CN110057921A - A kind of three-dimension ultrasonic imaging system - Google Patents
A kind of three-dimension ultrasonic imaging system Download PDFInfo
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- CN110057921A CN110057921A CN201910290733.6A CN201910290733A CN110057921A CN 110057921 A CN110057921 A CN 110057921A CN 201910290733 A CN201910290733 A CN 201910290733A CN 110057921 A CN110057921 A CN 110057921A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
Abstract
The present invention provides a kind of three-dimension ultrasonic imaging system, it include: a two dimension CMUT array, AFE(analog front end) transceiver module, time gain compensation module, low pass filter blocks, ADC conversion module, Digital Signal Processing and control module, the analog front end transceiver includes: that high pressure emits/receive disconnecting switch, trans-impedance amplifier, impulse generator；The array of the two dimension CMUT array and AFE(analog front end) transceiver module is correspondingly connected with by vertical through silicon via；The trans-impedance amplifier includes: a single-ended amplifier and a feedback resistance Rf；The single-ended amplifier is made of the source follower MN3 that a common-source stage amplifier MN1 cascades a N tubing type.Three-dimension ultrasonic imaging system provided by the invention, the features such as high frequency trans-impedance amplifier input resistance in analog receiver is low, mutual conductance and feedback resistance are high makes the system have wider frequency bandwidth, work is enabled a system in higher frequency, the spatial resolution of 3D imaging is higher.
Description
Technical field
The present invention relates to ultrasound medical imaging fields, and in particular to a kind of three-dimension ultrasonic imaging system.
Background technique
With the development of electronic technology and ultrasound theory, ultrasonic imaging detection device is widely used in every profession and trade, such as
Medical imaging diagnosis, submarine geomorphy drafting, resources observation, industrial nondestructive testing, supersonic sounding, submerged wreck is salvaged, naval vessels are known
The various fields such as not.Ultrasonic imaging, which refers to, detects target object using ultrasonic beam, and to the echo received or thoroughly
After ejected wave signal such as is detected, stored at the processing steps, target range, profile and inside are obtained according to different imaging modes
The information such as structure, are finally shown above- mentioned information in a manner of image.Currently, common scan-type ultrasonic imaging mainly has
Following several method, A type display mode (amplitude mode), Type B display mode (intensification modulation type), M type, D type, in recent years,
With the continuous extension of ultrasonography application field, and there is the imaging of conjunction phased array supersonic, ultrasonic imaging is focused at aperture, is spread out
Penetrate the imaging techniques such as time difference method ultrasonic imaging, ultrahigh resolution ultrasonic imaging.
Ultrasonic transducer is one of critical component of ultrasonic imaging, and performance directly determines the picture matter of imaging system
Amount.Ultrasonic transducer as a kind of energy converter device, its performance will directly affect to the detection performance of target object with
And the application field of energy converter, its major function have: (1) in launching phase: energy converter will be defeated under the action of pumping signal
The electric energy entered is changed into mechanical energy and passes, and realizes the transmitting of ultrasonic wave；(2) in the stage of reception, energy converter can convert sound
Electric signal realizes the reception of ultrasonic wave.And capacitive micromachined ultrasonic transducer (Capacitive
MicromachinedUltrasonic Transducer, CMUT) detection circuit read ultrasound echo signal play it is crucial
Effect, currently, detection method has charge and discharge detection method, method of charge transfer and across resistance amplification detection method etc..The circuit of charge and discharge electrical method
Simply, cost is relatively low, and CMOS technology realization can be used and integrate, data reading speed is very fast, and disadvantage uses DC power supply for it, puts
Drifting problem after big is serious, influences measurement effect；The charge and discharge of capacitor are controlled by electronic switch network in method of charge transfer,
But electronic switch can bring Charge injection effect, and the influence to measurement result can not avoid completely；And across resistance amplification detection circuit
Both self-oscillation can be eliminated, trailing phenomenon is improved, high-frequency range can be suitable for adjustment circuit bandwidth.
However, the bandwidth of trans-impedance amplifier (TIA) is mostly focused on 5.1MHZ existing across in resistance amplification detection circuit
To between 25MHZ, so that the reception of echoes signal of ultrasonic image-forming system is weak, 3-D supersonic imaging spatial resolution is low.In addition, by
Need to be correspondingly connected with by vertical through silicon via in the array of two-dimentional CMUT array and AFE(analog front end) transceiver module, current ultrasound at
Common single CMTU device should be consistent with single AFE(analog front end) transceiver module size in picture system, and in certain design objective
Single CMUT unit can not be matched with the possible size of single AFE(analog front end) transceiver module under it is required that, limited it and be correspondingly connected with, into
And it may be decreased 3-D supersonic imaging spatial resolution.
Summary of the invention
It is an object of the invention to: in order to overcome because working frequency it is low caused by 3-D supersonic imaging spatial resolution it is low,
Amplifier bandwidth low the deficiencies of causing reception of echoes signal weak, provide a kind of three-dimension ultrasonic imaging system.
A kind of three-dimension ultrasonic imaging system, comprising:
One two dimension CMUT array, reusable is in reception or transmitting ultrasound information；
AFE(analog front end) transceiver module, for handling the ultrasound information of two-dimentional CMUT array received or generation；
Time gain compensation module, for compensation sound wave with the intensity of range attenuation in transmission process；
Low pass filter blocks, for filtering out unnecessary noise signal；
ADC conversion module, for converting digital signal for analog signal；
Digital Signal Processing and control module, for by conversion after digital signal be input to ultrasound image processing module into
Row analysis and display；
The analog front end transceiver includes: that high pressure emits/receive disconnecting switch, trans-impedance amplifier, impulse generator；
The array of the two dimension CMUT array and AFE(analog front end) transceiver module is correspondingly connected with by vertical through silicon via；
The trans-impedance amplifier includes: a single-ended amplifier and a feedback resistance Rf；The single-ended amplifier one
The source follower MN3 that common-source stage amplifier MN1 cascades a N tubing type is constituted.
Further, three-dimension ultrasonic imaging system as described above, it includes: MOS that the high pressure, which emits/receive disconnecting switch,
Pipe MSW1With metal-oxide-semiconductor MSW2, the metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2Source electrode connection after be commonly connected to the input of trans-impedance amplifier
End；Metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2Grid carry out gating with corresponding enable signal RX_IN_EN1, RX_IN_EN2 respectively and connect；
Metal-oxide-semiconductor MSW1Drain electrode one end connect with the CMUT1 unit in two dimension CMUT array, one end is connect with impulse generator 1；Metal-oxide-semiconductor
MSW2Drain electrode one end connect with the CMUT2 unit in two dimension CMUT array, one end is connect with impulse generator 2.
Further, three-dimension ultrasonic imaging system as described above, the feedback resistance RfResistance value be 1.15K Ω,
The resistance value is directly determined by the transimpedance gain parameter of 61.18dB Ω.
Further, three-dimension ultrasonic imaging system as described above, described its promising offer of common-source stage amplifier MN1 setting
Promising its of source follower MN3 setting of the current mirror transistor of different size bias current, the N tubing type provides different size
The current mirror transistor of bias current.
The utility model has the advantages that
Three-dimension ultrasonic imaging system provided by the invention, high frequency trans-impedance amplifier input resistance in analog receiver is low,
The features such as mutual conductance and high feedback resistance, makes the system have wider frequency bandwidth, enables a system to work in higher frequency
In, so that the spatial resolution that the 3D of system is imaged is higher.
Further, since two dimension CMUT array need to be connect using reviewing packaged type with analog front end transceiver module, and it is single
The size of a CMUT device is often below the size of analog front end transceiver module, and the present invention uses two CMUT devices and one
The mode that analog front end transceiver is connected is integrated, it may be assumed that is inputted by using binary channels so that single analog front end transceiver mould
Block can be encapsulated by the shared use of two CMUT devices so as to avoid two-dimentional CMUT array and the reviewing of analog front end transceiver array
Size limitation when connection, to further improve the resolution ratio in system 3-D supersonic imaging space.
Detailed description of the invention
Fig. 1 is three-dimension ultrasonic imaging system structural schematic diagram of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, the technical solution in the present invention is carried out below
It clearly and completely describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
Fig. 1 is three-dimension ultrasonic imaging system structural schematic diagram of the present invention, as shown in Figure 1, the system includes: a two dimension
CMUT array module, analog front end transceiver module, time gain compensation module, low pass filter blocks, ADC module, number
Signal processing and control module, ultrasound image processing and display module.Wherein, two-dimentional CMUT array module be by top crown, under
The plane-parallel capacitor of pole plate, insulating layer and cavity composition, for receiving ultrasonic wave and transmitting ultrasonic wave；Analog front end transceiver
Module includes that high pressure emits/receive disconnecting switch, high frequency trans-impedance amplifier, high-voltage pulse generator；Time gain compensation module
For compensation sound wave with the intensity of range attenuation in transmission process；Low pass filter blocks are for filtering out unnecessary clutter letter
Number；In the receiving mode, the signal by time gain compensation module and low pass filter blocks enters ADC conversion module,
Under the action of Digital Signal Processing and control module, by the digital signal after conversion be input to image analysis module carry out analysis with
Display.Dimension scale based on CMOS analog front end transceiver module and CMUT module limits, and the present invention uses two CMUT devices
The mode that part is connected with a CMOS analog front end transceiver is integrated.
It includes: metal-oxide-semiconductor M that the high pressure, which emits/receive disconnecting switch,SW1With metal-oxide-semiconductor MSW2, the metal-oxide-semiconductor MSW1And metal-oxide-semiconductor
MSW2Source electrode connection after be commonly connected to the input terminal of trans-impedance amplifier；Metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2Grid respectively and phase
Enable signal RX_IN_EN1, RX_IN_EN2 is answered to carry out gating connection；Metal-oxide-semiconductor MSW1Drain electrode one end and two dimension CMUT array
The connection of CMUT1 unit, one end is connect with impulse generator 1；Metal-oxide-semiconductor MSW2Drain electrode one end and two dimension CMUT array CMUT2 it is mono-
Member connection, one end is connect with impulse generator 2.
The high voltage protective switch of the analog front end transceiver is located in high-voltage pulse generator and high frequency trans-impedance amplifier
Between, it not only can isolate high frequency trans-impedance amplifier circuit and avoided possible breakdown under emission mode, but also can be under echo reception mode
Single CMUT unit is selected, single high frequency trans-impedance amplifier is multiplexed and reads the received ultrasound letter of two CMUT units
Number, to improve imaging resolution.
The present invention is encapsulated using the array of analog front end transceiver module and two dimension CMUT array reviewing and is integrated, and top is two
Victoria C MUT array, lower section are CMOS analog front end transceiver arrays, and the two is correspondingly connected with by vertical through silicon via, compared to
Conplane cabling connection, reviewing encapsulation integrate the signal transmission distance that can reduce CMUT device to analog front end transceiver
From.And the present invention is by the way that high frequency trans-impedance amplifier to be connected to below CMUT unit by reviewing packaged type, it can be achieved that will
The charge that CMUT capacitance variations generate is changed into voltage, and input resistance is low, high transconductance, high feedback resistance.
As shown in Figure 1, CMOS high frequency trans-impedance amplifier circuit includes that two input signal accesses and an output signal are logical
Road, two input signal accesses pass through respectively high-voltage switch gear metal-oxide-semiconductor (MSW1, MSW2) and corresponding enable signal RX_IN_EN1,
RX_IN_EN2 carries out gating control, and output signal access is controlled by OUT_EN signal, and high-voltage switch gear metal-oxide-semiconductor (MSW1, MSW2) is even
High-voltage pulse generator and high frequency trans-impedance amplifier and positioned there between are connect, amplifier circuit had both been can isolate and has avoided transmitting mould
Possible breakdown under formula, and single CMUT unit can be selected under echo reception mode.Every input signal of trans-impedance amplifier
A CMUT is connected, it can be achieved that the charge that CMUT capacitance variations generate is changed into voltage, input resistance is low, high transconductance, high anti-
Feed resistance.
The circuit performance of the CMOS high frequency trans-impedance amplifier determines by the performance of CMUT device, in the present embodiment, mainly
Performance parameter such as trans-impedance amplifier bandwidth need to reach 52.5MHz, and transimpedance gain need to reach 61.18dB Ω.According to the performance requirement,
The present invention proposes that trans-impedance amplifier is by a single-ended amplifier and a feedback electricity using resistance feedback formula trans-impedance amplifier structure
Hinder RfIt constitutes, the single-ended amplifier is by a common-source stage amplifier MN1Cascade the source follower M of a N tubing typeN3It constitutes.Resistance
Value Rf=1.15K Ω is directly determined by the transimpedance gain parameter of 61.18dB Ω.MP1、MP2、MP3And MN2、MN4To press size each other
The good current mirror transistor of ratio match, for being MN1And MN3Different size of bias current required for providing, to make
It can be worked normally.The high frequency trans-impedance amplifier is for the detection application of high frequency three dimensional ultrasonic imaging, in simulation reading circuit
Front end can receive the signal of up to 52.5MHZ bandwidth, realize high frequency 3D ultrasonic imaging using across resistance amplification mode.
Therefore, the present invention realizes that the maximization of input current, increase are single-ended by reducing the input resistance of trans-impedance amplifier
The methods of the mutual conductance of amplifier and the resistance value of feedback resistance realize whole system suitable for high frequency ultrasound imaging environment.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (4)
1. a kind of three-dimension ultrasonic imaging system, comprising:
One two dimension CMUT array, reusable is in reception or transmitting ultrasound information；
AFE(analog front end) transceiver module, for handling the ultrasound information of two-dimentional CMUT array received or generation；
Time gain compensation module, for compensation sound wave with the intensity of range attenuation in transmission process；
Low pass filter blocks, for filtering out unnecessary noise signal；
ADC conversion module, for converting digital signal for analog signal；
Digital Signal Processing and control module are divided for the digital signal after conversion to be input to ultrasound image processing module
Analysis and display；
It is characterized in that, the analog front end transceiver includes: that high pressure emits/receive disconnecting switch, trans-impedance amplifier, pulse hair
Raw device；
The array of the two dimension CMUT array and AFE(analog front end) transceiver module is correspondingly connected with by vertical through silicon via；
The trans-impedance amplifier includes: a single-ended amplifier and a feedback resistance Rf；One common-source stage of the single-ended amplifier
The source follower MN3 that amplifier MN1 cascades a N tubing type is constituted.
2. three-dimension ultrasonic imaging system according to claim 1, which is characterized in that the high pressure transmitting/reception is kept apart
Pass includes: metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2, the metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2Source electrode connection after be commonly connected to put across resistance
The input terminal of big device；Metal-oxide-semiconductor MSW1With metal-oxide-semiconductor MSW2Grid respectively with corresponding enable signal RX_IN_EN1, RX_IN_EN2 into
Row gating connection；Metal-oxide-semiconductor MSW1Drain electrode one end connect with the CMUT1 unit in two dimension CMUT array, one end and impulse generator
1 connection；Metal-oxide-semiconductor MSW2Drain electrode one end connect with the CMUT2 unit in two dimension CMUT array, one end and impulse generator 2 connect
It connects.
3. three-dimension ultrasonic imaging system according to claim 2, which is characterized in that the feedback resistance RfResistance value be
1.15K Ω, the resistance value are directly determined by the transimpedance gain parameter of 61.18dB Ω.
4. three-dimension ultrasonic imaging system according to claim 2, which is characterized in that the common-source stage amplifier MN1 setting
Promising its provides the current mirror transistor of different size bias current, and the source follower MN3 of the N tubing type is arranged promising its and mentions
For the current mirror transistor of different size bias current.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114460588A (en) * | 2022-04-12 | 2022-05-10 | 杭州兆华电子股份有限公司 | High-precision imaging method based on active acoustic imager |
| WO2023284212A1 (en) * | 2021-07-16 | 2023-01-19 | 深圳市赛禾医疗技术有限公司 | Ultrasonic device and ultrasound imaging catheter |
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