CN110137382A

CN110137382A - A kind of substrate, encapsulating structure and organic electro-optic device

Info

Publication number: CN110137382A
Application number: CN201910527251.8A
Authority: CN
Inventors: 赵杨; 董萌; 徐松苗; 李鹏; 张乐怡; 温怀东; 胡永岚
Original assignee: Guan Yeolight Technology Co Ltd
Current assignee: Guan Yeolight Technology Co Ltd
Priority date: 2019-06-18
Filing date: 2019-06-18
Publication date: 2019-08-16
Anticipated expiration: 2039-06-18
Also published as: CN110137382B

Abstract

This application discloses a kind of substrate, encapsulating structure and organic electro-optic devices；Any surface of substrate is equipped with a circle groove；The organic layer for setting reeded surface and being formed for pad-ink in thin-film encapsulation layer of substrate；The longitudinal section of groove is that bottom is less than the trapezoidal of upper bottom；Distance h of the bottom width s, bottom surface of groove apart from substrate surface, the angle α of first side and substrate thickness direction, second side and substrate thickness direction angle β meet setting formula, groove makes the surface of substrate form fluctuations, when substrate surface carries out thin-film package, the spilling of flowing material in encapsulating structure in preparation process can inhibit；The edge that the size of groove limits the organic layer for the thin-film package that pad-ink is formed is fallen in groove, under the premise of not increasing the area of top layer inorganic layer, inorganic layer is fully covered organic layer, it avoids that organic layer is exposed, improves the service life of the organic electro-optic device using the substrate and encapsulating structure.

Description

A kind of substrate, encapsulating structure and organic electro-optic device

Technical field

The present disclosure relates generally to encapsulation technology fields, and in particular to thin film encapsulation technology field more particularly to a kind of substrate, Encapsulating structure and organic electro-optic device.

Background technique

OLED (Organic Light Emitting Diode, Chinese name organic light emitting display) refers to organic semiconductor Material and luminescent material are under electric field driven, the phenomenon that injection by carrier with composite guide photoluminescence.According to this luminous original It manages and display is made or illuminating product is referred to as organic light emitting display or organic luminous illuminating device.With OLED screen body court Flexibility, meandering, ultra-thin direction are developed, and more and more OLED screen bodies are encapsulated using thin-film package instead of glass cover-plate.

The thin-film packing structure of OLED screen body increases by one layer between being CVD layers → IJP layers → CVD layers or being two layers of CVD layers every IJP layers, most upper one layer of one side is CVD layers.

The full name of CVD is Chemical Vapor Deposition, is translated as chemical vapor deposition, is referred to containing composition Other gases needed for the gaseous reactant of film element or the steam of liquid reactants and reaction introduce reaction chamber, in substrate surface The process that chemical reaction generates film occurs.

The meaning of IJP is inkjet printing, and IJP layers are that inkjet printing forms ink layer, and effect is that encapsulated layer is flat Change, if the inorganic layer that encapsulated layer only has single layer too thick has stress problem, so needs are between inorganic layer plus one layer organic Layer, organic layer for example can be ink layer.

Since the mobility of ink is very strong, IJP layers of one layer CVD layers of top are unable to all standing INK or need one layer of top The area of CVD is very big, if one layer of top CVD, which is unable to IJP layers of all standing, will affect screen body life time, if one layer CVD layers of top Area will lead to greatly the very big problem of screen body hem width very much.

Industry and solve the problems, such as this method be mainly in photolithographic substrate make DAM for reducing INK mobility, DAM is generally photoresist or other organic materials, this method have the following problems: photoresist can be irradiated by UV (ultraviolet light), point Solving moieties will lead to luminescent material oxidation influence bulk life time.

Summary of the invention

In view of drawbacks described above in the prior art or deficiency, it is intended to provide a kind of substrate, encapsulating structure and organic photoelectric device Part.

In a first aspect, the application provides a kind of substrate, any surface of the substrate is equipped with a circle groove；The substrate If reeded surface forms the organic layer in thin-film encapsulation layer for pad-ink；

The longitudinal section of the groove is that bottom is less than the trapezoidal of upper bottom；The groove includes bottom surface, in the substrate The second side of the first side in heart district domain and the separate substrate central areas；

Distance h, first side and the substrate thickness direction of the width s, bottom surface of the bottom surface apart from substrate surface The angle β of angle α, second side and the substrate thickness direction meets following formula:

As s < h (cos α-μ sin α)/(μ sin α),

As s >=h (cos α-μ sin α)/(μ sin α),

μ is the coefficient of friction on surface accompanying by the organic layer；

T is the thickness of the organic layer；

C₁For the printing perimeter of the organic layer；

C₂The perimeter enclosed for the top of the second side around the groove one.

According to technical solution provided by the embodiments of the present application, the angle α of the first side and the substrate thickness direction Greater than the angle β of second side and the substrate thickness direction.

According to technical solution provided by the embodiments of the present application, the bottom surface of the groove is wavy surface or serrated face, wave or The extending direction of sawtooth is parallel to the extending direction of groove.

According to technical solution provided by the embodiments of the present application, the groove is by way of etching, dry etching or laser ablation It is formed.

Second aspect, the application provide a kind of encapsulating structure, including substrate described in above-mentioned any one and are located at described The encapsulated layer of substrate surface；The encapsulated layer includes at least two layers of inorganic layer, and the organic layer between the inorganic layer.

According to technical solution provided by the embodiments of the present application, the material of the inorganic layer is inorganic material, preferably SiN_x、 SiO₂。

According to technical solution provided by the embodiments of the present application, the material of the organic layer is ink.

The third aspect, the application provide a kind of organic electro-optic device, including encapsulating structure described in above-mentioned any one；Institute The functional structure of organic electro-optic device is stated between the encapsulated layer and substrate, is surround by the groove.

According to technical solution provided by the embodiments of the present application, each layer edge of the encapsulated layer is all fallen in groove.

According to technical solution provided by the embodiments of the present application, the ink layer of the encapsulated layer is covered by inorganic layer.

The application is the ladder that bottom is less than upper bottom by one circle groove of setting, the longitudinal section of the groove on the surface of the substrate Shape；Groove makes the surface of substrate form fluctuations, when substrate surface carries out thin-film package, can inhibit preparation process The spilling of flowing material in middle encapsulating structure；The groove include bottom surface, close to the substrate central areas first side and Second side far from the substrate central areas；Distance h of the width s, bottom surface of the bottom surface of the groove apart from substrate surface, It is public that the angle β of the angle α of first side and the substrate thickness direction, second side and the substrate thickness direction meets setting Formula, so that the edge for the organic layer that pad-ink is formed can be fallen during the device to substrate surface carries out thin-film package In groove, under the premise of not increasing the area of top layer inorganic layer, organic layer is fully covered by inorganic layer, kept away It is exposed and influence the service life of packed structure organic layer has been exempted from；Further, the design of groove structure also increases water oxygen erosion Path further improves the organic electro-optic device service life using the substrate and encapsulating structure.

According to technical solution provided by the embodiments of the present application, by the way that the bottom surface of groove is set as serrated face or wavy surface, into One step increases the resistance of fluid flowing, reduces the mobility of flowing material.

Detailed description of the invention

By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other Feature, objects and advantages will become more apparent upon:

Fig. 1 is the top view of the embodiment of the present application one；

Fig. 2 is the face the A-A cross-sectional view of embodiment one；

Fig. 3 is another structural schematic diagram of groove；

Fig. 4 is a kind of structural schematic diagram of the embodiment of the present application two；

Fig. 5 is second of structural schematic diagram of encapsulating structure；

Fig. 6 is the third structural schematic diagram of encapsulating structure；

Fig. 7 is the 4th kind of structural schematic diagram of encapsulating structure；

Fig. 8 is the 5th kind of structural schematic diagram of encapsulating structure；

Fig. 9 is the 6th kind of structural schematic diagram of encapsulating structure；

Figure 10 is the 7th kind of structural schematic diagram of encapsulating structure；

Figure 11 is the 8th kind of structural schematic diagram of encapsulating structure

Figure label:

10, substrate；20, groove；21, bottom surface；22, first side；23, second side；30, the first inorganic layer；40, ink Layer；50, the second inorganic layer；

Specific embodiment

The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to Convenient for description, part relevant to invention is illustrated only in attached drawing.

It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

Embodiment one:

The structural schematic diagram that Fig. 1 to Fig. 2 is a kind of a kind of embodiment of substrate 10 provided by the present application is please referred to, wherein Fig. 1 For the top view of substrate 10, Fig. 2 is the face the A-A cross-sectional view of substrate 10 in Fig. 1；The upper surface of the substrate 10 in the present embodiment Equipped with a circle groove 20；It will be understood to those skilled in the art that the upper surface in the present embodiment exists only for substrate 10 Orientation in figure limits, rather than to the absolute limit of 20 position of groove, such as when substrate 10 is placed vertically when, it is recessed Slot 20 is to be located at its right lateral surface or left-hand face.

In the present embodiment, substrate 10 is glass, and the groove 20 leads to overetched mode and formed；In other embodiments Groove 20 can also be formed by the way of dry etching or laser ablation, for example, when substrate 10 is PI, then it can be on the surface of PI It is lithographically formed groove 20.

The surface equipped with groove 20 of the substrate forms the organic layer in thin-film encapsulation layer for pad-ink；Such as Fig. 4 Shown, the longitudinal section of the groove 20 is that bottom is less than the trapezoidal of upper bottom；The shape not only makes ink by limited flow rate, prevents Overflow to outside groove 20, moreover, because groove 20 have buffering bottom surface 21 and inclined side, allow ink equably It is laid on the surface of groove 20；In other embodiments, the groove 20 is also possible to U-shaped or V-arrangement, or is also possible to other Other shapes structure with bottom surface 21 and inclined side can be rule, be also possible to irregular.

In the present embodiment, the groove 20 include bottom surface 21, close to 10 center of substrate first side 22 and lean on The second side 23 at nearly 10 edge of substrate；

In order to also further fluid-ink is limited in groove 20, the present embodiment while reducing fluid velocity In 20 size of groove meet it is claimed below:

Distance h, first side 22 and institute of the width s, bottom surface 21 of the bottom surface 21 of the groove 20 apart from 10 surface of substrate Angle α, second side 23 and the angle β of 10 thickness direction of substrate for stating 10 thickness direction of substrate meet following formula:

As s < h (cos α-μ sin α)/(μ sin α),

As s >=h (cos α-μ sin α)/(μ sin α),

T is the thickness of organic layer；

C₁For the printing perimeter of the organic layer；

C₂The perimeter enclosed for the top of the second side 23 around the groove 20 1.

According to law of conservation of energy, it is assumed that when ink overflows to 22 top of first side, initial velocity 0, then As s < h (cos α-μ sin α)/(μ sin α), fluid can rest on the bottom surface 21 of groove 20；As s >=h (cos α-μ sin α)/(μ Sin α) when, groove 20 can climb up second side 23.

For example, when the substrate 10 in the present embodiment is used for the OLED product of thin-film package, according to the design need of OLED product It asks, obtains needing making OLED on the rectangular substrate 10 of a 11mm*11mm, and need to encapsulate its functional structure layer In the central area of the center 9mm*9mm of substrate 10, then at this point, groove 20 is located in apart from 10 edge of substrate according to demand In the range of 1mm-2mm, then perimeter C is printed at this time₁It is exactly 9*4=36mm, the top of second side 23 is around the groove 20 The perimeter C of one circle₂It is exactly 10*4=40mm；It is assumed that structure accompanying by organic layer is inorganic layer, the friction coefficient μ of inorganic layer= 0.9, the thickness T for the organic layer-ink layer 40 for needing to print is 0.5mm.

Such as during etching, then first given design parameter alpha, s, h judge s's and α and h according to the following formula Relationship,

As s < h (cos α-μ sin α)/(μ sin α), the size of β is determined according to the following formula；

As s >=h (cos α-μ sin α)/(μ sin α), the size of β is determined according to the following formula；

In the present embodiment, the angle α of the first side 22 and 10 thickness direction of substrate, is greater than second side 23 With the angle β of 10 thickness direction of substrate, first side 22 is designed to gentle slope, reduces the decrease speed of fluid, second side Face 23 is designed to the gradient steeper than first side 22, reduces the above-mentioned speed of fluid；And then more effectively reduce fluid Flow velocity.

In the present embodiment, substrate 10 is used as the matrix of OLED screen body, the groove 20 on substrate 10 can make in OLED screen When body carries out thin-film package, the pad-ink for forming organic layer can be flowed into groove 20, reduce flow velocity by groove 20, excellent Selection of land is also limited in groove 20, so that the CVD layer above ink layer 40 can be covered fully.Such as in phase Under same ink print area, ink in the prior art can then be flow to outside distance printing frame edge such as 5mm, and this implementation In example, ink is then limited in groove 20, and Edge Distance is limited to the distance for printing frame due to the left and right of groove 20 In the range of 2mm, and then correspondingly, reduce the area of CVD layers of its top also significantly, to reduce entire OLED screen The area of body；Identical situation, such as on the basis of existing substrate 10, photoresist is added inside ink, it can also make The distance controlling of flood-level rim distance printing frame of ink is obtained in 2mm, but photoresist itself but affects OLED screen body Service life, therefore compare, substrate 10 provided in this embodiment improves the service life of OLED screen body.

It is further preferred that as shown in figure 3, the bottom surface 21 of groove 20 is zigzag；In other embodiments, groove 20 Bottom surface 21 is also possible to wavy, the extending direction of the wave or sawtooth extending direction with groove 20 in parallel.Wavy or sawtooth Shape can also further decrease the flow velocity of fluid.

Embodiment two

The present embodiment provides a kind of encapsulating structures to be located at 10 table of substrate including 10 He of substrate described in embodiment one The encapsulated layer in face；

In the present embodiment, corresponding with embodiment one, the encapsulated layer is also to seal for encapsulating the film of OLED screen body Layer is filled, from bottom to up successively includes inorganic layer, organic layer and inorganic layer；Such as the material of inorganic layer uses in the present embodiment Inorganic material, such as SiN_x、SiO₂Material Deng, organic layer uses ink, then correspondingly, encapsulated layer includes first from bottom to up Inorganic layer 30, ink layer 40, the second inorganic layer 50；Wherein the first inorganic layer 30 and the second inorganic layer 50 are what vapor deposition was formed CVD layers；In the present embodiment, structure accompanying by organic layer is the first inorganic layer 30.

By the design size of the groove of embodiment one kind, following seven kinds of different encapsulation layer structures can be at least obtained, Such as shown in figure 5, each layer edge of encapsulated layer is all fallen in groove 20, i.e. the first inorganic layer 30, ink layer 40 and the second nothing Machine layer 50 is all located in groove 20；Ink layer 40 is contacted with the second side 23 of groove 20, and the second inorganic layer 50 is in groove 20 Second side 23 covers ink layer 40；

As shown in the example of figure 6, each layer edge of encapsulated layer is all fallen in groove 20, ink layer 40 not with groove 20 Two side faces 23 contact, namely stop on the first inorganic layer 30, and ink layer 40 is covered on the first inorganic layer by the second inorganic layer 50 On 30.

As shown in fig. 7, second inorganic layer 50 extends outside groove 20 on the basis of Fig. 5 is exemplary.

As shown in figure 8, first inorganic layer 30 extends outside groove 20 on the basis of Fig. 6 is exemplary, leak outside at edge.

As shown in figure 9, second inorganic layer 50 extends outside groove 20 on the basis of Fig. 8 is exemplary.

As shown in Figure 10, on the basis of Fig. 9, the second inorganic layer 50, which continues to extend, covers the first inorganic layer 30.

As shown in figure 11, ink layer 40 can also extend only to the bottom surface 21 of groove 20；And in the structure of Fig. 5 to Figure 10, oil Layer of ink 40 flows to the second side 23 of groove 20, is sufficiently used the length of groove 20, can when on the OLED screen body of application Save the size of screen body.

And in the present embodiment, by being defined to parameters, so that meet following formula,

To which fluid has been limited to 20 the inside of groove, so that the second inorganic layer 50 can be preferably by ink layer 40 Covering.

Embodiment three:

OLED screen body provided in this embodiment, the OLED screen body include the encapsulating structure and function of Figure 10 in embodiment two Structure, functional structure are surround between the encapsulated layer and substrate 10 by the groove 20.

The design of groove 20 also effectively extends water oxygen and corrodes the path of OLED screen body internal components, and then extends it Service life.

Following table performance comparison of the OLED screen body in control group for the OLED screen body in the present embodiment and in the prior art, it is real Example three and control group substantially luminous dimensional parameters having the same and electrical parameter are applied, embodiment three and control group are in high temperature and humidity Experimental result comparison is described in table 1 below under environment:

Table 1

The service life that can be seen that the OLED screen body in the present embodiment from above-mentioned comparison is obviously improved, encapsulation effect Fruit improves, and brightness and luminous efficiency degree routinely shield body indifference.

In other embodiments, the encapsulating structure in embodiment two can be used for other and need to carry out having for thin-film package Machine part, such as organic photovoltaic cells.

Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein Can technical characteristic replaced mutually and the technical solution that is formed.

Claims

1. a kind of substrate, which is characterized in that any surface of the substrate is equipped with a circle groove；Setting for the substrate is reeded Surface forms the organic layer in thin-film encapsulation layer for pad-ink；

The longitudinal section of the groove is that bottom is less than the trapezoidal of upper bottom；The groove includes bottom surface, close to the area, substrate center The second side of the first side in domain and the separate substrate central areas；

The angle of distance h of the width s, bottom surface of the bottom surface apart from substrate surface, first side and the substrate thickness direction The angle β of α, second side and the substrate thickness direction meet following formula:

As s < h (cos α-μ sin α)/(μ sin α),

As s >=h (cos α-μ sin α)/(μ sin α),

T is the thickness of the organic layer；

C₁For the printing perimeter of the organic layer；

2. substrate according to claim 1, which is characterized in that the angle of the first side and the substrate thickness direction α is greater than the angle β of second side and the substrate thickness direction.

3. substrate according to claim 1, which is characterized in that the bottom surface of the groove is wavy surface or serrated face, wave Or the extending direction of sawtooth is parallel to the extending direction of groove.

4. according to claim 1 to substrate described in 3 any one, which is characterized in that the groove is by etching, dry etching or swashs The mode of photoengraving is formed.

5. a kind of encapsulating structure, which is characterized in that including substrate described in claims 1 to 3 any one and be located at the base The encapsulated layer of plate surface；The encapsulated layer includes at least two layers of inorganic layer, and the organic layer between the inorganic layer.

6. encapsulating structure according to claim 5, which is characterized in that the material of the inorganic layer is inorganic material, preferably For SiN_x、SiO₂。

7. encapsulating structure according to claim 5, which is characterized in that the material of the organic layer is ink.

8. a kind of organic electro-optic device, which is characterized in that including encapsulating structure described in claim 5 to 7 any one；It is described The functional structure of organic electro-optic device is surround between the encapsulated layer and substrate by the groove.

9. a kind of organic electro-optic device according to claim 8, which is characterized in that each layer edge of the encapsulated layer is fallen In groove.

10. a kind of organic electro-optic device according to claim 9, which is characterized in that the ink layer of the encapsulated layer is by nothing The covering of machine layer.