CN110035630B - High-strength sealing and injection molding process for integrated circuit - Google Patents
High-strength sealing and injection molding process for integrated circuit Download PDFInfo
- Publication number
- CN110035630B CN110035630B CN201910255008.5A CN201910255008A CN110035630B CN 110035630 B CN110035630 B CN 110035630B CN 201910255008 A CN201910255008 A CN 201910255008A CN 110035630 B CN110035630 B CN 110035630B
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- China
- Prior art keywords
- injection molding
- pressure injection
- low
- circuit board
- adhesive layer
- Prior art date
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 107
- 238000007789 sealing Methods 0.000 title claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims abstract description 27
- 229920003023 plastic Polymers 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 7
- 239000004831 Hot glue Substances 0.000 claims description 4
- 229920006351 engineering plastic Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 230000035939 shock Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000012544 monitoring process Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an integrated circuit high-strength sealing and injection molding process, which comprises the following steps of: firstly, protecting and fixing a circuit board by using a hard plastic sheath, then placing the fixed circuit board into low-pressure injection molding equipment for low-pressure injection molding to obtain a low-pressure injection molding adhesive layer wrapping the circuit board, confirming that the low-pressure injection molding adhesive layer completely fills the hard plastic sheath, and finally, wrapping and injecting a high-pressure injection molding adhesive layer with a softening point higher than that of the low-pressure injection molding adhesive layer outside the hard plastic sheath by using a high-pressure injection molding process. The invention has smart process structure, skillfully carries out wrapped high-pressure injection molding which does not affect the low-pressure injection molding adhesive layer outside the low-pressure injection molding, thus not affecting the function of the product, meeting the requirement of high-strength mechanical property, finally meeting the effects of water resistance, drop resistance and temperature resistance of the product in the use process, and being particularly outstanding in the aspects of shock resistance and drop resistance, so that the product can be used for portable mobile medical monitoring equipment, and has huge social value and strong practicability.
Description
Technical Field
The invention belongs to the field of integrated circuits, and particularly relates to a high-strength sealing and injection molding process of an integrated circuit.
Background
The existing portable medical monitoring products in the market are various, such as an electronic blood pressure detector, an electronic blood sugar detector, a sleep monitor, an electrocardiograph monitor and the like, and the various products generally adopt a plastic shell assembly structure, are waterproof, and can only realize life waterproofing (daily cleaning), and the products drop or soak carelessly in the use process, so that the shell is possibly damaged to be water, the acquired life data is distorted, and the original expected functions are lost. In the field of low-pressure injection molding, integrated circuit board packaging is common, but the integrated circuit board packaging has limited pressure resistance degree and low softening point (about 120 ℃) due to softer sizing materials, and can only be used in a limited way according to basic waterproof function. There are also attempts to directly perform high-pressure injection molding after low-pressure injection molding, but because of the temperature difference, the low-pressure injection molding layer injected before is scattered and mixed with the high-pressure injection molding layer, so that the product has no impact resistance of high-pressure injection molding and no good shock absorption and flexibility of low-pressure injection molding, and therefore, a better packaging method is always desired.
Disclosure of Invention
The invention aims to solve the technical problem of providing the integrated circuit high-strength sealing glue injection molding process which has the advantages of simple and ingenious production process and high-pressure injection molding and low-pressure injection molding.
The invention is realized by the following technical scheme:
an integrated circuit high-strength sealing and injection molding process comprises the following steps: firstly, protecting and fixing a circuit board by using a hard plastic sheath, then placing the fixed circuit board into low-pressure injection molding equipment for low-pressure injection molding to obtain a low-pressure injection molding adhesive layer wrapping the circuit board, confirming that the low-pressure injection molding adhesive layer completely fills the hard plastic sheath, and finally, wrapping and injecting a high-pressure injection molding adhesive layer with a softening point higher than that of the low-pressure injection molding adhesive layer outside the hard plastic sheath by using a high-pressure injection molding process.
Preferably, the low-pressure injection molding adhesive layer is a hot melt adhesive.
Preferably, the low-pressure injection molding adhesive layer is heated and hot melted by a one-stage type melt adhesive cylinder.
Preferably, the pressure of the low pressure injection molding is in the range of 1 to 5kg.f.
Preferably, the power source for the low-pressure injection molding is industrial air pressure.
Preferably, the material of the high-pressure injection molding glue layer comprises engineering plastics, PP, PE, PVC, TPE, TPU.
Preferably, the raw material of the high-pressure injection molding adhesive layer adopts segmented melting materials.
Preferably, the pressure of the high-pressure injection molding is in the range of 10 to 130kg.f.
Preferably, the power source of the high-pressure injection molding is oil pressure.
When the volume of the circuit board is large or the height of the electronic component is greatly different, as a preferable mode, before the circuit board is protected and fixed by using a hard plastic sheath and then the fixed circuit board is put into low-pressure injection molding equipment to be subjected to low-pressure injection molding, according to the difference of the parts, a layer of pre-low-pressure injection molding glue layer is coated on the circuit board through a low-pressure injection molding process, namely, the first low-pressure injection molding is performed, and then the subsequent second low-pressure injection molding wrapping and high-pressure injection molding wrapping are performed on the basis of the pre-low-pressure injection molding glue layer, so that the probability of bubble generation under the high-temperature condition during high-pressure injection molding due to the fact that the glue layer of the low-pressure injection molding is too thick can be reduced or reduced, and the pressure during the high-pressure injection molding can not cause deformation of the circuit board.
The beneficial effects of the invention are as follows:
The invention has ingenious process structure, the circuit board is protected and fixed by selecting a proper structure, then the circuit board is filled with low-pressure injection in low-pressure injection molding equipment together with the protection structure, and then the outside of the protection structure is covered with a layer of plastic with higher temperature resistance, namely, the high-pressure injection molding which is covered by a layer of plastic with higher temperature resistance is skillfully carried out outside the low-pressure injection molding, so that the function of the product is not influenced, the requirement of high-strength mechanical property is met, the waterproof, anti-falling and temperature-resistant effects of the product in the use process are finally met, the shock resistance and anti-falling aspects are particularly outstanding, the function of the product and the transmission authenticity of data acquisition can still be ensured under special environments such as earthquake, fire disaster and the like, so that the circuit board can be used for portable mobile medical monitoring equipment due to the excellent mechanical property and sealing property, has huge social value and strong practicability and is worth popularizing.
Drawings
For ease of illustration, the invention is described in detail by the following specific examples and figures.
FIG. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of the two low pressure injection molding process of embodiment 2 of the present invention.
Detailed Description
Example 1
As shown in fig. 1, a high-strength molding process for an integrated circuit includes the following steps: firstly, a circuit board 1 is protected and fixed by a hard plastic sheath 2, then the fixed circuit board 1 is put into low-pressure injection molding equipment for low-pressure injection molding, a low-pressure injection molding adhesive layer 3 wrapping the circuit board is obtained, the fact that the low-pressure injection molding adhesive layer 3 is filled and filled in the hard plastic sheath 2 completely is confirmed, finally, a plastic layer 4 with the softening point higher than that of the low-pressure injection molding adhesive layer is wrapped and molded outside the hard plastic sheath 2 by using a high-pressure injection molding process, specifically, the circuit board 1 and the hard plastic sheath 2 are connected through the low-pressure injection molding adhesive layer 3, and then the high-pressure injection molding adhesive layer 4 with the softening point higher than that of the low-pressure injection molding adhesive layer is processed.
The low-pressure injection molding adhesive layer 3 is a hot melt adhesive.
The low-pressure injection molding adhesive layer 3 is heated and hot melted by a one-section type melt adhesive cylinder.
The pressure range of the low-pressure injection molding is 1-5 kg.
The power source of the low-pressure injection molding is industrial air pressure.
The material from which the plastic layer 4 having a softening point higher than that of the low pressure injection molded glue layer is made comprises engineering plastic, PP, PE, PVC, TPE, TPU.
The plastic layer 4 with the softening point higher than that of the low-pressure injection molding adhesive layer is prepared from sectional type melting materials.
The pressure range of the high-pressure injection molding is 10-130 kg.
The power source of the high-pressure injection molding is oil pressure.
The low-pressure injection molding adhesive layer is hot melt adhesive, and is melted once, and the circuit board is sealed by using small pressure, so that the electronic components on the circuit board cannot be damaged due to the small pressure, and meanwhile, the requirements of moisture resistance and water resistance can be met, so that the service life of the product is prolonged. The low-pressure molded sizing material has certain strength and toughness after being cooled, and the high-pressure injection molding is performed outside the protective structure for the purposes of attractive appearance and anti-falling, shock-resistant and anti-falling effects of the product, so that the inside cannot be damaged due to pressure.
Example 2
As shown in fig. 2, when the volume of the circuit board is large or the height of the electronic component is greatly different, the other features are the same as those of embodiment 1, but before the circuit board is first protected and fixed by using a hard plastic sheath and then the fixed circuit board is put into a low-pressure injection molding device to perform low-pressure injection molding, according to the difference of the parts, a layer of pre-low-pressure injection molding glue layer is coated on the circuit board through a low-pressure injection molding process, namely, the first low-pressure injection molding is performed, and then the subsequent second low-pressure injection molding and high-pressure injection molding are performed on the basis of the pre-low-pressure injection molding glue layer, so that the probability of generating bubbles under the high-temperature condition during high-pressure injection molding due to the excessively thick glue layer of the low-pressure injection molding can be reduced or reduced, and the pressure during high-pressure injection molding can not cause deformation of the circuit board.
The invention has ingenious process structure, the circuit board is protected and fixed by selecting a proper structure, then the circuit board is filled with low-pressure injection in low-pressure injection molding equipment together with the protection structure, and then the outside of the protection structure is covered with a layer of plastic with higher temperature resistance, namely, the high-pressure injection molding which is covered by a layer of plastic with higher temperature resistance is skillfully carried out outside the low-pressure injection molding, so that the function of the product is not influenced, the requirement of high-strength mechanical property is met, the waterproof, anti-falling and temperature-resistant effects of the product in the use process are finally met, the shock resistance and anti-falling aspects are particularly outstanding, the function of the product and the transmission authenticity of data acquisition can still be ensured under special environments such as earthquake, fire disaster and the like, so that the circuit board can be used for portable mobile medical monitoring equipment due to the excellent mechanical property and sealing property, has huge social value and strong practicability and is worth popularizing.
The foregoing is merely illustrative of specific embodiments of the present invention, and the scope of the invention is not limited thereto, but any changes or substitutions that do not undergo the inventive effort should be construed as falling within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (1)
1. The integrated circuit high-strength sealing and injection molding process is characterized by comprising the following steps of: firstly, protecting and fixing a circuit board by using a hard plastic sheath, then putting the fixed circuit board into low-pressure injection molding equipment for low-pressure injection molding to obtain a low-pressure injection molding adhesive layer wrapping the circuit board, confirming that the low-pressure injection molding adhesive layer completely fills and fills the hard plastic sheath, and finally wrapping and injecting a high-pressure injection molding adhesive layer with a softening point higher than that of the low-pressure injection molding adhesive layer outside the hard plastic sheath by using a high-pressure injection molding process; the low-pressure injection molding adhesive layer is a hot melt adhesive; the material of the high-pressure injection molding glue layer comprises engineering plastic, PP, PE, PVC, TPE, TPU; the pressure range of the low-pressure injection molding is 1-5 kg.f; the pressure range of the high-pressure injection molding is 10-130 kg.f; in order to reduce or reduce the probability of air bubbles generated under the high temperature condition when the glue layer is too thick, the circuit board is protected and fixed by using a hard plastic sheath, and then the fixed circuit board is put into low-pressure injection molding equipment to be subjected to low-pressure injection molding, a layer of pre-low-pressure injection molding glue layer is coated on the circuit board through a low-pressure injection molding process according to different parts according to the height of the parts, namely, the first low-pressure injection molding is firstly carried out, and then the subsequent second low-pressure injection molding and high-pressure injection molding are carried out on the basis of the pre-low-pressure injection molding glue layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910255008.5A CN110035630B (en) | 2019-04-01 | 2019-04-01 | High-strength sealing and injection molding process for integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910255008.5A CN110035630B (en) | 2019-04-01 | 2019-04-01 | High-strength sealing and injection molding process for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110035630A CN110035630A (en) | 2019-07-19 |
| CN110035630B true CN110035630B (en) | 2024-08-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910255008.5A Active CN110035630B (en) | 2019-04-01 | 2019-04-01 | High-strength sealing and injection molding process for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110035630B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111571922A (en) * | 2020-04-10 | 2020-08-25 | 仝达科技（惠州）有限公司 | Electronic element, plastic coating process with resistor microswitch and microswitch with resistor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206379581U (en) * | 2017-01-12 | 2017-08-04 | 东莞市因特肯波实业有限公司 | Connector structure with independent internal protection |
| CN207118133U (en) * | 2017-07-14 | 2018-03-16 | 东莞市百维科技有限公司 | Circuit board protection structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049837A (en) * | 2009-11-11 | 2011-05-11 | 滕艺科技有限公司 | Ink-washout-resistant intra-mode decoration framework |
| CN203057751U (en) * | 2013-01-04 | 2013-07-10 | 郑州跃博汽车电器有限公司 | A sealing type electric box structure and an electric box with the structure |
-
2019
- 2019-04-01 CN CN201910255008.5A patent/CN110035630B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206379581U (en) * | 2017-01-12 | 2017-08-04 | 东莞市因特肯波实业有限公司 | Connector structure with independent internal protection |
| CN207118133U (en) * | 2017-07-14 | 2018-03-16 | 东莞市百维科技有限公司 | Circuit board protection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110035630A (en) | 2019-07-19 |
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