CN110103131A - It is ground grinding device and grinding grinding method - Google Patents
It is ground grinding device and grinding grinding method Download PDFInfo
- Publication number
- CN110103131A CN110103131A CN201910071570.2A CN201910071570A CN110103131A CN 110103131 A CN110103131 A CN 110103131A CN 201910071570 A CN201910071570 A CN 201910071570A CN 110103131 A CN110103131 A CN 110103131A
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- China
- Prior art keywords
- grinding
- water
- unit
- chip
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
Grinding grinding device and grinding grinding method are provided, is eliminated and is carried out water seal formation using different institutions in grinding grinding device and keep cooling down for workbench and cause apparatus structure big and complicated situation.Being ground grinding device (1) has holding unit (5), grinding unit (30,31) and grinding unit (4), holding unit has porous plate (50) and framework (51), porous plate has chip retaining surface, framework has the recess portion (511a) for exposing retaining surface and being stored to porous plate, framework includes attraction road (510), the lower surface (511b) of framework is connected to by it with recess portion bottom surface, and connect lower face side with attraction source (59)；And access, lower surface is connected to by it with the upper surface on the outside of recess portion, and so that lower face side is provided source (57) with water and connect, being ground grinding device has unit (9), which sprays water to ejiction opening obtained by be open on an upper from access and the water between chip and retaining surface in the case where formation water seal and the water in the case where cooling down to holding unit control.
Description
Technical field
It is to implement to be ground to machined objects such as semiconductor wafers the present invention relates to grinding grinding device and grinding grinding method
The device and method of attrition process.
Background technique
In the past, there is following grinding grinding device: the chip of peripheral side warpage is being retained in keeping workbench
In the state of be ground, and chip after grinding is ground.In such grinding grinding device, in order to utilize holding
Workbench, to there are the chips of warpage to carry out attracting holding, provides unit via nozzle pair from water in the state of no vacuum leak
The periphery of chip provides water, forms water seal.
Also, in order to ensure be formed by water seal keep workbench from by chip relative to grinding grinding device on guarantor
Hold workbench carrying-in/carrying-out carrying-in/carrying-out region be moved to chip carry out grinding grinding region during not
It is destroyed, is keeping near workbench there is water to provide unit and nozzle.
After forming water seal and making that movable workbench is kept to be ground chip to grinding region, keep
Movable workbench implements attrition process to chip to attrition process region.Here, in attrition process, a large amount of processing is generated
Heat, it is therefore desirable to which setting carries out cooling mechanism to holding workbench (for example, referring to patent document 1).
Patent document 1: No. 6166958 bulletins of Japanese Patent
In previous grinding grinding device, it is respectively provided with the nozzle mechanism to form water seal and to the holding work in grinding
Cooling cooling body is carried out as platform, therefore there is a problem of that apparatus structure is big and complicated.
As a result, in grinding grinding device, there is the project to be solved in the following aspects: due to carrying out using different institutions
The formation of water seal and the cooling for keeping workbench, so that apparatus structure is big and complicated.
Summary of the invention
It the purpose of the present invention is to provide grinding grinding device and grinding grinding method, is processed to semiconductor wafer etc.
The device and method that object implements grinding attrition process.
The present invention for solving the above subject be grinding grinding device, include holding unit, have to chip into
The retaining surface that row is kept；Grinding unit is ground using the chip that grinding grinding tool keeps the holding unit；And it grinds
Unit is ground, is ground using the chip that grinding pad keeps the holding unit, wherein the holding unit includes porous
Plate has the retaining surface kept to chip；And framework, having makes the retaining surface expose and carry out to the porous plate
The recess portion of storage, the framework include attraction road, the lower surface of the framework are connected to the bottom surface of the recess portion, and make lower surface
Side is connect with source is attracted；And access, which is connected to the upper surface on the outside of the recess portion, and make the lower face side
It provides source with water to connect, which has control unit, and the control unit is to from ejiction opening ejection water and in the crystalline substance
The first water in the case where water seal and the in the case where cooling down to the holding unit is formed between piece and the retaining surface
Two waters are controlled, wherein the ejiction opening is obtained by the access is open on this upper surface.
It is preferred that the framework includes the first framework, with the recess portion, and there is the first access, first connection
The lower surface is connected to by road with the lateral surface of first framework；And second framework, the lateral surface of first framework is surrounded,
And have the second access, second access by the medial surface of the second framework be connected to the upper surface and with this first company
Access connection.
The present invention for solving the above subject is that grinding grinding method is protected chip using the grinding grinding device
It is held in the holding unit and grinding grinding is carried out to the chip, wherein the grinding grinding method has following process: keeping
Process provides water from the ejiction opening according to first water, in the chip and the retaining surface being placed in the retaining surface
Between formed water seal and chip is kept；Be ground preparatory process, make the holding unit for being formed with the water seal be moved to by
The defined grinding position that the grinding unit is ground chip；Grinding process, using the grinding grinding tool to this
The chip that holding unit is kept is ground；Grind preparatory process, after grinding process, make the holding unit be moved to by
The defined attrition process position that the grinding unit grinds chip；And attrition process process, according to than this first
Few second water of water sprays water from the ejiction opening on one side and carries out to the holding unit cold to the access water delivery
But chip is ground using the grinding pad on one side.
For grinding grinding device of the invention, holding unit includes porous plate, has the guarantor kept to chip
Hold face；And framework, have make retaining surface expose and to the recess portion that porous plate is stored, framework includes attraction road, will
The lower surface of framework is connected to the bottom surface of recess portion, and connect lower face side with attraction source；And access, by lower surface with
Upper surface connection on the outside of recess portion, and so that lower face side is provided source with water and connect, which has control unit, should
Control unit is to the first water in the case where forming water seal between chip and retaining surface from ejiction opening ejection water and to guarantor
It holds the second water that unit carries out in the case where cooling to be controlled, wherein the ejiction opening is that access is opened on this upper surface
Obtained by mouthful, therefore the formation of water seal and the cooling of holding unit are not carried out using different mechanisms, only passes through control unit pair
The amount for being provided to the water of access is adjusted, be just able to carry out in the state of no vacuum leak to the chip of warpage into
The formation of water seal when the grinding of row attracting holding and holding unit when further being ground to chip after grinding
Cooling appropriate, therefore apparatus structure will not be big and complicated.
There is following process using the grinding grinding method of the invention that the grinding grinding device is implemented: keeping work
Sequence provides water from the ejiction opening according to the first water, forms water seal between the chip and retaining surface being placed in retaining surface
And chip is kept；Be ground preparatory process, make the holding unit for being formed with water seal be moved to by grinding unit to chip into
The defined grinding position of row grinding；Grinding process is ground using the chip that grinding grinding tool keeps holding unit
It cuts；Grinding preparatory process makes holding unit be moved to the regulation ground by grinding unit to chip after grinding process
Attrition process position；And attrition process process, according to second water fewer than the first water to access water delivery, on one side from
Ejiction opening is sprayed water and carries out cooling to holding unit and ground on one side using grinding pad to chip, therefore is not utilized different
Mechanism carries out the formation of water seal and the cooling of holding unit, is only adjusted to the amount for being provided to the water of access by control unit
First water and the second water are just able to carry out for carrying out attracting holding to the chip of warpage in the state of no vacuum leak
Grinding when water seal formation and holding unit when further being ground to chip after grinding cooling appropriate.
Detailed description of the invention
Fig. 1 is the perspective view for showing an example of grinding grinding device.
Fig. 2 is the cross-sectional view for showing an example of construction of holding unit.
Fig. 3 is the cross-sectional view for showing the state being ground using the chip that grinding grinding tool keeps holding unit.
Fig. 4 is the cross-sectional view for showing the state ground using the chip that grinding pad keeps holding unit.
Label declaration
1: grinding grinding device；10: first device pedestal；A: carrying-in/carrying-out region；150: the first box mounting portions；150a:
First box；151: the second box mounting portions；151a: the second box；152: temporarily putting region；153: bit cell；154a: loading arm；
154b: load arm is unloaded；155: robot；156: cleaning unit；11: second device pedestal；B: machining area；12: the first columns；20:
Corase grinding cuts feed unit；30: thick grinding unit；13: the second columns；21: fine ginding feed unit；31: fine ginding unit；14: the
Three columns；24:Y axis direction mobile unit；25: grinding feed unit；4: grinding unit；6: turntable；5: holding unit；50: porous
Plate；50a: retaining surface；51: framework；53: rotary cover；511: the first frameworks；511a: recess portion；The lower surface of 511b: the first framework；
511f: the first access；512: second framework；512f: the second access；55: rotary joint；56: rotary unit；560: main
Axis；560a: road is provided；560b: main shaft attraction road；57: water provides source；571: piping；572: flow rate regulating valve；59: attracting source；
70: jar；71,72: Processing Room；9: control unit.
Specific embodiment
Grinding grinding device 1 shown in FIG. 1 is a device which it with thick grinding unit 30,31 and of fine ginding unit
Grinding unit 4 is ground by the wafer W that thick grinding unit 30 and fine ginding unit 31 keep arbitrary holding unit 5
It cuts, and wafer W is ground by grinding unit 4.
Grinding grinding device 1 is for example configured to be linked with second device at the rear (+Y direction side) of first device pedestal 10
Pedestal 11.Become the carrying-in/carrying-out region A of carrying-in/carrying-out for carrying out wafer W etc. on first device pedestal 10.Second device pedestal
Become on 11 and is carried out by the wafer W that thick grinding unit 30, fine ginding unit 31 or grinding unit 4 keep holding unit 5
The machining area B of processing.
Wafer W shown in FIG. 1 is, for example, the semiconductor wafer for the circular plate being made of silicon base material etc., the direction in Fig. 1
Multiple devices are formed on the positive Wa of the wafer W of lower section, and is pasted with protection band (not shown) and is protected.The back of wafer W
Face Wb is as the machined surface for implementing grinding and attrition process.
The face side (-Y direction side) of first device pedestal 10 is provided with the first box mounting portion 150 and the second box mounting portion
151, the first box 150a stored to the wafer W before processing is placed in the first box mounting portion 150, in the second box mounting portion
151 are placed with the second box 151a stored to the wafer W after processing.
It is equipped with robot 155 at the rear of the opening of the first box 150a, by the wafer W before processing from the first box 150a
It moves out, and the wafer W after processing is moved in the second box 151a.The position adjacent with robot 155 is provided with the area Zan Fang
Domain 152, temporarily, putting region 152 is equipped with bit cell 153.Bit cell 153 will be from using the alignment pin that can reduce diameter
First box 150a is moved out and is placed in the wafer W contraposition (centering) for temporarily putting region 152 in defined position.
It is configured with loading arm 154a in the position adjacent with bit cell 153, in the state of keeping to wafer W
Rotation.Loading arm 154a keeps the wafer W aligned in bit cell 153, and wafer W is transported to arranging
Arbitrary holding unit 5 in machining area B.It is provided with beside loading arm 154a and unloads load arm 154b, to processing
Wafer W afterwards rotates in the state of being kept.In the cleaning unit for being configured with one chip close to the position for unloading load arm 154b
156, the wafer W after the processing by unloading load arm 154b conveying is cleaned.Cleaning has been carried out by cleaning unit 156
Wafer W is moved in by robot 155 to the second box 151a.
Rear (+Y direction side) on second device pedestal 11, which is erect, is provided with the first column 12, in the preceding table of the first column 12
It is equipped corase grinding on face and cuts feed unit 20.Corase grinding cuts feed unit 20 and includes: ball-screw 200, with vertical direction (Z
Axis direction) axle center；A pair of guide rails 201, they are arranged to parallel with ball-screw 200；Motor 202, with ball-screw
200 connections, rotate ball-screw 200；Lifter plate 203, internal nut are screwed togather with ball-screw 200, lifter plate 203
Side and 201 sliding contact of guide rail；And rest 204, link with lifter plate 203, thick grinding unit 30 is kept, when
When motor 202 rotates ball-screw 200, along with this, lifter plate 203 is guided and reciprocal in the Z-axis direction by guide rail 201
Mobile, the thick grinding unit 30 for being supported on rest 204 also moves back and forth in the Z-axis direction.
Thick grinding unit 30 includes main shaft 300, and axial direction is vertical direction (Z-direction)；Shell 301, by main shaft
300 bearings are that can rotate；Motor 302 carries out rotation driving to main shaft 300；The mounting base 303 of round, with master
The lower end of axis 300 connects；And grinding emery wheel 304, it is connect in a manner of assemble and unassemble with the lower surface of mounting base 303.And
And grinding emery wheel 304 includes emery wheel base station 304a；And multiple corase grinding skivings of approximately cuboid shape have 304b, they are in
Ring-type is disposed on the bottom surface of emery wheel base station 304a.Roughly grinding skiving tool 304b is, for example, the biggish mill of abrasive grain contained in grinding tool
Tool.
Such as be formed in the inside of main shaft 300 along the grinding water flow road that Z-direction extends, grinding water (not shown) provides
Unit and the grinding water fluid communication.The grinding water provided from grinding water offer unit main shaft 300 is under grinding water flow road
The opening at end sprays downwards towards corase grinding skiving tool 304b, reaches the contact site of corase grinding skiving tool 304b and wafer W.
In addition, the rear on second device pedestal 11, erects side by side in the X-axis direction with the first column 12 and be provided with the
Two columns 13 are equipped with fine ginding feed unit 21 in the front surface of the second column 13.Fine ginding feed unit 21 and corase grinding cut into
It is similarly constituted to unit 20, fine ginding unit 31 can be subjected to grinding and feeding in the Z-axis direction.Fine ginding unit 31 has
The lesser fine ginding grinding tool 314b of abrasive grain contained in grinding tool, other structures are identical as thick grinding unit 30.
Side (-X direction side) on second device pedestal 11, which is erect, is provided with third column 14, in the preceding table of third column 14
Y direction mobile unit 24 is equipped on face.Y direction mobile unit 24 includes: ball-screw 240, with Y direction
Axle center；A pair of guide rails 241, they are arranged to parallel with ball-screw 240；Motor 242 rotates ball-screw 240；With
And movable plate 243, internal nut are screwed togather with ball-screw 240, the side of movable plate 243 and 241 sliding contact of guide rail.And
And when motor 242 make ball-screw 240 rotate when, along with this, movable plate 243 by guide rail 241 guide and in Y direction
Upper movement, the grinding unit 4 being disposed on movable plate 243 move in the Y-axis direction with the movement of movable plate 243.
It is equipped grinding feed unit 25 on movable plate 243, makes grinding unit 4 close relative to holding unit 5
Or it is gone up and down in separate Z-direction.Grinding feed unit 25 includes: ball-screw 250, the axle center with vertical direction；One
To guide rail 251, they are arranged to parallel with ball-screw 250；Motor 252 links with ball-screw 250, makes ball wire
Thick stick 250 rotates；Lifter plate 253, internal nut are screwed togather with ball-screw 250, and the side of lifter plate 253 and guide rail 251 are sliding
Dynamic contact；And rest 254, link with lifter plate 253, grinding unit 4 is kept, when motor 252 makes ball wire
When thick stick 250 rotates, lifter plate 253 is guided and moved in the Z-axis direction by guide rail 251, is supported on the grinding unit 4 of rest 254
Also it moves in the Z-axis direction.
Grinding unit 4 for example comprising: main shaft 40, axial direction are vertical directions；Shell 41, being by the bearing of main shaft 40 can
Rotation；Motor 42 carries out rotation driving to main shaft 40；The mounting base 43 of circular plate, is fixed on the lower end of main shaft 40；
And circular grinding pad 44, it is installed in a manner of assemble and unassemble on the lower surface of mounting base 43.Grinding pad 44 for example by
The non-woven fabrics such as felt are constituted, and are partially formed with the perforation that logical liquid is carried out for slurry (lapping liquid comprising free abrasive grain) at its center
Hole.The diameter of grinding pad 44 is the size with the diameter same degree of mounting base 43, in addition, the diameter of grinding pad 44 is than keeping single
The diameter of member 5 is big.
The paste flow path axially extended is formed in the inside of main shaft 40, slurry (not shown) provides unit and the slurry
Fluid communication.Unit is provided from slurry to spray the slurry that main shaft 40 provides from the opening of the lower end of paste flow path towards grinding pad 44
Out, by the through hole of grinding pad 44, the contact site of grinding pad 44 and wafer W is reached.
As shown in Figure 1, turntable 6 is equipped on second device pedestal 11, on the upper surface of turntable 6, such as circumferentially
Separate holding unit 5 there are four being equally spaced arranged.It is equipped at the center of turntable 6 for making the (not shown) of 6 rotation of turntable
Rotary shaft, capable of making turntable 6, the axle center in direction carries out rotation about the z axis centered on rotary shaft.Rotation, energy are carried out by turntable 6
Enough make four revolution of holding unit 5 and holding unit 5 is successively positioned at thick grinding unit 30 from temporarily putting near region 152
Lower section, the lower section of fine ginding unit 31 and the lower section of grinding unit 4.
As shown in Fig. 2, such as its shape of holding unit 5 is circular plate, porous plate 50 is included, is had to wafer W
The retaining surface 50a kept；And framework 51, having makes retaining surface 50a expose and be stored to porous plate 50 recessed
Portion 511a.Such as framework 51 includes: the first framework 511, with above-mentioned recess portion 511a, and having will be under the first framework 511
The first access 511f that surface 511b is connected to lateral surface 511c；And second framework 512, around the first framework 511
Lateral surface 511c has the second access that medial surface 512d is connected to upper surface 512a and is connect with the first access 511f
512f。
Porous plate 50 is embedded in the circular recess portion 511a of the first framework 511.The upper surface of first framework 511 is for example formed
There is the cricoid step difference of single order, the single order so that region of peripheral side is lower, the water energy sprayed from outside inclined downward direction is enough pressed
The upper surface of the first framework 511 is reached according to the parabolical mode of description.
Framework 51 has attraction road 510, and the attraction road 510 is by the lower surface 511b's of the first framework 511 and recess portion 511a
Bottom surface connection, and it connect the attractions source 59 such as the lower surface side 511b and vacuum generating device.One end (the upper end of attraction road 510
Side) for example it is open in the bottom surface of recess portion 511a at multiple positions.Attraction road 510 for example extends downward in the first framework 511,
Middle section of its other end in the lower surface 511b of the first framework 511 is open.
First access 511f is circumferentially spaced in the first framework 511 to be formed at equal intervals, each first connection
One end of road 511f is open in outer side 511c respectively.Each first access 511f is for example from lateral surface 511c the first framework of direction
511 central horizontal extends, and then extends downward, middle section of the other end in the lower surface 511b of the first framework 511
Opening.
As shown in Fig. 2, can be in turntable 6 and rotary unit 56 of lower section of the holding unit 5 by being disposed in holding unit 5
Upper rotation.Rotary unit 56 is, for example, belt wheel mechanism, includes main shaft 560, and axial direction is Z-direction, and the upper end and holding are single
The lower surface 511b connection of first framework 511 of member 5；And motor 561, it is to make holding unit 5 in holding unit 5
The heart is the driving source that axis is rotated.Driving pulley 562 is installed on the motor reel of motor 561, in driving pulley 562
On endless belt 563 is installed.Driven pulley 564 is installed in the upper end side of main shaft 560, it is driven that endless belt 563 is also wound in this
Belt wheel 564.Motor 561 carries out rotation driving to driving pulley 562, thus rotation of the endless belt 563 with driving pulley 562
It is rotated, endless belt 563 carries out rotation to which driven pulley 564 and main shaft 560 are rotated.
The main shaft attraction road 560b being connected to attraction road 510 is formed in the inside of main shaft 560.Main shaft attraction road 560b's
Upper end side is connected with the opening of the other end of attraction road 510.It is connected with rotary joint 55 in main shaft 560, is produced from attraction source 59
Raw attraction and aftermentioned water are transferred to the main shaft 560 of rotation with providing water exhaustive provided by source 57.Main shaft attraction road
560b is axially extended in main shaft 560, and lower end side is connected to via rotary joint 55 with source 59 is attracted.
Multiple offer road 560a being connected to each first access 511f are formed in the inside of main shaft 560.It is each that road is provided
The upper end side of 560a is connected with the opening of the other end of each first access 511f.Road 560a is provided in main shaft 560 along axial direction
Extend, the water that lower end side is constituted via rotary joint 55 and piping 571 with by pump etc. provides source 57 and is connected to.
Second framework 512 has circular shape, supports in its medial surface 512d and the lateral surface 511c of the first framework 511
In the state of connecing, second framework 512 is fixed on the first framework 511 by fixing bolt (not shown) etc..In addition, second framework
512 can also be integrally formed with the first framework 511.
Second access 512f is circumferentially spaced in second framework 512 to be formed at equal intervals, in medial surface
One end of each second access 512f of 512d opening is connected to the first access 511f respectively.It is being located at the first framework 511
On the upper surface 512a of the second framework 512 in the outside of recess portion 511a, the other end of each second access 512f is as injection water
Ejiction opening, it is circumferentially spaced to be equally spaced open.
Connected by being formed in the first access 511f of above-mentioned first framework 511 and being formed in the second of second framework 512
Access 512f and access is formed in framework 51, which will be on the outside of the lower surface 511b of the first framework 511 and recess portion 51a
Second framework 512 upper surface 512a connection and the lower surface side 511b and water offer source 57 are provided.
As shown in Fig. 2, covered on second device pedestal 11 by jar 70, carrying-in/carrying-out region A shown in FIG. 1 relative to
Jar 70 exposes in outside.In the space inside jar 70, it is formed with multiple using divides (not shown)
Processing Room, the demarcation plate are matched in the way of to being divided between four holding units 5 for example on the upper surface of turntable 6
If.That is, the inside of jar 70 at least formed with: when implementing thick grinding to holding unit 5 and thick grinding unit 30
The Processing Room 71 stored of grinding emery wheel 304；When implementing fine ginding processing to holding unit 5 and fine ginding unit 31
The Processing Room (not shown) that grinding emery wheel 304 is stored；And when implementing attrition process to holding unit 5 and grinding pad 44
The Processing Room 72 stored (referring to Fig. 4).By the rotation of turntable 6, holding unit 5 can move between each Processing Room.
In addition, by with demarcation plate (not shown), thus grinding water used in for example thick grinding or generated grinding
Bits etc. will not flow into the Processing Room 72 of attrition process to be implemented from Processing Room 71.
Such as rotary cover 53 is equipped around each holding unit 5.Rotary cover 53 includes sidewall portion 530, and setting is set
It is placed in the upper surface of turntable 6；And top plate portion 531, extend from the upper end of sidewall portion 530 to the central side of holding unit 5.It protects
The retaining surface 50a of unit 5 is held as the circular opening upwards side state outstanding from top plate portion 531.Such as it can also be to top
The second access on the extended position and front end geometry of the front end in plate portion 531 and the upper surface 512a of second framework 512
The position of the ejiction opening of 512f is adjusted, and is adjusted so as to moving direction, the speed etc. to the water sprayed from ejiction opening
It is whole.
As shown in Figure 1 and Figure 2, grinding grinding device 1 has control unit 9, and control unit 9 is stored by CPU and memory etc.
Element is constituted, and carries out the control of device entirety.Control unit 9 cuts feed unit 20, Y-axis with corase grinding by wiring (not shown)
The electrical connection such as direction mobile unit 24 and rotary unit 56 cuts feed unit 20 to based on corase grinding under the control of control unit 9
Thick grinding unit 30 up and down direction shift action, attrition process when the grinding list based on Y direction mobile unit 24
Reciprocating action in the Y direction of member 4 and the spinning movement etc. of the holding unit 5 based on rotary unit 56 are controlled.
Such as water is provided source 57 and main shaft 560 provide be equipped in the piping 571 that road 560a is connected it is (not shown)
Flow rate regulating valve 572 (such as proportional control solenoid valve), the flow rate regulating valve 572 are electrically connected with control unit 9.Control unit 9
Increase and decrease the control signal for being sent to flow rate regulating valve 572 and keep the throttling of valve variable, so as to from piping 571 second
The flow of flowing water is adjusted in access 512f.That is, control unit 9 can be to from ejiction opening ejection water and in wafer W
Between retaining surface 50a formed water seal in the case where water (the first water) and in attrition process to holding unit 5 carry out
Water (the second water) in the case where cooling is controlled, wherein the ejiction opening is the second access 512f in second framework
Obtained by 512 upper surface 512a upper opening.
In addition, the control of the above-mentioned water based on control unit 9 be not limited to shown in present embodiment it is such by right
In the control signal of flow rate regulating valve 572 increase and decrease and the example that carries out, can also be by providing source 57 to water by control unit 9
It is directly controlled and is carried out.
Hereinafter, to using above-mentioned grinding grinding device 1 shown in FIG. 1 to implement grinding and attrition process to wafer W
In the case of each process be illustrated.
(1) process is kept
Firstly, making 6 rotation of turntable shown in FIG. 1, so that the holding unit 5 for not loading the state of wafer W be made to revolve, will protect
Unit 5 is held to be moved near loading arm 154a.Robot 155 pulls out a wafer W from the first box 150a, and wafer W is moved
It moves to temporary and puts region 152.Then, after being felt relieved by bit cell 153 to wafer W, after loading arm 154a will feel relieved
Wafer W be moved on holding unit 5.Also, as shown in Fig. 2, big according to the center at the center and wafer W that make holding unit 5
Causing consistent mode by wafer W, overleaf Wb is placed on retaining surface 50a in the state of upward.In Fig. 2, carried shown in dotted line
Wafer W such as its integrally bending of the state of retaining surface 50a is placed in into middle concavity, that is, there is the periphery from the back side Wb of wafer W
The region of side slowly reduces such warpage towards central region.
Then, water provides source 57 and water is sent to piping 571.The water passes through piping 571, rotary joint 55, main shaft 560
Each the first access 511f that road 560a and the first framework 511 are provided and from the second access 512f's of second framework 512
Ejiction opening sprays.In addition, flow rate regulating valve 572 is adjusted in control unit 9, the amount of the water sprayed from the ejiction opening is adjusted
To form the first water (such as 3L/ minutes~5L/ minutes) in the case where water seal between wafer W and retaining surface 50a.
As shown in Fig. 2, the water sprayed from ejiction opening is for example parabolical according to describing from the outside obliquely downward of retaining surface 50a
Mode reaches the outer peripheral edge of the warpage of wafer W shown in dotted line and the gap of retaining surface 50a.As a result, will be brilliant by water seal
Gap between the outer peripheral edge and retaining surface 50a of the warpage of piece W seals.In this state, attraction source 59 is acted and is generated
Attraction porous plate 50 is transferred to by the main shaft attraction road 560b of main shaft 560 and the attraction road 510 of the first framework 511
Retaining surface 50a, thus holding unit 5 on retaining surface 50a in the state of no vacuum leak to wafer W (crystalline substance shown in solid
Piece W) carry out attracting holding.
(2) corase grinding cuts preparatory process
Then, the holding unit 5 for being formed with water seal is moved to as defined in thick grinding unit 30 is ground wafer W
Grinding position.That is, the rotation counterclockwise from +Z direction of Fig. 1, turntable shown in Fig. 26, to make to be formed with water
The holding unit 5 for sealing and carrying out in the state of no vacuum leak to wafer W the state of attracting holding revolves and is accommodated in Fig. 2 institute
In the Processing Room 71 shown, in addition, the wafer W that the corase grinding skiving of thick grinding unit 30 tool 304b and holding unit 5 are kept into
Row contraposition.Contraposition is for example carried out according to the rotational trajectory for roughly grinding skiving tool 304b is made by way of the rotation center of wafer W.
When 6 rotation of turntable, stop the rotation of the main shaft 560 of holding unit 5.Alternatively, can also be relative to the direction of rotation of turntable 6
It rotates in the opposite direction.
(3) roughing process
As shown in figure 3, with main shaft 300 is rotated according to the rotation speed of regulation by motor 302, corase grinding skiving tool
304b is rotated.It is fed in addition, thick grinding unit 30 cuts feed unit 20 by corase grinding to -Z direction, by making the thick of rotation
The back side Wb for the wafer W that grinding grinding tool 304b is kept with holding unit 5 is abutted and is carried out grinding.In addition, with rotation
Unit 56 rotates holding unit 5 according to the rotation speed (such as 300rpm~500rpm) of regulation, institute on retaining surface 50a
The wafer W of holding is also rotated, therefore roughly grinds the thick grinding that skiving tool 304b carries out the entire back side Wb of wafer W.?
In thick grinding, also sprayed from the ejiction opening of the second access 512f according to the first water (such as 3L/ minutes~5L/ minutes)
Water maintains the formation of water seal.In addition, grinding water (not shown) provides unit and passes through the grinding water flow in main shaft 300 for water is ground
Road and the contact site for being provided to the back side Wb of corase grinding skiving tool 304b and wafer W, to contact site carry out it is cooling, clean.
(4) fine ginding preparatory process
Wafer W is slightly ground to and is up to completion thickness, then corase grinding, which cuts feed unit 20, makes on thick grinding unit 30
It rises and separate wafer W.Fig. 1, turntable shown in Fig. 36 rotate counterclockwise from +Z direction, will be formed with water seal and
The holding unit 5 for carrying out attracting holding to wafer W in the state of no vacuum leak is moved to the lower section of fine ginding unit 31.Separately
Outside, in the case where cutting the warpage for eliminating wafer W by corase grinding, fine ginding preparatory process can also stop providing source from water
57 pairs of holding units 5 provide water and release and carry out in the state of water seal.
(5) fine grinding
The fine ginding grinding tool 314b's and 5 attracting holdings of holding unit for having carried out fine ginding unit 31 shown in FIG. 1
After the contraposition of wafer W, fine ginding unit 31 is fed downwards by fine ginding feed unit 21, makes the fine ginding grinding tool of rotation
314b is abutted with the back side Wb of wafer W, and with the rotation of holding unit 5, the wafer W that retaining surface 50a is kept is revolved
Turn, so that the entire back side Wb to wafer W carries out fine ginding.In addition, grinding water is provided to fine ginding grinding tool 314b and wafer W
Contact site carries out cooling to contact site, cleans.
(6) preparatory process is ground
Make the separate flatness for being ground to completion thickness and further improving back side Wb of fine ginding grinding tool 314b
After wafer W, make turntable 6 shown in FIG. 1 rotation counterclockwise from +Z direction, to make after remain fine ginding
The holding unit 5 of wafer W revolves and is accommodated in Processing Room 72 shown in Fig. 4, and it is right that holding unit 5 is positioned at grinding unit 4
The defined attrition process position that wafer W is ground.Wafer W relative to the grinding pad 44 of grinding unit 4 contraposition for example such as
It is carried out in the way of abutting grinding pad 44 with the entire back side Wb of wafer W as shown in Figure 4.
(7) attrition process process
As shown in figure 4, grinding pad 44 is rotated with rotation driving is carried out to main shaft 40 by motor 42.In addition,
Grinding unit 4 is fed by grinding feed unit 25 to -Z direction, is abutted grinding pad 44 with the back side Wb of wafer W and is ground
Mill processing.In addition, as rotary unit 56 rotates holding unit 5 according to the rotation speed (such as 800rpm) of regulation,
The wafer W kept on retaining surface 50a is also rotated, therefore the grinding of the entire back side Wb of the progress wafer W of grinding pad 44 adds
Work.In addition, providing slurry to the contact site of grinding pad 44 and the back side Wb of wafer W in attrition process.
In attrition process, do not make grinding unit 4 in the case where mobile on the face direction (horizontal direction) of wafer W,
Sometimes overleaf form candy strip on Wb, this become reduce wafer W bending strength the main reason for.Therefore, add in grinding
In work, Y direction mobile unit 24 makes grinding unit 4 move back and forth in the Y-axis direction and make grinding pad 44 at the back side of wafer W
It is slided along the y axis on Wb.
When starting to carry out attrition process (the so-called CMP) using slurry, a large amount of processing can be applied to holding unit 5
Heat, therefore water provides source 57 and water is sent to piping 571.The water passes through each offer road 560a and the first framework 511 of main shaft 560
The first access 511f and sprayed from the ejiction opening of the second access 512f of second framework 512, therefore from inside to holding
Unit 5 is cooled down.In addition, flow rate regulating valve 572 is adjusted in control unit 9, the first access 511f and will be passed through
The water of two access 512f is adjusted to fewer than the first water (such as 3L/ minutes~5L/ minutes) when forming water seal before
Second water (such as 1L/ minutes).
Carried out the adjustment of water and from the water that the ejiction opening of the second access 512f sprays with formation water seal when it is different, no
With the impetus for reaching retaining surface 50a.In addition, the rotation speed (such as 800rpm) of holding unit 5 is set to than implementing to be ground
Fastly, therefore the centrifugal force for being applied to holding unit 5 compares grinding to rotation speed (such as 300rpm~500rpm) when processing
Shi great, as a result, being directed away from the radial outside stream of retaining surface 50a from the water that the ejiction opening of the second access 512f sprays
Under.In this way, carry out cooling to holding unit 5 and do not reach retaining surface 50a from the water that the ejiction opening of the second access 512f sprays,
Therefore water will not enter to the contact site (processing stand) of the back side Wb of grinding pad 44 and wafer W, will not generate in processing stand
A problem that slurry is thin out.
Such as when being equipped with rotary cover 53 around holding unit 5 as in the present embodiment, even from
The ejiction opening of two access 512f spray and be directed away from the radial outside of retaining surface 50a water splash upwards in the case where,
Also water can be prevented to be attached on the lower surface of grinding pad 44 by top plate portion 531.The water for example passes through the side wall of rotary cover 53
Portion 530 etc. is directed to discharge outlet (not shown) etc..
After the grinding for completing a wafer W, keep grinding unit 4 mobile to +Z direction by grinding feed unit 25
And the wafer W completed far from attrition process.In addition, stopping the rotation of holding unit 5, make turntable 6 from +Z direction to the inverse time
Holding unit 5 is moved to by the rotation of needle direction so that the holding unit 5 kept to the wafer W after attrition process be made to revolve
It is shown in FIG. 1 to unload near load arm 154b.In addition, stopping providing source 57 from water to the offer water of holding unit 5.
Then, load arm 154b is unloaded to attract the wafer W for implementing attrition process of institute's attracting holding on holding unit 5
It keeps, and stops the attraction in attraction source 59, release holding unit 5 to the attracting holding of wafer W.Load arm 154b is unloaded by wafer W
From the conveying of holding unit 5 to cleaning unit 156, the cleaning of wafer W is carried out using cleaning unit 156.The wafer W cleaned
By in the storage to the second box 151a of robot 155.
In grinding grinding device 1 of the invention, holding unit 5 includes porous plate 50, has and keeps to wafer W
Retaining surface 50a；And framework 51, have make retaining surface 50a expose and to the recess portion 511a that porous plate 50 is stored, frame
Body 51 includes attraction road 510, the lower surface 511b of the first framework 511 is connected to the bottom surface of recess portion 511a, and make lower surface
The side 511b is connect with source 59 is attracted；And access (the first access 511f and the second access 512f), by the first framework
Upper surface 512a on the outside of 511 lower surface 511b and recess portion 511a is connected to, and so that the lower surface side 511b and water is provided source 57 and connected
Connect, the grinding grinding device 1 have control unit 9, to from ejiction opening spray water and between wafer W and retaining surface 50a shape
The second water in the case where cooling down at the first water in the case where water seal and to holding unit 5 controls, wherein
The ejiction opening is the second access 512f obtained by the 512a upper opening of upper surface, and therefore, grinding grinding device 1 does not utilize difference
Mechanism carry out the formation of water seal and the cooling of holding unit 5, only by control unit 9 to the amount of the water for being provided to access into
Row adjustment, when being just able to carry out in the state of no vacuum leak to the grinding of the wafer W progress attracting holding of warpage
The formation and the cooling appropriate of the holding unit 5 when further being ground to wafer W after grinding of water seal, therefore device knot
Structure will not be big and complicated.
The grinding grinding method of the invention implemented using grinding grinding device 1 has following process: process is kept,
Water is provided from the ejiction opening of framework 51 according to the first water, between the wafer W being placed on retaining surface 50a and retaining surface 50a
It forms water seal and wafer W is kept；It is ground preparatory process, the holding unit 5 for being formed with water seal is moved to and is cut by corase grinding
The defined grinding position that unit 30, fine ginding unit 31 are ground wafer W；Grinding process utilizes corase grinding skiving
The wafer W that tool 304b, fine ginding grinding tool 314b keep holding unit 5 is ground；Preparatory process is ground, in grinding process
Later, holding unit 5 is moved to the defined attrition process position ground by grinding unit 4 to wafer W；And grinding
Manufacturing procedure, it is defeated to access (the first access 511f and the second access 512f) according to second water fewer than the first water
Water grinds wafer W using grinding pad 44 while cooling down from ejiction opening ejection water to holding unit 5, because
This does not carry out the formation of water seal and the cooling of holding unit 5 using different mechanisms, only will be provided to connection by control unit 9
The amount of the water on road is adjusted to the first water and the second water, be just able to carry out in the state of no vacuum leak to warpage
The formation of water seal when wafer W carries out the grinding of attracting holding and guarantor when further being ground to wafer W after grinding
Hold the cooling appropriate of unit 5.
In addition, grinding grinding method of the invention is not limited to the above embodiment, in addition, mill illustrated for attached drawing
Each structure for cutting grinding device 1, is also not necessarily limited to this, can suitably be become in the range of can play effect of the invention
More.
Claims (3)
1. a kind of grinding grinding device, includes
Holding unit has the retaining surface kept to chip；
Grinding unit is ground using the chip that grinding grinding tool keeps the holding unit；And
Grinding unit is ground using the chip that grinding pad keeps the holding unit,
Wherein,
The holding unit includes
Porous plate has the retaining surface kept to chip；And
Framework, having exposes the retaining surface and to the recess portion that the porous plate is stored,
The framework includes
The lower surface of the framework is connected to the bottom surface of the recess portion, and connect lower face side with attraction source by attraction road；And
The lower surface is connected to by access with the upper surface on the outside of the recess portion, and so that the lower face side is provided source with water and connect,
The grinding grinding device has control unit, and the control unit is to from ejiction opening ejection water and in the chip and the retaining surface
Between form the first water in the case where water seal and the second water in the case where cooling down to the holding unit is controlled
System, wherein the ejiction opening is obtained by the access is open on this upper surface.
2. grinding grinding device according to claim 1, wherein
The framework includes
First framework, with the recess portion, and have the first access, first access by the lower surface and this first
The lateral surface of framework is connected to；And
Second framework surrounds the lateral surface of first framework, and has the second access, and second access is by second frame
The medial surface of body is connected to the upper surface and connect with first access.
3. chip is held in the guarantor using grinding grinding device described in as claimed in claim 1 or 22 by a kind of grinding grinding method
It holds unit and grinding grinding is carried out to the chip, wherein
The grinding grinding method has following process:
Keep process, provide water from the ejiction opening according to first water, the chip that is placed in the retaining surface with
Water seal is formed between the retaining surface and chip is kept；
It is ground preparatory process, the holding unit for being formed with the water seal is moved to and chip is ground by the grinding unit
Defined grinding position；
Grinding process is ground using the chip that the grinding grinding tool keeps the holding unit；
Grinding preparatory process is moved to the holding unit and is ground by the grinding unit to chip after grinding process
The defined attrition process position of mill；And
Attrition process process, according to second water fewer than first water to the access water delivery, on one side from the spray
Outlet is sprayed water and carries out cooling to the holding unit and ground on one side using the grinding pad to chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018014332A JP7096674B2 (en) | 2018-01-31 | 2018-01-31 | Grinding and polishing equipment and grinding and polishing method |
| JP2018-014332 | 2018-01-31 |
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| CN110103131A true CN110103131A (en) | 2019-08-09 |
| CN110103131B CN110103131B (en) | 2023-04-18 |
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| JP (1) | JP7096674B2 (en) |
| KR (1) | KR102606113B1 (en) |
| CN (1) | CN110103131B (en) |
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| CN110625519A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江润美机械科技有限公司 | High-precision wafer grinding machine |
| CN112917386A (en) * | 2019-12-06 | 2021-06-08 | 株式会社迪思科 | Plate-like object holding tool |
| CN113021105A (en) * | 2021-02-25 | 2021-06-25 | 深圳市昶东鑫线路板有限公司 | Grinding device and grinding method for circuit board pretreatment |
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| JP7353715B2 (en) | 2019-10-25 | 2023-10-02 | 株式会社ディスコ | Grinding method of workpiece |
| JP2022040984A (en) | 2020-08-31 | 2022-03-11 | 株式会社ディスコ | Grinding apparatus |
| JP2022077171A (en) | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | Machining device |
| CN113199487B (en) * | 2021-03-30 | 2022-04-01 | 武汉数字化设计与制造创新中心有限公司 | Grinding and polishing unit pose sensing method, grinding method and grinding and polishing unit |
| JP2023053560A (en) | 2021-10-01 | 2023-04-13 | 株式会社ディスコ | Grinding apparatus |
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Also Published As
| Publication number | Publication date |
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| CN110103131B (en) | 2023-04-18 |
| JP7096674B2 (en) | 2022-07-06 |
| TWI781284B (en) | 2022-10-21 |
| KR20190093122A (en) | 2019-08-08 |
| TW201934261A (en) | 2019-09-01 |
| KR102606113B1 (en) | 2023-11-23 |
| JP2019130607A (en) | 2019-08-08 |
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