CN110054799A - A kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function - Google Patents
A kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function Download PDFInfo
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- CN110054799A CN110054799A CN201910373783.0A CN201910373783A CN110054799A CN 110054799 A CN110054799 A CN 110054799A CN 201910373783 A CN201910373783 A CN 201910373783A CN 110054799 A CN110054799 A CN 110054799A
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Abstract
The present invention provides a kind of super-hydrophobic hemispherical arrays of achievable drop pie bouncing function, it is in up-narrow and down-wide circular shape, wherein matrix-vapor interface is α through extraneous gas to matrix-hemisphere interface angle, semiglobe and the diameter in substrate contact face are d, and the spacing between adjacent hemisphere is s, and vertical height of the hemisphere top away from matrix bottom surface is h, meet 70 °≤α≤90 ° respectively, 900 μm≤d≤1700 μm, s≤550 μm, 600 μm≤h≤1100 μm；Contact angle >=150 °, roll angle≤10 ° of the super-hydrophobic hemispherical array to water droplet.Drop pie bounce can be not only presented in super-hydrophobic hemispherical array proposed by the present invention, and the columnar arrays of more existing achievable pie bouncing function have better mechanical strength, this is great to the practical application dissemination on pie spring surface.
Description
Technical field
The invention belongs to technical field of function materials, it is related to a kind of super-hydrophobic hemispherical array, and can realizes drop pie
Bouncing function, specially a kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function.
Background technique
In recent years, transmission of electricity thread breakage, the increase of aircraft flight resistance, vehicle and the road surface friction force that may cause for sleet
The safety problems such as reduction, it is short that researcher has been devoted to liquid-solid time of contact when super hydrophobic surface specific by droplets impact
And the feature that easily tumbles prevents sleet from adhering to.In view of the drop to fixed volume, liquid-solid time of contact hardly follows shock
Speed and change, how to further decrease liquid-solid time of contact to improve the anti-sleet freezing of super hydrophobic surface have weight
Want meaning.Between 2013-2015, it is carinate that researcher has found that drop hits high 180 μm of strip on super hydrophobic surface successively
Structure (Nature.2013,503:385-388), diameter height are tens to several hundred micron-sized strip ridge column structures
(Nature Communications.2015,6:8001) and several millimeters of diameter laterally disposed of strip cylindrical-shaped structure
When curved surface (Nature Communications.2015,6:10034), liquid-solid time of contact equal decrease to some degree.So
And major part raindrop will not be dropped on above-mentioned carinate or cylindrical-shaped structure curved surface when practical application, application value is lower.
Until 2014, Liu et al. take the lead in reporting 20 μm~100 μm of droplets impact diameter, 800 μm~1200 μm of height,
It will appear pie spring (Nature Physics, 2014,10:515- on 100 μm of spacing of super-hydrophobic cone column and square column array
519), liquid-solid time of contact is reduced by about 80%.This kind of submillimeter level column structure can guarantee that raindrop contact, using valence
It is worth larger.2016, Hecksher etc. successfully amplified scale nearly a hundred times, in the nail plate that aqueous vapor ball impact spacing is 1.85cm
Macroscopical pie bouncing function (European Journal of Physics, 2016,38) is realized when array.2017, applicant
It has also been found that diameter≤1250 μm, 600 μm~1000 μm of height, the super-hydrophobic cylindrical-arrays of spacing≤250 μm can also realize drop
Pie spring (ACS nano, 2017,11:9259-9267, the patent No. 201710555340.4 and 201710568996.X), and
The size is easy to large area processing.But the ratio of height to diameter of super-hydrophobic cone column array, square column array and cylindrical-array is excessive, mechanical strong
Spend it is relatively low, and be used for aircraft surfaces when be also easy to produce big resistance, influence its practical application.Drop pie bullet can both be realized by designing
Function is jumped, and has smaller ratio of height to diameter, higher mechanical strength, the new structure array of drag-reduction effect extremely important.
Summary of the invention
The present invention is intended to provide a kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function, drop hits super thin
When water hemisphere array, which can assemble a large amount of capillary energy and then discharge, and realize that drop pie bounces.
Technical solution of the present invention:
A kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function is in up-narrow and down-wide circular shape, wherein base
Body-vapor interface is α through extraneous gas to matrix-hemisphere interface angle, and the diameter in semiglobe and substrate contact face is d, phase
Spacing between adjacent hemisphere is s, and vertical height of the hemisphere top away from matrix bottom surface is h, respectively 70 °≤α≤90 ° of satisfaction, 900 μm
≤ d≤1700 μm, s≤550 μm, 600 μm≤h≤1100 μm；The super-hydrophobic hemispherical array to the contact angle of water droplet >=
150 °, roll angle≤10 °.
Beneficial effects of the present invention:
(1) the invention proposes a kind of new structures of achievable drop pie bouncing function --- super-hydrophobic half spherical array
Column；
(2) ratio of height to diameter of super-hydrophobic hemispherical array proposed by the present invention is up to 0.48 or more；
(3) the super-hydrophobic cone column of the more existing achievable drop pie spring of super-hydrophobic hemispherical array proposed by the present invention,
Square column and cylindrical-array have better mechanical strength.
Detailed description of the invention
Fig. 1 is the schematic diagram of super-hydrophobic hemispherical array structural parameters.
Fig. 2 is α=71 °, d=1570 μm, s=160 μm, the structure chart of h=890 μm of super-hydrophobic hemispherical array.
Fig. 3 is 21.0 μ L droplets impact α=71 °, d=1570 μm, s=160 μm, h=890 μm of super-hydrophobic hemispherical array
Motion conditions.
Fig. 4 is the electron microscope of the magnesium alloy mold of 300 μm of hemisphere micro-pit array.
Specific embodiment
With reference to the accompanying drawing and technical solution, a specific embodiment of the invention is further illustrated.
Embodiment
A kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function of the invention, as shown in Fig. 2, present it is narrow under
Wide circular shape, wherein matrix-vapor interface is α=71 ° through extraneous gas to matrix-hemisphere interface angle, semiglobe with
The diameter in substrate contact face is d=1570 μm, and the spacing between adjacent hemisphere is s=160 μm, and hemisphere top is away from matrix bottom surface
Vertical height is h=890 μm, and ratio of height to diameter reaches 0.56；The super-hydrophobic hemispherical array is 160 ° to the contact angle of water droplet,
Roll angle is 3 °；Pie bounce status is presented in the 21.0 μ L droplets impacts super-hydrophobic array, as shown in Figure 3.
The processing technology of the super-hydrophobic hemispherical array of above-mentioned achievable drop pie bouncing function, steps are as follows:
(1) it pre-processes: acetone being carried out to 30mm × 40mm × 2mm magnesium alloy plate and cleans oil removing, then uses 800# respectively
Polishing removal is carried out with the polishing of 1500# sand paper, then is cleaned by ultrasonic with deionized water, is dried up；
(2) prepared by exposure mask: successively by light actuating resisting corrosion dry film HT200 and 600 μm of exposure mask aperture, exposure mask of the center away from 1.9mm
Plate is affixed on pretreated magnesium alloy plate, then under the ultraviolet light of wavelength 360nm irradiate 30s to cause photopolymerization reaction,
Again in the Na of mass fraction 5%2CO3Develop 2min in solution, to replicate on pattern to dry film；
(3) it Electrolyzed Processing: is installed respectively using the magnesium alloy plate for being covered with dry film and with the copper sheet of size as anode and cathode
On side blow fixture, adjustment processing gap is 1mm, then makes interpolar full of mass fraction 15% by electrolyte circulation system
NaNO3Solution, and in current density 14Acm-2, frequency 20kHz, duty ratio 30% pulse parameter under process 2min, then will
Magnesium alloy plate taking-up is placed in immersion 4min striping in the NaOH solution of mass fraction 5%, and obtaining after cleaned, drying has hemisphere
The magnesium alloy mold of micro-pit array, as shown in Figure 4；
(4) micro-nano structure constructs: to magnesium alloy mold obtained in step (3) in frequency 20kHz, 50 W of power, scanning
Nanometer laser scanning machining is carried out under speed 200mm/s parameter, then carries out deionized water ultrasonic cleaning, drying；
(5) duplication processing: magnesium alloy mold obtained in step (4) is poured using PDMS module glue, through vacuum
Deaeration 2h under environment, heating 6h is solidified at 60 DEG C, and then directly manually demoulding obtains PDMS hemispherical array；
(6) PDMS hemispherical array obtained in step (3) super-hydrophobic processing: is placed in the silicon fluoride second of mass fraction 1%
40min is modified in alcoholic solution, takes out drying to get super-hydrophobic hemispherical array is arrived, as shown in Figure 2.
Claims (1)
1. a kind of super-hydrophobic hemispherical array of achievable drop pie bouncing function, it is characterised in that: the super-hydrophobic hemispherical array
In up-narrow and down-wide circular shape, wherein matrix-vapor interface is α, semiglobe through extraneous gas to matrix-hemisphere interface angle
Diameter with substrate contact face is d, and the spacing between adjacent hemisphere is s, and vertical height of the hemisphere top away from matrix bottom surface is h,
70 °≤α≤90 ° of satisfaction respectively, 900 μm≤d≤1700 μm, s≤550 μm, 600 μm≤h≤1100 μm, and ratio of height to diameter h/d >=
0.48；Contact angle >=150 °, roll angle≤10 ° of the super-hydrophobic hemisphere to water droplet.
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| CN201910373783.0A CN110054799B (en) | 2019-05-07 | 2019-05-07 | Super-hydrophobic hemisphere array capable of realizing cake-shaped bouncing function of liquid drops |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112742071A (en) * | 2021-01-13 | 2021-05-04 | 西南科技大学 | Structure for directional transportation and separation of low surface energy microdroplets and preparation method |
| CN113477285A (en) * | 2021-07-21 | 2021-10-08 | 杜林� | Micro-droplet array chip system and method |
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| CN113477285A (en) * | 2021-07-21 | 2021-10-08 | 杜林� | Micro-droplet array chip system and method |
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