CN110058358A - The high frequency connection device of optical module heat dissipation can be promoted - Google Patents
The high frequency connection device of optical module heat dissipation can be promoted Download PDFInfo
- Publication number
- CN110058358A CN110058358A CN201810048625.3A CN201810048625A CN110058358A CN 110058358 A CN110058358 A CN 110058358A CN 201810048625 A CN201810048625 A CN 201810048625A CN 110058358 A CN110058358 A CN 110058358A
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- China
- Prior art keywords
- contact portion
- optical module
- radiator
- contact
- shell
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A kind of high frequency connection device that can promote optical module heat dissipation, including shell, interlayer part, inner radiator, heat pipe, rear radiator and upper radiator.Interlayer part is set in the accommodating space of shell, and accommodating space is partitioned into a upper space and a lower space.Inner radiator is set to the inside of interlayer part, and the top and bottom of inner radiator are respectively provided with the first contact portion and the second contact portion.Upper radiator is flexibly set in the upper cover of shell, and the bottom of upper radiator has a third contact portion, the 4th contact portion of setting 1 of the lower cover elasticity of shell.First optical module and the second optical module can be inserted in respectively in upper space and lower space, the top and bottom of first optical module are contacted with third contact portion and the first contact portion respectively, the top and bottom of second optical module are contacted with the second contact portion and the 4th contact portion respectively, to assist the first optical module and the second optical module to radiate, the generation of thermal resistance can be reduced and accelerate the ability of heat dissipation.
Description
Technical field
The present invention relates to a kind of high frequency connection device more particularly to a kind of high frequency connections that can promote optical module heat dissipation
Device.
Background technique
Existing high frequency connectors may be disposed at the inside of a shell (female end), and optical module (male end) can be inserted in shell
Inside be mutually inserted optical module can with high frequency connectors, is electrically connected with reaching.Existing high frequency connection device can be in shell
Top upper radiator is set, when optical module is inserted in the inside of shell, optical module is contacted using upper radiator, to assist
Optical module is helped to radiate, however, only assisting heat dissipation using upper radiator, therefore heat dissipation is bad.Furthermore existing optical module can
The inside for being set to shell of plug, therefore optical module can not effectively be contacted with radiator, and it is bad also to have heat dissipation
Problem, and existing heat-conducting mode medium is more and thermal resistance is more, heat loss is big, be efficiently transferred to the high temperature of optical module can not
Radiator.
Summary of the invention
The technical problems to be solved by the invention are to provide a kind of high frequency connection dress that can promote optical module heat dissipation
It sets, makes the high temperature of optical module that can be efficiently transferred to each radiator, the generation of thermal resistance can be reduced and accelerate the ability of heat dissipation.
In order to solve the above technical problems, the present invention provides a kind of high frequency connection dress that can promote optical module heat dissipation
It sets comprising radiator after a shell, an interlayer part, an inner radiator, one, a heat pipe, radiator and a connector on one.It should
Shell includes a upper cover, two side walls and a lower cover, forms an accommodating space between the upper cover, the two side walls and the lower cover；
The interlayer part is set in the accommodating space, which is partitioned into a upper space and a lower space；The interior heat dissipation
Device is set to the inside of the interlayer part, and the top and bottom of the inner radiator are respectively provided with one first contact portion and one second contact
Portion, first contact portion and second contact portion are respectively exposed to the upper space and the lower space；The rear radiator setting
In the rear of the shell；The heat pipe is connected between the inner radiator and the rear radiator；Radiator elasticity is set on this
The upper cover of the shell, bottom of radiator has a third contact portion on this, which is exposed to the upper space, should
The 4th contact portion of setting 1 of the lower cover elasticity of shell, the 4th contact portion are exposed to the lower space；The connector is set to
The inside of the shell, can be to one first optical module of grafting and one second optical module；Wherein, first optical module and second light
Module is inserted in respectively in the upper space and the lower space, to be mutually inserted with the connector, and first optical module
Top and bottom directly contacted with the third contact portion and first contact portion respectively, the top and bottom of second optical module
It is directly contacted with second contact portion and the 4th contact portion respectively.
Preferably, which has plate body before a upper plate body and a lower body and one, between the upper plate body and the lower body
Every being arranged and being parallel to each other, which is connected between the front end of the upper plate body and the front end of the lower body, the inner radiator
It is set between the upper plate body and lower body of the interlayer part.
Preferably, the upper plate body and the lower body are respectively equipped on one open-work and once open-work, first contact portion and should
Second contact portion is corresponding with open-work on this and the lower open-work respectively.
Preferably, first contact portion and second contact portion protrude from the top and bottom of the inner radiator respectively, should
First contact portion and second contact portion are respectively provided with one first contact surface and one second contact surface.
Preferably, which protrudes from the bottom of radiator on this, which contacts with a third
Face, the 4th contact portion protrude from the top of the lower cover, and the 4th contact portion has one the 4th contact surface, first optical module
Top and bottom are directly contacted with the third contact surface and first contact surface respectively, the top and bottom point of second optical module
It is not contacted directly with second contact surface and the 4th contact surface.
Preferably, first contact surface, second contact surface, the third contact surface and the 4th contact surface are all smooth flat
Face and be parallel to each other, first contact surface, second contact surface, the third contact surface and the 4th contact surface roughness be all
1 μm of Ra or less.
Preferably, the upper cover of the shell is equipped with a top open-work, and the third contact portion is corresponding with the top open-work.
Preferably, the 4th contact portion is in boss-shaped, and the lower cover of the shell has an elastic slice, and the 4th contact portion is set to
On the elastic slice, the opposite sides of the elastic slice is equipped with profile groove, separates the opposite sides of the elastic slice and the lower cover, the another phase of the elastic slice
Two sides are connect with the lower cover, the 4th contact portion can be set to the lower cover by elastic slice elasticity.
Preferably, radiator is set to the upper cover of the shell with a spring secures rail to sleeper on this.
Beneficial effects of the present invention:
High frequency connection device of the present invention makes the high temperature of the first optical module and the second optical module that can be efficiently transferred to interior heat dissipation
Each radiators such as device, rear radiator and upper radiator, and the third contact portion of upper radiator has the elasticity pushed, the of lower cover
Four contact portions have the elasticity on upper top, make what the first optical module and the second optical module can be stable to be folded in inner radiator, upper heat dissipation
Between device and lower cover, contact the first optical module and the second optical module effectively with inner radiator, upper radiator and lower cover, and the
The high temperature of one optical module and the second optical module can be transferred to rear radiator by inner radiator and heat pipe, therefore can reduce the hair of thermal resistance
Ability that is raw and accelerating heat dissipation.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however, the drawings only provide reference and explanation, the person of being not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the stereogram exploded view of high frequency connection device of the present invention.
Fig. 2 is the perspective view (one) of high frequency connection device of the present invention.
Fig. 3 is the perspective view (two) of high frequency connection device of the present invention.
Fig. 4 is the cross-sectional view of high frequency connection device of the present invention.
Fig. 5 is the perspective view of upper cover of the present invention.
Fig. 6 is the perspective view of lower cover of the present invention.
Fig. 7 is between interlayer of the present invention, the perspective view of inner radiator and heat pipe.
Fig. 8 is the perspective view of the upper radiator of the present invention.
Fig. 9 is the perspective view of another embodiment of high frequency connection device of the present invention.
Specific embodiment
[first embodiment]
The present invention provides a kind of high frequency connection device that can promote optical module heat dissipation referring to FIG. 1 to FIG. 4, is
The structure of one stacking-type, can be 2 × 1,2 × 2,2 × 3,2 × 4 and 2 × 5 equal-specifications, do not limited, the present embodiment be 2 ×
3 specifications, but only just wherein 2 × 1 structure division illustrates.The high frequency connection device is including in a shell 1, an interlayer part 2, one
Radiator 6 on radiator 5 and one after radiator 3, a heat pipe 4, one.
The shell 1 is a metal shell, and shell 1 includes that a upper cover 11, two side walls 12 and a lower cover 13 (please refer to Fig. 5
And Fig. 6), upper cover 11, two side walls 12 and lower cover 13 can all be in rectangle metal plate, two side walls 12 be connected to upper cover 11 and
Between lower cover 13, an accommodating space 14 is formed between upper cover 11, two side walls 12 and lower cover 13, it is opening-like to constitute a front end
Shell 1.
The interlayer part 2 is made of metal plate, and bends U-shaped, that is, the interlayer part 2 can have a upper plate body 21, one
Plate body 23 (please referring to Fig. 7) before lower body 22 and one, upper plate body 21, lower body 22 and preceding plate body 23 can all be in rectangle, upper plate body
21 and lower body 22 interval setting and be parallel to each other, preceding plate body 23 be connected to upper plate body 21 front end and lower body 22 front end it
Between.Upper plate body 21 and lower body 22 can be respectively equipped on one open-work 211 and once open-work 221, upper open-work 211 and lower open-work 221
It can all be in rectangle.Interlayer part 2 is set in accommodating space 14, that is, interlayer part 2 may be disposed at 14 intermediate altitude of accommodating space
Position, and the two sides of interlayer part 2 can be fixed on the two side walls 12 of shell 1 in the way of clamping or welding etc., interlayer part 2 to
Accommodating space 14 is partitioned into a upper space 141 and a lower space 142.
The inner radiator 3 is made of with the good metal material of the thermal conductivity such as aluminium or copper, and inner radiator 3 is preferably in rectangle
Block, but the shape of inner radiator 3 is not intended to limit.Inner radiator 3 is set to the inside of interlayer part 2, that is, inner radiator 3 can be set
It is placed between the upper plate body 21 and lower body 22 of interlayer part 2.The top and bottom of inner radiator 3 are respectively provided with one first contact portion
31 and one second contact portion 32, the first contact portion 31 and the second contact portion 32 protrude from the top and bottom of inner radiator 3 respectively,
First contact portion 31 and 32 system of the second contact portion are respectively provided with one first contact surface 311 and one second contact surface 321 (such as Fig. 4 institute
Show), the first contact surface 311 and the second contact surface 321 are smooth flat.First contact portion 31 and the second contact portion 32 respectively with it is upper
Open-work 211 and lower open-work 221 are corresponding, make the first contact portion 31 and the second contact portion 32 be respectively exposed to upper space 141 and
Lower space 142, that is, the first contact portion 31 can be exposed to the bottom of upper space 141, under the second contact portion 32 can be exposed to
The top in portion space 142.
The rear radiator 5 is made of with the good metal material of the thermal conductivity such as aluminium or copper, and the shape of rear radiator 5 is simultaneously unlimited
System, rear radiator 5 are set to the rear of shell 1, the rear for being set to shell 1 that rear radiator 5 can be spaced.The heat pipe 4 connection
Between inner radiator 3 and rear radiator 5, heat pipe 4 is at least provided with one, such as settable one or more, the number of heat pipe 4
Amount is not intended to limit.The front end of heat pipe 4 is connected to inner radiator 3, and the front end of heat pipe 4 can be arranged in 3 inside of inner radiator or two sides,
The rear end of heat pipe 4 is connected to rear radiator 5, and the rear end of heat pipe 4 can be arranged in rear 5 inside of radiator or two sides.Therefore, optical module
High temperature rear radiator 5 sequentially can be transferred to by inner radiator 3 and heat pipe 4.
Radiator 6 is made of with the good metal material of the thermal conductivity such as aluminium or copper on this, and the shape of upper radiator 6 is simultaneously unlimited
System, upper radiator 6 are set to the upper cover 11 of shell 1, and upper radiator 6 can be set to the upper of shell 1 with 7 elasticity of a spring secures rail to sleeper
The structure of lid 11, spring secures rail to sleeper 7 is not intended to limit, and can be various existing spring secures rail to sleepers.The bottom of upper radiator 6 has a third
Contact portion 61 (please refers to Fig. 8), and third contact portion 61 protrudes from the bottom of radiator 6, and third contact portion 61 has a third
Contact surface 611, third contact surface 611 are smooth flat.In the present embodiment, the upper cover 11 of shell 1 is equipped with a top open-work 111,
Pushing up open-work 111 can be in rectangle, and third contact portion 61 is corresponding with top open-work 111, and third contact portion 61 is made to be exposed to upper space
141, that is, third contact portion 61 can be exposed to the top of upper space 141.Upper radiator 6 is fixed on shell 1 with spring secures rail to sleeper 7
Upper cover 11, make the third contact portion 61 of radiator 6 that can there is the elasticity of pushing.
The 4th contact portion 131 of setting 1 of 13 elasticity of lower cover of the shell 1, the 4th contact portion 131 protrude from lower cover 13
Top, the 4th contact portion 131 have one the 4th contact surface 1311, and the 4th contact surface 1311 is smooth flat, the 4th contact portion 131
It is exposed to lower space 142, that is, the 4th contact portion 131 can be exposed to the bottom of lower space 142.In the present embodiment,
Four contact portions 131 are in boss-shaped, and the lower cover 13 of shell 1 has an elastic slice 132, and the 4th contact portion 131 is set to elastic slice 132
On, make the 4th contact portion 131 of the lower cover 13 that can there is the elasticity on upper top.In the present embodiment, the opposite sides of elastic slice 132 is set
There is profile groove 133, separates the opposite sides of elastic slice 132 and lower cover 13, the another opposite sides of elastic slice 132 connect with lower cover 13, makes
4th contact portion 131 can be set to lower cover 13 by 132 elasticity of elastic slice.Above-mentioned first contact surface 311, the second contact surface 321,
Third contact surface 611 and the 4th contact surface 1311 are all smooth flat and are parallel to each other, the first contact surface 311, the second contact surface
321, the roughness of third contact surface 611 and the 4th contact surface 1311 is all Ra1 μm or less.
The high frequency connection device further includes a connector 8, which is set to the inside of shell 1, and connector 8 is one
Two-layer equation electric connector can be used to one first optical module 20 of grafting and one second optical module 30 (as shown in Figure 4), the first optical module
20 and second optical module 30 be inserted in upper space 141 and lower space 142 respectively, to be mutually inserted with connector 8, and
The top and bottom of first optical module 20 respectively with third contact portion 61 (third contact surface 611) and the first contact portion 31 (first
Contact surface 311) directly contact, the top and bottom of the second optical module 30 respectively with the second contact portion 32 (the second contact surface 321)
And the 4th contact portion 131 (the 4th contact surface 1311) directly contact, to assist the first optical module 20 and the second optical module 30 to dissipate
Heat.The generation of thermal resistance can be reduced as a result, and accelerates the ability of heat dissipation.
[second embodiment]
Referring to Fig. 9, the present embodiment discloses a kind of high frequency connection device of 2 × 2 specifications, structure is big with above-described embodiment
It causes identical, therefore is not repeated here.
High frequency connection device of the present invention makes the high temperature of the first optical module and the second optical module that can be efficiently transferred to interior heat dissipation
Each radiators such as device, rear radiator and upper radiator, and the third contact portion of upper radiator has the elasticity pushed, the of lower cover
Four contact portions have the elasticity on upper top, make what the first optical module and the second optical module can be stable to be folded in inner radiator, upper heat dissipation
It between device and lower cover, contact the first optical module and the second optical module can with inner radiator, upper radiator and lower cover effectively, and
The high temperature of first optical module and the second optical module can be transferred to rear radiator by inner radiator and heat pipe, therefore can reduce thermal resistance
Occur and accelerate the ability of heat dissipation.
However the above description is only a preferred embodiment of the present invention, is not intended to limit to scope of patent protection of the invention, therefore
All equivalence changes carried out by with description of the invention and accompanying drawing content, are similarly all contained in claims of the present invention
In protection scope, Chen Ming is given in conjunction.
Claims (9)
1. a kind of high frequency connection device that can promote optical module heat dissipation characterized by comprising
One shell, the shell include a upper cover, two side walls and a lower cover, shape between the upper cover, the two side walls and the lower cover
At an accommodating space；
One interlayer part, the interlayer part are set in the accommodating space, which is partitioned into a upper space and a lower part
Space；
One inner radiator, the inner radiator are set to the inside of the interlayer part, and the top and bottom of the inner radiator are respectively provided with
One first contact portion and one second contact portion, first contact portion and second contact portion are respectively exposed to the upper space and should
Lower space；
Radiator after one, the rear radiator are set to the rear of the shell；
One heat pipe, the heat pipe are connected between the inner radiator and the rear radiator；
Radiator on one, the upper cover for being set to the shell of radiator elasticity on this, bottom of radiator has a third on this
Contact portion, the third contact portion are exposed to the upper space, the 4th contact portion of setting 1 of the lower cover elasticity of the shell, and the 4th
Contact portion is exposed to the lower space；And
A connector, the connector are set to the inside of the shell, can be to one first optical module of grafting and one second optical module；
Wherein, first optical module and second optical module are inserted in respectively in the upper space and the lower space, to
The connector is mutually inserted, and the top of first optical module and bottom are straight with the third contact portion and first contact portion respectively
Contact, the top and bottom of second optical module are directly contacted with second contact portion and the 4th contact portion respectively.
2. the high frequency connection device of optical module heat dissipation can be promoted as described in claim 1, which is characterized in that the interlayer part
With plate body before a upper plate body and a lower body and one, the upper plate body and the lower body interval are arranged and are parallel to each other, the foreboard
Body is connected between the front end of the upper plate body and the front end of the lower body, the inner radiator be set to the interlayer part upper plate body and
Between lower body.
3. the high frequency connection device of optical module heat dissipation can be promoted as claimed in claim 2, which is characterized in that the upper plate body
And the lower body is respectively equipped on one open-work and once open-work, first contact portion and second contact portion respectively with open-work on this
And the lower open-work is corresponding.
4. the high frequency connection device of optical module heat dissipation can be promoted as described in claim 1, which is characterized in that this first connects
Contact portion and second contact portion protrude from the top and bottom of the inner radiator, first contact portion and second contact portion respectively
It is respectively provided with one first contact surface and one second contact surface.
5. the high frequency connection device of optical module heat dissipation can be promoted as claimed in claim 4, which is characterized in that the third connects
Contact portion protrudes from the bottom of radiator on this, which has a third contact surface, and the 4th contact portion protrudes from this
The top of lower cover, the 4th contact portion have one the 4th contact surface, the top and bottom of first optical module respectively with the third
Contact surface and first contact surface directly contact, the top and bottom of second optical module respectively with second contact surface and this
Four contact surfaces directly contact.
6. the high frequency connection device of optical module heat dissipation can be promoted as claimed in claim 5, which is characterized in that this first connects
Contacting surface, second contact surface, the third contact surface and the 4th contact surface are all smooth flat and are parallel to each other, first contact
Face, second contact surface, the third contact surface and the 4th contact surface roughness be all 1 μm of Ra or less.
7. the high frequency connection device of optical module heat dissipation can be promoted as described in claim 1, which is characterized in that the shell
Upper cover is equipped with a top open-work, and the third contact portion is corresponding with the top open-work.
8. the high frequency connection device of optical module heat dissipation can be promoted as described in claim 1, which is characterized in that the 4th connects
Contact portion is in boss-shaped, and the lower cover of the shell has an elastic slice, and the 4th contact portion is set on the elastic slice, and opposite the two of the elastic slice
Side is equipped with profile groove, separates the opposite sides of the elastic slice and the lower cover, and the another opposite sides of the elastic slice connect with the lower cover, this
Four contact portions can be set to the lower cover by elastic slice elasticity.
9. the high frequency connection device of optical module heat dissipation can be promoted as described in claim 1, which is characterized in that heat dissipation on this
Device is set to the upper cover of the shell with a spring secures rail to sleeper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810048625.3A CN110058358A (en) | 2018-01-18 | 2018-01-18 | The high frequency connection device of optical module heat dissipation can be promoted |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810048625.3A CN110058358A (en) | 2018-01-18 | 2018-01-18 | The high frequency connection device of optical module heat dissipation can be promoted |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110058358A true CN110058358A (en) | 2019-07-26 |
Family
ID=67315134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810048625.3A Pending CN110058358A (en) | 2018-01-18 | 2018-01-18 | The high frequency connection device of optical module heat dissipation can be promoted |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110058358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022199436A1 (en) * | 2021-03-25 | 2022-09-29 | 华为技术有限公司 | Heat dissipation apparatus for optical module, and communication device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200990754Y (en) * | 2006-12-27 | 2007-12-12 | 东莞莫仕连接器有限公司 | Radiating device |
| CN104979681A (en) * | 2014-04-03 | 2015-10-14 | 至良科技股份有限公司 | Plugging module seat |
| CN105445859A (en) * | 2014-08-27 | 2016-03-30 | 泰科电子(上海)有限公司 | Connector for plugs and connector assembly |
| CN105934854A (en) * | 2013-08-16 | 2016-09-07 | 莫列斯有限公司 | Connector with thermal management |
| US20170192185A1 (en) * | 2016-01-04 | 2017-07-06 | Infinera Corp. | Stacked Cage Optical Module Heat Relay System |
-
2018
- 2018-01-18 CN CN201810048625.3A patent/CN110058358A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200990754Y (en) * | 2006-12-27 | 2007-12-12 | 东莞莫仕连接器有限公司 | Radiating device |
| CN105934854A (en) * | 2013-08-16 | 2016-09-07 | 莫列斯有限公司 | Connector with thermal management |
| CN104979681A (en) * | 2014-04-03 | 2015-10-14 | 至良科技股份有限公司 | Plugging module seat |
| CN105445859A (en) * | 2014-08-27 | 2016-03-30 | 泰科电子(上海)有限公司 | Connector for plugs and connector assembly |
| US20170192185A1 (en) * | 2016-01-04 | 2017-07-06 | Infinera Corp. | Stacked Cage Optical Module Heat Relay System |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022199436A1 (en) * | 2021-03-25 | 2022-09-29 | 华为技术有限公司 | Heat dissipation apparatus for optical module, and communication device |
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Application publication date: 20190726 |