CN110071381B - Cable socket connector assembly for electronic packages - Google Patents

Cable socket connector assembly for electronic packages Download PDF

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Publication number
CN110071381B
CN110071381B CN201811344635.8A CN201811344635A CN110071381B CN 110071381 B CN110071381 B CN 110071381B CN 201811344635 A CN201811344635 A CN 201811344635A CN 110071381 B CN110071381 B CN 110071381B
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CN
China
Prior art keywords
cable
socket
receptacle
assembly
substrate
Prior art date
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Active
Application number
CN201811344635.8A
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Chinese (zh)
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CN110071381A (en
Inventor
J.W.梅森
M.D.赫林
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TE Connectivity Corp
Original Assignee
TE Connectivity Corp
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Filing date
Publication date
Priority claimed from US15/941,575 external-priority patent/US10910748B2/en
Application filed by TE Connectivity Corp filed Critical TE Connectivity Corp
Publication of CN110071381A publication Critical patent/CN110071381A/en
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Publication of CN110071381B publication Critical patent/CN110071381B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps

Abstract

A cable socket connector assembly (102) for an electronic system (100) includes a socket assembly (106) having a socket substrate (116) including a socket substrate conductor (118). The receptacle assembly has receptacle contacts (220) extending between terminating ends (224) that terminate to corresponding receptacle substrate conductors and mating ends (226) that are configured to terminate to corresponding package contacts (156) of an electronic package (104) of the electronic system. The cable socket connector assembly includes a cable assembly (108) terminated to the socket assembly that includes an array of cables (200), each cable having a cable conductor (310) terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define an electrical path (112) between cable conductors of the cable and package conductors of the electronic package.

Description

Cable socket connector assembly for electronic packages
Technical Field
The subject matter herein relates generally to a cable receptacle connector assembly for an electronic package of an electronic system.
Background
The continuing trend toward smaller, lighter, and higher performance electronic components and higher density circuits has led to the development of surface mount technology in the design of printed circuit boards and electronic packages. Surface mountable packages allow an electronic package (e.g., an integrated circuit or computer processor) to be detachably connected with pads on the surface of a circuit board, rather than through contacts or pins soldered in plated through holes through the circuit board. Surface mount technology may allow for increased component density on the circuit board, thereby saving space on the circuit board.
One form of surface mount technology includes a receptacle connector. The receptacle connector may include a substrate with terminals on one side of the substrate and an array of conductive solder elements, such as a Ball Grid Array (BGA) or Land Grid Array (LGA), on the opposite side, that are electrically connected through the substrate by conductive vias through the substrate. The terminals engage contacts on the electronic package and the solder elements are secured to conductive pads on a main circuit board (e.g., motherboard) to electrically bond the electronic package to the main circuit board. Conventional architectures provide a receptacle connector between the electronic package and the main circuit board. The electronic package includes conductors on the bottom of the electronic package through which signals are driven to terminals of the receptacle connector and then through the receptacle connector to the main circuit board. The signals are then transferred to an electrical connector, such as a high speed electrical connector, on the main circuit board. Routing of the electrical circuit between the mounting areas for the receptacle connector and the high speed electrical connector and the mounting area for the high speed electrical connector occupies board space on the main circuit board. In addition, the electrical performance of the electronic system is degraded due to the multiple electrical interfaces between the electronic package and the high-speed connector. Conventional systems are striving to meet the signal and power output from electronic packages because smaller size and greater number of conductors are required while maintaining good electrical performance, and conventional electronic packages have a limited amount of surface area for the conductors along the bottom of the electronic package.
There remains a need for a high-speed receptacle connector assembly having improved electrical performance.
Disclosure of Invention
In accordance with the present invention, a cable receptacle connector assembly for an electronic system is provided that includes a receptacle assembly having a receptacle substrate including a receptacle substrate conductor. The receptacle assembly has receptacle contacts extending between terminating ends that terminate to corresponding receptacle substrate conductors and mating ends that are configured to terminate to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly that includes an array of cables, each cable having a cable conductor terminated to a corresponding socket substrate conductor. The receptacle contacts and the corresponding receptacle substrate conductors define an electrical path between cable conductors of the cable and package conductors of the electronic package.
Drawings
Fig. 1 is a schematic diagram of an electronic system including a contact receptacle connector assembly formed in accordance with an exemplary embodiment.
Fig. 2 is a perspective view of an electronic system showing a contact receptacle connector assembly according to an exemplary embodiment.
Fig. 3 is an exploded view of an electronic system showing a receptacle assembly and a cable assembly of a contact receptacle connector assembly according to an exemplary embodiment.
Fig. 4 is a side view of an electronic system according to an exemplary embodiment.
Fig. 5 is an enlarged view of a portion of an electronic system according to an exemplary embodiment.
Fig. 6 is a perspective view of a receptacle contact of a receptacle assembly according to an exemplary embodiment.
Fig. 7 is an exploded view of a portion of a cable receptacle connector assembly, showing the receptacle assembly.
Fig. 8 is an exploded view of the cable receptacle connector assembly, showing the receptacle assembly and the cable assembly.
Fig. 9 is a top perspective view of a cable jack connector assembly according to an exemplary embodiment.
Fig. 10 is a top view of a cable socket connector assembly according to an exemplary embodiment.
Fig. 11 is a bottom perspective view of a cable jack connector assembly according to an exemplary embodiment.
Fig. 12 is a top view of a cable receptacle connector assembly according to an exemplary embodiment.
Fig. 13 is an enlarged bottom view of a portion of the cable receptacle connector assembly.
Fig. 14 is a side view of a portion of an electronic system showing a cable jack connector assembly ready for mating with an electronic package.
Fig. 15 is a side view of a portion of an electronic system showing a cable receptacle connector assembly mated with an electronic package.
Fig. 16 is an enlarged side view of a portion of the electronic system showing the cable receptacle connector assembly ready for mating with an electronic package.
Fig. 17 is an enlarged side view of a portion of the electronic system showing the cable receptacle connector assembly mated with the electronic package.
Fig. 18 is a side view of a portion of an electronic system according to an example embodiment.
Fig. 19 is a side view of a portion of an electronic system according to an example embodiment.
Detailed Description
Fig. 1 is a schematic diagram of an electronic system 100 formed in accordance with an exemplary embodiment. The electronic system 100 includes a cable receptacle connector assembly 102 that is electrically connected to an electronic package 104, such as an integrated circuit. The cable receptacle connector assembly 102 includes a receptacle assembly 106 configured to be directly electrically connected to the electronic package 104 and a cable assembly 108 directly electrically connected to the receptacle assembly 106. The receptacle assembly 106 electrically connects the cable assembly 108 with the electronic package 104 so as to be routed away from the electronic package 104. In an exemplary embodiment, the socket assembly 106 is coupled to a top of the electronic package 104 and a bottom of the electronic package 104 is coupled to a main circuit board 110, such as a motherboard. The electronic system 100 allows the socket assembly 106 to be connected to the top of the electronic package 104 and the bottom of the electronic package 104 to be connected to the main circuit board 110 to increase performance and design efficiency by increasing the number of connection locations of the electronic package 104. In an exemplary embodiment, components are coupled to multiple sides of the electronic package 104 to increase the density of the electronic system 100 and shorten the electrical path of the electronic system 100. This arrangement may reduce the number of electrical interfaces along the signal path to enhance the electrical performance of the electronic system 100. For example, high-speed data signals may be transmitted directly from the electronic package 104 to the cable assembly 108 through the receptacle assembly 106, rather than being routed first through the main circuit board 110.
In the exemplary embodiment, electrical paths 112 from electronic package 104 to cable assembly 108 pass through receptacle assembly 106 without being routed through main circuit board 110. For example, in the illustrated embodiment, the electrical path 112 is a high-speed electrical path routed through the receptacle assembly 106 to the cable assembly 108, while other electrical paths 114 (e.g., low-speed electrical paths and power electrical paths) are routed between the electronic package 104 and the main circuit board 110 through the interface 120. In the illustrated embodiment, the interface 120 is a Ball Grid Array (BGA) having solder balls 122, the solder balls 122 soldered between main contacts 124 on an upper surface 126 of the main circuit board 110 and lower package contacts 128 on a lower surface of the electronic package 104. However, other types of interfaces may be used in alternative embodiments, such as Land Grid Arrays (LGAs). In various alternative embodiments, a receptacle connector (not shown) may be provided at the interface 120 between the electronic package 104 and the main circuit board 110. Alternatively, the electrical path 114 may comprise a high speed electrical path.
In the exemplary embodiment, socket assembly 106 includes a socket substrate 116 having socket substrate conductors 118, and socket substrate conductors 118 provide an electrical path between electronic package 104 and cable assembly 108. The socket substrate 116 may be a printed circuit board and the socket substrate conductors 118 may be circuits, pads, traces, vias, etc. of the printed circuit board. The cable assembly 108 may be terminated directly to the receptacle substrate conductor 118, such as by soldering to the receptacle substrate conductor 118. Socket substrate conductors 118 may be electrically connected to electronic package 104 using contacts, pins, solder balls, conductive posts, or other intermediate conductive elements. In an exemplary embodiment, the socket substrate 116 includes an interface on the bottom side for direct electrical connection to the electronic package 104, such as an LGA interface, BGA interface, or the like. Thus, the socket substrate 116 electrically connects the cables of the cable assembly 108 to the top of the electronic package 104.
In the electronic system 100, the electronic system 100 includes a heat sink 130 for dissipating heat from one or more components of the electronic system 100, such as from the electronic package 104 and/or the receptacle assembly 106. In the illustrated embodiment, the heat sink 130 is disposed above the socket assembly 106 such that the socket assembly 106 is disposed in the space between the heat sink 130 and the electronic package 104. Optionally, the heat sink 130 may be mounted to the main circuit board 110 and/or a mounting block 132 below the main circuit board 110. For example, fasteners 134 may be used to secure the heat sink 130 to the mounting block 132. Optionally, the mounting block 132 supports the heat sink 130 and/or the main circuit board 110. The electronic package 104 and the receptacle assembly 106 may be sandwiched between a heat sink 130 and the main circuit board 110 and/or mounting block 132.
Optionally, the components may include one or more compressible interfaces therebetween. For example, the receptacle assembly 106 may include a compressible interface that is separable from the top of the electronic package 104. When the heat sink 130 is coupled to the mounting block 132, the receptacle assembly 106 may be spring biased against the electronic package 104. In the exemplary embodiment, cable receptacle connector assembly 102 includes a loading member 136 between heat sink 130 and receptacle assembly 106. The loading member 136 may be spring loaded against the socket assembly 106 to mechanically press and hold the socket assembly 106 against the electronic package 104. In the exemplary embodiment, cable socket connector assembly 102 includes a socket frame 138 that supports components of cable socket connector assembly 102. For example, the receptacle frame 138 may support the receptacle assembly 106. The socket frame 138 may support the electronic package 104. The receptacle frame 138 may support the cable assembly 108. In an exemplary embodiment, the receptacle frame 138 may limit or stop compression at the compressible interface to prevent damage to the various components. The receptacle frame 138 may guide or position the various components relative to one another. The receptacle frame 138 may hold the various components together for mounting to other components.
Fig. 2 is a perspective view of the electronic system 100 according to an exemplary embodiment. Fig. 3 is an exploded view of electronic system 100 according to an exemplary embodiment. Fig. 3 shows the electronic package 104 mounted to a main circuit board 110. Alternatively, the electronic package 104 may be soldered to the main circuit board 110; however, in alternative embodiments, the electronic package 104 may be mechanically and/or electrically coupled to the main circuit board 110 by other means. The cable socket connector assembly 102 is ready to be coupled to an electronic package 104.
In the illustrated embodiment, the heat sink 130 is located above the cable receptacle connector assembly 102 and is configured to mount to a mounting block 132 below the main circuit board 110. In other various embodiments, the electronic system 100 may be provided without the heat sink 130 and/or without the mounting block 132. For example, the cable socket connector assembly 102 may be mounted to and supported by the main circuit board 110 above the electronic package 104, such as using clips, fasteners, or other securing components.
The heat sink 130 includes a base 140 at the bottom of the heat sink 130. The heat sink 130 includes mounting features 142 at the base 140 for securing the heat sink 130 to the mounting block 132. In the illustrated embodiment, the mounting features 142 are flanges or bosses extending from opposite ends of the base 140, with openings to receive the fasteners 134. Other types of mounting features may be used in alternative embodiments. In the exemplary embodiment, heat sink 130 includes a plurality of heat fins 144 that dissipate heat from heat sink 130. The heat fins 144 may be parallel plates. Other types of heat fins, such as posts, may be provided in alternative embodiments.
In an exemplary embodiment, the electronic package 104 is an integrated circuit component, such as an Application Specific Integrated Circuit (ASIC); however, other types of electronic packages may be used in alternative embodiments, such as chips, processors, memory devices, and the like. The electronic package 104 includes a substrate 150 having an upper surface 152 and a lower surface 154. The electronic package 104 includes package contacts 156 defined by circuitry of the substrate 150. In the exemplary embodiment, package contacts 156 are disposed on upper surface 152 and lower surface 154. The package contacts 156 may include pads, traces, vias, or other types of contacts.
In the illustrated embodiment, the electronic package 104 includes an electronic component 158, such as a chip, on the upper surface 152. The electronic component 158 may be electrically connected to the package contacts 156 through traces or circuitry of the substrate 150. In the illustrated embodiment, the electronic component 158 is substantially centered on the substrate 150 such that the platform 160 is defined on all four sides of the electronic component 158. The platform 160 extends to an edge 162 of the substrate 150, defining a perimeter of the substrate 150. The size and shape of the substrate 150 and the size and shape of the electronic component 158 define the size and shape of the platform 160 and thus the amount of substrate area available on the upper surface 152 of the package contact 156.
After the electronic package 104 is mechanically and electrically coupled to the main circuit board 110, the cable socket connector assembly 102 may be preassembled and mounted to the electronic package 104 and/or the main circuit board 110. For example, the cable assembly 108 may be terminated to the receptacle assembly 106 in the receptacle frame 138 to couple to the electronic package 104. In the exemplary embodiment, receptacle frame 138 supports receptacle assembly 106 and loading member 136. In the exemplary embodiment, receptacle assembly 106 includes a receptacle opening 170 therethrough, receptacle opening 170 receiving electronic component 158. Optionally, a portion of the electronic component 158 passes through the socket opening 170 to interface with the heat sink 130.
The cable assembly 108 is terminated to the receptacle assembly 106 and is thus supported by the receptacle frame 138. In the exemplary embodiment, cable assembly 108 includes a plurality of cables 200, each cable 20 terminating to receptacle assembly 106. For example, the cable 200 may be terminated directly to the socket substrate 116, such as by soldering the cable 200 to the socket substrate conductors 118 of the socket substrate 116. Any number of cables 200 may be provided, depending on the particular application. For example, a greater number of cables 200 may be used in higher density applications to provide a greater number of electrical pathways to electronic package 104. Alternatively, the cable 200 may be a shielded cable, providing electrical shielding for the electrical path. Alternatively, the cables 200 may be differential pair cables, wherein each cable 200 includes a pair of cable conductors. In an exemplary embodiment, the cable 200 may be terminated to the upper and/or lower surfaces of the receptacle substrate 116. In the exemplary embodiment, cable assembly 108 includes a plurality of cable subassemblies 202. Each cable subassembly 202 includes a plurality of cables 200 arranged in an array. Each cable subassembly 202 may be terminated to a corresponding region of the receptacle substrate 116. For example, the upper cable subassembly 202 may be terminated to an upper surface of the receptacle substrate 116 and the lower cable subassembly 202 may be terminated to a lower surface of the receptacle substrate 116. In an exemplary embodiment, the cable sub-assembly 202 may be routed from different sides of the receptacle substrate 116. For example, in the illustrated embodiment, the cable assembly 108 includes cable subassemblies 202 that terminate on all four sides of the receptacle substrate 116, extending in four different directions (e.g., north/south/east/west). However, in other various embodiments, fewer cable subassemblies 202 may be provided, such as cable subassemblies 202 extending from two opposite sides in opposite directions (e.g., north/south). The cable 200 may extend generally horizontally, such as generally coplanar with the receptacle assembly 106 and/or parallel to the main circuit board 110. Alternatively, different cable subassemblies 202 may be routed to different components. The cables 200 of the various cable subassemblies 202 may be tethered together for cable management, for example, using cable ties, clips, ties, and the like.
Fig. 4 is a side view of the electronic system 100 according to an exemplary embodiment. Fig. 5 is an enlarged view of a portion of electronic system 100 according to an exemplary embodiment. During assembly, the electronic package 104 is positioned over the main circuit board 110 and mechanically and electrically connected to the upper surface 126 of the main circuit board 110, for example using solder balls 122.
During assembly, the cable socket connector assembly 102 is positioned over the electronic package 104 and mechanically and electrically connected to an upper surface of the electronic package 104. The receptacle frame 138 may align and position the cable receptacle connector assembly 102 with respect to the electronic package 104. When assembled, a portion of the electronic component 158 extends through the cable receptacle connector assembly 102 to interface with the heat sink 130.
During assembly, the heat sink 130 is positioned over the cable socket connector assembly 102 and the electronic package 104. In an exemplary embodiment, the heat sink 130 is in thermal contact with an upper surface of the electronic component 158 to dissipate heat from the electronic component 158. When assembled, the electronic package 104 and the cable socket connector assembly 102 are positioned in the gap 172 between the heat sink 130 and the main circuit board 110.
During assembly, the heat sink 130 is secured to the mounting block 132 using fasteners 134. Tightening of the fasteners 134 may draw the heat sink 130 toward the main circuit board 110. Optionally, the bottom of the heat sink 130 presses against the cable socket connector assembly 102 to load the cable socket connector assembly 102 against the electronic package 104. For example, a loading member 136 located at the top of the cable socket connector assembly 102 engages the bottom of the heat sink and provides a loading force in a downward direction to load the cable socket connector assembly 102 against the electronic package 104.
In the loading member 136, the loading member 136 includes one or more loading beams 210 configured to be spring biased against the heat sink 130. The load beams 210 may be connected together, such as by a plate, or may be separate load beams 210, such as connected to the receptacle assembly 106 or to the heat sink 130. The load beam 210 exerts a downward spring force on the socket substrate 116 to bias the socket assembly 106 against the electronic package 104. For example, in an exemplary embodiment, the receptacle assembly 106 may include a plurality of receptacle contacts 220 (shown in fig. 6) between the receptacle substrate 116 and the substrate 150 of the electronic package 104. The receptacle contacts 220 may be compressible. The receptacle contacts 220 may define a separable mating interface with the electronic package 104. The receptacle contact 220 may be an LGA contact. During assembly, downward movement of the cable socket connector assembly 102 may spring load the socket contacts 220 against the electronic package 104 to ensure a good electrical connection between the socket assembly 106 and the electronic package 104.
In an exemplary embodiment, the receptacle frame 138 may limit compression or downward movement of the heat sink 130. The receptacle frame 138 may limit downward movement of the cable receptacle connector assembly 102 relative to the electronic package 104, such as by bottoming out against the main circuit board 110. The socket frame 138 may prevent damage to the electronic package 104. The receptacle frame 138 may prevent damage to the receptacle contacts 220.
Fig. 6 is a perspective view of a receptacle contact 220 according to an example embodiment. The receptacle contact 220 includes a base 222 between a terminating end 224 and a mating end 226. The terminating end 224 is configured to terminate to the receptacle substrate 116. The mating end 226 is configured to mate with the electronic package 104. In the illustrated embodiment, the terminating ends 224 include compliant pins, such as eye-of-the-needle contacts, configured to be press-fit into plated through holes of the receptacle substrate 116. Other types of terminating ends 224 may be provided in alternative embodiments. In the illustrated embodiment, the receptacle contact 220 includes a stabilizing beam 228 extending from the base 222 at the terminating end 224. The stabilizing beams 228 are configured to engage the receptacle substrate 116 to stabilize the receptacle contacts 220 on the receptacle substrate 116.
The receptacle contact 220 includes a spring beam 230 extending from the base 222 at the mating end 226. The spring beam 230 is deflectable. In the illustrated embodiment, the spring beam 230 includes two beam arms separated by a gap; however, the spring beam 230 may have other shapes in alternative embodiments, including a single beam arm. In the exemplary embodiment, receptacle contact 220 includes a hook 232 at a distal end thereof, and hook 232 defines a mating interface 234 for mating with a corresponding package contact 156 of electronic package 104. In the exemplary embodiment, mating interface 234 is a separable mating interface. The spring beams 230 may elastically deflect during the abutment of the spring-biased hooks 232 against the package contacts 156 to ensure electrical connection between the receptacle contacts 220 and the package contacts 156.
In alternative embodiments, the receptacle contacts 220 may have other shapes and features. For example, the receptacle contacts 220 may include solder tail portions at the mating ends 226 that are configured to be soldered to the electronic package 104. In other various embodiments, the socket contacts 220 may be solder balls for soldering the socket assembly 106 to the electronic package 104.
Fig. 7 is an exploded view of a portion of the cable receptacle connector assembly 102, showing the receptacle assembly 106. In the exemplary embodiment, receptacle assembly 106 includes a receptacle substrate 116, a receptacle frame 138, a loading member 136, and an insulator 240 positioned between receptacle substrate 116 and loading member 136.
The insulator 240 electrically isolates the receptacle substrate 116 from the loading member 136. Insulator 240 includes an upper surface 242 and a lower surface 244. The lower surface 244 may rest on the receptacle substrate 116. The upper surface 242 may support the loading member 136. The insulator 240 includes an insulator opening 246 that aligns with the receptacle opening 170 in the receptacle substrate 116. The insulator 240 may be similar in size and shape to the loading member 136 and/or the receptacle substrate 116. In alternative embodiments, the insulator 240 may have other shapes. In other various embodiments, the receptacle assembly 106 may include multiple insulators instead of a single insulator 240, such as a stand off mount to the receptacle substrate 116 for supporting the loading member 136.
The loading member 136 includes a body 250 having an upper surface 252 and a lower surface 254. The body 250 may be a plate. Load beam 210 extends above upper surface 252 for interfacing with heat sink 130. Alternatively, the load beam 210 may extend below the lower surface 254 to interface with the insulator 240. The lower surface 254 rests on the insulator 240. The body 250 includes a load beam 210. Of the load members 136, the load member 136 is a stamped component having a load beam 210 stamped from a body 250. Any number of load beams 210 may be provided. Alternatively, load beams 210 may be dispersed around the perimeter of load member 136 to disperse the loading force around load member 136. For example, in the illustrated embodiment, load beam 210 is disposed on all four sides of body 250. Alternatively, the load beam 210 may extend in a different direction for counteracting the compressive load from the heat sink 130. In alternative embodiments, the loading member 136 can have other shapes and features. The loading member 136 applies an activating spring load on the socket assembly 106 to load or press the socket assembly 106 against the electronic package 104. For example, the activation spring load may be a force greater than the spring force of the receptacle contacts 220 to overcome the spring force and compress the receptacle contacts 220 to load the receptacle contacts 220 against the electronic package 104.
In alternative embodiments, rather than providing a single load member over the socket substrate 116, the socket assembly 106 may include multiple individual load beams mounted directly to the socket substrate 116. For example, the load beam 210 may be similar to the socket contacts 220 and configured to be mounted to an upper surface of the socket substrate 116 such that when the heat sink 130 is loaded against the socket assembly 106, the load beam 210 is spring biased against the heat sink 130. In other various embodiments, the load beam 210 may be a coil spring between the heat sink and the socket substrate 116. In alternative embodiments, the load beam 210 may be part of the heat sink 130, rather than being part of the receptacle assembly 106.
The socket substrate 116 may be a printed circuit board and the socket substrate conductors 118 may be electrical circuits of the printed circuit board. The receptacle substrate 116 includes an upper surface 260 and a lower surface 262. The receptacle opening 170 extends through the receptacle substrate 116 between the upper surface 260 and the lower surface 262. The receptacle substrate 116 includes a land 264 surrounding the receptacle opening 170. The land 264 is defined by an inner edge 266 surrounding the receptacle opening 170 and an outer edge 268 along the perimeter of the receptacle substrate 116. The receptacle substrate 116 includes a first sidewall 270 and a second sidewall 272 opposite the first sidewall 270. The receptacle substrate 116 includes a first end wall 274 and a second end wall 276 opposite the first end wall 274. In the exemplary embodiment, receptacle substrate 116 includes corners 278 at intersections between side walls 270, 272 and end walls 274, 276. In the illustrated embodiment, the receptacle substrate 116 is generally rectangular; however, in alternative embodiments, the receptacle substrate 116 may have other shapes.
The socket substrate conductors 118 include pads, traces, vias, etc. that extend along one or more layers of the socket substrate 116. In an exemplary embodiment, portions of the various socket substrate conductors 118 may be exposed on the upper surface 260 and portions of the various socket substrate conductors 118 may be exposed on the lower surface 262.
In the exemplary embodiment, socket substrate conductors 118 include contact pads 280 for electrically connecting with corresponding cables 200. Contact pads 280 may be disposed at or near one or more of the outer edges 268. For example, in the illustrated embodiment, contact pads 280 are disposed along the first side wall 270, the second side wall 272, the first end wall 274, and the second end wall 276 for mating with the corresponding cable 200. Contact pads 280 may be disposed on upper surface 260 and/or lower surface 262 for electrical connection with a corresponding cable 200.
In an exemplary embodiment, the socket substrate conductors 118 include plated through holes 282 for electrical connection with corresponding socket contacts 220. Plated through holes 282 may be associated with corresponding contact pads 280. Plated through holes 282 may be provided at upper surface 260 and/or lower surface 262. In the exemplary embodiment, receptacle contacts 220 are coupled to corresponding through-holes 282 at lower surface 262 to extend below receptacle substrate 116 for electrical connection with electronic package 104.
The receptacle frame 138 includes a top 290 and a bottom 292. The socket frame 138 includes a support member 294 for supporting the socket substrate 116. In the illustrated embodiment, support members 294 are provided at corners of the receptacle frame 138 for supporting corners 278 of the receptacle substrate 116. In the exemplary embodiment, receptacle frame 138 includes one or more heat sink positioning surfaces 296 at top 290 that are configured to engage and position heat sink 130 with respect to receptacle frame 138. The heat sink positioning surface 296 may define a stop surface for preventing the heat sink 130 from being lowered toward the receptacle assembly 106. In the exemplary embodiment, socket frame 138 includes one or more electronic package positioning surfaces 298 at bottom 292 that are configured to engage and position electronic package 104 with respect to socket frame 138. The electronic package positioning surface 298 may position the electronic package 104 relative to the socket substrate 116. During loading of the receptacle assembly 106 onto the electronic package 104, the electronic package positioning surface 298 may bottom out against the electronic package 104 to prevent damage to the receptacle contacts 220. Optionally, the bottom 292 may be configured to bottom out against the main circuit board 110 during assembly to prevent damage to the electronic package 104, the load beam 210, and/or the receptacle contacts 220.
Fig. 8 is an exploded view of the cable receptacle connector assembly 102, showing the receptacle assembly 106 and the cable assembly 108. The cable assembly 108 includes a plurality of cable subassemblies 202 configured to be terminated to the receptacle assembly 106. The receptacle assembly 106 is shown in an assembled state in which the receptacle substrate 116 is held in the receptacle frame 138 and supported by the receptacle frame 138, and the loading member 136 and the insulator 240 are coupled to the receptacle substrate 116. When the loading member 136 and the insulator 240 are coupled to the receptacle substrate 116, the contact pads 280 are exposed to terminate the cable 200 to the receptacle substrate 116. The support member 294 may be used to position the insulator 240 and the loading member 136.
Each cable subassembly 202 includes an array 300 of cables 200. The cables 200 may be tethered together. Each cable subassembly 202 includes a ground bus 302 configured to electrically connect to each cable 200 and to the receptacle substrate 116. In the illustrated embodiment, the ground bus 302 includes a panel 304 and a plurality of ground fingers 306 extending from the panel 304. The ground fingers 306 are configured to terminate to corresponding contact pads 280 on the receptacle substrate 116. For example, the ground fingers 306 may be soldered to the corresponding contact pads 280. The panel 304 shares each of the ground fingers 306 with each other and with each of the cables 200. In alternative embodiments, instead of using a ground bus 302, the cable 200 may include a ground conductor, such as a drain wire that may terminate to a corresponding contact pad 280.
The cable 200 includes a cable conductor 310 configured to terminate to a corresponding contact pad 280. For example, the cable conductor 310 may be soldered to the contact pad 280. Cable conductors 310 may be exposed by stripping the ends of cable 200. Alternatively, the cable 200 may be a twinax cable, each having a pair of signal cable conductors 310 carrying differential pair signals. Optionally, each cable 200 may include a ground cable conductor 310, such as a drain wire and/or cable braid, configured to be electrically connected to the ground bus 302.
Fig. 9 is a top perspective view of the cable jack connector assembly 102 according to an exemplary embodiment. Fig. 10 is a top view of the cable socket connector assembly 102 according to an exemplary embodiment. Fig. 11 is a bottom perspective view of the cable jack connector assembly 102 according to an exemplary embodiment. Fig. 12 is a bottom view of the cable receptacle connector assembly 102 according to an exemplary embodiment.
When assembled, the receptacle substrate 116 is retained in and supported by the receptacle frame 138. The loading member 136 and the insulator 240 are coupled to the socket substrate 116. The cable assembly 108 extends from the receptacle assembly 106. The cable 200 is terminated to the socket substrate conductors 118 of the socket substrate 116. The cable subassemblies 202 extend from the receptacle substrate 116 in respective directions. In the illustrated embodiment, the cable subassembly 202 is shown extending from all four sides of the receptacle substrate 116 (e.g., from the first side wall 270, from the second side wall 272, from the first end wall 274, and from the second end wall); however, in alternative embodiments, fewer cable subassemblies 202 may be provided, such as from three sides, two sides, or a single side. In the illustrated embodiment, the cable subassembly 202 is shown as corresponding receptacle substrate conductors 118 terminated on an upper surface 260 and a lower surface 262; however, in alternative embodiments, the cable sub-assembly 202 may be disposed only on the upper surface 260 or only on the lower surface 262.
In an exemplary embodiment, the bottom of the cable socket connector assembly 102 is configured to electrically connect to the electronic package 104. Thus, the receptacle contacts 220 (fig. 11) extend from the lower surface 262 of the receptacle substrate 116. The receptacle contacts 220 terminate at the lower surface 262 to corresponding receptacle substrate conductors 118, such as press-fit in corresponding through-holes 282 (fig. 12). The socket substrate conductors 118 on the upper surface 260 are routed through the socket substrate 116 to the lower surface 262 for electrical connection with corresponding socket contacts 220 at the lower surface 262.
Fig. 13 is an enlarged bottom view of a portion of the cable receptacle connector assembly 102. The cable 200 is shown terminated to the receptacle assembly 106. In the illustrated embodiment, each cable 200 includes a pair of signal cable conductors 312 and a ground cable connector 314. The signal cable conductors 312 are stripped at the ends of the cable 200 and are configured to be soldered to corresponding contact pads 280. In the illustrated embodiment, the ground cable conductors 314 include drain wires and/or cable braids of the cable 200. The ground cable conductors 314 are electrically connected to the panel 304 of the ground bus 302. The ground fingers 306 extend from the panel 304 to terminate to corresponding contact pads 280. Alternatively, the ground fingers 306 may be soldered to the contact pads 280. In the illustrated embodiment, the contact pads 280 are arranged in a ground-signal-ground arrangement for termination to the signal cable conductors 312 and the ground cable conductors 314. Optionally, the cable socket connector assembly 102 may include one or more strain relief features for securing the cable 200 to the socket assembly 106. The strain relief features may extend from the receptacle frame 138 or be connected to the receptacle frame 138.
The receptacle contacts 220 extend from the lower surface 262 of the receptacle substrate 116. The stabilizing beams 228 stabilize the receptacle contact 220 at the lower surface 262. Spring beams 230 extend below lower surface 262 and position receptacle contacts 220 for electrical connection with electronic package 104. The receptacle contacts 220 are arranged in an array, such as a grid. The receptacle contacts 220 may be signal receptacle contacts or ground receptacle contacts. Alternatively, the signal receptacle contacts may be arranged in pairs surrounded by corresponding ground receptacle contacts that provide electrical shielding between the corresponding signal receptacle contacts. The receptacle contacts 220 may include power receptacle contacts. The receptacle contacts 220 are electrically connected to corresponding contact pads 280 on the upper surface 260 or the lower surface 262. The receptacle contacts 220 are associated with package contacts 156 (e.g., SMT pads) on the upper surface 152 of the electronic package 104.
Fig. 14 is a side view of a portion of the electronic system 100 showing the cable socket connector assembly 102 ready to mate with the electronic package 104. Fig. 15 is a side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic package 104. Fig. 16 is an enlarged side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 ready to mate with electronic package 104. Fig. 17 is an enlarged side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic package 104.
During mating, the cable receptacle connector assembly 102 is aligned with the electronic package 104 and lowered onto the electronic package 104. The receptacle contacts 220 are for electrical connection to the receptacle assembly 106 and the electronic package 104. The socket contacts 220 extend from the lower surface 262 of the socket substrate 116 and are spring loaded against the substrate 150 of the electronic package 104. The spring beams 230 may deflect between the socket substrate 116 and the substrate 150 of the electronic package 104. The mating ends 226 of the receptacle contacts 220 are aligned with corresponding package contacts 156 on the upper surface 152 of the substrate 150 of the electronic package 104. The receptacle assembly 106 is configured to be compressed in a downward direction 320 to deflect the receptacle contacts 220 and spring load the receptacle contacts 220 against the electronic package 104. For example, the heat sink 130 may be pressed downward against the receptacle assembly 106. In an exemplary embodiment, the loading member 136 distributes the load from the heat sink 130 to press down on the receptacle assembly 106 and compress the receptacle contacts 220. In other various embodiments, the socket contacts 220 may be solder balls, such as BGA, that are configured to be soldered to the electronic package 104, rather than having compressible socket contacts 220.
The receptacle assembly 106 is used to directly attach the cable 200 of the cable assembly 108 to the electronic package 104. The cable conductors 310 are electrically connected to corresponding package contacts 156 of the electronic package 104 through the socket contacts 220 and the socket substrate conductors 118. The electrical path does not pass through the main circuit board 110 to the cable assembly 108. The electrical path between the cable conductor 310 and the electronic package 104 is short and there is a small electrical interface. The electronic system 100 provides good electrical performance for high-speed signals from the electronic package 104. The electronic system 100 provides electrical connection to the upper surface 152 and lower surface 154 of the substrate 150 of the electronic package 104 to provide a higher density and/or smaller footprint. By connecting the cable 200 of the cable assembly 108 to the receptacle assembly 106, the electronic system 100 eliminates the need to route high-speed signals through the main circuit board 110 and/or through a separate electrical connector mounted to the main circuit board 110, eliminating the expense of components and assembly of components to reduce costs.
Fig. 18 is a side view of a portion of an electronic system 100 showing a cable socket connector assembly 102 mated with an electronic package 104 and a main circuit board 110, in accordance with an exemplary embodiment. In the illustrated embodiment, the electronic package 104 is mated to the top of the cable socket connector assembly 102 and the cable socket connector assembly 102 is mated to the top of the main circuit board 110. For example, receptacle contacts 220 (shown in fig. 6) may be disposed on the top and bottom of receptacle substrate 116. The heat sink 130 may be thermally coupled to the electronic package 104.
Fig. 19 is a side view of a portion of an electronic system 100 showing a cable socket connector assembly 102 mated with an electronic package 104 and showing the electronic package 104 mated with a main circuit board 110, according to an example embodiment. In the illustrated embodiment, the electronics package 104 mates with the top of the cable socket connector assembly 102. For example, receptacle contacts 220 (shown in fig. 6) may be disposed on top of receptacle substrate 116 to mate to the bottom of electronic package 104. The electronic package 104 is mated to the bottom of the main circuit board 110, for example using a ball grid array. The heat sink 130 may be thermally coupled to the electronic package 104.

Claims (15)

1. A cable socket connector assembly (102) for an electronic system (100) including a main circuit board (110), comprising:
a socket assembly (106) including a socket substrate (116) having socket substrate conductors (118), the socket assembly having socket contacts (220) extending between terminating ends (224) and mating ends (226), the terminating ends (224) terminating to corresponding socket substrate conductors (118), the mating ends configured to terminate to corresponding package contacts (156) of an electronic package (104) of the electronic system; and
a cable assembly (108) terminated to the receptacle assembly, the cable assembly having an array of cables (200), each cable having a cable conductor (310) terminated to a corresponding receptacle substrate conductor (118);
wherein the receptacle contacts (220) and the corresponding receptacle substrate conductors (118) define an electrical path (112) between a cable conductor (310) of the cable and a package conductor of the electronic package,
wherein the electrical path (112) passes through the receptacle assembly (106) without passing through the main circuit board (110).
2. The cable socket connector assembly (102) of claim 1, wherein the mating ends (226) of the socket contacts (220) directly engage package contacts (156) of the electronic package (104) to electrically connect the socket assembly (106) to the electronic package, and the cable conductors (310) of the cable (200) directly engage the socket substrate conductors (118) to electrically connect the cable assembly (108) to the socket assembly.
3. The cable socket connector assembly (102) of claim 1, wherein the mating ends (226) of the socket contacts (220) comprise spring beams (230) configured to resiliently deflect against the electronic package (104).
4. The cable socket connector assembly (102) of claim 1, further comprising a loading member (136) engaging the socket assembly (106), the loading member having at least one loading beam (210) that exerts a downward spring force on the socket substrate (116) to bias the socket contacts (220) against the package contacts (156) of the electronic package (104).
5. The cable socket connector assembly (102) of claim 1, wherein the cable conductor (310) is soldered to the corresponding socket substrate conductor (118).
6. The cable socket connector assembly (102) of claim 1, wherein the socket contacts (220) are configured to spring load against corresponding package contacts (156) of the electronic package (104) at the separable mating interface (120).
7. The cable socket connector assembly (102) of claim 1, wherein the socket substrate (116) includes an upper surface (260) and a lower surface (262) from which the socket contacts (220) extend to engage an upper surface of the electronic package (104).
8. The cable socket connector assembly (102) of claim 7, wherein the socket substrate conductors (118) have plated through holes (282), the terminating ends (224) of the socket contacts (220) being received in corresponding plated through holes.
9. The electrical cable socket connector assembly (102) of claim 7, wherein the socket substrate conductor (118) includes contact pads (280) on at least one of the upper surface (260) and the lower surface (262), the electrical cable conductor (310) terminating to corresponding contact pads of the socket substrate conductor.
10. The cable socket connector assembly (102) of claim 1, wherein the socket contacts (220) comprise signal socket contacts and ground socket contacts, the signal socket contacts being arranged in pairs, the cable conductors (310) comprising signal cable conductors and ground cable conductors, the signal cable conductors being arranged in pairs in each cable (200), the signal cable conductors terminating to corresponding signal socket contacts and the ground cable conductors terminating to corresponding ground socket contacts.
11. The electrical cable socket connector assembly of claim 1, wherein the socket substrate (116) includes an outer edge (268) defining an outer perimeter and an inner edge (266) defining a socket opening (170) configured to receive an electronic package, the socket substrate conductors (118) being disposed along at least one of the outer edges, the socket contacts being disposed along at least one of the inner edges.
12. The electrical cable socket connector assembly of claim 1, wherein the socket substrate (116) includes first and second side walls (270, 272) and first and second end walls (274, 276), the socket substrate conductor (118) being disposed along at least one of the first and second side walls (270, 272).
13. The electrical cable receptacle connector assembly of claim 12, wherein the receptacle substrate conductors (118) are disposed along at least one of the first and second end walls (274, 276).
14. The electrical cable receptacle connector assembly of claim 1, wherein the receptacle substrate (116) includes a receptacle opening (170) therethrough configured to receive the electronic package.
15. The electrical cable receptacle connector assembly of claim 1, wherein the receptacle assembly and the electrical cable assembly are configured to be received in a gap (172) between the electronic package and a heat sink (130) thermally coupled to the electronic package.
CN201811344635.8A 2017-11-13 2018-11-13 Cable socket connector assembly for electronic packages Active CN110071381B (en)

Applications Claiming Priority (4)

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US201762585268P 2017-11-13 2017-11-13
US62/585,268 2017-11-13
US15/941,575 US10910748B2 (en) 2017-11-13 2018-03-30 Cable socket connector assembly for an electronic
US15/941,575 2018-03-30

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JPH0294375A (en) * 1988-09-30 1990-04-05 Thomas & Betts Corp <T&B> Connector
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CN103117486A (en) * 2011-07-13 2013-05-22 泰科电子公司 Electrical connector assembly for interconnecting an electronic module and an electrical component
US9252521B1 (en) * 2014-08-04 2016-02-02 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Short path circuit card

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294375A (en) * 1988-09-30 1990-04-05 Thomas & Betts Corp <T&B> Connector
CN1976128A (en) * 2005-11-30 2007-06-06 三美电机株式会社 Connection terminal and connection apparatus for electronic components
CN102332646A (en) * 2010-06-30 2012-01-25 泰科电子公司 The electric connector that is used for electronic module
CN103117486A (en) * 2011-07-13 2013-05-22 泰科电子公司 Electrical connector assembly for interconnecting an electronic module and an electrical component
US9252521B1 (en) * 2014-08-04 2016-02-02 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Short path circuit card

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