CN110136756B - Heat-dissipating and shock-resistant structure - Google Patents
Heat-dissipating and shock-resistant structure Download PDFInfo
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- CN110136756B CN110136756B CN201810105364.4A CN201810105364A CN110136756B CN 110136756 B CN110136756 B CN 110136756B CN 201810105364 A CN201810105364 A CN 201810105364A CN 110136756 B CN110136756 B CN 110136756B
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- heat
- hard disk
- dissipating
- elastic body
- shock
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/08—Insulation or absorption of undesired vibrations or sounds
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
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- Vibration Prevention Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat-dissipating shock-proof structure for an electronic module, the electronic module is provided with a hard disk, the heat-dissipating shock-proof structure comprises a heat-dissipating frame, an elastic body and at least one heat-conducting layer, the heat-dissipating frame is provided with a fixed section and two extension sections, the extension sections are connected with two ends of the fixed section, the fixed section can be connected with one side surface of the hard disk, and the distance between the extension sections is larger than the thickness of the hard disk. The elastic body is at least partially positioned on the extending sections, and at least one heat conduction layer covers the elastic body. The heat dissipation shock-proof structure of the invention can dissipate the heat energy generated by the hard disk during operation, the heat dissipation frame can protect the hard disk by a first layer, so that the hard disk is not easy to be extruded, then the elastic body can effectively absorb the external vibration energy, the hard disk is protected by a second layer, and the heat conduction layer further assists in dissipating the heat energy generated by the hard disk, thereby achieving the effects of heat dissipation and shock absorption at the same time.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a heat dissipating and shock absorbing structure, and more particularly, to a heat dissipating and shock absorbing structure for a hard disk of an electronic device.
[ background of the invention ]
Because a hard disk in an existing electronic device usually has a structure of a magnetic disk, a magnetic disk reading head, and a plurality of driving motors, if the hard disk is severely shaken or squeezed during the process of accessing the hard disk, the actions of the above-mentioned elements are easily affected, so that the structure of accessing the magnetic disk is damaged. In order to effectively protect the hard disk, the conventional protection structure usually includes a plurality of foam tapes, and after the foam tapes cover the whole hard disk, the protection structure and the hard disk are fixed in an electronic device, when the electronic device is picked up and placed on a desktop or accidentally falls down in the using process, the hard disk is vibrated, and at the moment, the foam tapes covering the hard disk can absorb the energy of the vibration, so as to prevent the internal structure of the hard disk from being damaged by the energy of the vibration.
However, since the hard disk generates a large amount of heat during operation and the foam has a problem of poor thermal conductivity, the conventional protection structure can only protect the hard disk, and the heat generated during operation of the hard disk cannot escape outwards through the protection structure and is easily damaged. Therefore, a novel heat-dissipating shock-resistant structure is needed.
[ summary of the invention ]
The invention provides a heat-dissipating shock-resistant structure for an electronic module, wherein the electronic module has a hard disk, the hard disk is disposed on a heat-dissipating frame of the heat-dissipating shock-resistant structure, and an elastic body is further disposed on the heat-dissipating frame and is matched with a heat-conducting layer, so that heat generated during operation of the hard disk can be effectively dissipated through the heat-dissipating frame and the heat-conducting layer, and when the electronic device shakes, the elastic body can effectively absorb vibration energy to achieve a shock-resistant effect.
In order to achieve the above object, the present invention provides a heat-dissipating shock-resistant structure for an electronic module, the electronic module having a hard disk, the heat-dissipating shock-resistant structure including a heat-dissipating frame, an elastic body and at least one heat-conducting layer, the heat-dissipating frame having a fixing section and two extending sections, the extending sections being connected to two ends of the fixing section, the fixing section being connectable to a side surface of the hard disk, the distance between the extending sections being greater than the thickness of the hard disk. The elastic body is at least partially positioned on the extending sections, and at least one heat conduction layer covers the elastic body.
The extending sections respectively extend to an upper surface and a lower surface of the hard disk to form a gap with the upper surface and the lower surface.
The upper surface and the lower surface are respectively defined to be provided with a central area and two side areas, the central area is positioned between the side areas, the extension sections respectively extend on the side areas, and the gaps are formed between the extension sections and the side areas.
In an embodiment of the invention, the elastic body has a plurality of elastic bodies, the elastic bodies are respectively attached to the extending sections, and the at least one heat conduction layer simultaneously wraps the elastic bodies and the heat dissipation frame.
In another embodiment of the present invention, the elastic body has a plurality of elastic bodies, the at least one heat conduction layer has a plurality of heat conduction layers, and the heat conduction layers respectively wrap the elastic bodies and are disposed on the extension sections together, so that a part of each heat conduction layer is located between each elastic body and the heat dissipation frame.
Meanwhile, in another embodiment of the present invention, one of the extension sections has a hollow or cantilever structure.
The electronic module further has a housing, and the hard disk and the heat-dissipating shock-resistant structure are accommodated in the housing.
In an embodiment of the present invention, one of the extension sections extends outward.
In order to make the aforementioned objects, features and advantages more comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
FIG. 1 is a perspective view of a hard disk and a heat-dissipating and shock-resistant structure according to a first embodiment of the present invention.
FIG. 2 is a schematic side view of the first embodiment of the heat-dissipating and shock-resistant structure of the present invention combined with a hard disk.
Fig. 3 is a perspective view illustrating the combination of the heat-dissipating and shock-resistant structure and the electronic device according to the present invention.
FIG. 4 is a schematic side view of a hard disk combined with a second embodiment of the heat-dissipating and shock-resistant structure of the present invention.
FIG. 5 is a perspective view of a hard disk combined with a heat-dissipating and shock-resistant structure according to a third embodiment of the present invention.
FIG. 6 is a perspective view of a hard disk combined with a fourth embodiment of the heat-dissipating and shock-resistant structure of the present invention.
FIG. 7 is a perspective view of a hard disk combined with a fifth embodiment of the heat dissipating and shock absorbing structure of the present invention.
[ detailed description ] embodiments
The heat-dissipating shock-resistant structure 1 of the present invention is used in an electronic module, wherein please refer to fig. 1 and fig. 2, which illustrate a hard disk 21 assembly diagram of a first embodiment of the present invention and an electronic module (not shown). The heat-dissipating shock-resistant structure 1 of the present embodiment includes two heat-dissipating frames 11, a plurality of elastic bodies 12, and a plurality of heat-conducting layers 13, and the relationship between each component of the heat-dissipating shock-resistant structure 1 and the electronic module will be described in detail below.
The heat dissipation racks 11 are respectively disposed on two opposite side surfaces 213 of the hard disk 21, and since the connection manner of the heat dissipation racks 11 and the hard disk 21 is the same, the connection relationship between one heat dissipation rack 11 and the hard disk 21 will be described in this embodiment. The heat dissipation frame 11 has a fixing section 111 and two extending sections 112, the fixing section 111 is connected between the extending sections 112, so that the heat dissipation frame 11 is U-shaped, and the fixing section 111 and the extending sections 112 define an accommodating space S together, so that the hard disk 21 is partially located in the accommodating space S, that is, the fixing section 111 and the extending sections 112 define an opening together, and an opening direction D of the opening faces the hard disk 21. Wherein the fixed segment 111 is connected to the side 213 of the hard disk 21, the extending segments 112 extend to an upper surface 211 and a lower surface 212 of the hard disk 21, respectively, and the distance H between the extending segments 112 is larger than a thickness T of the hard disk 21, in other words, from the perspective of fig. 2, the extending segments 112 extend to the upper surface 211 and the lower surface 212 of the hard disk 21, respectively, and form a gap P with the upper surface 211 and the lower surface 212, respectively. When the upper surface 211 and the lower surface 212 respectively define a central region a1 and two side regions a2, and the central region a1 is located between the side regions a2, the extension segments 112 respectively extend on the side regions a2, and form the gap P with the side regions a 2.
Referring to fig. 2, after the heat conducting layers 13 correspondingly cover the elastic bodies 12, the heat conducting layers 13 are disposed on the extending sections 112 together, that is, a part of each heat conducting layer 13 is between each elastic body 12 and each heat dissipating frame 11. After the heat-dissipating shock-resistant structure 1 and the hard disk 21 are assembled, as shown in fig. 3, a casing 22 is further disposed in the electronic module, and the casing 22 is further disposed in an internal space of the electronic device, so that heat generated by the hard disk 21 passes through the fixing section 111 and the extending section 112 sequentially from the side surface 213 of the hard disk 21 to achieve the effect of dissipating heat of the hardware, and even some heat is continuously conducted to the heat-conducting layer 13 and dissipated outwards through the casing 22, that is, the problem of poor heat conductivity of the elastic body 12 can be solved by covering the heat-conducting layer 13. Meanwhile, the hard disk 21 is partially suspended in the heat sink 11, so as to prevent the hard disk 21 from being squeezed and damaging its internal structure (such as the magnetic disk, the magnetic disk pickup head and multiple driving motors), and the elastic body 12 is disposed on the extension section 112 to absorb the energy of vibration, so that the present invention achieves the effect of shock resistance and protecting the hard disk 21.
It should be noted that the placement and number of the heat dissipation frame 11, the elastic bodies 12 and the heat conduction layer 13 can be adjusted according to the requirement, for example, as shown in fig. 4, which is a schematic side view of the hard disk 21 combined with the second embodiment of the present invention, wherein the elastic bodies 12 are directly disposed on the heat dissipation frame 11 and directly contact with the heat dissipation frame 11 (i.e., the elastic bodies 12 and the hard disk 21 are located on opposite sides of the heat dissipation frame 11), the heat conduction layer 13 can only have one layer to cover the elastic bodies 12 and the heat dissipation frame 11 at the same time, and of course, the number of the heat dissipation frame 11 or the elastic bodies 12 can be adjusted to be only one according to the requirement. Besides the extension section 112, the elastic bodies 12 can be further located at the fixing section 111, so that the side 213 of the hard disk 21 is also protected by the elastic bodies 12, or as shown in fig. 4, the elastic bodies 12 are further disposed between the extension section 112 and the upper surface 211 or the lower surface 212 of the hard disk 21 after being covered by the heat conductive layer 13 (i.e., the elastic bodies 12 are covered by the heat conductive layer 13 and are disposed on the same side of the heat dissipation frame 11 as the hard disk 21).
In the present embodiment, the heat dissipation frame 11, the heat conduction layer 13 and the housing 22 are made of metal, and the elastic body 12 is made of foam, however, the present invention is not limited to the above materials, and at least the elastic coefficient of the elastic body 12 is larger than that of the heat conduction layer 13, and the heat conduction coefficient of the heat conduction layer 13 is higher than that of the elastic body 12, so that the materials with the heat dissipation and shock resistance effects can be selected.
Fig. 5 is a perspective view of the hard disk 21 combined with the third embodiment of the present invention, the difference between the present embodiment and the previous embodiment is that the extension section 112 of the present embodiment further has a cantilever structure 112a extending above the central area a1 of the upper surface 211 and the lower surface 212, and the cantilever structure 112a is also spaced apart from the upper surface 211 and the lower surface 212 by a distance, so as to increase the heat conducting area of the heat dissipation frame 11, the elastic bodies 12 can be located at the extension section 112, the cantilever structure 112a and the fixing section 111 at the same time, and the elastic body 12 can be covered by the heat conducting layer 13 and then disposed on the heat dissipation frame 11, and in other embodiments, the heat conducting layer 13 can cover the elastic body 12 and the heat dissipation frame 11 at the same time after the elastic body 12 is directly disposed on the heat dissipation frame 11, which.
In addition, FIG. 6 is a schematic diagram of a hard disk 21 according to a fourth embodiment of the present invention. The structure of the present embodiment is substantially the same as that of the first embodiment, and the difference between the present embodiment and the foregoing embodiment is that the extending section 112 and the fixing section 111 further have a plurality of hollow areas E, i.e. the present invention can remove non-main heat conducting blocks to form the hollow areas E, so as to reduce the weight of the heat dissipating frame 11 and achieve the effect of conducting heat energy.
FIG. 7 is a schematic diagram of a hard disk 21 combined with a fifth embodiment of the present invention, in which, except that the extending section 112 and the fixing section 111 have a plurality of hollow areas E respectively as in the fourth embodiment, the difference between the present embodiment and the other embodiments is that after the fixing section 111 is connected to the side surface 213 of the hard disk 21, the extending section 112 extends outward toward the outside of the hard disk 21, and there is no extending section 112 above or below the upper surface 211 and the lower surface 212 of the hard disk 21, that is, the fixing section 111 and the extending sections 112 define an opening, and an opening direction D of the opening is opposite to the hard disk 21.
In summary, the heat-dissipating and shock-absorbing structure of the present invention mounts the hard disk between the heat-dissipating frames, the heat-dissipating frames can dissipate the heat generated during the operation of the hard disk, and the hard disk can be protected by the first layer, so that the hard disk is not easily squeezed, and then an elastic body and a heat-conducting layer are further disposed, the elastic body can effectively absorb the external shock energy, the hard disk has the second layer of protection, and the heat-conducting layer further assists in dissipating the heat generated by the hard disk, thereby achieving the effects of heat dissipation and shock absorption.
The above-mentioned embodiments are only used to illustrate the implementation of the present invention and to explain the technical features of the present invention, and are not used to limit the protection scope of the present invention. Any modifications or equivalent arrangements which may occur to those skilled in the art and which fall within the spirit and scope of the appended claims should be construed as limited only by the scope of the claims.
Claims (9)
1. A heat-dissipating shock-resistant structure for an electronic module having a hard disk, the heat-dissipating shock-resistant structure comprising:
a heat dissipation frame having a fixed section and two extension sections, wherein the extension sections are connected to two ends of the fixed section, the fixed section can be connected to one side of the hard disk, and the distance between the extension sections is larger than the thickness of the hard disk;
an elastomer at least partially located on the extending sections; and
at least one heat conduction layer covering the elastic body; wherein
The extending sections respectively extend to an upper surface and a lower surface of the hard disk to form a gap with the upper surface and the lower surface, so that the hard disk is partially arranged on the heat dissipation frame in a suspended manner.
2. The structure of claim 1, wherein the top surface and the bottom surface define a central region and two side regions, the central region is located between the side regions, the extension sections extend over the side regions, and the gaps are formed between the extension sections and the side regions.
3. The structure of claim 2, wherein the elastic body has a plurality of elastic bodies respectively attached to the extending sections, and the at least one heat conductive layer covers the elastic bodies and the heat dissipation frame.
4. The structure of claim 2, wherein the elastic body has a plurality of elastic bodies, the elastic bodies are respectively attached to the extending sections and the fixing sections, and the at least one heat conduction layer covers the elastic bodies and the heat dissipation frame.
5. The structure of claim 2, wherein the elastic body comprises a plurality of elastic bodies, the at least one heat conduction layer comprises a plurality of heat conduction layers, and the heat conduction layers respectively wrap the elastic bodies and are arranged on the extension sections together, so that part of each heat conduction layer is arranged between each elastic body and the heat dissipation frame.
6. The structure of claim 2, wherein the elastic body comprises a plurality of elastic bodies, the at least one heat conduction layer comprises a plurality of heat conduction layers, and the heat conduction layers respectively wrap the elastic bodies and are disposed on the extension sections or the fixing sections together, so that a part of each heat conduction layer is located between each elastic body and the heat dissipation frame.
7. The structure of claim 1, wherein one of the extension sections has a hollow or cantilever structure.
8. The heat dissipating and shock absorbing structure of claim 1, wherein the electronic module further comprises a housing, and the hard disk and the heat dissipating and shock absorbing structure are accommodated in the housing.
9. The heat dissipating, shock absorbing structure of claim 1, wherein one of the extension sections extends outwardly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810105364.4A CN110136756B (en) | 2018-02-02 | 2018-02-02 | Heat-dissipating and shock-resistant structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810105364.4A CN110136756B (en) | 2018-02-02 | 2018-02-02 | Heat-dissipating and shock-resistant structure |
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| Publication Number | Publication Date |
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| CN110136756A CN110136756A (en) | 2019-08-16 |
| CN110136756B true CN110136756B (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810105364.4A Active CN110136756B (en) | 2018-02-02 | 2018-02-02 | Heat-dissipating and shock-resistant structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110246524A (en) * | 2018-03-08 | 2019-09-17 | 神讯电脑(昆山)有限公司 | Radiate quake-proof structure |
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| US5958212A (en) * | 1997-02-05 | 1999-09-28 | Matsushita Electric Industrial | Storage apparatus and shockproof case |
| US7012805B2 (en) * | 2003-07-16 | 2006-03-14 | Olixir Technologies | Ruggedized host module |
| CN102301421A (en) * | 2009-01-30 | 2011-12-28 | 日本电气株式会社 | Vibration-damping containing case for electronic device, the electronic device, and electronic apparatus having the electronic device mounted thereon |
| CN204651000U (en) * | 2015-05-29 | 2015-09-16 | 东莞福泽尔电子科技有限公司 | Vehicle-mounted hard disks shock-damping structure |
| TW201733049A (en) * | 2015-11-17 | 2017-09-16 | Seiwa Electric Mfg Co Ltd | Heat conducting component |
| CN206639140U (en) * | 2017-04-20 | 2017-11-14 | 衡阳师范学院 | A kind of information security computer protection device for hard disk |
| TWM553441U (en) * | 2017-07-21 | 2017-12-21 | 宏碁股份有限公司 | Heat dissipation structure for SSD |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8218310B2 (en) * | 2009-06-02 | 2012-07-10 | Getac Technology Corporation | Shockproof assembly for flat storage device |
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2018
- 2018-02-02 CN CN201810105364.4A patent/CN110136756B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5958212A (en) * | 1997-02-05 | 1999-09-28 | Matsushita Electric Industrial | Storage apparatus and shockproof case |
| US7012805B2 (en) * | 2003-07-16 | 2006-03-14 | Olixir Technologies | Ruggedized host module |
| CN102301421A (en) * | 2009-01-30 | 2011-12-28 | 日本电气株式会社 | Vibration-damping containing case for electronic device, the electronic device, and electronic apparatus having the electronic device mounted thereon |
| CN204651000U (en) * | 2015-05-29 | 2015-09-16 | 东莞福泽尔电子科技有限公司 | Vehicle-mounted hard disks shock-damping structure |
| TW201733049A (en) * | 2015-11-17 | 2017-09-16 | Seiwa Electric Mfg Co Ltd | Heat conducting component |
| CN206639140U (en) * | 2017-04-20 | 2017-11-14 | 衡阳师范学院 | A kind of information security computer protection device for hard disk |
| TWM553441U (en) * | 2017-07-21 | 2017-12-21 | 宏碁股份有限公司 | Heat dissipation structure for SSD |
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| CN110136756A (en) | 2019-08-16 |
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