CN110102881A - A kind of plate thickness self-regulation structure suitable for laser marking machine - Google Patents
A kind of plate thickness self-regulation structure suitable for laser marking machine Download PDFInfo
- Publication number
- CN110102881A CN110102881A CN201910493137.8A CN201910493137A CN110102881A CN 110102881 A CN110102881 A CN 110102881A CN 201910493137 A CN201910493137 A CN 201910493137A CN 110102881 A CN110102881 A CN 110102881A
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- China
- Prior art keywords
- marking machine
- mark
- plate thickness
- main body
- plate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of plate thickness self-regulation structures suitable for laser marking machine, frame main body, mark platform component, marking machine main body, plate thickness inductively measure mechanism, marking machine regulating mechanism and controller, the mark platform component and marking machine regulating mechanism are installed in the frame main body, the plate thickness inductively measures mechanism and is set on the mark platform component, for incuding and measuring the thickness to mark pcb board；The marking machine main body is installed on the marking machine regulating mechanism, and the marking machine body height is adjusted in the marking machine adjustment structure；The controller is installed in the frame main body, inductively measures thickness of slab value measured by mechanism for receiving the plate thickness, and the height of the marking machine main body is adjusted by the marking machine regulating mechanism.Plate thickness self-regulation structure suitable for laser marking machine of the invention realizes automatic adjustment of the marking machine to different-thickness pcb board, guarantees that marking depth is consistent, improves mark quality.
Description
Technical field
The present invention relates to automated production equipment more particularly to PCB substrate mark code processes, and in particular to one kind is suitable for
The plate thickness self-regulation structure of laser marking machine.
Background technique
Conventional laser marking machine need to manually adjust oscilaltion handle and carry out height when processing the marking of different-thickness pcb board
Degree is adjusted.When the different slab thickness specifications item numbers of processing are more, height need to be frequently adjusted, it is time-consuming and laborious, and mark depth and be difficult to control
It is bad to easily lead to marking for system.
Summary of the invention
The purpose of the present invention is to provide a kind of plate thickness self-regulation structures suitable for laser marking machine.
Technical scheme is as follows: the present invention provides a kind of plate thickness automatic adjustment knot suitable for laser marking machine
Structure, frame main body, mark platform component, marking machine main body, plate thickness inductively measure mechanism, marking machine regulating mechanism and controller, institute
It states mark platform component and marking machine regulating mechanism is installed in the frame main body, the plate thickness inductively measures mechanism set on described
On mark platform component, for incuding and measuring the thickness to mark pcb board；The marking machine main body is installed on the marking machine tune
It saves in mechanism, the marking machine body height is adjusted in the marking machine adjustment structure；The controller is installed on described
In frame main body, thickness of slab value measured by mechanism is inductively measured for receiving the plate thickness, and machine is adjusted by the marking machine
Structure adjusts the height of the marking machine main body.
Further, the mark platform component include the mark platform rack being installed in frame main body and be set to the mark
The mark platform of platform frame top, the mark platform are used to place the pcb board to mark.
Further, it includes: pressing plate lifting assembly and displacement sensor component, the pressure that the plate thickness, which inductively measures mechanism,
Plate lifting assembly is mounted in the mark platform rack, and can be slided up and down relative to the mark platform rack, institute's rheme
Displacement sensor component is fixed in the mark platform rack, and the relatively described pressing plate lifting assembly setting.
Further, the pressing plate lifting assembly includes cylinder block, cylinder, lifting sliding rail, lifting sliding rail bottom plate and upper pressure
Plate, the cylinder block and the lifting sliding rail are fixed on the side plate of the mark platform rack, and the cylinder is fixed on the gas
In cylinder seat, the output shaft of the cylinder is connect with the lifting sliding rail bottom plate, and the lifting sliding rail bottom plate passes through sliding block slidably
Ground is installed on the lifting sliding rail；The top board is installed on lifting sliding rail bottom plate top, and the top board corresponds to institute
State the setting of mark platform.
Further, the pressing plate lifting assembly include a floating junction, described floating junction one end by a nut with
The output axis connection of the cylinder, the other end are connect with the lifting sliding rail bottom plate.
Further, the pressing plate lifting assembly further includes a mark shield, and the mark shield is installed on the upper pressure
On plate, and it is located at the top of the mark platform, the top board, which corresponds to, is equipped with clearance position at the mark platform.
Further, the displacement sensor component includes: displacement inductive pick-up and inductor fixed block, the induction
Device fixed block is locked on the side plate of the mark platform rack, and the displacement inductive pick-up is locked in the inductor fixed block
On, the displacement inductive pick-up is laser displacement sensor.
Further, the marking machine regulating mechanism includes: support frame, sliding seat, tooth bar and driving device, the tooth bar
Both ends are installed on the support frame as described above by bearing, the sliding base sleeve in the tooth bar and between two bearings,
The marking machine main body is installed on the sliding seat, and the driving device is installed on support frame as described above, the driving device
It connect with described tooth bar one end, to drive the tooth bar to rotate, is moved down in the marking machine main body to be driven by sliding seat
It is dynamic.
Further, the marking machine regulating mechanism further includes a shaft coupling, and the output shaft of the driving device passes through institute
It states shaft coupling to connect with one end of the tooth bar, the driving device is installed on support frame as described above by a driving device mounting base
On.
Further, the tooth bar is trapezoidal tooth bar, and the driving device is stepper motor.
Using the above scheme, a kind of plate thickness self-regulation structure suitable for laser marking machine of the invention, by
The pcb board thickness that setting plate thickness measurement of inductance mechanism treats mark in mark platform rack measures, and measured value is sent to
Controller, controller control marking machine regulating mechanism according to measured value, the adjusting of the height of marking machine main body are realized, so that mark
Machine is suitable for the pcb board of different-thickness, eliminates the cumbersome process for manually adjusting laser marking machine, improves work efficiency,
And marking depth consistency is good.
Detailed description of the invention
Fig. 1 is the overall structure diagram for the plate thickness self-regulation structure that the present invention is suitable for laser marking machine.
Fig. 2 is that the plate thickness for the plate thickness self-regulation structure that the present invention is suitable for laser marking machine inductively measures the structure of mechanism
Schematic diagram.
Fig. 3 is that the structure of the marking machine regulating mechanism for the plate thickness self-regulation structure that the present invention is suitable for laser marking machine is shown
It is intended to.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Referring to Fig. 1, the present invention provides a kind of plate thickness self-regulation structure suitable for laser marking machine, comprising: rack
Main body (not shown), mark platform component 1, marking machine main body 2, plate thickness inductively measure mechanism 3, marking machine regulating mechanism 4 and control
Device (not shown), the mark platform component 2 and marking machine regulating mechanism 4 are installed in the frame main body, the plate thickness induction
Measuring mechanism 3 is set on the mark platform component 1, for incuding and measuring the thickness to mark pcb board；The marking machine main body
2 are installed on the marking machine regulating mechanism 4, the marking machine adjustment structure 4 be used for the height of the marking machine main body 2 into
Row is adjusted；The controller is installed in the frame main body, and the controller receives plate thickness measurement of inductance mechanism 3 and surveyed
The thickness of slab value obtained, and control the height that the marking machine regulating mechanism 4 adjusts the marking machine main body 2.Specifically, the mark
Platform component 1 includes the mark platform rack 11 being installed in frame main body and the mark platform set on 11 top of mark platform rack
12, the mark platform 12 is fixed by bolts in the top of the mark platform rack 11, for placing the pcb board to mark.
As shown in Fig. 2, it includes: pressing plate lifting assembly 31 and displacement sensor component 32 that the plate thickness, which inductively measures mechanism 3,
The pressing plate lifting assembly 31 is mounted in the mark platform rack 11, and can be relative to about the 11 mark platform rack
Sliding, the displacement sensor component 32 is fixed in the mark platform rack 11, and the relatively described pressing plate lifting assembly 31 is set
It sets.Specifically, the pressing plate lifting assembly 31 includes cylinder block 311, cylinder 312, lifting sliding rail 314, lifting sliding rail bottom plate 315
And top board 317, the cylinder block 311 and the lifting sliding rail 314 are mounted on the side plate 33 of the mark platform rack 11
On, the cylinder 312 is fixed on the cylinder block 311, the output shaft of the cylinder 312 and the lifting sliding rail bottom plate 315
Connection, the lifting sliding rail bottom plate 315 are equipped with sliding shoe, and the sliding shoe is installed on the lifting sliding rail 314, make described
Lifting sliding rail bottom plate 315 can be slided up and down along the lifting sliding rail 314；The top board 317 is installed on the lifting sliding rail bottom
315 top of plate, the corresponding mark platform 12 of the top board 317 are arranged, the corresponding mark platform 12 of the top board 317
Place is equipped with clearance position, and the pcb board on mark platform 12 described in empty avoiding needs to beat target area.The pressing plate lifting assembly 31 also wraps
A floating junction 313 is included, described 313 one end of floating junction passes through the output axis connection of a nut 316 and the cylinder 311, separately
One end is connect with the lifting sliding rail bottom plate 315.The floating junction 313 plays elimination error, protects both ends institute connecting component,
It is allowed to run smoothly, and the service life of the cylinder 311 can be extended.Preferably, mark shield is installed on the top board 317
Cover 318, the mark shield 318 is located at the top of the mark platform 12, when the pcb board to mark is placed in mark platform 12
When upper, the cylinder 312 drives the top board 317 to move downward, and pushes down the pcb board to mark, will be to the pcb board of mark
It is fixed on the mark platform 12.The setting of mark shield 318 can prevent laser during mark from damaging to human eye
And prevent dust, soft flocks from splashing, pollute working environment.
As shown in Fig. 2, the displacement sensor component 32 includes: displacement inductive pick-up 321 and inductor fixed block
322, the inductor fixed block 322 is locked on the side plate 33 of the mark platform rack 11, the displacement inductive pick-up 321
It is locked on the inductor fixed block 322, and is communicated to connect with the controller.Preferably, the displacement inductive pick-up
321 be laser displacement sensor.The displacement inductive pick-up 321 carries out induction meter to the displacement of the pressing plate lifting assembly 31
It calculates and is sent to the controller.Before mark, first the position of the pressing plate lifting assembly 31 is corrected, i.e., does not place PCB
Starting the pressing plate lifting assembly 31 in the case of plate, the top board 317 is moved downward until being pressed onto the mark platform 12, this
Shi Suoshu displacement inductive pick-up 321 records the position of the lifting sliding rail bottom plate 315 as initial value, while marking machine is adjusted
Mechanism 4 is resetted, and as the mechanical origin of marking machine main body 2, i.e., the labelling head of marking machine main body 2 and the mark are flat at this time
Distance between platform 12 is best marking height；When the pcb board when mark is placed on mark platform 12,312 band of cylinder
It moves the top board 317 to move downward, pushes down the pcb board to mark, the pcb board to mark is fixed on the mark platform
On 12, while the displacement inductive pick-up 321 records the end value of the position of the lifting sliding rail bottom plate 315, and by the position
Shifting value is sent to the controller, and the controller obtains the thickness of the pcb board to mark according to the difference of end value and initial value
Value, and according to the thickness value control marking machine regulating mechanism 4 is adjusted based on the mechanical origin marking machine main body 2 accordingly on
Rise the height of the pcb board thickness value.Under normal circumstances, when the difference of thickness of slab value is within the scope of ± 0.2mm, default best
It marks in depth bounds, marking machine regulating mechanism 4 is such as more than the difference range without adjustment, then 4 weight of marking machine regulating mechanism
Height adjustment is carried out, on the basis of the mechanical origin newly to guarantee best marking depth.
Referring to Fig. 3, the marking machine regulating mechanism 4 includes a support frame, sliding seat 404, tooth bar 41 and driving device
45,41 both ends of tooth bar are installed on the support frame as described above by two bearings 6,7, and two bearings are respectively 6 He of first bearing
Second bearing 7,404 sets of the sliding seat in the tooth bar 41 and between two bearings 6 and 7, the marking machine main body 2 is pacified
Loaded on the sliding seat 404, the driving device 45 is installed on support frame as described above 40, the driving device 45 and the tooth
The connection of 41 one end of bar is moved down in the marking machine main body 2 with driving the tooth bar 41 to rotate to be driven by sliding seat 404
It is dynamic.Specifically, support frame as described above includes upper mounted plate 401, bottom plate 402, side wall support plate 403, the side wall support plate
403 connect fixed plate 401 and the bottom plate 402, correspond on the side wall support plate 403 and hollow out shape at tooth bar 41
At a strip-shaped hole (not shown), the sliding seat 404 passes through the strip-shaped hole and connect with the marking machine main body 2.Preferably, institute
Side wall support plate 403 is stated equipped with sliding rail (not indicating), the sliding seat 404 is slidably mounted on the side wall support plate
On 403 sliding rail, the sliding rail is installed on the sliding seat 404 more stably on the side wall support plate 403, plays simultaneously
To the better fixed function of the marking machine main body 2.The marking machine regulating mechanism 4 further includes a shaft coupling 43, the driving
The output shaft of device 45 is connect by the shaft coupling 43 with one end of the tooth bar 41, and the driving device 45 passes through a driving
Device mounting seat 44 is installed on support frame as described above 40, it is preferred that the tooth bar 41 is trapezoidal tooth bar, strength and stiffness performance
It is good, more it is able to satisfy the requirement of transmission.Preferably, which is stepper motor, and it is more accurate to position, and without any product
Tired error.The driving device mounting base 44 is a motor base.The torque that the driving device 45 generates passes through the shaft coupling
43 pass to the tooth bar 41.More specifically, described 41 one end of tooth bar is installed on the bottom plate 402 by a bearing 6
Middle position, the other end are installed on the middle position of fixed plate 401,404 middle part of sliding seat by another bearing 7
It is equipped with tapped through hole, the sliding seat 404 is sheathed in the tooth bar 41 by the tapped through hole, and with the tooth bar 41
Rotation it can be driven to move up and down.The driving device mounting base 44 is fixed on fixed plate 401, the driving
Device 45 is fixed in the driving device mounting base 44, and the shaft coupling 43 is set to 44 bottom of driving device, described
43 one end of axis device connects described 41 one end of tooth bar, and the other end connects the driving device 45.The controller receives the displacement
It after the signal of inductive pick-up 41, controls the driving device 5 and is accordingly operated, the tooth bar 41 is carried out suitable by moment loading
Hour hands rotate counterclockwise, to drive the sliding seat 404 to move up or down along the sliding rail, due to the marking machine
Main body 2 is fixed on the sliding seat 404, so, moving up and down for sliding seat 404 accordingly drives the marking machine main body 2
Upper and lower displacement has the function that adjust 2 height of marking machine main body according to pcb board thickness, is adaptive to the marking machine main body 2 not
The mark of stack pile pcb board ensure that the consistency of marking depth, is not in water clock or carves too deep bad phenomenon.It is described
Controller receives the numerical value of displacement inductive pick-up 321 and calculates the thickness of pcb board, and adjusts control driving according to the thickness
The rotation of device 45 is to realize that the height adjustment of marking machine main body 2 can be implemented by using the prior art, as long as can be realized
The prior art for stating function can meet demand.
In conclusion a kind of plate thickness self-regulation structure suitable for laser marking machine of the invention, by mark
The pcb board thickness that setting plate thickness measurement of inductance mechanism treats mark in platform rack measures, and measured value is sent to control
Device, controller control marking machine regulating mechanism according to measured value, realize the height adjustment of marking machine main body, so that marking machine is applicable in
In the pcb board of different-thickness, the cumbersome process for manually adjusting laser marking machine is eliminated, is improved work efficiency, and marked
Depth consistency is good.
The above is merely preferred embodiments of the present invention, be not intended to restrict the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of plate thickness self-regulation structure suitable for laser marking machine characterized by comprising frame main body, mark platform
Component, marking machine main body, plate thickness inductively measure mechanism, marking machine regulating mechanism and controller, the mark platform component and mark
Machine regulating mechanism is installed in the frame main body, and the plate thickness inductively measures mechanism and is set on the mark platform component, is used for
Incude and measures the thickness to mark pcb board；The marking machine main body is installed on the marking machine regulating mechanism, the mark
The marking machine body height is adjusted in machine adjustment structure；The controller is installed in the frame main body, for connecing
It receives the plate thickness and inductively measures thickness of slab value measured by mechanism, and the mark owner is adjusted by the marking machine regulating mechanism
The height of body.
2. the plate thickness self-regulation structure according to claim 1 suitable for laser marking machine, which is characterized in that described to beat
Marking platform component includes the mark platform rack being installed in frame main body and the mark platform set on the mark platform frame top, institute
Mark platform is stated for placing the pcb board to mark.
3. the plate thickness self-regulation structure according to claim 1 suitable for laser marking machine, which is characterized in that the plate
It includes: pressing plate lifting assembly and displacement sensor component that thickness, which inductively measures mechanism, and the pressing plate lifting assembly is mounted on institute
It states in mark platform rack, and can be slided up and down relative to the mark platform rack, the displacement sensor component is fixed on described
In mark platform rack, and the relatively described pressing plate lifting assembly setting.
4. the plate thickness self-regulation structure according to claim 3 suitable for laser marking machine, which is characterized in that the pressure
Plate lifting assembly includes cylinder block, cylinder, lifting sliding rail, lifting sliding rail bottom plate and top board, the cylinder block and the lifting
Sliding rail is fixed on the side plate of the mark platform rack, and the cylinder is fixed on the cylinder block, the output shaft of the cylinder
It is connect with the lifting sliding rail bottom plate, the lifting sliding rail bottom plate is slidably mounted on the lifting sliding rail by sliding block；
The top board is installed on lifting sliding rail bottom plate top, and the top board corresponds to the mark platform setting.
5. the plate thickness self-regulation structure according to claim 4 suitable for laser marking machine, which is characterized in that the pressure
Plate lifting assembly includes a floating junction, and described floating junction one end passes through the output axis connection of a nut and the cylinder, separately
One end is connect with the lifting sliding rail bottom plate.
6. the plate thickness self-regulation structure according to claim 4 suitable for laser marking machine, which is characterized in that the pressure
Plate lifting assembly further includes a mark shield, and the mark shield is installed on the top board, and is located at the mark platform
Top, the top board correspond at the mark platform be equipped with clearance position.
7. the plate thickness self-regulation structure of laser marking machine according to claim 3, which is characterized in that the displacement induction
Device assembly includes: that displacement inductive pick-up and inductor fixed block, the inductor fixed block are locked in the mark platform rack
Side plate on, the displacement inductive pick-up is locked on the inductor fixed block, the displacement inductive pick-up be laser
Displacement sensor.
8. the plate thickness self-regulation structure according to claim 1 suitable for laser marking machine, which is characterized in that described to beat
Mark machine regulating mechanism includes: support frame, sliding seat, tooth bar and driving device, and the tooth bar both ends are installed on described by bearing
On support frame as described above, for the sliding base sleeve in the tooth bar and between two bearings, the marking machine main body is installed on institute
It states on sliding seat, the driving device is installed on support frame as described above, and the driving device is connect with described tooth bar one end, to drive
The tooth bar rotation is moved, to drive the marking machine main body to move up and down by sliding seat.
9. the plate thickness self-regulation structure according to claim 8 suitable for laser marking machine, which is characterized in that described to beat
Mark machine regulating mechanism further includes a shaft coupling, one end that the output shaft of the driving device passes through the shaft coupling and the tooth bar
Connection, the driving device are installed on support frame as described above by a driving device mounting base.
10. the plate thickness self-regulation structure according to claim 9 suitable for laser marking machine, which is characterized in that described
Tooth bar is trapezoidal tooth bar, and the driving device is stepper motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910493137.8A CN110102881A (en) | 2019-06-06 | 2019-06-06 | A kind of plate thickness self-regulation structure suitable for laser marking machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910493137.8A CN110102881A (en) | 2019-06-06 | 2019-06-06 | A kind of plate thickness self-regulation structure suitable for laser marking machine |
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| CN110102881A true CN110102881A (en) | 2019-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910493137.8A Pending CN110102881A (en) | 2019-06-06 | 2019-06-06 | A kind of plate thickness self-regulation structure suitable for laser marking machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295123A (en) * | 2021-05-18 | 2021-08-24 | 英拓自动化机械（深圳）有限公司 | Thickness measuring equipment for PCB (printed circuit board) |
| CN113714627A (en) * | 2020-05-25 | 2021-11-30 | 深圳市大族数控科技股份有限公司 | Laser processing device and thickness measuring method of laser processing device |
| CN114985916A (en) * | 2020-07-20 | 2022-09-02 | 深圳市中科激光科技有限公司 | PCB laser marking mechanism and corresponding PCB laser marking machine |
| CN115307558A (en) * | 2022-10-11 | 2022-11-08 | 苏州智联科慧自动化有限公司 | PCBA board contactless thickness measurement device |
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| CN210359799U (en) * | 2019-06-06 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Thick automatic regulating structure of board suitable for laser marking machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113714627A (en) * | 2020-05-25 | 2021-11-30 | 深圳市大族数控科技股份有限公司 | Laser processing device and thickness measuring method of laser processing device |
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| CN115307558A (en) * | 2022-10-11 | 2022-11-08 | 苏州智联科慧自动化有限公司 | PCBA board contactless thickness measurement device |
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