CN110099225A

CN110099225A - Array camera module and its depth information acquisition method and electronic equipment

Info

Publication number: CN110099225A
Application number: CN201810441714.4A
Authority: CN
Inventors: 吴旭东; 粟登超
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-01-31
Filing date: 2018-05-10
Publication date: 2019-08-06
Anticipated expiration: 2038-05-10
Also published as: CN208572263U; CN208572262U; CN110099226B; CN110099225B; CN110099226A

Abstract

Array camera module and its depth information acquisition method and electronic equipment, wherein the array camera module includes one first camera module；One second camera module；An and third camera module.First camera module and second camera module are respectively an infrared photography mould group, wherein, first camera module and second camera module are arranged at intervals, for acquiring one the oneth IR image information and one the 2nd IR image information of the measured target respectively.The third camera module is a RGB camera module, first camera module is neighboringly set to, for acquiring a RGB image information of the measured target.Wherein, the depth information of the measured target is obtained by the first IR image information and the 2nd IR image information, further, can merge the RGB image information of the measured target and the depth information of the measured target to obtain the RGB-D image information of measured target.In this way, improving the image quality of the array camera module.

Description

Array camera module and its depth information acquisition method and electronic equipment

Technical field

The present invention relates to camera module field more particularly to array camera modules and its depth information acquisition method and electronics Equipment.

Background technique

In the current information age, how a person's identity is accurately identified, it is ensured that information security, it has also become one must The crucial social concern that must be solved.It is gradually perfect based on biometrics identification technology under this background, and be gradually applied to Every field, such as biometrics identification technology is applied to mobile terminal, it is unlocked, pays.In living things feature recognition In technology, face recognition technology is wherein one of hot topic, is concerned because of application convenient, efficient, quick the advantages that.

There are two basic technique directions for existing face recognition technology: two-dimension human face image identification and three-dimensional face images Identification.As its name suggests, two-dimension human face image identification is referred to through two-dimensional imaging mould group, such as RGB camera module, acquires quilt The two-dimensional image information of face is surveyed, and identification judgement is carried out by the matching comparison with backstage face database.However, many institute's weeks Know, face has extremely complex geometry.When acquiring the two-dimensional image information of tested face using RGB camera module, All multi informations of face can be lost, such as the absolute dimension (height, depth of glasses recess of nose etc.) of face, and due to It blocks and sightless part.In other words, accuracy of identification is not high in practical applications for two-dimension human face image identification technology.

It is identified compared to two-dimension human face image, three-dimensional face images identification technology fully takes into account the complicated three-dimensional knot of face Structure feature, therefore be dedicated to acquiring the three-dimensional image information of tested face, and compare by the matching with backstage face database Carry out identification judgement.Therefore, three-dimensional face images identification technology has relatively high accuracy of identification.It is existing have it is three-dimensional at As the camera module of function includes: the depth information camera module based on structured light technique, it is based on TOF technology (Time OF Flight depth information camera module or binocular depth information camera module).

Depth information camera module based on structured light technique and the depth information camera module based on TOF technology, in work During work, a laser or structure light need to be initiatively projected to a measured target surface, by the parsing laser or structure light Flight time or deformation obtain the measured target depth information.Just because of this, based on structured light technique or TOF technology Its modular structure of depth information camera module is relatively complicated, at high cost.Simultaneously as needing actively to project during the work time Laser, although the laser is set in safety range of human eye, in practical work process, the light intensity of shoot laser is by all Multifactor influence, such as temperature, humidity etc., this is undoubtedly security risk for user.

Existing binocular depth information camera module includes two RGB camera modules, during the work time, respectively by this RGB camera module acquires the RGB image of measured target, and by respective algorithms, such as range of triangle algorithm etc., and it is tested to obtain this The depth information of target.However, requirement of the RGB camera module to shooting environmental is relatively high, especially vulnerable to ambient light It influences, when in dark-state environment (dark or low light environment), which can not accurately acquire the depth of measured target Information, and then influence the application of binocular depth information camera module.

Summary of the invention

The main purpose of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the array mould group includes one first camera module and one second camera module, first camera module and described the Two camera modules are infrared photography mould group, and the two, which cooperates, acquires the depth information of measured target.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, there is the array camera module relatively high dark-state to shoot ability, that is, the array camera module, in dark-state ring Under border, still have the function of that preferably depth information acquires relatively.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the array camera module further includes a light compensating apparatus, and the light compensating apparatus is for mending Fill intensity of illumination of the array camera module when acquiring measured target depth information, with ensure first camera module and The Image Acquisition quality of second camera module.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the light filling can be opened/be closed to the array camera module based on external environment information Device, so that on the one hand, the light compensating apparatus can be based on external environment in time replenishment imaging light；On the other hand, work as nothing It needs to close the light compensating apparatus in due course when the light compensating apparatus, to save energy consumption.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the photosensitive core of IR of the light compensating apparatus is projected infrared light and first camera module and second camera module The infrared band that piece can perceive is consistent, so that the infrared light projected by the light compensating apparatus can optimize the array The shooting environmental of camera module, to enhance the image quality of first camera module and second camera module and finally mention The precision of the high array camera module depth information collected.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the light compensating apparatus is set takes the photograph positioned at first camera module and described second Between picture mould group, so that the imaging ray supplemented by the light compensating apparatus can comparatively equably reflex to institute respectively The first camera module and second camera module are stated, to ensure first camera module and second camera module simultaneously Image quality.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, first camera module and second camera module respectively include a filter element, and the filter element is set respectively The photosensitive path of first camera module and second camera module is placed in for filtering veiling glare, to promote the array camera shooting The precision of the image quality of mould group and depth information collected.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the array camera module further includes a third camera module, and the third camera module is a RGB camera module, with The image quality of the array camera module and the precision of depth information collected are promoted by the RGB camera module.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the third camera module is set synchronously works with first camera module and second camera module, with The RGB image information of measured target is acquired, with by merging third camera module RGB image information collected and described First camera module and second camera module measured target depth information collected form RGB-D image information, optimization The image quality and depth information acquisition precision of the array camera module.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the array camera module further includes a bracket, and in one embodiment of this invention, the bracket is for positioning described first Camera module and second camera module and the structural strength for reinforcing first camera module and the second camera module.This The another object of invention is to provide an array camera module and its depth information acquisition method and electronic equipment, wherein at this In one embodiment of invention, the bracket in conjunction with and positioning first camera module, second camera module and institute Third camera module is stated, is imaged with reinforcing first camera module, the second camera module and the third by the bracket The structural strength of mould group.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the bracket has a recessed portion, and the depressed area is in first camera module Extend down between second camera module and integrally from the top surface of the bracket, in first camera module A reserved space is formed between second camera module, wherein when the array camera module is assembled in an electronic equipment When, the reserved space can be used for installing other electronic components of the electronic equipment, maximumlly to save the electronic equipment Assembling space.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the bracket have one opening, it is described opening correspond to first camera module and Between second camera module, to form described pre- leave a blank between first camera module and second camera module Between, so that the reserved space can be used for installing the electronic equipment when the array camera module is assembled in an electronic equipment Other electronic components, maximumlly to save the assembling space of the electronic equipment.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the light compensating apparatus is installed on the bracket and the array camera module is formed The reserved space in so that the array camera module have more compact construction.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, the third camera module is neighboringly set to first camera module or second camera module, so that the The shooting visual angle phase of shooting visual angle possessed by three camera modules and the array camera module deep image information collected It is close, it is synthesized conducive to subsequent image and obtains the RGB-D image information.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the third camera module and first camera module or the second camera shooting mould Group has unitary module structure, in favor of the installation calibrating of the array camera module.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the array camera module further includes an inner support, to be combined by the inner support The third camera module and first camera module or second camera module so that the third camera module and First camera module or second camera module have integral structure.

Another object of the present invention is to provide an array camera module and its depth information acquisition method and electronic equipment, Wherein, in one embodiment of this invention, the third camera module and first camera module or the third image mould The common pedestal of group, in this way, so that the third camera module and first camera module or described the Two camera modules have integral structure.

By following description, other advantages of the invention and feature will be become apparent, and can pass through right The means and combination particularly pointed out in claim are accomplished.

According to the present invention, aforementioned and other purposes and advantage can be by an array camera modules for acquiring a measured target Depth information, be implemented comprising:

One first camera module；With

One second camera module, first camera module and second camera module are respectively an infrared photography mould Group, for acquiring one the oneth IR image information and one the 2nd IR image information of the measured target respectively, wherein the first IR image Information and the 2nd IR image information are transferred to an image processor, and described image processor is for handling the first IR image letter Breath and the 2nd IR image information are to obtain the depth information of the measured target.

In one embodiment of this invention, the array camera module further includes a light compensating apparatus, the light compensating apparatus quilt It is arranged for projecting an infrared light with specific wavelength to the measured target.

In one embodiment of this invention, the light compensating apparatus is set takes the photograph with first camera module and described second As mould group synchronously works.

In one embodiment of this invention, the light compensating apparatus is located at first camera module and the second camera shooting mould Between group.

In one embodiment of this invention, first camera module includes one first filter element, wherein described second Filter element is located at the photosensitive path of first camera module for filtering veiling glare.

In one embodiment of this invention, second camera module includes one second filter element, wherein described second Filter element is located at the photosensitive path of second camera module for filtering veiling glare.

In one embodiment of this invention, the array camera module further includes a bracket, and the bracket has a receiving Chamber for accommodating first camera module and second camera module in the inner, wherein the bracket have one first opening and One second opening, first opening and second opening are respectively communicated in the accommodating chamber, and first opening corresponds to First camera module corresponds to second camera module with exposure first camera module, second opening with sudden and violent Reveal second camera module.

In one embodiment of this invention, the bracket also has a third opening, and third opening is located at described the It is reserved to form one between first camera module and second camera module between one opening and second opening Space

In one embodiment of this invention, first opening, second opening and third opening are integrally prolonged It stretches, to form an opening of the bracket.

In one embodiment of this invention, the bracket also has a recessed portion, and the depressed area is taken the photograph in described first As extending down between mould group and second camera module and integrally from the top surface of the bracket, to be taken the photograph described first As forming a reserved space between mould group and second camera module.

In one embodiment of this invention, the array camera module further includes a third camera module, and the third is taken the photograph As mould group is a RGB camera module for acquiring a RGB image information of the measured target.

In one embodiment of this invention, described image processor is communicatively coupled with the third camera module, supplies It receives the RGB image information of the third camera module measured target collected and merges the RGB image of the measured target The depth information of information and the measured target, to obtain a RGB-D image information.

In one embodiment of this invention, the third camera module is neighboringly set to first camera module or institute State the second camera module.

In one embodiment of this invention, the third camera module and the institute with the neighbouring setting of the third camera module Stating the first camera module or the second camera module has integral structure.

In one embodiment of this invention, the array camera module further includes a bracket, and the bracket has a receiving Chamber for accommodating first camera module, second camera module and the third camera module in the inner, wherein the branch Frame has one first opening, one second opening and third opening, and first opening, second opening and the third are opened Mouth is respectively communicated in the accommodating chamber, and first opening corresponds to first camera module with exposure the first camera shooting mould Group, second opening correspond to second camera module with exposure second camera module, and the third opening corresponds to In the third camera module with the exposure third camera module.

In one embodiment of this invention, the bracket also has one the 4th opening, and the 4th opening is located at described the It is reserved to form one between first camera module and second camera module between one opening and second opening Space.

In one embodiment of this invention, first opening, second opening, third opening and the third Opening integrally extends, to form an opening of the bracket.

In one embodiment of this invention, the array camera module further includes an inner support, for taking the photograph in conjunction with described first As mould group and second camera module, so that first camera module and second camera module have integral type knot Structure.

In one embodiment of this invention, the array camera module further includes an inner support, for taking the photograph in conjunction with described first As mould group and the third camera module, so that first camera module and the third camera module have integral type knot Structure.

According to another aspect of the present invention, the present invention also provides a depth information acquisition methods comprising step:

S1 obtains one the oneth IR image information of a measured target, wherein described first takes the photograph by one first camera module As mould group is an infrared photography mould group；

S2 obtains one the 2nd IR image information of the measured target by one second camera module, wherein described second takes the photograph As mould group is an infrared photography mould group；With

S3 handles the first IR image information and the 2nd IR image information according to preset algorithm to obtain the measured target Depth information.

In one embodiment of this invention, it in step S1 and step S2, further comprises the steps of:

S10 projects an infrared light to the measured target surface by a light compensating apparatus.

In one embodiment of this invention, the depth information acquisition method further comprises the steps of:

S4 obtains a RGB image information of the measured target by a third camera module, wherein the third images mould Group is a RGB camera module；With

S5 merges the depth information of the RGB image information and the measured target to obtain a RGB-D image information.

According to another aspect of the present invention, the present invention also provides an electronic equipments comprising:

One electronic equipment ontology；With

An array camera module, wherein the array camera module is assembled in the electronic equipment ontology, for acquiring a quilt Survey the depth information of target.

By the understanding to subsequent description and attached drawing, further aim of the present invention and advantage will be fully demonstrated.

These and other objects of the invention, feature and advantage, by following detailed descriptions, drawings and claims are obtained To fully demonstrate.

Detailed description of the invention

Fig. 1 is the stereoscopic schematic diagram according to the array camera module of one first preferred embodiment of the invention.

Fig. 2 is the block diagram representation according to the array camera module of above-mentioned preferred embodiment.

Fig. 3 is the diagrammatic cross-section according to the array camera module of above-mentioned preferred embodiment.

Fig. 4 is the operation schematic diagram according to a light compensating apparatus of the array camera module of above-mentioned preferred embodiment.

Fig. 5 is the diagrammatic cross-section according to a variant embodiment of the array camera module of above-mentioned preferred embodiment.

Fig. 6 is to be illustrated according to the section of another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Fig. 7 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Fig. 8 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Fig. 9 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 10 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 11 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 12 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 13 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 14 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 15 is the block diagram representation according to the array camera module of one second preferred embodiment of the invention.

Figure 16 is the diagrammatic cross-section according to the array camera module of above-mentioned preferred embodiment.

Figure 17 is the diagrammatic cross-section according to a variant embodiment of the array camera module of above-mentioned preferred embodiment.

Figure 18 is to be illustrated according to the section of another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 19 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 20 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 21 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 22 is to be illustrated according to the section of the another variant embodiment of the array camera module of above-mentioned preferred embodiment Figure.

Figure 23 A and 23B are the assembling process schematic diagram according to the array camera module of above-mentioned preferred embodiment.

Figure 24 is another arrangement schematic diagram according to the very tired camera module of above-mentioned preferred embodiment.

Figure 25 is to be illustrated according to the process of the depth information acquisition method of the array camera module provided by the present invention Figure.

Figure 26 is the stereoscopic schematic diagram that the array camera module provided by the present invention is assembled in electronic equipment.

Figure 27 is another stereoscopic schematic diagram that the array camera module provided by the present invention is assembled in electronic equipment.

Figure 28 is the another stereoscopic schematic diagram that the array camera module provided by the present invention is assembled in electronic equipment.

When Figure 29 illustrates the array camera module and is assembled in electronic equipment, the reserved space of the array camera module With the fiting effect schematic diagram between the electronic equipment ontology.

Specific embodiment

It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.

It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art Language is not considered as limiting the invention.

It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " is no It can be interpreted as the limitation to quantity.

If Fig. 1 is to as shown in figure 4, an array camera module of one first preferred embodiment is elucidated with according to the present invention, In, depth information of the array camera module for one measured target of acquisition.For example, in specific application of the invention, it is described Array camera module can be applied to three-dimensional face identification technology.In this application, the array camera module is arranged to The three-dimensional image information for acquiring tested face further can be by carrying out matching comparison with the three-dimensional face database on backstage Realize three-dimensional face identification function.

As previously mentioned, the existing camera module with three-dimensional imaging function includes: the depth letter based on structured light technique Camera module is ceased, the depth information camera module of flight time rule technology (Time OF Flight, TOF) is based on, and, it is double Mesh depth information camera module.It is limited to imaging mechanism, the depth based on structured light technique and based on flight time rule technology Information camera module, modular structure is relatively complicated, at high cost, and has some potential safety problems.Although existing double Mesh depth information camera module, structure is simple, only includes two RGB camera modules, but the requirement to shooting environmental is opposite It is higher, especially vulnerable to the influence of ambient light.When in dark-state environment (dark or low light environment), the camera shooting of binocular depth information Mould group can not accurately acquire the depth information of (or even can not acquire) measured target.Therefore, existing that there is three-dimensional imaging function Modular structure and depth information acquisition performance can all be cannot be considered in terms of, there are still certain room for improvement or replaceable spaces.

Correspondingly, as shown in Fig. 2, the array camera module provided by the present invention includes one first camera module 10, One second camera module 20 and an image processor 40, wherein first camera module 10 and second camera module 20 It is communicatively coupled with described image processor 40 respectively and cooperates for the depth information for acquiring measured target.Particularly, In the preferred embodiment of the invention, first camera module 10 and second camera module 20 are respectively one infrared to take the photograph As mould group (Infrared Radiation, IR), for acquiring one the oneth IR image information and one second of the measured target respectively IR image information, and further described image processor 40 according to preset algorithm handle the first IR image information and this Two IR image informations are to obtain the depth information of the measured target.

For the angle of modular structure, the array camera module provided by the present invention and existing binocular depth are believed It is similar to cease camera module structure, all by a relatively simple, difference is, in the present invention, the institute of the array camera module Stating the first camera module 10 and second camera module 20 is infrared photography mould group rather than RGB camera module., it will be appreciated that Compared to RGB camera module, the infrared photography mould group is with preferably dark-state shoots performance relatively.That is, even if The array camera module provided by the present invention still has relatively preferably deeply (under dark or low light environment) under dark-state environment Information collection function is spent, so that the array provided by the present invention is taken the photograph compared to existing binocular depth information camera module As the application range of mould group is substantially expanded.

More specifically, as shown in figure 3, first camera module 10 includes one in the preferred embodiment of the invention First sensitive chip 11, one first optical lens 12 and a first circuit board 13, first sensitive chip 11 are electrically connected to institute First circuit board 13 is stated, first optical lens 12 is held in the photosensitive path of first sensitive chip 11, thus by It can be supported along the photosensitive path by the imaging ray of first optical lens 12 measured target collected to first sense Optical chip 11, and imaging reaction occurs at first sensitive chip 11.Second camera module 20 includes one second sense Optical chip 21, one second optical lens 22 and a second circuit board 23, second sensitive chip 21 are electrically connected to described second Circuit board 23, second optical lens 22 is held in the photosensitive path of second sensitive chip 21, thus by described The imaging ray of second optics measured target collected can be supported along the photosensitive path to second sensitive chip 21, and Imaging reaction occurs at second sensitive chip 21.

Particularly, in the present invention, first camera module 10 and second camera module 20 are infrared photography mould Group, in other words, first sensitive chip 11 and second sensitive chip 21 are that IR (Infrared Radiation) is photosensitive Chip.Compared to conventional RGB sensitive chip, the IR sensitive chip can perceive the infrared light of specific band, such as 850nm, 940nm etc., thus, even if under dark-state environment (dark or low light environment under), the IR sensitive chip can still perceive from The infrared light for the specific band that measured target surface is reflected, and the first IR image and the 2nd IR image are generated, for obtaining Take the depth information of the measured target.In this way, the array camera module provided by the present invention can not only illumination condition compared with Effect is played in the case where good, and can still have superperformance in dark-state, is used so as to cover to meet day and night The demand that family uses at any time.

In order to avoid light disturbance influences the image quality of first camera module 10 and second camera module 20, First camera module 10 further includes one first filter element 14, and first filter element 14 is held in first sense The photosensitive path of optical chip 11, for filtering in the imaging ray by first optical lens 12 measured target collected Veiling glare.Analogously, second camera module 20 further includes one second filter element 24, second filter element 24 It is held in the photosensitive path of second sensitive chip 21, for filtering by second optical lens 22 quilt collected Survey the veiling glare in the imaging ray of target.Particularly, in the preferred embodiment of the invention, the filter element (described One filter element 14 and second filter element 24) it is set and only allows the sensitive chip (first sensitive chip 11 With second sensitive chip 21) penetrate, thus when first filter element 14 and second filter element 24 respectively by When being set to the photosensitive path of first sensitive chip 11 and second sensitive chip 21, it can only be felt by described first First filter element described in the infrared light-transmissive for the specific band that optical chip 11 and second sensitive chip 21 can perceive 14 and second filter element 24, and the light of remaining wave band is by first filter element 14 and second filter element 24 stop or absorb, in this way, it is ensured that first camera module 10 and second camera module 20 at Image quality amount.

As shown in figure 3, in the preferred embodiment of the invention, filter element (14 He of the first filter element Second filter element 24) there is laminated structure, and it is supported on first camera module 10 and second camera shooting Inside mould group 20.It should be readily apparent that, in other embodiment of the present invention, filter element (first filter element 14 With second filter element 24) equally it is mountable to the outer of first camera module 10 and second camera module 20 Portion, and correspond to the photosensitive path for corresponding to first sensitive chip 11 and second sensitive chip 21.For example, institute First optical lens can be installed in by stating filter element (first filter element 14 and second filter element 24) 12 and second optical lens 22 top side, to enter first optical lens 12 from extraneous imaging ray Before second optical lens 22, by the filter element (first filter element 14 and second filter element 24) it effectively filters, to ensure the image quality of first camera module 10 and second camera module 20.

It is noted that in other embodiment of the present invention, filter element (14 He of the first filter element Second filter element 24) it can also be implemented as a filter coating, wherein and it is photosensitive that the filter coating can be coated on described first Any position of chip 11 and the corresponding photosensitive path of second sensitive chip 21, for the veiling glare in filtering imaging ray.For example, In a particular embodiment, the filter coating directly can overlappingly be coated on first sensitive chip 11 and described second photosensitive The top side of chip 21, to support from extraneous imaging ray to first sensitive chip 11 and second sensitive chip 21 concurrently generate as effectively being filtered before reaction by the filter coating, to ensure first camera module 10 and described the The image quality of two camera modules 20.In other words, in the preferred embodiment of invention, the embodiment of the filter element The installation site of (sheet, film-form) and the filter element is not limited to by the present invention.

Further, those skilled in the art will be appreciated that, the first sensitive chip 11 and described second described in nature Although the infrared light of required specific band is imaged in the presence of not abundant and be easy to be inhaled by other substances in sensitive chip 21 It receives.Alternatively, in some cases, such as when shooting environmental is in dark-state, the specific band in the presence of nature it is red The outer very possible intensity of light is insufficient.Therefore, in order to ensure first camera module 10 and second camera module 20 can The infrared light of the sufficient specific band is collected, in the preferred embodiment of the invention, the array camera module is also wrapped A light compensating apparatus 50 is included, the light compensating apparatus 50 is imaged for supplementing first camera module 10 and second camera module 20 The infrared light of the required specific band.The light compensating apparatus 50 can be implemented as a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), edge-emitting laser or LED etc..

In the preferred embodiment of the invention, the light compensating apparatus 50 is electrically coupleable to first camera module 10 The second circuit board 23 of the first circuit board 13 or second camera module 20, by the first circuit board 13 It is electric energy needed for the light compensating apparatus 50 provides work with the second circuit board 23.When the light compensating apparatus 50 is activated When, the light compensating apparatus 50 generates and projects the infrared light with specific wavelength to the measured target surface, described in supplementing Required infrared light is imaged in first camera module 10 and second camera module 20.In other words, in the preferable reality of the invention It applies in example, the light compensating apparatus 50 forms the active light source of the array camera module, for supplementing first camera module 10 With the intensity of imaging ray needed for second camera module 20.

Fig. 4 illustrates the imaging ray that the light compensating apparatus supplements first camera module and second camera module Schematic diagram.As shown in figure 4, by caused by the light compensating apparatus 50 this that there is the infrared light of specific wavelength to be projected to is tested Target surface.Further, which reflects at the measured target surface, and is radiated to first camera shooting respectively Mould group and second camera module, wherein to the first optical lens described in the infrared light to first camera module It 12 and is filtered by first filter element 14, finally to support to first sensitive chip 11；To the extremely described second camera shooting mould Second optical lens 22 described in the infrared light of group 20, and filtered by second filter element 24, finally to support to institute State the second sensitive chip 21.

Preferably, in the preferred embodiment of the invention, the light compensating apparatus 50 is set positioned at first camera shooting Between mould group 10 and second camera module 20.As shown in figure 4, such arrangement may make first camera module 10, second camera module 20 and the light compensating apparatus 50 have relatively more compact structure.Those skilled in the art It will be appreciated that although, in the present invention, first camera module 10 and second camera module of the array camera module 20 be infrared photography mould group rather than RGB camera module, however, the existing depth applied to binocular depth information camera module Information extraction algorithm, such as range of triangle algorithm etc. still can be applied to the array camera module provided by the present invention.It is corresponding It should be equipped between the feature of range of triangle algorithm, first camera module 10 and second camera module 20 between presetting Away from, and the depth information acquisition precision of the default more big array camera module of spacing is higher.In other words, it is somebody's turn to do in of the invention In preferred embodiment, naturally there is gap between first camera module 10 and second camera module 20.Here, work as institute When stating light compensating apparatus 50 and being installed between first camera module 10 and second camera module 20, the void space energy It is enough effectively utilised, so that the array camera module has more compact construction.

It should further be noted that being taken the photograph when the light compensating apparatus 50 is set to first camera module 10 and described second When as between mould group 20, the infrared light with specific wavelength that the light compensating apparatus 50 is projected ensures that this that it is projected has The infrared light of specific wavelength can be distributed in the testee surface, and be easy to be taken the photograph by first camera module 10 and described second As mould group 20 is perceived, to ensure the Image Acquisition quality of first camera module 10 and second camera module 20.It changes Yan Zhi, when the light compensating apparatus 50 is set between first camera module 10 and second camera module 20, by The imaging ray that the light compensating apparatus 50 is supplemented can comparatively equably reflex to 10 He of the first camera module respectively Second camera module 20, to ensure the image quality of first camera module and second camera module simultaneously.

It is noted that in other embodiment of the present invention, the light compensating apparatus 50 may be placed at other positions, For example, the outside portion (referring to attached drawing 5) of first camera module 10 or second camera module 20, in this regard, being not this Invention is limited to.Particularly, when the light compensating apparatus 50 is arranged at other positions, the power supply circuit of the light compensating apparatus 50 It can be separately provided, for example, the light compensating apparatus 50 can be connected separately to an additional circuit board (not shown).Here, right It is not emphasis of the invention in the configuration of the power supply circuit of the light compensating apparatus 50, so it will not be repeated.

In addition, it's also worth mentioning that in the specific application scenarios of array camera module, for example, by the battle array Column camera module is assembled in electronic equipment (such as smart phone), if electronic equipment itself is equipped with similar to light compensating apparatus 50 Component, the array camera module itself can not provide the light compensating apparatus 50.In other words, in the present invention, the light filling dress 50 are set as inessential element, may be selected to omit under specific circumstances.

Further, in order to reduce energy consumption, in the preferred embodiment of the invention, the Working mould of the light compensating apparatus 50 Formula may be configured so that synchronously to work with first camera module 10 and second camera module 20.Alternatively, in the present invention In other embodiment, the operating mode of the light compensating apparatus 50 can intelligently be adjusted based on external environment.For example, when detecting When first camera module 10 and second camera module, the 20 received imaging ray intensity of institute are less than preset threshold, setting Open the light compensating apparatus 50, and when detect first camera module 10 and second camera module, 20 institute it is received at When meeting preset threshold as light intensity, the light compensating apparatus 50 is remained turned-off.Here, the array camera module is based on the external world Open or close to ambient intelligence the operating mode of the light compensating apparatus 50, on the one hand, may make that the light compensating apparatus 50 can base In external environment in time replenishment imaging light；On the other hand, the light filling dress is closed in due course when being not necessarily to the light compensating apparatus 50 are set, further to save energy consumption.It is noted that the array camera module is also when using this operating mode Including the detection device (not shown) to detect the intensity of the infrared light of the specific wavelength in external environment, by this The testing result of detection device intelligently controls unlatching/closing of the light compensating apparatus 50.

Further, in the preferred embodiment of the invention, the array camera module can be implemented as integral type battle array Column camera module.For example, as shown in figure 3, in the preferred embodiment of the invention, described the of first camera module 10 One circuit board 13 integrally extends the second circuit board 23 of second camera module 20, so that first circuit Plate 13 and the second circuit board 23 have integral structure.That is, in the preferred embodiment of the invention, described One camera module 10 and 20 common circuit board of the second camera module.Here, the first circuit board 13 and second electricity Road plate 23 has integral structure, to form a positioning installation base surface, for installing and calibrating first camera module 10 and institute State the second camera module 20.It is noted that in other embodiment of the present invention (referring to attached drawing 7,10 or 12), described the One circuit board 12 and the second circuit board 23 can be individually arranged, that is, in other embodiment of the present invention, the array is taken the photograph As mould group has split type structure.

Further, in the present invention, the combination between first camera module 10 and second camera module 20 Mode (either integral type or split type) can be configured by other means.

More specifically, in the present invention, first camera module 10 further includes one first pedestal 15, first base Seat 15 is installed on the first circuit board 13, wherein first optical lens 12 is installed on the top side of first pedestal 15, First optical lens 12 to be held in the photosensitive path of first sensitive chip 11 by first pedestal 15.It is special Not, first pedestal 15 has one first light hole 150, and first light hole 150 corresponds to the described first photosensitive core At least photosensitive region of piece 11, to define first sense by first optical lens 12 and first light hole 150 The photosensitive path of optical chip 11.Second camera module 20 further includes one second pedestal 25, and second pedestal 25 is installed on The circuit board, wherein second optical lens 22 is installed on the top side of second pedestal 25, by second base Second optical lens 22 is held in the photosensitive path of second sensitive chip 21 by seat 25.Analogously, described second Pedestal 25 forms one second light hole 250, and second light hole 250 corresponds at least sense of second sensitive chip 21 Light region, to define the sense of second sensitive chip 21 by second optical lens 22 and second light hole 250 Light path.

It correspondingly, in the present invention, can be by the combination between first pedestal 15 and second pedestal 25 Adjust the molding structure of the array camera module.As shown in fig. 7, in a variant embodiment of the preferred embodiment of the invention In, first pedestal 15 integrally extends second pedestal 25, so that first pedestal 15 and second base Seat 25 has integral structure.That is, the array camera module has integral structure.In other words, in the variant embodiment In, first camera module 10 and second camera module 20 share a Contiuum type pedestal, so as to pass through described first Pedestal 15 and second pedestal 25 are formed by Contiuum type pedestal to first camera module 10 and the first camera shooting mould Group 20 positioned, Installation And Calibration.Correspondingly, (the reference in the other variant embodiment of the preferred embodiment of the invention Attached drawing 6, attached drawing 9, attached drawing 10 or attached drawing 12), first pedestal 15 and second pedestal 25 can be individually arranged, and change speech It, the array camera module has split type structure.

Particularly, in some embodiments of the invention, the array camera module can configure integrated circuit plate simultaneously With Contiuum type pedestal, that is, in some embodiments of the invention (refer to attached drawing 3), described the of first camera module 10 The second circuit board 23 of one circuit board 13 and second camera module 20 has integral structure, the second camera shooting mould First pedestal 15 of group 10 and second pedestal 25 of second camera module 20 have integral structure.Here, Integrated circuit plate and Contiuum type pedestal complement each other further to optimize first camera module 10 and described second and take the photograph As the installation of mould group 20 cooperates precision.

It is noted that in the present invention, when first pedestal 15 and second pedestal 25 are Separated base, First pedestal 15 and second pedestal 25 can be formed individually, and respectively by COB technique (Chop On Board) It is mounted on the first circuit board 13 and the second circuit board 23 (referring to attached drawing 3).Alternatively, when the array camera module has When having Contiuum type pedestal, by first pedestal 15 and second pedestal 25 be formed by the Contiuum type pedestal can individually at Type, and the first circuit board 13 and the second circuit board 23 are mounted on by COB technique (Chop On Board) respectively (or corresponding position of integrated circuit plate), referring to attached drawing 7 and attached drawing 11.

Certainly, in other embodiment of the present invention, first pedestal 15 and second pedestal 25 can pass through other Mode is installed on the corresponding position of the first circuit board 13 and the second circuit board.For example, as shown in figure 8, in the present invention The preferred embodiment the variant embodiment in, first pedestal 15 and second pedestal 25 can be by molding or being molded Technique is formed in the corresponding position of the first circuit board 13 and the second circuit board 23.Particularly, when first pedestal 15 and second pedestal be Contiuum type pedestal when, which can pass through MOB (Molding On board), MOC The techniques such as (Molding On Chip) or MOG (Molding On Glass) form the pedestal (15 He of the first pedestal Second pedestal 25).Here, it is different from traditional COB mounting means, is formed by the Contiuum type by integral forming process Pedestal may make first camera module and second camera module to have more compact construction, and smaller.

In order to further assure that the relative mounting location of first camera module 10 and second camera module 20 Meet certain relationship, such as the two optical axis is parallel or is spaced preset distance, and reinforces 10 He of the first camera module The structural strength of second camera module 20, the array camera module further include a bracket 60, and the bracket 60 is by one It is fixed on the peripheral part of first camera module 10 and second camera module 20 in conjunction with glue-line, is taken the photograph for positioning described first As mould group 10 and second camera module 20.Here, it will be appreciated that, by the bracket 60, first camera module 10 and second camera module 20 substantially still have integral structure, in other words, in the present invention, when the array image Configured with integrated circuit plate, Contiuum type pedestal or when bracket three is any altogether, the array camera module is just integrated mould group Formula array camera module.

More specifically, as shown in figure 3, in this embodiment of the invention, the bracket 60 is supplied with an accommodating chamber 61 Accommodate first camera module 10 and second camera module 20 in the inner.Further, as shown in figure 3, the bracket 60 have one first opening 601 and one second opening 602, it is described first opening 601 and it is described second opening 602 be respectively communicated in The accommodating chamber 61, first opening 601 correspond to first camera module 10 with exposure first camera module 10, Second opening 602 corresponds to second camera module 20 with exposure second camera module 20.

As previously mentioned, in the present invention, the array camera module can carry out depth information using range of triangle algorithm etc. Measurement.Corresponding to the feature of range of triangle algorithm, should be set between first camera module 10 and second camera module 20 There is default spacing, and the depth information acquisition precision of the default more big array camera module of spacing is higher.In other words, at this In the preferred embodiment of invention, naturally there is gap between first camera module 10 and second camera module 20. Particularly, in the preferred embodiment of the invention, the bracket 60 also has third opening 603, wherein the third is opened Mouth 603 is located between first opening 601 and second opening 602, that is, the third is open 603 positioned at described first Between camera module 10 and second camera module 20.

Here, third opening 603 is connected to the accommodating chamber 61, with by third opening 603 described the It defines to form a reserved space 62 between one camera module 10 and second camera module 20, to make full use of described first to take the photograph As the void space between mould group 10 and second camera module 20.For example, the reserved space 62 can be used for installing institute State light compensating apparatus 50.It is described pre- to leave a blank alternatively, when the array camera module is assembled in electronic equipment (such as smart phone) Between 62 other electronic components (for example, microphone etc.) that can be used for installing the electronic equipment, maximumlly to save the electronics The assembling space of equipment.

It is as shown in figure 11 a variant embodiment of the bracket 60.As shown in figure 11, described in the variant embodiment First opening 601, second opening 602 and third opening 603 integrally extend, and open with form the bracket 60 one Mouth 600.Here, the bracket 60 has " mouth " shape structure, to form the accommodating chamber 61 in its peripheral wall and the opening 600, wherein the opening 600 is connected to the accommodating chamber 61, with exposure first camera module 10 and second camera shooting Mould group 20 simultaneously forms the reserved space 62 between first camera module 10 and second camera module 20.

It is as shown in figure 12 another variant embodiment of the bracket 60 provided by the present invention, wherein in the deformation implementation In example, the bracket 60 has an accommodating chamber 61 for accommodating first camera module 10 and second camera module 20 in it It is interior.Further, the bracket 60 has one first opening 601 and one second opening 602, first opening 601 and described Second opening 602 is respectively communicated in the accommodating chamber 61, and first opening 601 corresponds to first camera module 10 with sudden and violent Reveal first camera module 10, second opening 602 is corresponded to second camera module 20 and taken the photograph with exposure described second As mould group 20.Particularly, the bracket 60 also has a recessed portion 605, and the recessed portion 605 is located at first camera module Extend down between 10 and second camera module 20 and integrally from the top surface of the bracket 60, to be taken the photograph described first As forming a reserved space 62 between mould group 10 and second camera module 20.Analogously, the reserved space 62 can quilt For installing the light compensating apparatus 50.Alternatively, when the array camera module is assembled in electronic equipment (such as smart phone), The reserved space 62 can be used for installing other electronic components (for example, microphone etc.) of the electronic equipment, with maximumlly Save the assembling space of the electronic equipment.

Further, in the preferred embodiment of invention, first camera module 10 further includes that one first camera lens is held Element 16 is carried, wherein first optical lens 12 is installed on the first camera lens load-carrying unit 16, the first camera lens carrying Element 16 is installed on first pedestal 15, in this way, keeps first optical lens 12 in first sense The photosensitive path of optical chip 11.Second camera module 20 further includes one second camera lens load-carrying unit 26, wherein described second Optical lens 22 is installed on the second camera lens load-carrying unit 26, and the second camera lens load-carrying unit 26 is installed on second base Seat 25 keeps second optical lens 22 in the photosensitive path of second sensitive chip 21 in this way.

It is noted that in the present invention, the camera lens load-carrying unit 16,26 can be implemented as a support lens barrel 161, 261 so that corresponding camera module is implemented as a fixed-focus camera module or the camera lens load-carrying unit 16,26 can quilt A driving element 162,262 is embodied as so that corresponding camera module is implemented as a dynamic burnt camera module., it will be appreciated that In the present invention, the type and group of first camera module 10 of the array camera module and second camera module 20 Closing can be any form, if Figure 13 is to as shown in figure 14, in this regard, not limited to be of the invention.

, it will be appreciated that in the present invention, the introduction about the construction of the array camera module is only for example, in order to this field Technical staff can more fully understand the technical characteristic of the array camera module provided by the present invention, in this regard, this The technical staff in field it would be appreciated that.

Further, as shown in Figure 15 and Figure 22, an array camera module of one second preferred embodiment according to the present invention It is elucidated with, wherein the array camera module that second preferred embodiment is illustrated is first preferred embodiment One improves implementation.

As shown in Figure 15 and Figure 16, in the preferred embodiment of the invention, the array camera module further includes one Three camera modules 30, the third camera module 30 is a RGB camera module, to acquire the quilt by the RGB camera module Survey the RGB image information of target.As previously mentioned, in the present invention, the first camera module 10A of the array camera module It is infrared photography mould group with the second camera module 20A.Those skilled in the art will be appreciated that, by infrared photography mould group institute Acquiring the measured target image information is gray level image information, therefore, by the first IR image information and the 2nd IR image The deep image information of the extracted measured target of information is gray scale deep image information, and image quality is not high.Also, nothing By being gray level image information or gray scale deep image information, visual effect is all difficult to meet the normal vision demand of human eye. Therefore, in the preferred embodiment of the invention, by additionally configuring the RGB camera module (the third camera module 30) And the third camera module 30 RGB image information collected and the further are merged by described image processor 40A One camera module 10 and the depth information collected of second camera module 20 pass through this to obtain a RGB-D image information The mode of sample improves the image quality of the array camera module.

Particularly, it synthesizes to be conducive to subsequent image to obtain the RGB-D image information, it is preferable that be somebody's turn to do in of the invention In preferred embodiment, the third camera module 30 is neighboringly set to the first camera module 10A or described second and images Mould group 20A, so that the field angle of third camera module 30 and the array camera module deep image information collected Field angle is consistent.As previously mentioned, described first takes the photograph in order to improve the acquisition precision of the depth information of the array camera module Spacing is preset as mould group 10A and the second camera module 20A has, and in order to be conducive to image co-registration, the third images mould Group 30 but needs neighboringly to be arranged with second camera module of the first camera module 10A or described 20A.In this way, foring described Special arrangement mode between each camera module of array camera module.Analogously, in the preferred embodiment of the invention, The array camera module can appoint matching for one or several combinations by the three of total bracket, integrated circuit plate or Contiuum type pedestal Mode is set, so that the array camera module has integral structure.For example, the array images mould as shown in Figure 16 to 19 Group is configured with integrated circuit plate, that is, the first circuit board 13A of the first camera module 10A, the second camera shooting mould The second circuit board 23A of group 20A and a tertiary circuit plate 33 of the third camera module 30 integrally extend.Namely It says, the first camera module 10A, the second camera module 20A and 30 common board of third camera module.This In, the first circuit board 13A, the second circuit board 23A and the tertiary circuit plate 33 have integral structure, to define A positioning installation base surface is formed, for installing and calibrating the first camera module 10A, the second camera module 20A and described Third camera module 30.

Alternatively, in the present invention, the first camera module 10A, the second camera module 20A and third camera shooting Combination (either integral type or split type) between mould group 30 can be configured such that described by other means Array camera module has integral structure.For example, the first pedestal 15A of the first camera module 10A, described second The second pedestal 25A of camera module 20A and 35 company of can be configured to of third pedestal of the third camera module 30 Body type base, i.e., described the second of the first pedestal 15A of the described first camera module 10A, the second camera module 20A One extends the third pedestal 35 of pedestal 25A and the third camera module 30 between each other, so that the array is taken the photograph As mould group has integral structure.

Further, in order to ensure the first camera module 10A, the second camera module 20A and the third are taken the photograph As the relative mounting location of mould group 30 meets certain relationship, for example, both optical axis is parallel or the preset distance in interval, Yi Jijia The structural strength of the strong first camera module 10A, the second camera module 20A and the third camera module 30, it is described Array camera module further includes that bracket a 60A, the bracket 60A is fixed on first camera module in conjunction with glue-line by one The peripheral part of 10A, the second camera module 20A and the third camera module 30, for positioning and reinforcing first camera shooting Mould group 10A, the second camera module 20A and the third camera module 30.

Such as Figure 20, in the preferred embodiment of the invention, the bracket 60A has an accommodating chamber 61A for described in receiving First camera module 10A, the second camera module 20A and the third camera module 30 are in the inner.Further, the branch There is frame 60A one first opening 601A, one second opening 602A and a third to be open 603A, the first opening 601A, described Second opening 602A and third opening 603A is respectively communicated with to be corresponded in the accommodating chamber 61A, the first opening 601A The first camera module 10A corresponds to described second with exposure the first camera module 10A, the second opening 602A Camera module 20A corresponds to the third camera module with exposure the second camera module 20A and third opening 603A 30 with the exposure third camera module 30.

As previously mentioned, in the present invention, the array camera module can carry out depth information using range of triangle algorithm etc. Measurement.Corresponding to the feature of range of triangle algorithm, answered between the first camera module 10A and the second camera module 20A Equipped with default spacing, and the depth information acquisition precision of the default more big array camera module of spacing is higher.In other words, exist In the preferred embodiment of the invention, naturally there is sky between the first camera module 10A and the second camera module 20A Gap.Particularly, in the preferred embodiment of the invention, the bracket 60A also has one the 4th opening 604A, wherein described the Four opening 604A are located between the first opening 601A and the second opening 602A, that is, the 4th opening 604A is located at Between the first camera module 10A and the second camera module 20A.

Here, the 4th opening 604A is connected to the accommodating chamber 61, to be open 604A described by the described 4th It defines to form a reserved space 62A between first camera module 10A and the second camera module 20A, it is described to make full use of Void space between first camera module 10A and the second camera module 20A.For example, the reserved space 62A can by with In the installation light compensating apparatus 50.Alternatively, when the array camera module is assembled in electronic equipment (such as smart phone), institute Stating reserved space 62 can be used for installing other electronic components (for example, microphone etc.) of the electronic equipment, maximumlly to save Save the assembling space of the electronic equipment.

It is as shown in figure 21 a variant embodiment of the bracket 60A provided by the present invention, wherein in the deformation implementation In, the first opening 601A, the second opening 602A, third opening 603A and the 4th opening 604A are integrated Ground extends, to form an opening 600A of the bracket 60A.Here, the bracket 60A has " mouth " shape structure, to be formed Accommodating chamber 61A is stated in its peripheral wall and the opening 600A, wherein the opening 600A is connected to the accommodating chamber 61A, with sudden and violent Reveal the first camera module 10A, the second camera module 20A and the third camera module 30 and is taken the photograph described first As forming the reserved space 62A between mould group 10A and the second camera module 20A.

It is as shown in figure 22 another variant embodiment of the bracket 60A provided by the present invention, wherein in deformation reality It applies in example, the bracket 60A has an accommodating chamber 61A for accommodating the first camera module 10A, second camera module 20A and the third camera module 30 are in the inner.The bracket 60A has one first opening 601A, one second opening 602A It is respectively communicated with third opening 603A, the first opening 601A, the second opening 602A and third opening 603A Correspond to the first camera module 10A in the accommodating chamber 61A, the first opening 601A with exposure the first camera shooting mould Group 10A, the second opening 602A correspond to the second camera module 20A with exposure the second camera module 20A and institute It states third opening 603A and corresponds to the third camera module 30 with the exposure third camera module 30.Further, described Bracket 60A also there is recessed portion a 605A, the recessed portion 605A to be located at the first camera module 10A and described second take the photograph As extending down between mould group 20A and integrally from the top surface of the bracket 60A, in the first camera module 10A and A reserved space 62A is formed between the second camera module 20A.Analogously, the reserved space 62A can be used for installing The light compensating apparatus 50.Alternatively, when the array camera module is assembled in electronic equipment (such as smart phone), it is described reserved Space 62A can be used for installing other electronic components (for example, microphone etc.) of the electronic equipment, maximumlly to save the electricity The assembling space of sub- equipment.

As previously mentioned, in order to be conducive to image co-registration, the third camera module 30 is but needed and the first camera module 10A Or the second camera module 20A is neighboringly arranged.Further, for the ease of calibrating and installing, the third camera module 30 and the first camera module 10A or third camera shooting and the second camera module 20A can first pre-assembled formation one Formula modular construction.For ease of description, first camera module is set to neighboringly with the third camera module 30 10A, and forming integral structure with the first camera module 10A is citing, to illustrate the third camera module 30 and institute State the integral type configuration between the first second camera module of camera module 10A or described 20A.

Analogously, the first camera module 10A and the third camera module 30 can pass through cocircuit plate, cobasis seat Or appoint the mode of one or several combinations for the three of the mode of bracket, so that the first camera module 10A and the third Camera module 30 has integral structure.

More specifically, common-battery is used with reference to attached drawing 16, the first camera module 10A and the third camera module 30 The mode of road plate has integral structure, that is, the first circuit board 13A of the first camera module 10A integrally extends In the tertiary circuit plate 33 of second camera module 30, so that the first circuit board 13A and the tertiary circuit Plate 33 has integral structure.Here, when the first circuit board 13A and the tertiary circuit plate 33 have integral structure When, the two defines to form a positioning installation base surface, images mould for installing and calibrating the first camera module 10A and the third Group 30.

With reference to attached drawing 17, the side of the first camera module 10A and the total conjoined base of the third camera module 30 use Formula has integral structure.That is, the first pedestal 15A of the first camera module 10A integrally extends the third The third pedestal 35 of camera module 30.Here, since the first camera module 10A and the third camera module 30 are total With a Contiuum type pedestal, so as to be formed by Contiuum type pedestal pair by the first pedestal 15A and the third pedestal 35 The first camera module 10A and the third camera module 30 positioned, Installation And Calibration.Particularly, of the invention In some embodiments, the array camera module can configure integrated circuit plate and Contiuum type pedestal simultaneously, that is, of the invention In some embodiments, the first circuit board 13A of the first camera module 10A and the third camera module 30 it is described Second circuit board 33 has integral structure, the first pedestal 15A of the second camera module 10A and third camera shooting The third pedestal 35 of mould group 30 has integral structure.Here, integrated circuit plate and Contiuum type pedestal complement each other with Further optimize the installation cooperation precision of the first camera module 10A and third camera module.

Alternatively, the first camera module 10A and the third camera module 30 are using altogether with reference to attached drawing 18 and attached drawing 19 The mode of bracket has integral structure.For example, as shown in figure 18, in the variant embodiment of the preferred embodiment of the invention In, the array camera module further includes an inner support 70, wherein the inner support 70 by one be fixed in conjunction with glue-line described in Second camera module 20A and the third camera module 30 or the first camera module 10A and three camera module it is outer Circumference, for positioning and encapsulating the first camera module 10A and the third camera module 30 or second camera module 20A and the third camera module 30, so that the third camera module 30 and the first camera module 10A or described Three camera shootings and the second camera module 20A form unitary module structure.Correspondingly, as shown in Figure 22 to 23B, when described When first camera module 10A and the third camera module 30 have integral structure, during subsequent Installation And Calibration, It is whole common with the second camera module 20A that the third camera module 30 and the first camera module 10A can be used as one It is installed on the inside of the bracket 60A, and further positions the first camera module 10A, described by the bracket 60A Second camera module 20A and the third camera module 30.Alternatively, the third camera module 30 and second camera module 20A is integral the inside for being installed on the bracket 60A jointly with the third camera module 30, and by the bracket 60A further positions the first camera module 10A, the second camera module 20A and the third camera module 30.It answers Understand, in this way, effectively the Installation And Calibration of the array camera module can be layered and carried out, to reduce The difficulty of assembling and calibration.

More specifically, such as Figure 23 A and Figure 23 B, during Installation And Calibration, the third camera module 30 and institute Stating the first second camera module of camera module 10A or described 20A, first pre-assembled formation unitary module structure (passes through cocircuit Plate, the mode for appointing one or several to combine for bracket or cobasis seat three).Further, unitary module knot will formed The third camera module 30 of structure and second camera module of the first camera module 10A or described 20A, in remaining described Second first camera module of camera module 20A or described is installed on the inside of the bracket 60A jointly, and by the bracket 60A further positions the first camera module 10A, the second camera module 20A and the third camera module 30. It is carried out in this way, the Installation And Calibration of the array camera module is layered, to reduce the difficulty of assembling and calibration, that is to say, that In this way, a camera module and one dexterously dexterously can be converted by the calibration between three camera modules Calibration between camera module module, to reduce the difficulty of calibration.

It is noted that the first camera module 10A, described second takes the photograph in the preferred embodiment of the invention As mould group 20A and the third camera module 30 can be set and arrange in a manner of in column.At this point, from the point of view of visual effect, institute The first camera module 10A, the second camera module 20A and the third camera module 30 is stated to arrange in " one " shape.Alternatively, In other embodiment of the present invention, the third camera module 30 and the first camera module 10A are at being longitudinally arranged, and described Two camera module 20A and the first camera module 10A are in lateral arrangement.At this point, from the point of view of visual effect, first camera shooting Mould group 10A, the second camera module 20A and the third camera module 30 are arranged in " L " shape, as shown in Figure 24.In this regard, Do not limited to by the present invention.

Further, as shown in figure 25, the present invention also provides a depth information acquisition methods comprising step:

S1 obtains one the oneth IR image information of a measured target by one first camera module 10,10A, wherein described First camera module 10,10A is an infrared photography mould group；

S2 obtains one the 2nd IR image information of the measured target by one second camera module 20,20A, wherein described Second camera module 20,20A is an infrared photography mould group；With

Correspondingly, it in step S1 and step S2, further comprises the steps of:

S10 projects an infrared light to the measured target surface by a light compensating apparatus 50,50A.

In addition, the depth information acquisition method further comprises the steps of: in second preferred embodiment of the invention

S4 obtains a RGB image information of the measured target by a third camera module 30, wherein the third images Mould group 30 is a RGB camera module；With

Further, as shown in Figure 26 to 28, the present invention also provides an electronic equipments 80 comprising:

One electronic equipment ontology 81；With

An array camera module 1, wherein the array camera module is assembled in the electronic equipment ontology, for acquisition one The depth information of measured target.Particularly, in the present invention, the electronic equipment ontology 81 has a front side 811 and a back side 812, the array camera module 1 can be assembled in the front side 811 of the electronic equipment ontology 81, to be configured to the electricity The preposition camera module of sub- equipment 80.Certainly, in other embodiment of the invention, the array camera module 1 can be by group The back side 812 loaded on the electronic equipment ontology 81, to be configured to the postposition camera module of the electronic equipment 80.

Particularly, in the present invention, as shown in Figure 26 to 29, the array camera module 1 has the reserved space 62, 62A, the reserved space are formed in first camera module 10,10A and second camera module 20, between 20A, thus When the array camera module 1 is assembled in the electronic equipment ontology 81 when (such as smart phone), the reserved space 62, 62A can be used for installing other electronic components (for example, microphone etc.) of the electronic equipment 80, described maximumlly to save The assembling space of electronic equipment.

It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims

1. an array camera module, for acquiring the depth information of a measured target characterized by comprising

One first camera module；

One second camera module；And

One third camera module, wherein first camera module and second camera module are respectively an infrared photography mould Group, wherein first camera module and second camera module are arranged at intervals, for acquiring the measured target respectively One the oneth IR image information and one the 2nd IR image information, wherein the third camera module is a RGB camera module, wherein Third camera module is neighboringly set to first camera module, for acquiring a RGB image information of the measured target, In, the first IR image information, the 2nd IR image information and the RGB image information are transferred to an image processor, with by The depth letter that first IR image information and the 2nd IR image information are handled by the image processor to obtain the measured target Breath, and merge the RGB image information of the measured target and the depth information of the measured target and schemed with the RGB-D for obtaining measured target As information.

2. array camera module as described in claim 1, wherein the third camera module and first camera module tool There is integral structure.

3. array camera module as claimed in claim 2, wherein the third camera module includes a tertiary circuit plate, institute Stating the first camera module includes a first circuit board, wherein the tertiary circuit plate integrally extends the first circuit board.

4. array camera module as claimed in claim 2, wherein the third camera module includes a third pedestal, described First camera module includes one first pedestal, wherein the third pedestal integrally extends first pedestal.

5. array camera module as claimed in claim 4, wherein first pedestal and the third pedestal pass through molding work Skill is shaped in the first circuit board and the tertiary circuit plate.

6. array camera module as claimed in claim 2, wherein the array camera module further includes an inner support, described Inner support in conjunction with first camera module and the third camera module periphery wall so that first camera module and The third camera module has unitary module structure.

7. the array camera module as described in claim 2 to 6 is any, wherein the array camera module further includes a bracket, The bracket has an accommodating chamber for accommodating first camera module, second camera module and the third camera module In the inner, wherein the bracket has one first opening, one second opening and third opening, first opening, described the Two openings and third opening are respectively communicated in the accommodating chamber, wherein first opening corresponds to first camera shooting Mould group is corresponded to second camera module and is taken the photograph with exposure described second with exposure first camera module, second opening As mould group, the third opening corresponds to the third camera module with the exposure third camera module, wherein the bracket Also there is one the 4th opening, wherein the 4th opening is located between first opening and second opening, by institute It states the 4th and is opened between first camera module and second camera module and define to form a reserved space.

8. array camera module as claimed in claim 7, wherein first opening, second opening, the third are opened Mouthful and the 4th opening integrally extends to form an opening, wherein the opening exposes first camera module, described Second camera module and the third camera module, and defined between first camera module and second camera module Form the reserved space.

9. the array camera module as described in claim 2 to 6 is any, wherein the array camera module further includes a bracket, The bracket has an accommodating chamber for accommodating first camera module, second camera module and the third camera module In the inner, wherein the bracket has one first opening, one second opening and third opening, first opening, described the Two openings and third opening are respectively communicated in the accommodating chamber, first opening correspond to first camera module with Exposure first camera module, second opening correspond to second camera module with exposure the second camera shooting mould Group, the third opening correspond to the third camera module with the exposure third camera module, wherein the bracket also has There is a recessed portion, the depressed area between first camera module and second camera module and is hollowly formed in The top surface of the bracket, to be defined between first camera module and second camera module by the recessed portion Form a reserved space.

10. the array camera module as described in claim 2 to 6 is any, wherein first camera module and the third are taken the photograph As mould group is longitudinally arranged, second camera module and first camera module are laterally arranged, so that described first Camera module, second camera module and the third camera module are arranged in " L " shape.

11. the array camera module as described in claim 2 to 9 is any, wherein the array camera module further includes a light filling Device, the light compensating apparatus are arranged for infrared light of the projection one with specific wavelength to the measured target.

12. array camera module as claimed in claim 11, wherein the light compensating apparatus, which is installed on, to be formed in described first and take the photograph As the reserved space between mould group and second camera module.

13. an electronic equipment characterized by comprising

Array camera module as described in claim 1 to 12 is any；With

One electronic equipment ontology, the array camera module are assembled in the electronic equipment ontology, for acquiring the depth of measured target Spend information.

14. an array camera module assemble method, which is characterized in that comprising steps of

Neighboringly arrange a third camera module in one first camera module, wherein first camera module is infrared photography Mould group, the third camera module is RGB camera module, also, first camera module and the third camera module have There is integral structure；

Arrange one second camera module in first camera module with a fixed spacing, wherein second camera module is red Outer camera module；And

Pass through a bracket second camera module joined integrally and the third camera module and the first camera module institute The unitary module of composition.

15. array camera module assemble method as claimed in claim 14, wherein the third camera module includes a third Circuit board, first camera module include a first circuit board, wherein the tertiary circuit plate integrally extends described first Circuit board.

16. array camera module as claimed in claim 14, wherein the third camera module includes a third pedestal, institute Stating the first camera module includes one first pedestal, wherein the third pedestal integrally extends first pedestal.

17. array camera module as claimed in claim 14, wherein the array camera module further includes an inner support, institute Inner support is stated in conjunction with the periphery wall of first camera module and the third camera module, so that first camera module There is unitary module structure with the third camera module.