CN110093116A - A kind of chip package low stress conductive silver glue and preparation method thereof - Google Patents
A kind of chip package low stress conductive silver glue and preparation method thereof Download PDFInfo
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- CN110093116A CN110093116A CN201810096575.6A CN201810096575A CN110093116A CN 110093116 A CN110093116 A CN 110093116A CN 201810096575 A CN201810096575 A CN 201810096575A CN 110093116 A CN110093116 A CN 110093116A
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- epoxy resin
- conductive silver
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of chip package low stress conductive silver glues and preparation method thereof, the conductive silver glue comprises the following components in parts by weight: by 50 parts by weight of epoxy resin, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, 0.1~5 parts by weight of coupling agent, it is placed in planetary stirring machine after dispersing 1.5 minutes, silver powder is added, after continuing to be placed in and being stirred 2 minutes under 750 revs/min of revolving speeds in planetary stirring machine, under 1300 revs/min of revolving speed vacuum defoamation 1 minute to get conductive silver glue product.Compared with prior art, the advantages that present invention has moderate toughness, can offset stress cracking caused by thermal force and mechanical load during chip package, guarantee the property stable and reliable for performance of final products.
Description
Technical field
The present invention relates to conductive silver glues, and in particular to a kind of chip package low stress conductive silver glue and preparation method thereof.
Background technique
Chip package low stress conductive be mainly chip and silicon wafer substrate bonding get up, imparting bonding plane centainly
Adhesive strength, while there is good electric conductivity between two bonded objects, in subsequent process such as Reflow Soldering, do not crack,
Adhesive strength, electric conductivity is able to maintain does not reduce.Solidfied material hardness is higher after general conduction adhesive curing, in Reflow Soldering, because
The quick variation of temperature is easy to crack inside bonding interface and conducting resinl, to influence adhesive strength and electric conductivity.It is low
Stress conducting resinl hardness is medium, can provide preferable adhesive strength, and there is certain toughness can disappear in Reflow Soldering
Stress cracking caused by removing due to high temperature variation, to guarantee the reliable bonding of chip.
In patent of invention CN1831073, it is noted that a kind of formula of low stress conductive uses in addition to epoxy resin
To another important resin --- one or more functionality acrylic acid series copolymers or terpolymer, with hydroxyl, carboxylic
Acid, isocyanates or epoxy functionalities, there is the Tg being located between about 30 DEG C to about -40 DEG C ranges, and molecular weight is about
200000 to about 900000.But the acrylic acid series copolymer or terpolymer is at high cost and obtained conducting resinl is tough
Property it is low, although counteracting stress cracking caused by thermal force and mechanical load during chip package to a certain extent, effect
Fruit is not significant.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of moderate toughness, can
To offset stress cracking caused by thermal force and mechanical load during chip package, guarantee the stable and reliable for performance of final products
Chip package low stress conductive silver glue and preparation method thereof of property.
The purpose of the present invention can be achieved through the following technical solutions: a kind of chip package low stress conductive silver glue,
It is characterized in that, the conductive silver glue comprises the following components in parts by weight: 50 parts by weight of epoxy resin, flexibility additive 50-80 weight
Measure part, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, 0.1~5 parts by weight of coupling agent, silver powder 200~400
Parts by weight.
The epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin or its one or two kinds of mixing
Object.
The flexible additive is a kind of flexible-epoxy, which includes polyglycols diglycidyl ether, castor-oil plant
One of oily triglycidyl ether, modifying epoxy resin by organosilicon, polyurethane modified epoxy resin, viscosity 5000-
20000mPa.s, epoxide equivalent 300-1200.
The curing agent is latent curing agent, including dicyandiamide, imidazoles and modified imidazole, modified urea based epoxy resin
One of curing agent is a variety of.
The curing accelerator is one in DMP-30, triethanolamine, 2-ethyl-4-methylimidazole and imidazole adducts
Kind is several.
The coupling agent is KH-550, KH560 or KH570.
The silver powder is the mixing of one or more of flake silver powder, spherical silver powder, nano-silver powder.
The silver powder is mixing of mixing with nano-silver powder 1:0.5-1:0-0.15 in mass ratio of flake silver powder, spherical silver powder
Close object.
A kind of preparation method of chip package low stress conductive silver glue, which is characterized in that method includes the following steps:
By 50 parts by weight of epoxy resin, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 weight of curing accelerator
Part, 0.1~5 parts by weight of coupling agent are measured, is placed in planetary stirring machine after dispersing 1.5 minutes, silver powder is added, continues to be placed in planet
After being stirred 2 minutes under 750 revs/min of revolving speeds in formula blender, vacuum defoamation 1 minute under 1300 revs/min of revolving speed,
Up to conductive silver glue product.
Compared with prior art, the invention has the following advantages that conductive silver glue of the present invention has moderate toughness, can support
Disappear stress cracking caused by thermal force and mechanical load during chip package, guarantees the property stable and reliable for performance of final products.
Polyglycols diglycidyl ether that the present invention selects, castor oil triglycidyl ether, modifying epoxy resin by organosilicon, polyurethane change
Property one of epoxy resin there is the viscosity for the resin that can debase the standard as flexible additive, and assign system outstanding soft
Toughness, extensibility and erosion-resisting characteristics have good chemistry and corrosion resistance and outstanding hot property, when with epoxy resin,
And the ingredient in the inventive formulations such as silver powder is reacted, and can provide high extension at -20 DEG C, thus
Allow to offset stress cracking caused by thermal force and mechanical load during chip package.
Specific embodiment
It elaborates below to the embodiment of the present invention, the present embodiment carries out under the premise of the technical scheme of the present invention
Implement, the detailed implementation method and specific operation process are given, but protection scope of the present invention is not limited to following implementation
Example.
Embodiment 1
Bisphenol A type epoxy resin 50g, polyglycols diglycidyl ether 55g, dicyandiamide 6g, 2- ethyl -4- first are weighed respectively
Base imidazoles 0.8g, Silane coupling agent KH550 0.3g are subsequently placed in planetary stirring machine and disperse 1.5 minutes, be added after taking-up
Flake silver powder 135g, spherical silver powder 135g, nano-silver powder 20g are placed into planetary stirring machine and are dispersed 2 minutes in 750RPM,
1 minute is handled in 1300RPM vacuum defoamation to get conducting resinl 1.
Embodiment 2
Bisphenol A type epoxy resin 30g, bisphenol f type epoxy resin 20g, modifying epoxy resin by organosilicon 65g are weighed respectively,
Dicyandiamide 6g, triethanolamine 1g, Silane coupling agent KH550 0.3g are subsequently placed in planetary stirring machine and disperse 1.5 minutes, take
Flake silver powder 180g, spherical silver powder 100g, nano-silver powder 20g are added after out, places into planetary stirring machine at 750RPM points
It dissipates 2 minutes, handles 1 minute in 1300RPM vacuum defoamation to get conducting resinl 2.
Embodiment 3
Bisphenol A type epoxy resin 20g, bisphenol f type epoxy resin 30g, polyurethane modified epoxy resin 55g are weighed respectively,
Dicyandiamide 7g, 2-ethyl-4-methylimidazole 1g, silane coupling agent KH560 0.3g, are subsequently placed in planetary stirring machine and disperse
1.5 minutes, flake silver powder 200g, spherical silver powder 50g are added after taking-up, places into planetary stirring machine and disperses 2 in 750RPM
Minute, 1 minute is handled in 1300RPM vacuum defoamation to get conducting resinl 3.
Embodiment 4
A kind of preparation method of chip package low stress conductive silver glue, method includes the following steps: by epoxy resin
50 parts by weight, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, coupling
0.1~5 parts by weight of agent are placed in planetary stirring machine after dispersing 1.5 minutes, and silver powder is added, continues to be placed in planetary stirring machine
In stirred 2 minutes under 750 revs/min of revolving speeds after, under 1300 revs/min of revolving speed vacuum defoamation 1 minute to get conduction
Elargol product.
Wherein, epoxy resin is bisphenol A type epoxy resin.Flexible additive polyglycols diglycidyl ether, viscosity are
5000-20000mPa.s epoxide equivalent 300-1200.Curing agent is dicyandiamide.Curing accelerator is DMP-30.The idol
Connection agent is KH-550.The silver powder is flake silver powder, spherical silver powder is mixed with nano-silver powder 1:0.5:0.05 in mass ratio
Mixture.
Embodiment 5
A kind of preparation method of chip package low stress conductive silver glue, method includes the following steps: by epoxy resin
50 parts by weight, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, coupling
0.1~5 parts by weight of agent are placed in planetary stirring machine after dispersing 1.5 minutes, and silver powder is added, continues to be placed in planetary stirring machine
In stirred 2 minutes under 750 revs/min of revolving speeds after, under 1300 revs/min of revolving speed vacuum defoamation 1 minute to get conduction
Elargol product.
Wherein, epoxy resin is bisphenol f type epoxy resin, and flexible additive is castor oil triglycidyl ether, viscosity
For 5000-20000mPa.s, epoxide equivalent 300-1200.The curing agent is imidazoles and modified imidazole.The solidification
Promotor is triethanolamine, and the coupling agent is KH560.The silver powder is flake silver powder, spherical silver powder and nano-silver powder
The mixture of the mixing of 1:1:0.1 in mass ratio.
Embodiment 6
A kind of preparation method of chip package low stress conductive silver glue, method includes the following steps: by epoxy resin
50 parts by weight, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, coupling
0.1~5 parts by weight of agent are placed in planetary stirring machine after dispersing 1.5 minutes, and silver powder is added, continues to be placed in planetary stirring machine
In stirred 2 minutes under 750 revs/min of revolving speeds after, under 1300 revs/min of revolving speed vacuum defoamation 1 minute to get conduction
Elargol product.
Wherein, the epoxy resin is bisphenol f type epoxy resin.The flexible additive is silicon-modified epoxy
Resin, viscosity 5000-20000mPa.s, epoxide equivalent 300-1200.The curing agent is modified ureas asphalt mixtures modified by epoxy resin
Rouge curing agent.The curing accelerator is 2-ethyl-4-methylimidazole.The coupling agent is KH570.The sheet silver
The mixture that powder, spherical silver powder are mixed with nano-silver powder 1:0.6:0.12 in mass ratio.
Embodiment 7
A kind of preparation method of chip package low stress conductive silver glue, method includes the following steps: by epoxy resin
50 parts by weight, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 parts by weight of curing accelerator, coupling
0.1~5 parts by weight of agent are placed in planetary stirring machine after dispersing 1.5 minutes, and silver powder is added, continues to be placed in planetary stirring machine
In stirred 2 minutes under 750 revs/min of revolving speeds after, under 1300 revs/min of revolving speed vacuum defoamation 1 minute to get conduction
Elargol product.
Wherein, epoxy resin is bisphenol A type epoxy resin, and the flexible additive is polyurethane modified epoxy resin,
Its viscosity is 5000-20000mPa.s, epoxide equivalent 300-1200.The curing agent is the solidification of modified urea based epoxy resin
Agent, the curing accelerator are 2-ethyl-4-methylimidazole addition product.The coupling agent is KH-550.The silver powder
For flake silver powder, spherical silver powder and nano-silver powder 1:0.5:0-0.13 in mass ratio.Mixed mixture.
Claims (9)
1. a kind of chip package low stress conductive silver glue, which is characterized in that the conductive silver glue comprises the following components in parts by weight:
50 parts by weight of epoxy resin, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, 0.1~3 weight of curing accelerator
Part, 0.1~5 parts by weight of coupling agent, 200~400 parts by weight of silver powder.
2. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the epoxy resin is
Bisphenol A type epoxy resin, bisphenol f type epoxy resin or its one or two kinds of mixture.
3. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the flexible additive
For a kind of flexible-epoxy, which includes polyglycols diglycidyl ether, castor oil triglycidyl ether, organic-silicon-modified
One of epoxy resin, polyurethane modified epoxy resin, viscosity 5000-20000mPa.s, epoxide equivalent 300-
1200。
4. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the curing agent is latent
Volt property curing agent, including one of dicyandiamide, imidazoles and modified imidazole, modified urea based epoxy resin curing agent or a variety of.
5. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the curing accelerator
For one or more of DMP-30, triethanolamine, 2-ethyl-4-methylimidazole and imidazole adducts.
6. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the coupling agent is
KH-550, KH560 or KH570.
7. chip package according to claim 1 low stress conductive silver glue, which is characterized in that the silver powder is sheet
The mixing of one or more of silver powder, spherical silver powder, nano-silver powder.
8. chip package according to claim 7 low stress conductive silver glue, which is characterized in that the silver powder is sheet
The mixture that silver powder, spherical silver powder are mixed with nano-silver powder 1:0.5-1:0-0.15 in mass ratio.
9. a kind of preparation method of chip package as described in claim 1 low stress conductive silver glue, which is characterized in that the party
Method is the following steps are included: by 50 parts by weight of epoxy resin, flexibility additive 50-80 parts by weight, 4~15 parts by weight of curing agent, consolidate
Change 0.1~3 parts by weight of promotor, 0.1~5 parts by weight of coupling agent, be placed in planetary stirring machine after dispersing 1.5 minutes, is added
Silver powder, after continuing to be placed in and being stirred 2 minutes under 750 revs/min of revolving speeds in planetary stirring machine, then at 1300 revs/min turn
Speed lower vacuum defoamation 1 minute to get conductive silver glue product.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096575.6A CN110093116A (en) | 2018-01-31 | 2018-01-31 | A kind of chip package low stress conductive silver glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096575.6A CN110093116A (en) | 2018-01-31 | 2018-01-31 | A kind of chip package low stress conductive silver glue and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110093116A true CN110093116A (en) | 2019-08-06 |
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| CN201810096575.6A Pending CN110093116A (en) | 2018-01-31 | 2018-01-31 | A kind of chip package low stress conductive silver glue and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
| CN115458330A (en) * | 2022-09-20 | 2022-12-09 | 广州创天电子科技有限公司 | Conductive resin composition, ceramic capacitor and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
| CN102443370A (en) * | 2010-10-15 | 2012-05-09 | 深圳市道尔科技有限公司 | Low-halogen high-conductivity single-ingredient conductive gum |
| US20120228560A1 (en) * | 2009-11-05 | 2012-09-13 | Duk San Tekopia Co., Ltd. | Conductive adhesive, method for manufacturing the same, and electronic device including the same |
-
2018
- 2018-01-31 CN CN201810096575.6A patent/CN110093116A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120228560A1 (en) * | 2009-11-05 | 2012-09-13 | Duk San Tekopia Co., Ltd. | Conductive adhesive, method for manufacturing the same, and electronic device including the same |
| CN102443370A (en) * | 2010-10-15 | 2012-05-09 | 深圳市道尔科技有限公司 | Low-halogen high-conductivity single-ingredient conductive gum |
| CN102086364A (en) * | 2010-12-16 | 2011-06-08 | 广东风华高新科技股份有限公司 | Conductive silver paste for microelectronic packaging and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
| CN115458330A (en) * | 2022-09-20 | 2022-12-09 | 广州创天电子科技有限公司 | Conductive resin composition, ceramic capacitor and preparation method thereof |
| CN115458330B (en) * | 2022-09-20 | 2024-05-28 | 广州创天电子科技有限公司 | Conductive resin composition, ceramic capacitor and preparation method thereof |
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Application publication date: 20190806 |