CN110079809A - A kind of copper face antioxidant - Google Patents
A kind of copper face antioxidant Download PDFInfo
- Publication number
- CN110079809A CN110079809A CN201910296790.5A CN201910296790A CN110079809A CN 110079809 A CN110079809 A CN 110079809A CN 201910296790 A CN201910296790 A CN 201910296790A CN 110079809 A CN110079809 A CN 110079809A
- Authority
- CN
- China
- Prior art keywords
- copper
- antioxidant
- copper face
- face
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention discloses a kind of copper face antioxidant, the raw material including following mass percent: antirust agent 3-7%, diluted alkaline 0.5-1%, water surplus, the antirust agent are benzotriazole or methyl benzotriazazole, and the diluted alkaline is sodium hydroxide or potassium hydroxide.Copper face antioxidant of the present invention is easily soluble in water, as the copper face protection in PCB production process, especially for protecting the copper panel in air.The present invention can handle the article sensitive to ultraviolet light, prevent its discoloration, also have good corrosion mitigating effect to aluminium, cast iron, zinc, nickel etc.；It can be used for the anti-corrosion of watering equipment made of copper, aluminium etc. and the anti-corrosion of central air-conditioning heat exchange copper tube；Plating post-processing, ectonexine etching post-processing, ectonexine, anti-pre-welding treatment and other similar copper surface oxidation-resistant processing.The present invention, which also has the function of capable of cleaning simultaneously copper face and has, prevents copper face from aoxidizing, and corrosivity is smaller, applied widely.
Description
Technical field
The present invention relates to technical field of surface, in particular to a kind of copper face antioxidant.
Background technique
Printed wiring board (PCB, printedcircuitboard), is important electronic component, is the branch of electronic component
Support body is the carrier of electronic component electrical connection.In the production procedure of PCB, there are two critical process electroless copper platings and electricity
Copper facing: electroless copper plating is the deposition that metallic copper is completed on non-conductive substrate, realizes the conducting in hole；The tangible electroless copper plating of electro-coppering
It is upper by electric plating method deposited metal copper, to provide enough electric conductivity thickness and prevent conducting channel from occurring generating heat and machine
Tool defect.
There are a large amount of sour gas in electroless copper plating and plating copper process, and complete the pcb board of electroless copper plating and plating
Son needs to rest on respective process for a period of time, and copper face can be plated the acid gas corrosion in workshop, by the dioxygen oxidation in air.It gives
Subsequent production brings many quality hidden danger.In the prior art, the anti-oxidant technique after copper facing is typically all anti-with copper face at present
Oxidant is handled, and copper face antioxidant antioxidant effect is poor at present, and cleaning copper face effect is poor, big to copper face corrosivity.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of copper face antioxidants, and can clean copper face and have prevents copper face
The function of oxidation, corrosivity are smaller.
In order to solve the above-mentioned technical problem, the technical solution of the present invention is as follows:
A kind of copper face antioxidant, the raw material including following mass percent: antirust agent 3-7%, diluted alkaline 0.5-1%, water
Surplus, the antirust agent are benzotriazole, and the diluted alkaline is sodium hydroxide.
Preferably, the raw material including following mass percent: benzotriazole 4-6%, sodium hydroxide 0.6-0.8%, water
Surplus.
Preferably, the raw material including following mass percent: benzotriazole 5%, sodium hydroxide 0.7%, water surplus.
Preferably, the antirust agent is methyl benzotriazazole, and the diluted alkaline is potassium hydroxide.
A kind of copper face antioxidant of the present invention the preparation method comprises the following steps: antirust agent, diluted alkaline are added to the water, be sufficiently mixed uniformly
Copper face antioxidant can be obtained.
Compared with prior art, the invention has the following beneficial effects: copper face antioxidants of the present invention to be easily soluble in water, uses
Make the copper face protection in PCB production process, especially for protecting the copper panel in air.The present invention can handle to purple
The article of UV light sensitivity, prevents its discoloration, also has good corrosion mitigating effect to aluminium, cast iron, zinc, nickel etc.；Can be used for copper,
The anti-corrosion of watering equipment made of aluminium etc. and the anti-corrosion of central air-conditioning heat exchange copper tube；Plating post-processes, ectonexine etching post-processes,
Ectonexine, anti-pre-welding treatment and other similar copper surface oxidation-resistant processing.The present invention simultaneously also have can clean copper face and have
There is the function of preventing copper face from aoxidizing, corrosivity is smaller, applied widely.
Specific embodiment
It to facilitate the understanding of the present invention, below will be to invention is more fully described.But the present invention can be to be permitted
Mostly different form is realized, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes
It is more thorough and comprehensive to the understanding of the disclosure.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Embodiment 1
A kind of copper face antioxidant, the raw material including following mass percent: benzotriazole 5%, sodium hydroxide
0.7%, water 94.3%.
Above-mentioned copper face antioxidant the preparation method comprises the following steps: according to above-mentioned percentage, benzotriazole, sodium hydroxide are added
In water, it is sufficiently mixed and copper face antioxidant uniformly can be obtained.
Anti-oxidation processing, copper face antioxidant is added to the water be diluted to concentration be 5%, by after etching copper panel immerse
In antioxidant after the dilution of embodiment 1, impregnates 3 minutes, cleaned twice after taking-up with deionized water at room temperature, it then will place
It puts 24 hours observation plate faces in air and does not aoxidize in the copper sheet face managed.
Embodiment 2
A kind of copper face antioxidant, the raw material including following mass percent: benzotriazole 3%, sodium hydroxide
0.5%, water 96.5%.
Above-mentioned copper face antioxidant the preparation method comprises the following steps: according to above-mentioned percentage, benzotriazole, sodium hydroxide are added
In water, it is sufficiently mixed and copper face antioxidant uniformly can be obtained.
Anti-oxidation processing, copper face antioxidant is added to the water be diluted to concentration be 5%, by after etching copper panel immerse
In antioxidant after the dilution of embodiment 2, impregnates 3 minutes, cleaned twice after taking-up with deionized water at room temperature, it then will place
It puts 24 hours observation plate faces in air and does not aoxidize in the copper sheet face managed.
Embodiment 3
A kind of copper face antioxidant, the raw material including following mass percent: benzotriazole 7%, sodium hydroxide 1%,
Water 92%.
Above-mentioned copper face antioxidant the preparation method comprises the following steps: according to above-mentioned percentage, benzotriazole, sodium hydroxide are added
In water, it is sufficiently mixed and copper face antioxidant uniformly can be obtained.
Anti-oxidation processing, copper face antioxidant is added to the water be diluted to concentration be 5%, by after etching copper panel immerse
In antioxidant after the dilution of embodiment 3, impregnates 3 minutes, cleaned twice after taking-up with deionized water at room temperature, it then will place
It puts 24 hours observation plate faces in air and does not aoxidize in the copper sheet face managed.
Embodiment 4
A kind of copper face antioxidant, the raw material including following mass percent: methyl benzotriazazole 4%, potassium hydroxide
0.6%, water 95.4%.
Above-mentioned copper face antioxidant the preparation method comprises the following steps: according to above-mentioned percentage, by methyl benzotriazazole, potassium hydroxide
It is added to the water, is sufficiently mixed and copper face antioxidant uniformly can be obtained.
Anti-oxidation processing, copper face antioxidant is added to the water be diluted to concentration be 5%, by after etching copper panel immerse
In antioxidant after the dilution of embodiment 1, impregnates 3 minutes, cleaned twice after taking-up with deionized water at room temperature, it then will place
It puts 24 hours observation plate faces in air and does not aoxidize in the copper sheet face managed.
Embodiment 5
A kind of copper face antioxidant, the raw material including following mass percent: methyl benzotriazazole 6%, potassium hydroxide
0.8%, water 93.2%.
Above-mentioned copper face antioxidant the preparation method comprises the following steps: according to above-mentioned percentage, by methyl benzotriazazole, potassium hydroxide
It is added to the water, is sufficiently mixed and copper face antioxidant uniformly can be obtained.
Anti-oxidation processing, copper face antioxidant is added to the water be diluted to concentration be 5%, by after etching copper panel immerse
In antioxidant after the dilution of embodiment 1, impregnates 3 minutes, cleaned twice after taking-up with deionized water at room temperature, it then will place
It puts 24 hours observation plate faces in air and does not aoxidize in the copper sheet face managed.
It can be obtained by embodiment 1-5, a kind of copper face antioxidant provided in the embodiment of the present application is prevented with better
Oxidation characteristic, formula chemical component used is less, and preparation method is simple.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the general of this field
For logical technical staff, the invention may be variously modified and varied, all within the spirits and principles of the present invention, made
What modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of copper face antioxidant, it is characterised in that: the raw material including following mass percent: antirust agent 3-7%, diluted alkaline
0.5-1%, water surplus, the antirust agent are benzotriazole, and the diluted alkaline is sodium hydroxide.
2. copper face antioxidant according to claim 1, it is characterised in that: the raw material including following mass percent: benzene
And triazole 4-6%, sodium hydroxide 0.6-0.8%, water surplus.
3. copper face antioxidant according to claim 2, it is characterised in that: the raw material including following mass percent: benzene
And triazole 5%, sodium hydroxide 0.7%, water surplus.
4. copper face antioxidant according to claim 1, it is characterised in that: the antirust agent is methyl benzotriazazole,
The diluted alkaline is potassium hydroxide.
5. a kind of preparation method of copper face antioxidant according to claim 1-4, it is characterised in that: by antirust
Agent, diluted alkaline are added to the water, and are sufficiently mixed and copper face antioxidant uniformly can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910296790.5A CN110079809A (en) | 2019-04-14 | 2019-04-14 | A kind of copper face antioxidant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910296790.5A CN110079809A (en) | 2019-04-14 | 2019-04-14 | A kind of copper face antioxidant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110079809A true CN110079809A (en) | 2019-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910296790.5A Pending CN110079809A (en) | 2019-04-14 | 2019-04-14 | A kind of copper face antioxidant |
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| CN (1) | CN110079809A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836480A (en) * | 2020-07-20 | 2020-10-27 | 昆山大洋电路板有限公司 | Multi-code parallel circuit board hole passivation prevention technology |
| CN113737167A (en) * | 2021-09-22 | 2021-12-03 | 东莞市四辉表面处理科技有限公司 | Copper material antioxidant and preparation method thereof |
| CN115703944A (en) * | 2021-08-09 | 2023-02-17 | 河北工业大学 | Application of composite inhibitor in CMP |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101736338A (en) * | 2009-11-25 | 2010-06-16 | 中南大学 | Composite antioxidant applied to copper powder |
-
2019
- 2019-04-14 CN CN201910296790.5A patent/CN110079809A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101736338A (en) * | 2009-11-25 | 2010-06-16 | 中南大学 | Composite antioxidant applied to copper powder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836480A (en) * | 2020-07-20 | 2020-10-27 | 昆山大洋电路板有限公司 | Multi-code parallel circuit board hole passivation prevention technology |
| CN115703944A (en) * | 2021-08-09 | 2023-02-17 | 河北工业大学 | Application of composite inhibitor in CMP |
| CN113737167A (en) * | 2021-09-22 | 2021-12-03 | 东莞市四辉表面处理科技有限公司 | Copper material antioxidant and preparation method thereof |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190802 |
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| RJ01 | Rejection of invention patent application after publication |