzles 40 having an 8-line structure.
The intermediate substrate 22 is made of, for example, a glass substrate, and has a first communication passage 41 that communicates the nozzle 40 with a pressure chamber 27 provided in a pressure chamber substrate 26 described later. The first communication channel 41 can be formed by sandblasting a predetermined position of the glass substrate. The first communication passages 41 are provided at positions corresponding to the nozzles 40, and are formed so as to penetrate the intermediate substrate 22. In the intermediate substrate 22, the shape of the flow path of the ink reaching the nozzle 40 is made to be an arbitrary shape by making the diameter of the first communication flow path 41 small or the like, so that the kinetic energy applied to the ink when flowing through the first communication flow path 41 can be adjusted. The intermediate substrate 22 is bonded to the nozzle substrate 21 via an adhesive layer (not shown). The intermediate substrate 22 is not essential, and may be a structure in which the intermediate substrate 22 is not provided.
The pressure chamber substrate 26 is formed by sequentially laminating a support substrate 23 made of Si and SiO2 A BOX layer 24 and an active layer 25 made of Si, and has a first communication path formed through a first interconnection provided on the intermediate substrate 22The flow path 41 includes a plurality of pressure chambers (passages) 27 communicating with the nozzles 40, a second communication flow path 28, and a pressure generating portion 55. The thickness of the support substrate 23 of the SOI substrate to be the pressure chamber substrate 26 is about 50 to 200 μm, the thickness of the BOX layer 24 is about 0.1 μm, and the thickness of the active layer 25 is about 10 to 50 μm.
The pressure chambers 27 are spaces that independently store ink supplied from the common ink chamber 8. The second communication channel 28 is a hole that communicates each pressure chamber 27 with a third communication channel 42 provided in the channel substrate 29 and described later. In fig. 4A and 4B, the shapes of the pressure chamber 27 and the second communication flow passage 28 are indicated by broken lines. As shown in fig. 4A, the pressure chambers 27 and the second communication channels 28 are provided in a two-dimensional matrix on the support substrate 23 side of the SOI substrate. The pressure chamber 27 is formed in a substantially circular cross section, and the second communication flow path 28 is provided to protrude from the pressure chamber 27 to a position where the third communication flow path 42 is disposed.
The pressure generating portion 55 has the vibration plate 47 and the actuator 50. The vibration plate 47 is provided on the upper surface of each pressure chamber 27 on the flow path substrate 29 side as shown in fig. 3, and is provided for each pressure chamber 27. The diaphragm 47 is formed by an upper wall portion of the pressure chamber 27 on the flow path substrate 29 side, and is integrally provided on the pressure chamber substrate 26 on which the pressure chamber 27 is formed. In the present embodiment, the vibrating plate 47 is formed of the active layer 25 of the SOI substrate constituting the pressure chamber substrate 26.
The actuator 50 is provided on a surface of the diaphragm 47 opposite to the side facing the pressure chamber 27, and is composed of a lower common electrode 51, a piezoelectric layer 52, and an upper electrode 53 which are stacked in this order from the diaphragm 47 side. The lower common electrode 51 is formed of a thin-film metal layer, and in the present embodiment, a Ti (titanium) layer and a Pt (platinum) layer are sequentially stacked. The Ti layer is formed to be about 0.02 μm, for example, and the Pt layer is formed to be about 0.1 μm, for example. Instead of the Pt layer, an Au (gold) layer may be formed. The lower common electrode 51 is provided in common to all the pressure chambers 27, and the lower common electrode 51 is grounded via a ground wiring 64 (see fig. 5A) provided on a wiring board 30 to be described later.
The piezoelectric layer 52 may be made of a material having a thickness of about 20 to 100 μm and deformed by an applied electric field, for example, a ferroelectric material such as lead zirconate titanate (PZT). The piezoelectric layer 52 is provided on the upper portion of the vibration plate 47 above the pressure chambers 27, and is formed in each pressure chamber 27 (each channel). In the present embodiment, as shown in fig. 4B, the shape is circular in plan view.
The upper electrode 53 is an electrode provided independently on the upper portion of each piezoelectric layer 52, and is an independent electrode provided corresponding to each pressure chamber 27. The upper electrode 53 is formed of a thin film metal layer, and in the present embodiment, a Ti layer and a Pt layer are sequentially stacked. The Ti layer is formed to be about 0.02 μm, for example, and the Pt layer is formed to be about 0.1 μm, for example. Instead of the Pt layer, an Au (gold) layer may be formed. As shown in fig. 4B, the upper electrode 53 is formed in a substantially circular shape, similarly to the piezoelectric layer 52. The upper electrode 53 has a protruding portion at its end, and a stud bump 54 of an independent wiring 39, which will be described later, and a solder bump or a conductive paste 56 are connected to the protruding portion.
In order to form the pressure chamber substrate 26, first, an SOI substrate is prepared, and a Ti layer having a thickness of about 0.02 μm and a Pt layer having a thickness of about 0.1 μm are sequentially formed on the entire surface of the active layer 25 of the SOI substrate by sputtering, thereby forming a metal layer to be the lower common electrode 51. Next, the excess portion of the metal layer is removed by etching using an optical lithography method, and the lower common electrode 51 having a desired shape is formed.
Subsequently, unnecessary portions of the support substrate 23, the BOX layer 24, and the active layer 25 are removed from the support substrate 23 side of the SOI substrate by etching by an optical lithography method, thereby forming a plurality of pressure chambers 27 and second communication flow paths 28. Here, in the etching step on the support substrate 23 side for forming the pressure chamber 27, the BOX layer 24 serves as an etching stopper, and the active layer 25 remaining in the portion corresponding to the pressure chamber 27 serves as the vibrating plate 47.
On the other hand, the piezoelectric layer 52 and the upper electrode 53 which constitute the actuator 50 are formed by sand blasting into predetermined shapes. At this time, although not shown, an electrode layer to be joined to the lower common electrode 51 is formed below the piezoelectric layer 52. That is, the laminate composed of the electrode layer, the piezoelectric layer 52, and the upper electrode 53 is integrally processed. After the pressure chamber substrate 26 is bonded to the bonded body formed by bonding the nozzle substrate 21 and the intermediate substrate 22, a laminate including a piezoelectric layer 52 and an upper electrode 53, which is to be an actuator 50, is bonded to the upper portion of the lower common electrode 51 on the vibrating plate 47 by an epoxy adhesive or the like. Thus, in the pressure chamber substrate 26, the actuator 50 having the piezoelectric single-chip structure is formed on the diaphragm 47.
In the present embodiment, the diaphragm 47 can be deformed by applying a voltage between the upper electrode 53 and the lower common electrode 51 to deform the piezoelectric layer 52. Then, the deformation of the vibration plate 47 generates a pressure for discharging the ink in each pressure chamber 27, and the ink is discharged from the nozzle 40. The surface of the pressure chamber substrate 26 opposite to the side on which the pressure generating portion 55 is formed is bonded to the surface of the intermediate substrate 22 opposite to the nozzle substrate 21 by, for example, anodic bonding.
The flow path substrate 29 is made of a glass substrate, 42 Alloy (Alloy), or the like, and has a space 44 for accommodating the actuator 50 and a third communication flow path 42 for communicating the pressure chambers 27 and a fourth communication flow path 43 provided on a wiring substrate 30 described later. As shown by the solid lines in fig. 4A, the space portion 44 provided in the flow path substrate 29 is formed in each row of the pressure chambers 27 arranged in a matrix shape, and is provided so as to penetrate the substrate. That is, the actuators 50 corresponding to the pressure chambers 27 adjacent in the row direction are housed in the space portions 44 continuous in the row direction.
Further, the third communication flow path 42 of the flow path substrate 29 is provided for each pressure chamber 27, and is formed in a circular shape in cross section as shown in fig. 4A. As shown in fig. 4A, lead-out through holes 61 for grounding the lower common electrodes 51 are provided at three locations at both ends of the flow path substrate 29 in the row direction, and each lower common electrode 51 is connected to a grounding wiring 64 of the wiring substrate 30, which will be described later, via bumps 62. The flow path substrate 29 is bonded to a surface of the pressure chamber substrate 26 opposite to the side to which the intermediate substrate 22 is bonded, via an adhesive layer (not shown).
The wiring substrate 30 includes a silicon layer 32, a wiring layer 31, an insulating layer 45 provided so as to cover the wiring layer 31, and a fourth communication channel 43 penetrating the silicon layer 32 and the insulating layer 45.
The fourth communication channel 43 (wiring substrate side communication channel of the present invention) is provided through the silicon layer 32 so as to communicate the common ink chamber 8 provided on the upper portion of the wiring substrate 30 with the third communication channel 42 provided on the channel substrate 29. In the present embodiment, the fourth communication channel 43 is formed in a substantially same shape as the cross section of the third communication channel 42, for example, in a circular shape, on the surface bonded to the channel substrate 29.
The wiring layer 31 includes an independent wiring 39 formed on the surface of the silicon layer 32 on the flow path substrate 29 side and connected to the upper electrodes 53 provided in the pressure generating sections 55, a ground wiring 64 connected to the lower common electrode 51, and a sealing section 46 provided so as to surround the periphery of the fourth communication flow path 43. The individual wiring 39, the ground wiring 64, and the sealing portion 46 are formed of, for example, aluminum.
The individual wires 39 are connected to the upper electrodes 53 constituting the actuators 50 via stud bumps 54 and solder bumps or conductive paste 56 as shown in fig. 3, and the individual wires 39 are provided so as to lead out the upper electrodes 53 to the end portions of the wiring board 30 in the column direction as shown in fig. 5A and 5B. Both ends of the wiring board 30 in the column direction serve as connection portions 63 to which the flexible circuit board 5 is connected. Each individual wire 39 is drawn out to the near one of the connection portions 63 provided at both ends in the column direction of the wiring substrate 30. In the present embodiment, the upper electrodes 53 provided in the pressure chambers 27 of 4 rows arranged from the center to one side among the pressure chambers 27 of 8 rows are led out to the connecting portion 63 of one side, and the upper electrodes 53 provided in the pressure chambers 27 of 4 rows arranged to the other side are led out to the connecting portion 63 of the other side.
In the present embodiment, the wiring board 30 is provided with the ground wiring 64 connected to the lower common electrode 51 at both ends in the direction orthogonal to the extending direction of the individual wiring 39. A bump 62 connected to the lower common electrode 51 is also formed on the ground wiring 64, and the ground wiring 64 is electrically connected to the lower common electrode 51 via the bump 62. The ground wiring 64 also extends in the same direction as the individual wiring 39, and is connected to the flexible circuit board 5 at the connection portion 63 of the wiring board 30.
In order to reduce the wiring resistance, it is preferable that the individual wiring 39 and the grounding wiring 64 be formed as thick and thick as possible within the manufacturable range, and in the present embodiment, formed to have a thickness of 4 μm.
The sealing portion 46 is formed to surround the fourth communication flow path 43 with a predetermined width from the edge of the fourth communication flow path 43, and in the present embodiment, is formed in a circular shape (ring shape). The sealing portion 46 is formed to have a size not to touch the adjacent individual wire 39. In the present embodiment, the sealing portion 46 is preferably formed to have a width of about 20 μm to 200 μm, preferably 100 μm or less, in the planar direction of the wiring layer 31. Here, the width of the seal portion 46 in the present embodiment is half of the difference between the outer diameter and the inner diameter of the seal portion 46 provided annularly.
The sealing portion 46 is provided at the interface between the flow path substrate 29 and the wiring substrate 30 as a barrier for improving the adhesion between the flow path substrate 29 and the wiring substrate 30 and preventing ink leakage. As in the present embodiment, the width of the sealing portion 46 in the surface direction is set to 20 μm or more, whereby the periphery of the ink flow path can be reliably sealed. Further, since the higher density of the channel also affects other wirings, it is preferable to form the channel with a width of 200 μm or less, preferably 100 μm or less. The sealing portion 46 is formed in the same step as the manufacturing step of the individual wiring 39, and is formed to have a thickness of 4 μm as in the case of the individual wiring 39 and the ground wiring 64.
The insulating layer 45 is made of, for example, SiO2The structure is formed on the upper surface of the wiring layer 31 provided on the wiring substrate 30, and is provided in a portion other than the formation region of the stud bump 54 provided on the individual wiring 39 and the bump 62 provided on the ground wiring 64. The insulating layer 45 is formed to have a thickness of, for example, about 1 μm, and is formed on the upper surface of the wiring layer 31 so as to follow the shape of the wiring layer 31.
In the wiring board 30, the insulating layer for protecting the silicon layer 32 is formed on the entire surface of the silicon layer 32, that is, between the silicon layer 32 and the wiring layer 31 and on the surface of the silicon layer 32 opposite to the surface on which the wiring layer 31 is formed. The wiring board 30 having such a configuration is bonded to the flow path board 29 via an adhesive layer (not shown) so that the surface on the wiring layer 31 side is bonded to the flow path board.
Here, an example of a manufacturing process of the wiring board 30 will be described. First, a silicon substrate to be the silicon layer 32 is prepared, and SiO is formed on the entire surface of one surface of the silicon substrate2An insulating layer (not shown) is formed, and an Al layer is formed on the upper surface of the insulating layer. Then, unnecessary portions of the Al layer are removed by etching using an optical lithography method, thereby forming the individual wiring 39, the ground wiring 64, and the wiring layer 31 of the sealing portion 46 having a desired shape. Then, SiO is formed on the wiring layer 312And an insulating layer 45. The insulating layer 45 is etched to remove the regions where the stud bump 54 and the solder bump 56 of the individual wire 39 and the bump 62 of the ground wire 64 are formed.
Next, SiO was formed on the entire surface of the silicon substrate opposite to the side on which the wiring layer 31 was formed2An insulating layer (not shown) is formed. Then, unnecessary portions of the insulating layer and the silicon substrate are removed by etching treatment using an optical lithography method, and the fourth communication flow path 43 is formed. Then, a stud bump 54 is formed at a predetermined position of the individual wire 39 by wire bonding using a thin metal wire. In order to ensure reliability of electrical connection between the wiring board 30 and the channel board 29 at the time of bonding, solder bumps 56 are formed on the stud bumps 54. In the same step as the step of forming the stud bump 54 and the solder bump 56 formed on the individual wire 39, the bump 62 of the ground wire 64 is also formed. Alternatively, instead of the solder bump, the conductive paste 56 may be applied to the stud bump tip by transfer or the like. Thereby, the wiring board 30 is formed.
Fig. 6A to 6C are process diagrams for manufacturing a bonded assembly of the wiring substrate 30, the flow path substrate 29, the pressure chamber substrate 26, the intermediate substrate 22, and the nozzle substrate 21 during bonding. First, the wiring board 30 (see fig. 6A) and a joined body (see fig. 6B) obtained by joining the flow path substrate 29, the pressure chamber substrate 26, the intermediate substrate 22, and the nozzle substrate 21 are prepared. The assembly of the flow path substrate 29, the pressure chamber substrate 26, the intermediate substrate 22, and the nozzle substrate 21 is formed by sequentially bonding the nozzle substrate 21, the intermediate substrate 22, the pressure chamber substrate 26, and the flow path substrate 29 as described above.
Next, an adhesive layer (not shown) is formed on the surface of the flow path substrate 29 in the assembly of the flow path substrate 29, the pressure chamber substrate 26, the intermediate substrate 22, and the nozzle substrate 21. The adhesive layer does not need to be uniformly applied over the entire surface, and therefore, it is preferable to apply the adhesive layer by using a transfer or printing technique. Thereafter, the surface of the wiring layer 31 of the wiring substrate 30 is opposed to the channel substrate 29, and alignment is performed using alignment marks, which are not shown. Then, as shown in fig. 6C, the wiring board 30 is bonded to the flow path substrate 29. The wiring board 30 is bonded to the assembly of the flow path board 29, the pressure chamber board 26, the intermediate board 22, and the nozzle board 21, whereby the individual wiring 39 is electrically connected to the upper electrode 53 of the pressure generating section 55, and the ground wiring 64 is electrically connected to the lower common electrode 51. Thereby, the inkjet head chip 10 is completed.
In the present embodiment, the common ink chamber 8 side of the ink manifold 2 is bonded to the wiring board 30 side of the inkjet head chip 10 via the holding plate 3, and the connection portion 63 provided on the wiring board 30 is bonded to the flexible circuit board 5 via the anisotropic conductive film, thereby completing the inkjet head 1.
In the ink jet head 1 of the present embodiment, the ink supplied to the common ink chamber 8 is supplied to the pressure chambers 27 through the fourth communication channel 43, the third communication channel 42, and the second communication channel 28. Then, in the pressure generating portion 55, an electric field is applied to the piezoelectric layer 52 in the actuator 50 to generate flexural deformation, and the flexural deformation causes a volume change of the pressure chamber 27 via the vibration plate. As a result, the pressure in the pressure chamber 27 changes due to the volume change, and the ink supplied to the inside is discharged to the outside through the first communication channel 41 and the nozzle 40.
In the present embodiment, the wiring substrate 30 is provided with the dam-shaped sealing portion 46 around the fourth communication channel 43, and the dam-shaped sealing portion 46 is formed at the same height as the other individual wires 39 and the ground wire 64, and therefore is the highest portion of the uneven surface of the wiring layer 31 surface. Therefore, the sealing portion 46 can be reliably bonded to the surface of the flow path substrate 29 when the wiring substrate 30 and the flow path substrate 29 are bonded to each other.
Thus, no gap is formed between the wiring substrate 30 and the flow path substrate 29 at the boundary between the fourth communication flow path 43 and the third communication flow path 42, and therefore the fourth communication flow path 43 and the third communication flow path 42 are held in a liquid-tight manner. Therefore, when the ink flows from the fourth communication channel 43 to the third communication channel 42, the ink can be prevented from leaking between the wiring board 30 and the channel board 29.
As shown in fig. 6A, irregularities due to the wiring layer 31 exist on the surface of the wiring substrate 30 on the wiring layer 31 side. Therefore, in the case of a structure without a sealing portion as in the conventional ink jet head, the periphery of the fourth communication channel 43 is formed in a concave shape, and a gap is formed between the surface of the wiring layer 31 and the channel substrate 29, so that the possibility of ink leakage is increased. On the other hand, if the amount of adhesive applied is increased in order to fill the gap, the adhesive may overflow into the flow path of the ink to block the flow path.
In contrast, in the present embodiment, by providing the seal portion 46, the gap at the boundary between the wiring substrate 30 and the flow path substrate 29 can be eliminated around the fourth communication flow path 43 and the third communication flow path 42 without increasing the amount of the adhesive applied.
In the present embodiment, the sealing portion 46 can be formed simultaneously with the independent wiring 39 and the ground wiring 64 when the wiring layer 31 is formed. Therefore, a separate process for forming the seal portion 46 is not required.
In the present embodiment, the description has been made using an example in which the wiring layer 31 is formed only on one surface of the wiring substrate 30, but the present invention can also be applied to a configuration in which the wiring layer 31 is provided on both surfaces of the wiring substrate 30. In this case, the same effect as that of the present embodiment can be obtained by forming the sealing portion 46 on the wiring layer 31 on the flow path substrate 29 side of the wiring substrate 30. In the present embodiment, the outer shape of the sealing portion 46 is formed by a circular member, but the present invention is not limited thereto, and may be a rectangular shape, for example.
2. Second embodiment (example of using a sealing part as wiring)
Next, an ink jet head according to a second embodiment of the present invention will be described. Fig. 7 is a schematic plan view of the wiring layer 72 of the ink jet head 70 according to the present embodiment disposed on the flow path substrate 29, and shows a part corresponding to a part of the pressure chamber 27 in an enlarged manner as in fig. 5B. In fig. 7, the same reference numerals are given to portions corresponding to fig. 5B, and redundant description is omitted.
As shown in fig. 7, in the inkjet head 70 of the present embodiment, the seal portion 46 formed on the wiring layer 72 is connected to the individual wiring 71. The seal portion 46 has the same configuration as that of the first embodiment. The individual wire 71 is connected to the sealing portion 46, connected to the upper electrode 53 via the stud bump 54 and the solder bump 56 or the conductive paste, and extended to the connection portion 63 at the end of the wiring board 30.
However, in the case of improving the resolution of the inkjet head, it is necessary to narrow the pitch between the channels (pressure chambers 27), increase the number of columns, or adopt both of them at the same time. In the case of narrowing the pitch between the channels, the interval between the flow paths is narrowed, but in order to widen the interval, the flow paths need to be narrowed, and reducing the diameter of the flow paths causes an increase in flow path resistance, which affects the emission characteristics. On the other hand, when the number of rows of wires is increased, the number of wires passing through the flow path increases, the width of each wire decreases, and the wire resistance increases.
In contrast, in the present embodiment, the sealing portion 46 is used as a part of the independent wiring 71, so that the wiring can be performed so as to straddle the fourth communication channel 43. Therefore, a region where wiring cannot be provided in the past can be used as a wiring space. This makes it possible to increase the width of one wire or increase the diameter of the third communication channel 42. Therefore, even when the resolution of the inkjet head is high, it is possible to prevent an increase in wiring resistance or deterioration in emission characteristics.
3. Third embodiment (example in which a thin film PZT is used for a piezoelectric layer and independent wiring is directly provided on a pressure chamber substrate)
Next, an ink jet head according to a third embodiment of the present invention will be described. Fig. 8 is a schematic configuration diagram of a plane on which the wiring layer 92 is formed of the inkjet head 80 according to the present embodiment, and fig. 9 is a schematic configuration diagram showing a cross section of a main portion of the inkjet head 80 according to the present embodiment. The inkjet head 80 of the present embodiment is different from the first embodiment in that the individual wiring 91 is directly provided on the pressure chamber substrate 26 and there is no wiring substrate. In fig. 9, the same reference numerals are given to portions corresponding to those in fig. 3, and redundant description is omitted.
As shown in fig. 9, the head chip 99 of the ink jet head 80 of the present embodiment is stacked in this order from the ink discharge surface side of the ink jet head 80 on the holding plate 3 side via the nozzle substrate 21, the intermediate substrate 22, the pressure chamber substrate 97, and the flow path substrate 88.
The pressure chamber substrate 97 is formed by laminating a support substrate 23 made of Si and SiO in this order2The BOX layer 24 and the active layer 25 made of Si are formed on an soi (silicon on insulator) substrate, and include a plurality of pressure chambers (channels) 27, second communication channels 28, and pressure generating portions 81 that communicate with the nozzles 40 via first communication channels 41 provided on the intermediate substrate 22. The pressure generating portion 81 has a vibration plate 47 and an actuator 85. In the present embodiment, the pressure chamber 27, the second communication channel 28, and the diaphragm 47 have the same configuration as in the first embodiment.
The actuator 85 is provided on the surface of the diaphragm 47 opposite to the side facing the pressure chamber 27, and is composed of a lower common electrode 82, a piezoelectric layer 83, and an upper electrode 84 stacked in this order from the diaphragm 47 side. The upper electrode 84 of the present embodiment is formed on the same layer as the wiring layer 92 constituting the sealing portion 93 and the individual wiring 91, and is connected to the sealing portion 93 and the individual wiring 91.
The lower common electrode 82 is formed of a thin film metal layer, and in the present embodiment, a Ti (titanium) layer and a Pt (platinum) layer are sequentially stacked. The lower common electrode 82 is provided in common on the upper surface of all the diaphragms 47. The Ti layer is formed to be about 0.02 μm, for example, and the Pt layer is formed to be about 0.1 μm, for example. The lower common electrode 82 is grounded at an end of the pressure chamber substrate 26.
The piezoelectric layer 83 can be made of a material that deforms when an electric field is applied thereto, and for example, a ferroelectric material such as lead zirconate titanate (PZT). The piezoelectric layer 83 is provided on the upper portion of the vibration plate 47, and is formed in each pressure chamber 27 (each channel). In the present embodiment, the piezoelectric layer 83 is formed of a thin film PZT (corresponding to the thin film piezoelectric layer of the present invention) that can be formed by sputtering or a sol-gel method. In the present embodiment, as shown in fig. 8, the elliptical shape is formed in a plan view.
The upper electrodes 84 are independently provided above the piezoelectric layers 83. As shown in fig. 8, the upper electrode 84 is formed in the same shape as the piezoelectric layer 83.
The wiring layer 92 extends from the upper portion of the piezoelectric layer 83 to an end portion connected to the flexible circuit board 5, and is formed to surround the second communication channel 28 in a ring shape. That is, the wiring layer 92 positioned around the second communication channel 28 in the wiring layer 92 of the present embodiment constitutes the sealing section 93, and the portion extending toward the end as shown in fig. 8 constitutes the independent wiring 91. The wiring layer 92 is partially formed to extend over the upper electrode 84.
Further, the upper electrode 84, the sealing portion 93, and the independent wire 91 are connected to each channel. The individual wires 91 are connected to the flexible circuit board 5 at the end of the pressure chamber substrate 26, although not shown, and thereby apply a desired voltage to the actuator 85. That is, in the present embodiment, the pressure chamber substrate 26 also serves as a wiring substrate.
An insulating layer 86 is formed between the wiring layer 92 and the lower common electrode 82 except for the region where the piezoelectric layer 83 is formed, and an insulating layer 87 is formed over the entire upper portion of the wiring layer 92 on the flow path substrate 88 side.
Here, a process of forming the pressure chamber substrate 97 will be described. First, an SOI substrate constituting the pressure chamber substrate 97 is prepared. An SOI substrate in which a support substrate 23 made of Si and SiO are laminated in this order2 A BOX layer 24, an active layer 25 made of Si, and a support substrate 23 having a thickness of about 50 to 200 μm. First, sputtering is used on the surface of the active layer 25In the method, a Ti layer having a thickness of about 0.2 μm and a Pt layer having a thickness of about 0.1 μm are sequentially formed to form a metal layer to be the lower common electrode 82. Next, a PZT layer to be the piezoelectric layer 83 is formed by, for example, sputtering on the entire surface of the metal layer to be the lower common electrode 82, and a Ti layer having a thickness of about 0.2 μm and a Pt layer having a thickness of about 0.1 μm are sequentially formed by sputtering or the like to form the metal layer to be the upper electrode 84. Thereafter, the metal layer to be the upper electrode and the excess portion of the PZT layer are removed by etching using an optical lithography method, thereby forming the upper electrode 84 and the piezoelectric layer 83. Next, similarly, an excess portion of the metal layer is removed by etching processing using an optical lithography method, thereby forming the lower common electrode 82.
Next, an insulating material layer is formed over the entire surface, and a region above the piezoelectric layer 83 is removed by etching using an optical lithography method, thereby forming an insulating layer 86. Then, a metal layer to be the wiring layer 92 of Al (aluminum) or the like is formed. Then, an excess portion of the metal layer is removed by etching using an optical lithography method, thereby forming a wiring layer 92 including the individual wiring 91 and the sealing portion 93. Then, the insulating layer 87 is formed on the entire surface where the wiring layer 92 is formed.
Next, unnecessary portions of the support substrate 23, the BOX layer 24, and the active layer 25 are removed from the support substrate 23 side of the SOI substrate by etching by an optical lithography method, thereby forming a plurality of pressure chambers 27 and second communication flow paths 28. Here, in the etching step on the support substrate 23 side for forming the pressure chamber 27, the BOX layer 24 serves as an etching stopper, and the active layer 25 remaining in the portion corresponding to the pressure chamber 27 serves as a vibrating plate.
In the present embodiment, as described above, after the upper electrode 84 constituting the actuator 85 is formed, the individual wiring 91 and the sealing portion 93 are formed on the upper portion of the pressure chamber substrate 97. Thus, a wiring board does not need to be separately formed.
The flow path substrate 88 is made of a glass substrate or 42 Alloy (Alloy), and has a space 90 for accommodating the actuator 85 and a third communication flow path 89 for communicating the pressure chambers 27 with the common ink chamber 8. In the present embodiment, since no wiring board is provided, the common ink chamber 8 is disposed above the flow path substrate 88. Therefore, the space 90 for accommodating the actuator 85 is formed of a groove portion formed at a predetermined depth from the pressure chamber substrate 97 side without penetrating the flow path substrate 88.
In the inkjet head 80 of the present embodiment, the flow path substrate 88 is bonded to the upper portion of the wiring layer 92 on the pressure chamber substrate 97 using an adhesive, thereby completing the inkjet head chip 99. Since the sealing portion 93 is formed around the third communication flow path 89 and the second communication flow path 28, when the flow path substrate 88 and the nozzle substrate 98 are bonded, the upper surface of the sealing portion 93 is bonded so as to be in close contact with the bonding surface of the flow path substrate 88. This prevents ink from leaking between the wiring layer 92 and the nozzle substrate 98 at the boundary between the third communication flow path 89 and the second communication flow path 28.
In the present embodiment, since the thin film PZT is used as the piezoelectric layer 83 constituting the actuator 85, the piezoelectric layer 83 can be directly formed on the Si substrate by a sputtering method, a sol-gel method, or the like. Since the thin film PZT has a film thickness as thin as about 1 to 5 μm and can obtain a large displacement with a small area, the actuators 85 can be arranged at a higher density, and the inkjet head chip 99 can be miniaturized. Further, since the piezoelectric layer 83 can be directly patterned on the Si substrate, the independent wiring 91 connected to the upper electrode 84 can be formed in the same plane, and the wiring substrate can be eliminated. In the present embodiment, the wiring layer 92 is formed so as to extend over the upper electrode 84, but the upper electrode 84 and the wiring layer 92 may be integrally formed by changing the pattern of the upper electrode 84. In this case, the upper electrode 84 and the wiring layer 92 can be formed at one time, and thus the number of steps can be reduced.
In the inkjet head 80 according to the present embodiment, the unevenness resulting from the wiring layer 92 is also formed on the surface of the nozzle substrate 98 on which the wiring layer 92 is formed. Therefore, when the nozzle substrate 98 and the flow path substrate 88 are bonded, a gap is generated due to the uneven surface formed by the wiring layer 92. However, in the present embodiment, the sealing portion 93 is also formed so as to surround the periphery of the second communication flow path 28, whereby the flow path substrate 88 and the nozzle substrate 98 can be attached to each other in a liquid-tight manner at the boundary portion between the second communication flow path 28 and the third communication flow path 89. This prevents ink from leaking between the flow path substrate 88 and the nozzle substrate 98.
The present invention has been described above based on the embodiments, but the present invention is not limited to the configurations described in the above embodiments, and the configurations can be appropriately changed within a range not departing from the gist thereof. In the above embodiment, the sealing portion is formed on the wiring layer, but the sealing portion may be formed of a member different from the wiring layer, for example, an insulating layer having a height similar to that of the wiring layer may be formed. In the case where the sealing portion is formed of a member different from the wiring layer, the sealing portion may be provided not on the wiring layer side but on the surface side to be bonded to the wiring layer. The configuration may be any configuration as long as it can seal a gap between the contact surfaces of the wiring layer having the uneven shape along the periphery of the flow path through which the ink flows. Therefore, the effect of the present invention can be obtained by forming the sealing portion to be as high as or higher than the height of the wiring layer.
The above embodiments are described in detail to facilitate understanding of the present invention, and are not limited to the embodiments having all the configurations described. For example, a part of the configuration of one embodiment may be replaced with the configuration of another embodiment, and the configuration of another embodiment may be added to the configuration of one embodiment. In addition, a part of the configuration of each embodiment can be added, deleted, or replaced with another configuration.
Description of the reference numerals
1 … inkjet head, 2 … ink manifold, 3 … holding plate, 5 … flexible circuit board, 8 … common ink chamber, 10 … inkjet head chip, 21 … nozzle board, 22 … intermediate board, 26 … pressure chamber board, 27 … pressure chamber, 28 … communication hole, 29 … flow path board, 30 … wiring board, 31 … wiring layer, 39 … individual wiring, 40 … nozzle, 41 … first communication flow path, 42 … second communication flow path, 43 … third communication flow path, 44 … space portion, 45 … insulating layer, 46 … sealing portion, 47 … vibration plate, 50 … actuator, 51 … lower common electrode, 52 … piezoelectric layer, 53 … upper electrode, 54 … pillar bump, 55 … pressure generating portion.
Claims (10)
1. An ink jet head, comprising:
a pressure chamber substrate having a plurality of pressure chambers and an actuator provided for each of the pressure chambers and changing a volume of the pressure chamber;
a nozzle substrate having nozzles which communicate with the pressure chambers and discharge liquid by a change in volume of the pressure chambers;
a common ink chamber that stores ink and supplies the ink to the pressure chambers;
a wiring layer having independent wires that independently supply power to the actuators provided for each of the pressure chambers;
a flow path substrate having a space portion for accommodating an actuator between the flow path substrate and the wiring layer and a communication flow path for independently communicating the pressure chamber and the common ink chamber, and bonded to a surface on which the wiring layer is formed;
a sealing section which is provided in a region surrounding the communication channel on a bonding surface between the channel substrate and a surface on which the wiring layer is formed, and which liquid-tightly seals the bonding surface;
the individual wiring and the sealing portion are formed of the same material.
2. An ink jet head according to claim 1,
the sealing section is formed by a part of the wiring layer.
3. An ink jet head according to claim 2,
an independent wire is connected to the sealing portion.
4. An ink jet head according to claim 3,
the wiring layer is formed on a wiring substrate provided on the pressure chamber substrate via the flow path substrate,
the wiring board is provided with a wiring board side communication passage that communicates with the communication passage.
5. An ink jet head according to claim 2,
the actuator includes a lower common electrode, a thin-film piezoelectric layer formed on the lower common electrode, and upper electrodes provided on the thin-film piezoelectric layer independently corresponding to the pressure chambers,
the wiring layer is connected to the upper electrode.
6. An ink jet head according to claim 5,
the wiring layer is formed integrally with the upper electrode.
7. An ink jet head, comprising:
a pressure chamber substrate having a plurality of pressure chambers and an actuator provided for each of the pressure chambers and changing a volume of the pressure chamber;
a nozzle substrate having nozzles which communicate with the pressure chambers and discharge liquid by a change in volume of the pressure chambers;
a common ink chamber that stores ink and supplies the ink to the pressure chambers;
a wiring layer having independent wires that independently supply power to the actuators provided for each of the pressure chambers;
a flow path substrate having a space portion for accommodating an actuator between the flow path substrate and the wiring layer and a communication flow path for independently communicating the pressure chamber and the common ink chamber, and bonded to a surface on which the wiring layer is formed;
a sealing section which is provided in a region surrounding the communication channel on a bonding surface between the channel substrate and a surface on which the wiring layer is formed, and which liquid-tightly seals the bonding surface;
the sealing section is constituted by a part of the wiring layer,
an independent wiring is connected to the sealing portion,
the wiring layer is formed on a wiring substrate provided on the pressure chamber substrate via the flow path substrate,
the wiring board is provided with a wiring board side communication passage that communicates with the communication passage.
8. An image forming apparatus provided with the ink jet head according to any one of claims 1 to 7.
9. A method of manufacturing an ink jet head, the ink jet head comprising:
a pressure chamber substrate having a plurality of pressure chambers and an actuator provided for each of the pressure chambers and changing a volume of the pressure chamber;
a nozzle substrate having nozzles which communicate with the pressure chambers and discharge liquid by a change in volume of the pressure chambers;
a common ink chamber that stores ink and supplies the ink to the pressure chambers;
a wiring layer having independent wires that independently supply power to the actuators provided for each of the pressure chambers;
a flow path substrate having a space portion for accommodating an actuator between the flow path substrate and the wiring layer and a communication flow path for independently communicating the pressure chamber and the common ink chamber, and bonded to a surface on which the wiring layer is formed;
the method for manufacturing the ink jet head comprises the following steps:
before the surface of the channel substrate on which the wiring layer is formed is bonded to the channel substrate, a sealing portion which is formed of the same material as the independent wiring and which seals the bonding surface in a liquid-tight manner is formed in a region surrounding the communication channel on the channel substrate or a bonding surface of the wiring layer on the surface of the channel substrate on which the wiring layer is formed.
10. A method of manufacturing an ink jet head according to claim 9,
the sealing portion is formed in the wiring layer and formed in the same step as the formation of the wiring formed on the wiring layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017000856 | 2017-01-06 | ||
| JP2017-000856 | 2017-01-06 | ||
| PCT/JP2017/042327 WO2018128030A1 (en) | 2017-01-06 | 2017-11-27 | Inkjet head, method for manufacturing inkjet head, and image forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110139760A CN110139760A (en) | 2019-08-16 |
| CN110139760B true CN110139760B (en) | 2021-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780081974.9A Active CN110139760B (en) | 2017-01-06 | 2017-11-27 | Ink jet head, method of manufacturing ink jet head, and image forming apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6950709B2 (en) |
| CN (1) | CN110139760B (en) |
| WO (1) | WO2018128030A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6749063B1 (en) * | 2018-11-29 | 2020-09-02 | 京セラ株式会社 | Liquid ejection head and recording device |
| WO2023190353A1 (en) * | 2022-03-29 | 2023-10-05 | 京セラ株式会社 | Liquid dispensing head and recording device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002086724A (en) * | 2000-09-19 | 2002-03-26 | Seiko Epson Corp | Ink jet recording head and ink jet recorder |
| JP2011115972A (en) * | 2009-12-01 | 2011-06-16 | Konica Minolta Holdings Inc | Ink jet head |
| JP2012139920A (en) * | 2010-12-28 | 2012-07-26 | Seiko Epson Corp | Liquid ejection head, liquid ejection apparatus and piezoelectric element |
| JP5977923B2 (en) * | 2011-03-07 | 2016-08-24 | セイコーエプソン株式会社 | Liquid ejecting head, manufacturing method thereof, and liquid ejecting apparatus |
| CN103596763B (en) * | 2011-05-31 | 2015-10-14 | 柯尼卡美能达株式会社 | Ink gun and possess the ink-jet drawing apparatus of ink gun |
| JP5862118B2 (en) * | 2011-08-31 | 2016-02-16 | 株式会社リコー | Ink jet head and recording apparatus |
| JP6330819B2 (en) * | 2013-11-29 | 2018-05-30 | コニカミノルタ株式会社 | Wiring board and inkjet head |
| US9592687B2 (en) * | 2014-10-02 | 2017-03-14 | Ricoh Company, Ltd. | Head device, apparatus incorporating the head device, liquid discharge device, and apparatus for discharging liquid |
| JP6447819B2 (en) * | 2015-03-10 | 2019-01-09 | セイコーエプソン株式会社 | Head and liquid ejecting apparatus |
-
2017
- 2017-11-27 WO PCT/JP2017/042327 patent/WO2018128030A1/en active Application Filing
- 2017-11-27 CN CN201780081974.9A patent/CN110139760B/en active Active
- 2017-11-27 JP JP2018560338A patent/JP6950709B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018128030A1 (en) | 2018-07-12 |
| JPWO2018128030A1 (en) | 2019-11-07 |
| JP6950709B2 (en) | 2021-10-13 |
| CN110139760A (en) | 2019-08-16 |
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