CN110126110B

CN110126110B - A splitting machine cutter clamping device for semiconductor material cleavage

Info

Publication number: CN110126110B
Application number: CN201910384245.1A
Authority: CN
Inventors: 姜晨; 高睿; 董康佳; 郎小虎
Original assignee: University of Shanghai for Science and Technology
Current assignee: University of Shanghai for Science and Technology
Priority date: 2019-05-09
Filing date: 2019-05-09
Publication date: 2021-04-02
Anticipated expiration: 2039-05-09
Also published as: CN110126110A

Abstract

The invention relates to a splitting machine cutter clamping device for semiconductor material dissociation, which comprises a connecting spring, a baffle, a force sensor, a splitting machine cutter clamp, a front fixing plate, a guide rail and a rear fixing plate, wherein the rear fixing plate is provided with the guide rail; the split blade clamp is internally provided with a T-shaped groove for fixing the ceramic split blade required by the split blade, and the force sensor is fastened in the split blade clamp, the pre-tightening mechanism and the baffle and used for measuring the vertical load required in the semiconductor material cleavage process. The device has a simple structure, can measure the vertical load required in the splitting process in real time, and is favorable for obtaining a critical load model required in the semiconductor material cleavage process.

Description

A splitting machine cutter clamping device for semiconductor material cleavage

Technical Field

The invention relates to a tool clamping device, in particular to a splitting machine tool clamping device for semiconductor material cleavage.

Background

The semiconductor industry is rapidly developed along with the last round of computer and internet technology revolution, and the chip as the core component of the computer accounts for the most part of the cost of the whole computer, so that the chip presents a vigorous development situation in the following decades. In recent years, the chip industry in China has been developed, but the manufacturing technology level of the integrated circuit chip in China is greatly different from the world advanced level, and the manufacturing technology level is still in the beginning stage. A series of specific processing technologies are required in the chip manufacturing process, wherein the splitting process belongs to one of the important steps in the packaging link, namely, the crystal grains are stripped from the wafer. The cleavage cracks are in a destabilization and expansion state due to factors such as overlarge load and the like in the splitting process, and the generated cleavage cracks directly influence the service quality and the service life of the chip. Meanwhile, the critical load required by the dissociation of wafers with different thicknesses is difficult to measure in real time under the existing conditions, and the production efficiency is low.

Disclosure of Invention

The invention aims to provide a cutter clamping device of a splitting machine for semiconductor material splitting, which can measure the vertical load required in the semiconductor material splitting process in real time.

In order to achieve the purpose, the technical scheme of the invention is as follows: a cutter clamping device of a splitting machine for dissociating semiconductor materials comprises a connecting spring, a baffle, a force sensor, a splitting cutter clamp, a front fixing plate, a guide rail and a rear fixing plate, wherein the rear fixing plate is provided with the guide rail; the split blade clamp is internally provided with a T-shaped groove for fixing the ceramic split blade required by the split blade, and the force sensor is fastened in the split blade clamp, the pre-tightening mechanism and the baffle and used for measuring the vertical load required in the semiconductor material cleavage process.

Furthermore, the leveling pre-tightening device consists of a leveling spring and a pre-tightening mechanism, one end of the pre-tightening mechanism is connected with the splinter knife clamp through the leveling spring, the other end of the pre-tightening mechanism is connected with the splinter knife clamp through a screw and a nut,

further, when the problem that a cutter is uneven due to assembly and machining errors is solved, after the levelness of the splitting tool clamp is measured through a level gauge before splitting each time, the pre-tightening mechanism ensures that the splitting tool clamp keeps horizontal before splitting each time through adjusting the deformation amount of the leveling spring.

The invention has the beneficial effects that:

the invention can measure the vertical load required in the semiconductor material cleavage process in real time, has simple structure and is beneficial to obtaining the critical load model required in the semiconductor material cleavage process.

Drawings

FIG. 1 is a front view of a cleaver tool clamping device for semiconductor material cleaving in accordance with the present invention;

fig. 2 is a side cross-sectional view of a cleaver tool clamping device for semiconductor material cleaving in accordance with the present invention.

Detailed Description

The technical scheme of the invention is further explained by combining the attached drawings.

As shown in fig. 1 to 2, the cleaver tool clamping device for semiconductor material cleavage of the present invention comprises a connecting spring 1, a baffle 2, a socket head cap screw 3, a force sensor 4, a cleaver clamp 6, a pre-tightening device 7, a front fixing plate 8, a guide rail 9, a rear fixing plate 10, and a leveling pre-tightening device. A leveling spring 5,

As shown in fig. 1 and 2, the fixing part of the integral device comprises a rear fixing plate 10, a guide rail 9 and a front fixing plate 8, the guide rail 9 is arranged on the rear fixing plate 10, the front fixing plate 8 is connected with the rear fixing plate 10 through the guide rail 9, when a cutter is loaded and unloaded in the splitting process, the front fixing plate 8 can move up and down through the guide rail 9, the two baffle plates 2 are respectively fixed on the front fixing plate 8 through the inner hexagon screws 3, two ends of the connecting spring 1 are respectively connected with the lug boss on the rear fixing plate 10 and the upper end faces of the baffle plates 2, when the cutter is loaded and unloaded in the splitting process, the connecting spring 1 generates corresponding deformation along with the motion track of the front fixing plate 8, meanwhile, the device is also used for solving the problem of assembly of the front fixing plate 8 and the rear fixing plate 10 through the guide rail 9 caused by machining errors, the leveling pre-tightening device is fixed on the front fixing plate 8 through the inner hexagon screw 3, and one end of the leveling pre-tightening device is connected with the splitting blade tool clamp 6. The leveling pre-tightening device consists of a leveling spring 5 and a pre-tightening mechanism 7, one end of the pre-tightening mechanism 7 is connected with the splitting tool clamp 6 through the leveling spring 5, and the other end of the pre-tightening mechanism is connected with the splitting tool clamp 6 through a screw and a nut. The leveling spring 5 and the pre-tightening mechanism 7 are used for solving the problem that a cutter is not flat due to assembly and machining errors, the levelness of the splitting tool clamp 6 is measured through a level meter before each splitting, the pre-tightening mechanism 7 is pre-tightened after the deformation amount of the leveling spring 5 is adjusted to achieve the purpose of ensuring that the splitting tool clamp 6 keeps horizontal before each splitting, a T-shaped groove is formed in the splitting tool clamp 6 and used for fixing a ceramic splitting tool required by the splitting, and the force sensor 4 is fastened in the splitting tool clamp 6, the pre-tightening mechanism 7 and the baffle 2 and used for measuring a vertical load required in the semiconductor material cleavage process.

Claims

1. The utility model provides a lobe of a leaf machine cutter clamping device for semiconductor material dissociates, includes coupling spring (1), baffle (2), force sensor (4), lobe of a leaf sword anchor clamps (6), preceding fixed plate (8), guide rail (9), after-fixing board (10), its characterized in that: a guide rail (9) is arranged on the rear fixing plate (10), the front fixing plate (8) is connected with the rear fixing plate (10) through the guide rail (9), two ends of the connecting spring (1) are respectively connected with the rear fixing plate (10) and the baffle (2), the baffle (2) and the leveling pre-tightening device are fixedly connected to the front fixing plate (8), and one end of the leveling pre-tightening device is connected with the splinter knife clamp (6); the ceramic splitting knife is characterized in that a T-shaped groove is formed in the splitting knife fixture (6) and used for fixing a ceramic splitting knife required by splitting, and the force sensor (4) is fastened in the splitting knife fixture (6), the pre-tightening mechanism (7) and the baffle (2) and used for measuring a vertical load required in the semiconductor material cleavage process.

2. The cleaver tool clamping device for semiconductor material dissociation of claim 1, wherein: the leveling pre-tightening device is composed of a leveling spring (5) and a pre-tightening mechanism (7), one end of the pre-tightening mechanism (7) is connected with the splitting knife fixture (6) through the leveling spring (5), and the other end of the pre-tightening mechanism is connected with the splitting knife fixture (6) through a screw and a nut.

3. The cleaver tool clamping device for semiconductor material dissociation of claim 2, wherein: when the problem that a cutter is uneven due to assembly and machining errors is solved, after the levelness of the splitting knife fixture (6) is measured by a level meter before splitting each time, the pretightening mechanism (7) ensures that the splitting knife fixture (6) keeps horizontal before splitting each time by adjusting the deformation amount of the leveling spring (5).