CN110106375A - A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si - Google Patents
A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si Download PDFInfo
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- CN110106375A CN110106375A CN201910369639.XA CN201910369639A CN110106375A CN 110106375 A CN110106375 A CN 110106375A CN 201910369639 A CN201910369639 A CN 201910369639A CN 110106375 A CN110106375 A CN 110106375A
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- Prior art keywords
- high temperature
- solder
- temperature alloy
- alloy solder
- preparation
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
Abstract
A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si, be as steps described below made of the side of preparation: (1) selection purity first is greater than 99.9%, Cu, Sn, Ti, Fe, Ni, Si metal powder of granular size 150-180um, by mass percentage: Cu:70-75, Sn:15-20, Ti:9-12, Fe:0.02-2, Ni:1-3, Si:0.1-1.5；(2) above-mentioned each group is distributed into double movement batch mixer mixing 90min, liquid dispersant is added and remixes 30min；(3) uniformly mixed solder is secondly packed into vacuum melting furnace melting, vacuum degree is less than 3.5 × 10‑3Pa keeps the temperature 15min after all metals dissolve completely；(4) finally by the alloy liquid being completely melt under atmosphere of inert gases, high temperature alloy solder is prepared using atomization method.The solder is higher with fusing point, shear strength is high, the moderate feature of trickling property.
Description
Technical field
The Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si that the present invention relates to a kind of.
Background technique
The superhard materials such as diamond, cBN have the properties such as superior physics, chemistry and mechanics, are that production hard brittle material adds
The ideal material of work tool.With the continuous development of artificial synthesized super hard abrasive and sintered carbide tools manufacturing technology, it is with diamond
The sintered carbide tools of representative are widely used in the hard brittle materials such as engineering ceramics, semiconductor material, optical glass, stone material, hard alloy
Manufacture field.
Traditional diamond tool production method mainly has a plating and sintering process, and abrasive grain is to be inlayed, wrapped by mechanical
Be embedded in inside bonding agent, tool is small to the holding power of abrasive grain, and abrasive grain is easy to fall off under heavy load conditions, cause life tools compared with
It is low.It is also the shortcoming of plating with sintered diamond tool that abrasive grain proud exposure is lower, processing efficiency is low.The 1980s
It begins one's study both at home and abroad and makes diamond tool with soldering processes, process is to realize Buddha's warrior attendant by middle layer of solder
Enhanced primary treatment between stone and steel matrix.Brazed diamond tool has compared with being electroplated with sintered diamond tool to be combined
The excellent properties such as intensity height, abrasive grain exposure height, service life length, structural strength height, cause more and more passes in Diamond Tools Industry
Note, industrial value are constantly promoted.
Domestic and international many scientific research personnel and unit have done a large amount of basic research and industrialization work to brazed diamond tool,
Such as: A. K. Chattopadhyay of Switzerland, A. Trenker of Germany, Nanjing Aero-Space University, The Fourth Military Medical University
Deng.Solder is the important component of brazed diamond tool, and solder has decisive influence to the performance of tool.Make at this stage
Solder mainly has Ni parent metal, Cu parent metal and Ag parent metal, and all there is respective advantage and disadvantage.It is with Ni-Cr alloy
The Ni parent metal of representative has the advantages that fusing point is high, wearability is good, obdurability is outstanding, price is low etc., but because of its fusing point is high, line is swollen system
Number is big and Ni element is diamond catalyst element, leads to the damage of diamond after being brazed greatly and solder layer is also easy to produce crackle；Ag base
Solder has the advantages that suitable fusing point, excellent craftsmanship, good hardness, intensity and corrosion resistance, but Ag is noble metal
Cause solder cost excessively high, is unfavorable for industrial application.Have fusing point moderate by the Cu parent metal of representative of Cu-Sn-Ti alloy
(about 900 DEG C), it is at low cost, mechanical property is good the advantages that, have the disadvantage in that in application process (1) since solder is partially soft and
Its excellent wellability, leads to that abrasive grain exposure is undesirable and cutting edge is easily coated by solder.(2) solder bond strength at high temperature
Low, brazing layer is easily removed from matrix when work, and the matrix surface at removing has alloy thin layer.
The shortcoming of advantage and existing solder in view of soldering sintered carbide tools, development of new solder not only has important
It the theory meaning and has broad application prospects and market value.
Summary of the invention
Its of the invention purpose be that provide a kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si with
The deficiency to solve the above problems, with fusing point is suitable for, trickling property is moderate, grit protrusion is good, not damaged to diamond and golden
There is the characteristics of dendroid densification TiC generation, good combination property at hard rock interface.
It adopts the technical scheme that achieve the above object, a kind of Cu-Sn-Ti high temperature alloy solder containing Fe, Ni, Si
Preparation method, the high temperature alloy solder are basic alloying component with Cu-Sn-Ti, and the high temperature that addition Fe, Ni, Si element is constituted closes
Gold solder；The high temperature alloy solder is as steps described below made of the side of preparation: (1) selection purity first is greater than 99.9%, particle
Cu, Sn, Ti, Fe, Ni, Si metal powder of size 150-180um, by mass percentage: Cu:70-75, Sn:15-20, Ti:
9-12, Fe:0.02-2, Ni:1-3, Si:0.1-1.5；(2) above-mentioned each group is distributed into double movement batch mixer mixing 90min, added
Enter liquid dispersant and remixes 30min；(3) uniformly mixed solder is secondly packed into vacuum melting furnace melting, vacuum degree is less than
3.5×10-3Pa keeps the temperature 15min after all metals dissolve completely；(4) finally by the alloy liquid being completely melt in indifferent gas
Under body atmosphere, high temperature alloy solder is prepared using atomization method.
Beneficial effect
The present invention has the following advantages that compared with prior art.
1. the fusing point of the high temperature alloy solder is suitable for, trickling property is moderate, grit protrusion is good, not damaged to diamond and golden
There is dendroid densification TiC generation at hard rock interface, has preferable comprehensive performance；
2. the present invention uses mixture experiment design test method, pass through the content of shearing test and soldering diamond exemplar pairing gold element
It optimizes.
Detailed description of the invention
Below in conjunction with attached drawing, the invention will be further described.
Fig. 1 is the SEM figure of the Cu-Sn-Ti high temperature alloy solder of the invention containing Fe, Ni, Si.
Specific embodiment
Below with reference to examples and drawings, the invention will be further described.
A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si, (1) are first
First selection purity is greater than Cu, Sn, Ti, Fe, Ni, Si metal powder of 99.9%, granular size 150-180um, by quality hundred
Divide than meter: Cu:70-75, Sn:15-20, Ti:9-12, Fe:0.02-2, Ni:1-3, Si:0.1-1.5；(2) by above-mentioned each component
Double movement batch mixer mixing 90min are packed into, liquid dispersant is added and remixes 30min；(3) secondly uniformly mixed solder is filled
Enter vacuum melting furnace melting, vacuum degree is less than 3.5 × 10-3Pa keeps the temperature 15min after all metals dissolve completely；(4) finally will
The alloy liquid being completely melt prepares high temperature alloy solder under atmosphere of inert gases, using atomization method.
The atmosphere of inert gases includes the mixture of argon gas, helium or argon gas and helium.
Height as shown in Figure 1 is prepared using atomization method under atmosphere of inert gases for the alloy liquid being completely melt
Temperature alloy solder.
By analysis of experiments, the Cu-Sn-Ti high temperature alloy solder of the invention containing Fe, Ni, Si has characteristics that weldering
Expect that fusing point is 950-1020 DEG C；The shear strength of solder itself is 160.14-210.45MPa；The trickling property of liquid filler
Moderate, the diamond exposure after soldering is good and cutting edge open coats；Diamond interface has dendroid densification TiC generation, right
Diamond holding power is high.
Specific example is as follows:
Embodiment 1
It takes following steps to make high temperature alloy solder: (1) selecting purity greater than 99.9%, the Cu of granular size 150-180um,
Sn, Ti, Fe, Ni, Si metal powder, by mass percentage: Cu:70.85, Sn:18, Ti:10, Fe:0.05, Ni:1, Si:
0.1；(2) each group is distributed into double movement batch mixer mixing 90min, liquid dispersant is added and remixes 30min；It (3) will mixing
Uniform solder is packed into vacuum melting furnace melting, and vacuum degree is less than 3.5 × 10-3Pa is kept the temperature after all metals dissolve completely
15min；(4) by the alloy liquid being completely melt under atmosphere of inert gases, solder is prepared using atomization method.
Embodiment 2
It takes following steps to make high temperature alloy solder: (1) selecting purity greater than 99.9%, the Cu of granular size 150-180um,
Sn, Ti, Fe, Ni, Si metal powder, by mass percentage: Cu:69.5, Sn:18, Ti:10, Fe:0.5, Ni:1.5, Si:
0.5；(2) each group is distributed into double movement batch mixer mixing 90min, liquid dispersant is added and remixes 30min；It (3) will mixing
Uniform solder is packed into vacuum melting furnace melting, and vacuum degree is less than 3.5 × 10-3Pa is kept the temperature after all metals dissolve completely
15min；(4) by the alloy liquid being completely melt under atmosphere of inert gases, solder is prepared using atomization method.
Embodiment 3
It takes following steps to make high temperature alloy solder: (1) selecting purity greater than 99.9%, the Cu of granular size 150-180um,
Sn, Ti, Fe, Ni, Si metal powder, by mass percentage: Cu:69, Sn:15, Ti:12, Fe:1, Ni:2, Si:1；(2) will
Each group is distributed into double movement batch mixer mixing 90min, and liquid dispersant is added and remixes 30min；(3) by uniformly mixed solder
It is packed into vacuum melting furnace melting, vacuum degree is less than 3.5 × 10-3Pa keeps the temperature 15min after all metals dissolve completely；It (4) will be complete
The alloy liquid of running down prepares solder under atmosphere of inert gases, using atomization method.
Embodiment 4
It takes following steps to make high temperature alloy solder: (1) selecting purity greater than 99.9%, the Cu of granular size 150-180um,
Sn, Ti, Fe, Ni, Si metal powder, by mass percentage: Cu:66.5, Sn:15, Ti:12, Fe:2, Ni:3, Si:1.5；
(2) each group is distributed into double movement batch mixer mixing 90min, liquid dispersant is added and remixes 30min；(3) it will be uniformly mixed
Solder be packed into vacuum melting furnace melting, vacuum degree is less than 3.5 × 10-3Pa keeps the temperature 15min after all metals dissolve completely；
(4) by the alloy liquid being completely melt under atmosphere of inert gases, solder is prepared using atomization method.
Claims (2)
1. a kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si, the high temperature alloy solder are with Cu-Sn-Ti
Base alloy ingredient, the high temperature alloy solder that addition Fe, Ni, Si element is constituted；It is characterized in that, the high temperature alloy solder be by
According to made of following step preparation method:
(1) selection purity is pressed greater than Cu, Sn, Ti, Fe, Ni, Si metal powder of 99.9%, granular size 150-180um first
Mass percent meter: Cu:70-75, Sn:15-20, Ti:9-12, Fe:0.02-2, Ni:1-3, Si:0.1-1.5；
(2) above-mentioned each group is distributed into double movement batch mixer mixing 90min, liquid dispersant is added and remixes 30min；
(3) uniformly mixed solder is secondly packed into vacuum melting furnace melting, vacuum degree is less than 3.5 × 10-3Pa, to all metals
15min is kept the temperature after dissolving completely；
(4) finally by the alloy liquid being completely melt under atmosphere of inert gases, high temperature alloy solder is prepared using atomization method.
2. a kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si according to claim 1, feature
It is, the atmosphere of inert gases includes the mixture of argon gas, helium or argon gas and helium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910369639.XA CN110106375A (en) | 2019-05-06 | 2019-05-06 | A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910369639.XA CN110106375A (en) | 2019-05-06 | 2019-05-06 | A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si |
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| Publication Number | Publication Date |
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| CN110106375A true CN110106375A (en) | 2019-08-09 |
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| CN201910369639.XA Withdrawn CN110106375A (en) | 2019-05-06 | 2019-05-06 | A kind of Cu-Sn-Ti high temperature alloy solder preparation method containing Fe, Ni, Si |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110961826A (en) * | 2019-12-25 | 2020-04-07 | 哈尔滨工业大学 | Preparation method of nano IMC (internal mold decoration) uniformly-reinforced tin-based alloy joint |
| CN112059470A (en) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | Active brazing filler metal for brazing titanate microwave dielectric ceramic and metal and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI87470B (en) * | 1989-11-17 | 1992-09-30 | Outokumpu Oy | SOM SLAGLOD ANVAENDBARA KOPPARLEGERINGAR. |
| CN101273148A (en) * | 2005-09-30 | 2008-09-24 | 三菱伸铜株式会社 | Fusion curingprocess article and copper alloy material for fusion curingprocess and manufacturing method thereof |
| CN108381059A (en) * | 2018-05-09 | 2018-08-10 | 南京固华机电科技有限公司 | A kind of Cu-Sn-Ti superalloy solders and preparation method thereof containing Fe, Ni, Si |
-
2019
- 2019-05-06 CN CN201910369639.XA patent/CN110106375A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI87470B (en) * | 1989-11-17 | 1992-09-30 | Outokumpu Oy | SOM SLAGLOD ANVAENDBARA KOPPARLEGERINGAR. |
| CN101273148A (en) * | 2005-09-30 | 2008-09-24 | 三菱伸铜株式会社 | Fusion curingprocess article and copper alloy material for fusion curingprocess and manufacturing method thereof |
| CN108381059A (en) * | 2018-05-09 | 2018-08-10 | 南京固华机电科技有限公司 | A kind of Cu-Sn-Ti superalloy solders and preparation method thereof containing Fe, Ni, Si |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110961826A (en) * | 2019-12-25 | 2020-04-07 | 哈尔滨工业大学 | Preparation method of nano IMC (internal mold decoration) uniformly-reinforced tin-based alloy joint |
| CN112059470A (en) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | Active brazing filler metal for brazing titanate microwave dielectric ceramic and metal and preparation method thereof |
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Application publication date: 20190809 |