CN110035603A - A kind of preparation method of printed circuit potting inductance - Google Patents
A kind of preparation method of printed circuit potting inductance Download PDFInfo
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- CN110035603A CN110035603A CN201910337319.6A CN201910337319A CN110035603A CN 110035603 A CN110035603 A CN 110035603A CN 201910337319 A CN201910337319 A CN 201910337319A CN 110035603 A CN110035603 A CN 110035603A
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- inductance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
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- Manufacturing Cores, Coils, And Magnets (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
A kind of preparation method of printed circuit potting inductance, belongs to inductance preparation technical field.The present invention is by sequentially forming metal seed layer and graphical resist layer in dielectric surface, metallic conductor structure is formed on the metal seed layer of no resist layer covering, and graphical resist layer and its lower metal seed layer covered are removed as sacrificial layer, the depositing magnetic film in metallic conductor structure again, to realize the production of printed circuit potting inductance.The present invention can be realized the production potting inductance on any substrate, so that potting inductance element is using more convenient and flexible；The inductance value that product is made is promoted significantly, while also avoiding making the uncontrollable problem of inductance performance caused by through-hole on permeability magnetic material；Preparation process is compatible with printed circuit board production line, without increasing additional process, reduces the investment of equipment and technology, advantageously reduces cost, realize industrialized production.
Description
Technical field
The invention belongs to inductance preparation technical fields, and in particular to a kind of preparation method of printed circuit potting inductance.
Background technique
As electronic equipment develops to miniaturization, functionalization, high integration direction, all kinds of electronic components certainly will be proposed more
High requirement.Inductance element plays important as important magnetic element in terms of high frequency, the transmission of microwave frequency band signal and processing
Effect as technology development has developed into two-dimensional structure of today via initial three-dimensional structure, and is being printed by potting
Inside circuit board.This potting becomes in the development that the inductance of printed circuit intralamellar part can not only meet electronic system high integration
Gesture, while electric signal can also be made to realize minimum range transmission, improve signal transmission integrity.Printed circuit potting inductive technologies
Already become research hotspot instantly.
Wang Yue is disclosed on the monosilicon in " institutional framework and performance study of magnetron sputtering C o and CoTaZr film "
Magnetron sputtering magnetic material forms the method that inductive circuit prepares thin film inductor, and entire inductance coil is all by magnetism in this method
Material is formed, and the potting inductance cost for making same inductance value is higher, while in actual circuit, between each circle coil of inductance mutually
Feel stronger, inductance performance is low.Kim etc. is in document " Thick-copper-buried inductors using anodized
Aluminum package substrates " in describe it is a kind of with excess metalization realize inductance coil production method, should
Method requires production groove then to carry out metal filling according to coil, and the inductance value of made potting inductance can only be by increasing line
Circle number is promoted, and the miniaturization of inductance element is unfavorable for.In order to increase the magnetic induction intensity of electromagnet, in inductance coil
Magnetic circuit in introduce magnetic conduction substance, the presence of magnetic conduction substance can enhance the magnetic flux density (magnetic flux) of electromagnetic coil magnetic circuit,
Inductor loss is reduced, and then increases electromagnetic intensity, is advantageously implemented the micromation of induction structure.In printed circuit potting electricity
The technology that magnetic conduction substance is constructed in sense realizes tremendous development under the effort of researcher.A kind of Chinese invention patent " printing
The induction structure and preparation method thereof of circuit board potting technology " a kind of elder generation is disclosed in (application No. is CN201610791943.X)
Magnetic conduction is formed in conductive coil surface cure in the copper foil etching conductive coil of double-sided copper-clad substrate, then by magnetic composite
The method of substance production printed circuit potting inductance.But this method complex process, the substrate for making potting inductance are restricted, nothing
Method is realized makes potting inductance on arbitrary medium.And with the extensive use of electronic product surface mounting technology (SMT), this is just
So that when component further integrates construction complete machine integrity problem may be caused due to material mismatch.Chinese invention patent
" production method of thin magnetic film pressure type blind hole electromagnetic induction multilayer printed circuit board " (application No. is CN201410285999.9)
In disclose it is a kind of first using laminating method make magnetic conduction substance, then on magnetic conduction substance make guide hole formed printed circuit bury
The method of embedding inductance, this method are easily destroyed the connection of magnetic conduction substance and substrate, magnetic conduction substance are caused to separate with substrate, in turn
Inductance performance is caused to be unable to control.Chen Jian etc. will in document " a kind of inductance core embedment PCB technology in an assembling process "
Magnetic conduction substance is integrally embedded to printed circuit intralamellar part, constructs hot-wire coil by metallization VIA, this method passes through through-hole and leads
Magnetic substance combines to obtain the printed circuit potting inductance with high inductance value, complex process, at high cost, and in printed circuit
Additional increase process is needed when slat production line produces, with PCB technology poor compatibility.A kind of Chinese invention patent " printed circuit board
The preparation method of potting core inductance " in describe one kind directly on inductance coil one layer of non-metal alloy magnetism material of chemical plating
Material, the method for preparing printed circuit potting inductance magnetic conduction substance.This method simple process, production cost is low, mentions to inductance value
Rising has a positive effect, but the obtained non-metal alloy of this method had not only been used as the conductor of electric signal posting, but also as magnetic conduction substance,
The biggish non-metal alloy of resistance value be easy to cause inductance quality factor low.Sugawa etc. is in document " Carbonyl-iron/
epoxy composite magnetic core for planar power inductor used in package-level
Power grid " and model jump agriculture etc. in document " design and performance study of inductor Ni-Cu-Zn ferrite film "
Describe by magnetic composite that ferrite and resin are mixed to get using silk-screen printing be covered on inductance coil surface come
The method for promoting inductance value.But use method for printing screen since there are thickness errors for technique itself, so that in same process
Under obtained inductance value error it is larger, inductance performance is unable to get control.
Summary of the invention
Substrate is limited and PCB technology poor compatibility, inductance performance are uncontrollable etc. is made for potting inductance in the prior art
Problem, the present invention provides a kind of preparation methods of printed circuit potting inductance, by sequentially forming metal kind in dielectric surface
Sublayer and graphical resist layer form metallic conductor structure on the metal seed layer of no resist layer covering, and will be graphical
Resist layer and its lower metal seed layer covered are removed as sacrificial layer, then magnetic core film is deposited in metallic conductor structure, from
And realize the production of printed circuit potting inductance.In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is specifically such as
Under:
A kind of preparation method of printed circuit potting inductance, which comprises the steps of:
Step: 1: forming metal seed layer in dielectric layer surface；
Step 2: the resist layer through pattern transfer technology cover graphics on the metal seed layer made from step 1；
Step 3: growing metal conductor layer on the metal seed layer of no resist layer covering；
Step 4: removing the metal seed layer of the resist layer and resist layer covering, the conductor knot of potting inductance is prepared
Structure；
Step 5: the conductor structure surface made from step 4 forms thin magnetic film.
Further, further include the steps that brownification is handled before carrying out step 5, so that the conductor structure table of potting inductance
Face forms organic metal film layer.
Further, metal seed layer is formed in the step 1 use sputtering technology or chemical plating process.
Further, the chemical plating process includes the process of cleaning, microetch, preimpregnation, activation and chemical plating.
Specifically, metal seed layer is formed in the step 1 may be selected sputtering titanium copper, electroless copper, chemical plating stannum or change
It is one of to learn nickel plating.
Further, graphical resist layer is designed according to the conductor structure of potting inductance in the step 2, and the two is in plane
Upper complementation.
Further, thin magnetic film is preferably pure cobalt thin film or nonmetallic cobalt composite material in the step 5.
Further, the method that thin magnetic film is formed in the step 5 is magnetron sputtering, plating or inkjet printing.
As a kind of specific embodiment, the concrete operations that cobalt film is electroplated in the step 5 are as follows: step 4 being made and is led
Body structure, which is placed in electroplate liquid, prepares pure cobalt thin film；Plating conditions are specific as follows: electroplate liquid pH be 3~6, electroplating temperature be 20~
40 DEG C, current density is 0.5~4A/dm2, electroplating time is 5~90min；The composition of the electroplate liquid include concentration be 20~
The first complexing agent that the cobalt salt of 300g/L, concentration are 1~2000mg/L, the second complexing agent that concentration is 1~200mg/L, concentration
For the buffer of 10~50g/L, pH adjusting agent and deionized water, wherein first complexing agent include glycine, alanine,
The mixing of any one or more in valine, leucine, isoleucine, aspartic acid, glutamic acid, lysine and arginine
Object, second complexing agent include any one in sodium polydithio-dipropyl sulfonate and 3-sulfydryl-1-propane sulfonic acid sodium or two kinds
Mixture, cobalt salt is any one or more combination in cobalt chloride, cobaltous sulfate, cobalt acetate, cobalt nitrate and sulfamic acid cobalt
Object, the pH adjusting agent are acid and/or sodium hydroxide corresponding to anion in cobalt salt, and the buffer is preferably boric acid.
As a kind of specific embodiment, the concrete operations of magnetron sputtering cobalt film are as follows in the step 5: being splashed by magnetic control
Cobalt film is all covered on and handles obtained printed circuit plate surface through step 4 by jet device, then covers on conductor structure surface
Resist, then the cobalt film of no resist protection is etched away, finally removing resist is the production for realizing thin magnetic film.Through magnetic control
Sputtering and the thickness of magnetic cobalt film is made is preferably 0.1~1 μm.
As a kind of specific embodiment, the concrete operations of inkjet printing cobalt film are as follows in the step 5: being beaten by ink-jet
Impression method obtains conductor structure surface or is coated with the conductor structure surface of organic metal film layer directly to beat in step 4 processing
Print cobalt film composite material；Raw material used in inkjet printing includes thermoplastic resin and cobalt granule, wherein thermoplastic resin is poly- cream
Acid, polyethylene, polypropylene, any one in polybutadiene, cobalt granule mass fraction is 60%~90%.
Compared with prior art, beneficial effects of the present invention are as follows:
(1) present invention has innovated the means that induction structure (conductive coil) is buried in substrate, and then in induction structure table
Face modified magnetic film realizes that the inductance for forming thin magnetic film is embedding in printed circuit board.It is made compared to existing subtractive process
Conductive coil, the present invention can be realized the production potting inductance on any substrate, and then SMT technology is avoided to realize that component is integrated
When material mismatch adverse effect so that potting inductance element is using more convenient and flexible.
(2) present invention provides a kind of method for preparing printed circuit potting inductance, compared with existing laminating method, in conductor knot
It can first be punched before being configured to, and realize through-hole (i.e. hole metallization) while forming metal seed layer, so as to avoid
The uncontrollable problem of inductance performance caused by through-hole is made on magnetic core.
(3) present invention provides a kind of method for preparing printed circuit potting inductance, and simple process is controllable, can be with printing electricity
Road plate production line is compatible, without increasing additional process, reduces the investment of equipment and technology, advantageously reduces cost,
Realize industrialized production.
(4) present invention provides a kind of method for preparing printed circuit potting inductance, passes through the conductor structure in potting inductance
Upper progress brownification processing makes conductor structure surface form organic metal film, and then redeposited thin magnetic film, organic using metal
Film has biggish resistance value, so that barrier layer of the organic metal film as potting inductance copper conductor and thin magnetic film, is protected
The magnetic property of barrier thin magnetic film effectively plays, and the inductance value for being advantageously implemented potting inductance promotes effect.
(5) present invention provides a kind of method for preparing printed circuit potting inductance, is splashed using inkjet printing, plating and magnetic control
Depositing magnetic film is penetrated, the defect that inductance error is big under same process present in traditional silk-screen printing technique can be overcome, had
Conducive to the inductance element for obtaining stability, the stability of product is improved, and then realizes mass production.
Detailed description of the invention
Fig. 1 is that the printed circuit potting inductance that the embodiment of the present invention 1 provides forms thin magnetic film based on magnetron sputtering method
Production process schematic diagram is illustrated using section in figure.
Fig. 2 is that the printed circuit potting inductance that the embodiment of the present invention 2 provides forms thin magnetic film based on ink-jet printing
Production process schematic diagram is illustrated using section in figure.
Fig. 3 is the production that the printed circuit potting inductance that the embodiment of the present invention 3 provides forms thin magnetic film based on galvanoplastic
Flow diagram is illustrated using section in figure.
Fig. 4 is the section metallographic microscope that product is made in the embodiment of the present invention 1.
Fig. 5 is the section metallographic microscope that product is made in the embodiment of the present invention 2.
Fig. 6 is the section metallographic microscope that product is made in the embodiment of the present invention 3.
Fig. 7 is that the coating surface for the printed circuit potting inductance that the embodiment of the present invention 3 and comparative example 1 and 2 provide is micro-
See shape appearance figure.
Fig. 8 is the inductance value for the printed circuit potting inductance that different plating systems provide.
Specific embodiment
In order to enable one of ordinary skill in the art can more understand the present invention program and principle, with reference to the accompanying drawing and have
Body embodiment is described in detail, and following embodiment is said to the printed circuit potting inductance of surface modification magnetic cobalt film
It is bright, it will be appreciated by those skilled in the art that the present invention is not limited to the printed circuit potting inductance of surface modification magnetic cobalt film,
This method is suitable for the production of the printed circuit potting inductance of any thin magnetic film modification.
Embodiment 1:
A kind of printed circuit potting inductance and its surface magnetism film forming method, implementing procedure is as shown in Figure 1, specific real
Apply step are as follows:
(1) metal seed layer is formed
A. it cleans: preparing the sulfuric acid for being 5% by concentration of volume percent, the OP emulsion that concentration of volume percent is 5%
And the acid deoiling liquid of deionized water composition；The epoxy resin base plate of 4cm × 5cm is impregnated in 50 DEG C of acid deoiling liquid
3min, ultrasonic treatment 1min are rinsed epoxy resin base plate with deionized water after oil removal treatment with removing the greasy dirt on surface
Completely to remove the degreasing fluid for being attached to surface；
B. microetch: the sulfuric acid for being 5% by concentration of volume percent, the sodium peroxydisulfate of 50g/L and deionized water are prepared and is formed
Micro-corrosion liquid；The epoxy resin base plate obtained after step a processing is ultrasonically treated 2min in 25 DEG C of micro-corrosion liquids, becomes surface
Rough coarse structure guarantees that coating is combined closely with surface, and microetch after treatment deionized water is by epoxy resin
Substrate is rinsed well to remove the micro-corrosion liquid for being attached to surface；
C. it presoaks: preparing the prepreg solution that the sulfuric acid and deionized water that are 5% by concentration of volume percent form；By step b
The epoxy resin base plate obtained after processing impregnates 1min in 25 DEG C of prepreg solutions, adjustment epoxy resin-matrix plate surface attachment solution
Acid-base property maintains the acidity of activated bath；
D. activate: metal is prepared to be made of 60mg/L palladium chloride, the sulfuric acid that concentration of volume percent is 5% and deionized water
Activating solution；The epoxy resin base plate obtained after step c processing is impregnated into 5min in 25 DEG C of prepreg solutions, in epoxy resin base plate
Crystal seed is catalyzed required for the deposition of surface；
E. it makes metal seed layer: preparing by 25g/L copper chloride, 20g/L copper sulphate, 4g/L formaldehyde, 20g/L ethylenediamine tetraacetic
The copper plating bath that acetic acid disodium salt, 10g/L sodium potassium tartrate tetrahydrate, 15g/L sodium hydroxide and deionized water form；After step d processing
Obtained epoxy resin base plate impregnates 5min in 35 DEG C of copper plating baths and completes electroless copper process, forms metal seed layer；
(2) graphical resist layer is formed
By the resist of the seed metallization layer surface obtained through electroless copper covering negative-appearing image inductance coil figure；
(3) metal is filled
Prepare the copper plating bath being made of 75g/L copper sulphate, the 220g/L concentrated sulfuric acid, 60mg/L chloride ion and deionized water；It will
60min, current density 2A/dm2 is electroplated in the epoxy resin base plate obtained after step (2) processing in 25 DEG C of electroplate liquids, part
The metal seed layer covered without resist is filled, metal conductor layer is formed；
(4) metal seed layer and resist layer are etched
Prepare the etching solution being made of 100g/L copper chloride, 100g/L sal-ammoniac, 600g/L ammonium hydroxide and deionized water；Removal
It is covered on the resist of printed circuit plate surface, and printed circuit board is impregnated into 30s in etching solution, etches away resist protection
Potting inductance coil outside seed metallization layer region, formed potting inductance coil；
(5) brownification is handled
It prepares by 95g/L sulfuric acid, 4g/L water solubility methoxylated polyethylene glycol, 25mg/L sodium chloride, 150mg/L sulfuric acid
The brownification liquid that copper, 8g/L benzotriazole, 20g/L hydrogen peroxide and deionized water form；By the potting inductance of formation in 35 DEG C of palm fibres
Change in liquid and impregnate 60s, conductor structure surface is made to form organic metal film；
(6) potting inductance surface magnetic cobalt film is formed
A. use purity for 99.95% metal Co target potting inductance surface magnetic control sputtering one obtained in step (5)
Layer magnetic cobalt film, sputtering power 200W, sputtering time 5min, operating air pressure 0.4Pa；
B. resist is covered on potting inductance coil surface, the etching for then preparing printed circuit board in step (4)
10s is impregnated in liquid, etches away the cobalt film of no resist protection, is finally removed resist and is obtained the printing of surface deposited magnetic cobalt film
Circuit potting inductance.
The section metallographic microscope for the potting inductance coil electroplating surface cobalt film that the present embodiment obtains is not as shown in figure 4, relative to
Potting inductance before depositing magnetic film, the inductance value promote 15%.
Embodiment 2:
A kind of printed circuit potting inductance and its surface magnetism film forming method, implementing procedure is as shown in Fig. 2, specific real
Apply step are as follows:
(1) metal seed layer is formed
A. it cleans: preparing the sulfuric acid for being 5% by concentration of volume percent, the OP emulsion that concentration of volume percent is 5%
And the acid deoiling liquid of deionized water composition；The epoxy resin base plate of 4cm × 5cm is impregnated in 50 DEG C of acid deoiling liquid
3min, ultrasonic treatment 1min are rinsed epoxy resin base plate with deionized water after oil removal treatment with removing the greasy dirt on surface
Completely to remove the degreasing fluid for being attached to surface；
B. microetch: the sulfuric acid for being 5% by concentration of volume percent, the sodium peroxydisulfate of 50g/L and deionized water are prepared and is formed
Micro-corrosion liquid；The epoxy resin base plate obtained after step a processing is ultrasonically treated 2min in 25 DEG C of micro-corrosion liquids, becomes surface
Rough coarse structure guarantees that coating is combined closely with surface, and microetch after treatment deionized water is by epoxy resin
Substrate is rinsed well to remove the micro-corrosion liquid for being attached to surface；
C. it presoaks: preparing the prepreg solution that the sulfuric acid and deionized water that are 5% by concentration of volume percent form；By step b
The epoxy resin base plate obtained after processing impregnates 1min in 25 DEG C of prepreg solutions, adjustment epoxy resin-matrix plate surface attachment solution
Acid-base property maintains the acidity of activated bath；
D. activate: metal is prepared to be made of 60mg/L palladium chloride, the sulfuric acid that concentration of volume percent is 5% and deionized water
Activating solution；The epoxy resin base plate obtained after step c processing is impregnated into 5min in 25 DEG C of prepreg solutions, in epoxy resin base plate
Crystal seed is catalyzed required for the deposition of surface；
E. it makes metal seed layer: preparing by 25g/L copper chloride, 20g/L copper sulphate, 4g/L formaldehyde, 20g/L ethylenediamine tetraacetic
The copper plating bath that acetic acid disodium salt, 10g/L sodium potassium tartrate tetrahydrate, 15g/L sodium hydroxide and deionized water form；After step d processing
Obtained epoxy resin base plate impregnates 5min in 35 DEG C of copper plating baths and completes electroless copper process, forms metal seed layer；
(2) graphical resist layer is formed
By the resist of the seed metallization layer surface obtained through electroless copper covering negative-appearing image inductance coil figure；
(3) metal is filled
Prepare the copper plating bath being made of 75g/L copper sulphate, the 220g/L concentrated sulfuric acid, 60mg/L chloride ion and deionized water；It will
60min, current density 2A/dm2 is electroplated in the epoxy resin base plate obtained after step (2) processing in 25 DEG C of electroplate liquids, part
The metal seed layer covered without resist is filled, metal conductor layer is formed；
(4) metal seed layer and resist layer are etched
Prepare the etching solution being made of 100g/L copper chloride, 100g/L sal-ammoniac, 600g/L ammonium hydroxide and deionized water；Removal
It is covered on the resist of printed circuit plate surface, and printed circuit board is impregnated into 30s in etching solution, etches away resist protection
Potting inductance coil outside seed metallization layer region, formed potting inductance coil；
(5) brownification is handled
It prepares by 95g/L sulfuric acid, 4g/L water solubility methoxylated polyethylene glycol, 25mg/L sodium chloride, 150mg/L sulfuric acid
The brownification liquid that copper, 8g/L benzotriazole, 20g/L hydrogen peroxide and deionized water form；By the potting inductance of formation in 35 DEG C of palm fibres
Change in liquid and impregnate 60s, conductor structure surface is made to form organic metal film；
(6) potting inductance surface magnetic cobalt film is formed
A. the cobalt granule for being 90% with mass fraction after dry 12h in 50 DEG C of baking ovens by polylactic acid mixes, and then uses and turns
Mixed material is blended square rheometer obtains the magnetic coupling wire rod that can carry out inkjet printing；
B. the magnetic coupling wire rod in step a is formed into magnetic cobalt film on potting inductance surface with ink-jet printer and obtains table
The printed circuit potting inductance of face deposited magnetic cobalt film.
The section metallographic microscope for the potting inductance coil electroplating surface cobalt film that the present embodiment obtains is not as shown in figure 5, relative to
Potting inductance before depositing magnetic film, the inductance value promote 10%~20%.
Embodiment 3:
A kind of printed circuit potting inductance and its surface magnetism film forming method, implementing procedure is as shown in figure 3, specific real
Apply step are as follows:
(1) metal seed layer is formed
A. it cleans: preparing the sulfuric acid for being 5% by concentration of volume percent, the OP emulsion that concentration of volume percent is 5%
And the acid deoiling liquid of deionized water composition；The epoxy resin base plate of 4cm × 5cm is impregnated in 50 DEG C of acid deoiling liquid
3min, ultrasonic treatment 1min are rinsed epoxy resin base plate with deionized water after oil removal treatment with removing the greasy dirt on surface
Completely to remove the degreasing fluid for being attached to surface；
B. microetch: the sulfuric acid for being 5% by concentration of volume percent, the sodium peroxydisulfate of 50g/L and deionized water are prepared and is formed
Micro-corrosion liquid；The epoxy resin base plate obtained after step a processing is ultrasonically treated 2min in 25 DEG C of micro-corrosion liquids, becomes surface
Rough coarse structure guarantees that coating is combined closely with surface, and microetch after treatment deionized water is by epoxy resin
Substrate is rinsed well to remove the micro-corrosion liquid for being attached to surface；
C. it presoaks: preparing the prepreg solution that the sulfuric acid and deionized water that are 5% by concentration of volume percent form；By step b
The epoxy resin base plate obtained after processing impregnates 1min in 25 DEG C of prepreg solutions, adjustment epoxy resin-matrix plate surface attachment solution
Acid-base property maintains the acidity of activated bath；
D. activate: metal is prepared to be made of 60mg/L palladium chloride, the sulfuric acid that concentration of volume percent is 5% and deionized water
Activating solution；The epoxy resin base plate obtained after step c processing is impregnated into 5min in 25 DEG C of prepreg solutions, in epoxy resin base plate
Crystal seed is catalyzed required for the deposition of surface；
E. it makes metal seed layer: preparing by 25g/L copper chloride, 20g/L copper sulphate, 4g/L formaldehyde, 20g/L ethylenediamine tetraacetic
The copper plating bath that acetic acid disodium salt, 10g/L sodium potassium tartrate tetrahydrate, 15g/L sodium hydroxide and deionized water form；After step d processing
Obtained epoxy resin base plate impregnates 5min in 35 DEG C of copper plating baths and completes electroless copper process, forms metal seed layer；
(2) graphical resist layer is formed
By the resist of the seed metallization layer surface obtained through electroless copper covering negative-appearing image inductance coil figure；
(3) metal is filled
Prepare the copper plating bath being made of 75g/L copper sulphate, the 220g/L concentrated sulfuric acid, 60mg/L chloride ion and deionized water；It will
60min, current density 2A/dm2 is electroplated in the epoxy resin base plate obtained after step (2) processing in 25 DEG C of electroplate liquids, part
The metal seed layer covered without resist is filled, metal conductor layer is formed；
(4) metal seed layer and resist layer are etched
Prepare the etching solution being made of 100g/L copper chloride, 100g/L sal-ammoniac, 600g/L ammonium hydroxide and deionized water；Removal
It is covered on the resist of printed circuit plate surface, and printed circuit board is impregnated into 30s in etching solution, etches away resist protection
Potting inductance coil outside seed metallization layer region, formed potting inductance coil；
(5) brownification is handled
It prepares by 95g/L sulfuric acid, 4g/L water solubility methoxylated polyethylene glycol, 25mg/L sodium chloride, 150mg/L sulfuric acid
The brownification liquid that copper, 8g/L benzotriazole, 20g/L hydrogen peroxide and deionized water form；By the potting inductance of formation in 35 DEG C of palm fibres
Change in liquid and impregnate 60s, conductor structure surface is made to form organic metal film；
(6) potting inductance surface magnetic cobalt film is formed
A. it prepares by 28g/L cobalt sulfate, 30g/L boric acid, 30mg/L glycine, 20mg/L3- sulfydryl -1- propane sulphur
The solution of sour sodium and deionized water composition, and adjusting pH value with dilute sulfuric acid, sodium hydroxide is 4.0, obtains electroplate liquid；By step
(5) the potting inductance obtained makees cathode, and ti-alloy mesh makees anode, and 30min, current density 2A/ are electroplated in 25 DEG C of electroplate liquids
Dm2, air stirring throughput are 1L/min；
B. the potting inductance obtained after step a processing is taken out from electroplate liquid rapidly after the completion of plating, uses deionization
Water rinses 1~3min, then rinses 0.5~2min with dehydrated alcohol, finally carries out cold air drying and obtains surface deposited magnetic cobalt film
Printed circuit potting inductance.
The section metallographic microscope for the potting inductance coil electroplating surface cobalt film that the present embodiment obtains is as shown in fig. 6, coating is microcosmic
Shape appearance figure is as shown in Figure 7 c.Relative to the potting inductance before non-depositing magnetic film, which promotes 11%.
Comparative example 1:
A kind of preparation method of printed circuit potting inductance, specific implementation step are as follows:
(1) metal seed layer is formed
A. it cleans: preparing the sulfuric acid for being 5% by concentration of volume percent, the OP emulsion that concentration of volume percent is 5%
And the acid deoiling liquid of deionized water composition；The epoxy resin base plate of 4cm × 5cm is impregnated in 50 DEG C of acid deoiling liquid
3min, ultrasonic treatment 1min are rinsed epoxy resin base plate with deionized water after oil removal treatment with removing the greasy dirt on surface
Completely to remove the degreasing fluid for being attached to surface；
B. microetch: the sulfuric acid for being 5% by concentration of volume percent, the sodium peroxydisulfate of 50g/L and deionized water are prepared and is formed
Micro-corrosion liquid；The epoxy resin base plate obtained after step a processing is ultrasonically treated 2min in 25 DEG C of micro-corrosion liquids, becomes surface
Rough coarse structure guarantees that coating is combined closely with surface, and microetch after treatment deionized water is by epoxy resin
Substrate is rinsed well to remove the micro-corrosion liquid for being attached to surface；
C. it presoaks: preparing the prepreg solution that the sulfuric acid and deionized water that are 5% by concentration of volume percent form；By step b
The epoxy resin base plate obtained after processing impregnates 1min in 25 DEG C of prepreg solutions, adjustment epoxy resin-matrix plate surface attachment solution
Acid-base property maintains the acidity of activated bath；
D. activate: metal is prepared to be made of 60mg/L palladium chloride, the sulfuric acid that concentration of volume percent is 5% and deionized water
Activating solution；The epoxy resin base plate obtained after step c processing is impregnated into 5min in 25 DEG C of prepreg solutions, in epoxy resin base plate
Crystal seed is catalyzed required for the deposition of surface；
E. it makes metal seed layer: preparing by 25g/L copper chloride, 20g/L copper sulphate, 4g/L formaldehyde, 20g/L ethylenediamine tetraacetic
The copper plating bath that acetic acid disodium salt, 10g/L sodium potassium tartrate tetrahydrate, 15g/L sodium hydroxide and deionized water form；After step d processing
Obtained epoxy resin base plate impregnates 5min in 35 DEG C of copper plating baths and completes electroless copper process, forms metal seed layer；
(2) graphical resist layer is formed
By the resist of the seed metallization layer surface obtained through electroless copper covering negative-appearing image inductance coil figure；
(3) metal is filled
Prepare the copper plating bath being made of 75g/L copper sulphate, the 220g/L concentrated sulfuric acid, 60mg/L chloride ion and deionized water；It will
60min, current density 2A/dm is electroplated in the epoxy resin base plate obtained after step f processing in 25 DEG C of electroplate liquids2, locally fill out
The metal seed layer for filling no resist covering, forms metal conductor layer；
(4) metal seed layer and resist layer are etched
Prepare the etching solution being made of 100g/L copper chloride, 100g/L sal-ammoniac, 600g/L ammonium hydroxide and deionized water；Removal
It is covered on the resist of printed circuit plate surface, and printed circuit board is impregnated into 30s in etching solution, etches away resist protection
Potting inductance coil outside seed metallization layer region, formed potting inductance coil；
(5) potting inductance surface magnetic cobalt film is formed
A. the solution being made of 28g/L cobalt sulfate, 30g/L boric acid and deionized water is prepared, and with dilute sulfuric acid, hydrogen-oxygen
Changing sodium to adjust pH value is 4.0, obtains electroplate liquid；The potting inductance that step (2) obtains is made into cathode, ti-alloy mesh makees anode,
30min, current density 2A/dm are electroplated in 25 DEG C of electroplate liquids2, air stirring throughput is 1L/min；
B. the potting inductance obtained after step a processing is taken out from electroplate liquid rapidly after the completion of plating, uses deionization
Water rinses 1~3min, then rinses 0.5~2min with dehydrated alcohol, finally carries out cold air drying and obtains surface modification magnetic cobalt film
Printed circuit potting inductance.
The coating microscopic appearance figure for the potting inductance that the present embodiment obtains is as shown in Figure 7a.Relative to film modified without cobalt
Potting inductance (1.373 μ H@1MHz), the inductance value promoted 4.7%.
Comparative example 2:
A kind of preparation method of printed circuit potting inductance, specific implementation step are as follows:
(1) metal seed layer is formed
A. it cleans: preparing the sulfuric acid for being 5% by concentration of volume percent, the OP emulsion that concentration of volume percent is 5%
And the acid deoiling liquid of deionized water composition；The epoxy resin base plate of 4cm × 5cm is impregnated in 50 DEG C of acid deoiling liquid
3min, ultrasonic treatment 1min are rinsed epoxy resin base plate with deionized water after oil removal treatment with removing the greasy dirt on surface
Completely to remove the degreasing fluid for being attached to surface；
B. microetch: the sulfuric acid for being 5% by concentration of volume percent, the sodium peroxydisulfate of 50g/L and deionized water are prepared and is formed
Micro-corrosion liquid；The epoxy resin base plate obtained after step a processing is ultrasonically treated 2min in 25 DEG C of micro-corrosion liquids, becomes surface
Rough coarse structure guarantees that coating is combined closely with surface, and microetch after treatment deionized water is by epoxy resin
Substrate is rinsed well to remove the micro-corrosion liquid for being attached to surface；
C. it presoaks: preparing the prepreg solution that the sulfuric acid and deionized water that are 5% by concentration of volume percent form；By step b
The epoxy resin base plate obtained after processing impregnates 1min in 25 DEG C of prepreg solutions, adjustment epoxy resin-matrix plate surface attachment solution
Acid-base property maintains the acidity of activated bath；
D. activate: metal is prepared to be made of 60mg/L palladium chloride, the sulfuric acid that concentration of volume percent is 5% and deionized water
Activating solution；The epoxy resin base plate obtained after step c processing is impregnated into 5min in 25 DEG C of prepreg solutions, in epoxy resin base plate
Crystal seed is catalyzed required for the deposition of surface；
E. it makes metal seed layer: preparing by 25g/L copper chloride, 20g/L copper sulphate, 4g/L formaldehyde, 20g/L ethylenediamine tetraacetic
The copper plating bath that acetic acid disodium salt, 10g/L sodium potassium tartrate tetrahydrate, 15g/L sodium hydroxide and deionized water form；After step d processing
Obtained epoxy resin base plate impregnates 5min in 35 DEG C of copper plating baths and completes electroless copper process, forms metal seed layer；
(2) graphical resist layer is formed
By the resist of the seed metallization layer surface obtained through electroless copper covering negative-appearing image inductance coil figure；
(3) metal is filled
Prepare the copper plating bath being made of 75g/L copper sulphate, the 220g/L concentrated sulfuric acid, 60mg/L chloride ion and deionized water；It will
60min, current density 2A/dm is electroplated in the epoxy resin base plate obtained after step f processing in 25 DEG C of electroplate liquids2, locally fill out
The metal seed layer for filling no resist covering, forms metal conductor layer；
(4) metal seed layer and resist layer are etched
Prepare the etching solution being made of 100g/L copper chloride, 100g/L sal-ammoniac, 600g/L ammonium hydroxide and deionized water；Removal
It is covered on the resist of printed circuit plate surface, and printed circuit board is impregnated into 30s in etching solution, etches away resist protection
Potting inductance coil outside seed metallization layer region, formed potting inductance coil；
(5) potting inductance surface magnetic cobalt film is formed
A. the solution being made of 28g/L cobalt sulfate, 30g/L boric acid, 30mg/L glycine and deionized water is prepared, and
Adjusting pH value with dilute sulfuric acid, sodium hydroxide is 4.0, obtains electroplate liquid；The potting inductance that step (2) obtains is made into cathode, metal
Titanium net makees anode, and 30min, current density 2A/dm are electroplated in 25 DEG C of electroplate liquids2, air stirring throughput is 1L/min；
B. the potting inductance obtained after step a processing is taken out from electroplate liquid rapidly after the completion of plating, uses deionization
Water rinses 1~3min, then rinses 0.5~2min with dehydrated alcohol, finally carries out cold air drying and obtains surface modification magnetic cobalt film
Printed circuit potting inductance.
The coating microscopic appearance figure for the potting inductance that the present embodiment obtains is as shown in Figure 7b.Relative to film modified without cobalt
Potting inductance (1.373 μ H@1MHz), the inductance value promoted 6.8%.
The addition of glycine is substantially reduced coating crystallite dimension in embodiment 2, coercivity with crystallite dimension reduction
And (coating coercivity is 150Oe when glycine not being added, and coating coercivity is reduced to 71Oe after glycine is added) is reduced, coating
Magnetic performance improve, for inductor, the material with high saturated magnetic induction and low-coercivity is more suitable for
Magnetic medium, therefore the inductance value of inductance gets a promotion.In conjunction with comparative example 1 and 2 and embodiment 3 it is found that glycine adds
Enter to make coating crystallite dimension to be substantially reduced, it is coercitive simultaneously as 3-sulfydryl-1-propane sulfonic acid sodium to reduce coating in glycine
Have the function of inhibiting crystal face growth in feature crystal face in crystal growing process, it is seen that two kinds of substances are all to coating grain growth
Have an impact.Further study show that the optimum concentration of the first complexing agent is 30mg/L, keep the first complexing agent in optimum concentration
On the basis of, the balanced action of the second complexing agent and the first complexing agent is conducive to the promotion of inductance value in a certain range, such as Fig. 8 institute
Show.Since the magnetic performance of cobalt coating and the particular crystal plane of crystal have a major impact, the magnetic saturation intensity increase of coating (is not added
Coating magnetic saturation intensity is 19emu/g when glycine and 3-sulfydryl-1-propane sulfonic acid sodium, and glycine and 3- sulfydryl -1- third is added
It is 31emu/g that coating magnetic saturation intensity, which increases, after alkyl sulfonic acid sodium), it is seen then that coating application is obtained based on present invention plating cobalt system
Traditional plating system inductance value is compared in potting inductance to be improved.
The embodiment of the present invention is elaborated in conjunction with attached drawing above, but the invention is not limited to above-mentioned
Specific embodiment, above-mentioned specific embodiment is only schematical, rather than restrictive, the ordinary skill people of this field
Member under the inspiration of the present invention, can also make many in the case where not departing from present inventive concept and claimed range
Deformation, these belong to protection of the invention.
Claims (9)
1. a kind of preparation method of printed circuit potting inductance, which comprises the steps of:
Step: 1: forming metal seed layer in dielectric layer surface；
Step 2: the resist layer through pattern transfer technology cover graphics on the metal seed layer made from step 1；
Step 3: growing metal conductor layer on the metal seed layer of no resist layer covering；
Step 4: removing the metal seed layer of the resist layer and resist layer covering, the conductor structure of potting inductance is prepared；
Step 5: the conductor structure surface made from step 4 forms thin magnetic film.
2. the preparation method of printed circuit potting inductance according to claim 1, which is characterized in that formed in the step 1
Metal seed layer uses sputtering technology or chemical plating process.
3. the preparation method of printed circuit potting inductance according to claim 1, which is characterized in that before carrying out step 5
Further include the steps that brownification is handled, so that the conductor structure surface of potting inductance forms organic metal film layer.
4. according to claim 1 or the preparation method of the 3 printed circuit potting inductance, which is characterized in that shape in the step 5
Method at thin magnetic film is magnetron sputtering, plating or inkjet printing.
5. the preparation method of printed circuit potting inductance according to claim 4, which is characterized in that magnetic in the step 5
Film is pure cobalt thin film, and the pure cobalt thin film is prepared using galvanoplastic, and concrete operations are as follows: conductor structure will be made through step 4
Or the conductor structure with organic metal film layer is placed in electroplate liquid, is electroplated under electrode effect；The electroplate liquid
Composition include cobalt salt, the first complexing agent, the second complexing agent, buffer, pH adjusting agent and deionized water, in which: described first
Complexing agent includes glycine, alanine, valine, leucine, isoleucine, aspartic acid, glutamic acid, lysine and arginine
In any one or more mixture, second complexing agent includes sodium polydithio-dipropyl sulfonate and 3- sulfydryl -1- propane
Any one in sodium sulfonate or two kinds of mixture.
6. the preparation method of printed circuit potting inductance according to claim 5, which is characterized in that cobalt salt in the electroplate liquid
Concentration be 20~300g/L, the concentration of the first complexing agent is 1~2000mg/L, the concentration of the second complexing agent is 1~200mg/L
, the concentration of buffer be 10~50g/L；Plating conditions are specific as follows: electroplate liquid pH is 3~6, and electroplating temperature is 20~40
DEG C, current density is 0.5~4A/dm2, electroplating time is 5~90min.
7. the preparation method of printed circuit potting inductance according to claim 4, which is characterized in that magnetic in the step 5
Film is pure cobalt thin film, and the pure cobalt thin film is prepared using magnetron sputtering method, and concrete operations are as follows: will by magnetron sputtering apparatus
Cobalt film, which is all covered on, handles obtained printed circuit plate surface through step 4, then organic on conductor structure surface or metal
Thin-film surface covers resist, then etches away the cobalt film of no resist protection, and it is magnetic thin finally to remove resist i.e. realization
The production of film.
8. according to the preparation method of the printed circuit potting inductance of claim 3 or 6, which is characterized in that magnetic in the step 5
Property film be cobalt composite material, for the cobalt composite material using ink-jet printing preparation, concrete operations are as follows: passing through inkjet printing
Method obtains conductor structure surface in step 4 processing or organic metal film layer surface directly prints cobalt film composite material.
9. the preparation method of printed circuit potting inductance according to claim 8, which is characterized in that original used in inkjet printing
Material includes thermoplastic resin and cobalt granule, wherein thermoplastic resin is polylactic acid, polyethylene, polypropylene, appointing in polybutadiene
It anticipates one kind, cobalt granule mass fraction is 60%~90%.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI823278B (en) * | 2021-03-04 | 2023-11-21 | 大陸商珠海越亞半導體股份有限公司 | Method for manufacturing embedded support frame with integrated inductor |
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| CN1321059A (en) * | 2000-04-04 | 2001-11-07 | 株式会社东金 | Circuit board consisting of grain structure magnetic film |
| US6493861B1 (en) * | 1999-12-28 | 2002-12-10 | Intel Corporation | Interconnected series of plated through hole vias and method of fabrication therefor |
| CN101166393A (en) * | 2006-10-20 | 2008-04-23 | 富士胶片株式会社 | Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
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| US6493861B1 (en) * | 1999-12-28 | 2002-12-10 | Intel Corporation | Interconnected series of plated through hole vias and method of fabrication therefor |
| CN1321059A (en) * | 2000-04-04 | 2001-11-07 | 株式会社东金 | Circuit board consisting of grain structure magnetic film |
| CN101166393A (en) * | 2006-10-20 | 2008-04-23 | 富士胶片株式会社 | Laminated body used to produce printed wiring board, and method of producing printed wiring board using the same |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
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| TWI823278B (en) * | 2021-03-04 | 2023-11-21 | 大陸商珠海越亞半導體股份有限公司 | Method for manufacturing embedded support frame with integrated inductor |
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