CN110031277A - A kind of chip sample production method for failure analysis - Google Patents
A kind of chip sample production method for failure analysis Download PDFInfo
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- CN110031277A CN110031277A CN201910353867.8A CN201910353867A CN110031277A CN 110031277 A CN110031277 A CN 110031277A CN 201910353867 A CN201910353867 A CN 201910353867A CN 110031277 A CN110031277 A CN 110031277A
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- chip
- grinding
- heat sink
- auxiliary stand
- bonding agent
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
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- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The embodiment of the invention discloses a kind of chip sample production methods for failure analysis, auxiliary stand is arranged around chip, fixed bonding agent is filled in the space of the chip in auxiliary stand, it can guarantee that chip will not move during the grinding process, it avoids grinding uneven, improves chip sample and be prepared into power；The height of auxiliary stand is higher than the highest point height of lead, can increase the protection to lead, convenient for directly carrying out chip back failure analysis after sample preparation success.Further, the grinding and polishing liquid of configuration when to chip back progress chemical grinding, grinding efficiency can be promoted, save milling time, and it will not be chemically reacted with fixed bonding agent, it avoids chip caused by reaction deposit damaged, finally obtains uniform, complete, bright and clean chip sample surface, improve the success rate of lossless sample preparation.
Description
[technical field]
The present invention relates to technical field of photo communication, more particularly to a kind of chip sample production side for failure analysis
Method.
[background technique]
With the fast development of the communication technology, people are higher and higher to the reliability requirement of communication system, and then to its core
The q&r of heart link element semiconductor laser requires also higher and higher.To in development, production and use process
The chip of laser of failure, it is also desirable to find failure cause, design is upper, in technique and the defects of operation and not to improve
Foot, so that improving laser device chip reliability is horizontal.Meanwhile constantly mature integrated technology of preparing promotes semiconductor laser
Size constantly reduces, and wherein the chip of semiconductor laser is especially small, and size is generally in micron dimension；Semiconductor laser chip
Material has brittle nature again, therefore is chip failure the test sample to be analyzed that is made of the chip failing efficient lossless of small size
Difficult point in analytic process.
Semiconductor laser chip generally require be mounted at least there are two electrode it is heat sink on, the pole chip N passes through golden tin
Solder is welded on a heat sink electrode, and the pole chip P is connected on another heat sink electrode by lead.Traditional die
Heat sample preparation method be to heat chip, to golden tin solder melt, using tweezers by chip from it is heat sink it is upper directly remove, the party
Method is dissolved each other by golden tin solder leads to the not easily detachable restriction of chip, and chip is also easy stress breakage during clamping.It is existing
It is the heat sink inversion with chip to be encapsulated on carrying tablet using paraffin, then carrying tablet is consolidated in a kind of commonly method for making sample
It is scheduled on the fixture of autogenous mill, the sample back side is polished directly, until exposing chip back and being wrapped in encapsulation
Intracorporal lead is directly used in back side failure positioning analysis, and also capable of washing come out is analyzed for subsequent failure.However this method is also
It has the following deficiencies: that (1) paraffin is easily-deformable during the grinding process, will lead to chip and be subjected to displacement or tilt, so as to cause chip
Grinding is uneven, or even damaged；(2) constraint of packing forms and packaging body size is limited to from packaging body grinding back surface, easily
Lead is destroyed, is unfavorable for manufactured test sample to be analyzed and directly carries out failure positioning analysis；(3) during the grinding process, paraffin
It is easy to multiple grinding and carries out chemical reaction generation deposit, leads to chip edge breakage in process of lapping.
In consideration of it, overcoming defect present in the prior art is the art urgent problem to be solved.
[summary of the invention]
The technical problems to be solved by the present invention are: solving the heat sink encapsulation that will have chip using paraffin in the prior art
On carrying tablet, lead to the problem of chip grinds unevenness, is easily destroyed lead, is unfavorable for chip failure analysis when grinding.
The present invention adopts the following technical scheme:
The present invention provides a kind of chip sample production methods for failure analysis, comprising:
Heating remove with the heat sink of chip, the chip back be mounted on it is described it is heat sink on, the chip front side and institute
It states and heat sink is connected with lead；
Auxiliary stand is formed using cushion block, the upper and lower surface of the auxiliary stand is polished directly；
By the auxiliary stand after grinding and polishing around the chip be arranged it is described it is heat sink on, the auxiliary stand
Height is higher than the highest point height of the lead；
Fixed bonding agent is filled in the space of the chip to the auxiliary stand；
By being placed on carrying tablet away from the heat sink side for the auxiliary stand for filling the fixed bonding agent, with shape
At the clamp body of the fixation chip；
The carrying tablet is bonded on grinder, using default grinding method to the clamp body of the chip back
It is polished directly, to produce chip sample to be analyzed.
Preferably, described that auxiliary stand is formed using cushion block, it specifically includes:
Four pieces of cushion block bondings are formed by rectangular-ambulatory-plane auxiliary stands using bicomponent epoxy resin glue.
Preferably, the auxiliary stand by after grinding and polishing around the chip be arranged it is described it is heat sink on, tool
Body includes:
The auxiliary stand after grinding and polishing is arranged around the die bonding described using normal temperature cure glue
On heat sink.
Preferably, described to fill fixed bonding agent in the space of the chip to the auxiliary stand, it is specific to wrap
It includes:
The described of the auxiliary stand will be fixed with heat sink to be placed on the warm table with preset temperature；
Fixed bonding agent is filled to the space around the chip of the auxiliary stand.
Preferably, described to hold being placed on away from the heat sink side for the auxiliary stand for filling the fixed bonding agent
On slide glass, to form the clamp body of the fixed chip, specifically include:
The carrying tablet is placed on the warm table with preset temperature；
By being placed on the carrying tablet away from the heat sink side for the auxiliary stand for filling the fixed bonding agent；
It presses described heat sink, removes the carrying tablet, the carrying tablet, the auxiliary stand and the heat sink formation are fixed
The clamp body of the chip.
Preferably, the fixed bonding agent is to heat bonding agent capable of washing.
Preferably, in being placed on away from the heat sink side by the auxiliary stand for filling the fixed bonding agent
On carrying tablet, to be formed after the clamp body of the fixed chip, further includes:
Adhesive is coated on the carrying tablet and carries out secondary curing, and described adhesive covers described heat sink and described auxiliary
Bracket.
Preferably, described adhesive is uv-curable glue or normal temperature cure glue.
Preferably, described that the clamp body of the chip back is polished directly using default grinding method, have
Body includes:
It is described heat sink that corase grinding removal is carried out to the clamp body of the chip back；
To remove it is described it is heat sink after the clamp body carry out chemical grinding, expose the backing substrate of the chip and described
The solder joint of lead；
The back side of the chip is processed by shot blasting, the backing substrate grinding of the chip is smooth.
Preferably, for the grinding and polishing liquid of the chemical grinding are as follows: made of cerium oxide and silica mixed preparing
Grinding and polishing liquid.
Provided by the present invention for the chip sample production method of failure analysis, auxiliary stand is arranged around chip,
Auxiliary stand fills fixed bonding agent in the space of the chip, can guarantee that chip will not occur during the grinding process
It is mobile, it avoids grinding uneven, improves chip sample and be prepared into power；The highest point that the height of auxiliary stand is higher than lead is high
Degree, can increase the protection to lead, convenient for directly carrying out chip back failure analysis after sample preparation success.
The grinding and polishing liquid of configuration, can promote grinding efficiency, save when further, to chip back progress chemical grinding
About milling time, and will not be chemically reacted with fixed bonding agent, avoid chip caused by reaction deposit damaged, finally
Uniform, complete, bright and clean chip sample surface is obtained, the success rate of lossless sample preparation is improved.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will make below to required in the embodiment of the present invention
Attached drawing is briefly described.It should be evident that drawings described below is only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the flow chart of the chip sample production method provided in an embodiment of the present invention for failure analysis；
Fig. 2 is the heat sink diagrammatic cross-section provided in an embodiment of the present invention with chip；
Fig. 3 is the heat sink floor map provided in an embodiment of the present invention for being provided with auxiliary stand；
Fig. 4 is the diagrammatic cross-section of the clamp body provided in an embodiment of the present invention for being fixed with chip；
Fig. 5 is the diagrammatic cross-section of chip sample to be analyzed provided in an embodiment of the present invention；
Fig. 6 is the flow chart that the clamp body provided in an embodiment of the present invention to chip back is polished directly.
[specific embodiment]
In order to which the purpose of the present invention, technical solution and excellent convex block is more clearly understood, with reference to the accompanying drawings and embodiments,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
In the description of the present invention, term "inner", "outside", " longitudinal direction ", " transverse direction ", "upper", "lower", "top", "bottom" etc. refer to
The orientation or positional relationship shown be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention rather than
It is required that the present invention must be constructed and operated in a specific orientation, therefore it is not construed as limitation of the present invention.
In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other not
Constituting conflict can be combined with each other.
Embodiment one:
The embodiment of the invention provides a kind of chip sample production methods for failure analysis, refering to fig. 1 to Fig. 6, institute
State chip sample production method the following steps are included:
Step S100: heating remove with the heat sink of chip, the chip back be mounted on it is described it is heat sink on, the chip
It is positive heat sink to be connected with described with lead.
In embodiments of the present invention, heat sink 102 with chip 103 are removed from failure optical device to be analyzed,
The optionally chip of laser of chip 103.In a specific embodiment, when chip 103 is chip of laser, such as laser
When device is encapsulated using TO, TO cap is taken out using cap device is opened, TO pedestal is placed on the warm table that temperature is 340 ± 20 DEG C,
Microscopically observation gold tin solder 1012 starts to melt, pushed open with tweezers and remove with chip of laser heat sink 102.Such as figure
Shown in 2,103 back side of chip is mounted on heat sink 102, and 103 rear electrode of chip passes through golden tin solder 1011 and is connected to heat sink 102
An electrode on, lead 104 connect 103 front electrode of chip and heat sink 102 on metal layer.Wherein, lead 104 is optional
For spun gold bonding wire.
Step S200: auxiliary stand is formed using cushion block, the upper and lower surface of the auxiliary stand is polished directly.
In embodiments of the present invention, as shown in figure 3, four pieces of cushion block composition rectangular-ambulatory-planes are optionally assisted branch using bonding agent
Frame.Rectangular-ambulatory-plane auxiliary stand is made of two short cushion block 1052 and two long cushion block 1051, the mutual opposite side of two short cushion block 1052
It is arranged in parallel, the mutual opposite side of two long cushion block 1051 is arranged in parallel, and short cushion block 1052 and long cushion block 1051 are strip structure.
Bonding agent is used to for the link position of two short cushion block 1052 and two long cushion block 1051 to be bonded composition rectangular-ambulatory-plane auxiliary
Bracket is helped, bonding agent is optionally bicomponent epoxy resin glue, and bicomponent epoxy resin adhesive curing is unlikely to deform, and can be born
150 DEG C or more of high temperature.
In embodiments of the present invention, in order to which rectangular-ambulatory-plane auxiliary stand upper and lower surface is bright and clean smooth, in rectangular-ambulatory-plane auxiliary stand
After being completed, it is also necessary to be polished directly to the upper and lower surface of rectangular-ambulatory-plane auxiliary stand.In a preferred embodiment, it adopts
The rectangular-ambulatory-plane auxiliary stand upper and lower surface being assembled into is polished directly respectively with the abrasive sheet that surface roughness is 1 μm.?
In preferred embodiment, the material of rectangular-ambulatory-plane auxiliary stand is glass material, for example, general silica glass；Other
In embodiment, rectangular-ambulatory-plane auxiliary stand can also be other materials, as long as support, easy to cut and be easy to grind can be played
Effect.
In a specific embodiment, in order to make the size of auxiliary stand and heat sink 102 and the ruler of chip to be ground 103
Very little to match, when auxiliary stand is rectangular-ambulatory-plane auxiliary stand, the size of the length, width and height of the short cushion block 1052 of use is respectively
0.9mm, 0.5mm and 0.3mm, the size of the length, width and height of the long cushion block 1051 of use are respectively 1.2mm, 0.5mm and 0.3mm, often
Each two pieces of cushion block of kind.It in other embodiments, can be according to short 1052 He of cushion block of size appropriate adjustment of heat sink 102 and chip 103
The length, width and height size of long cushion block 1051.
It should be noted that in other embodiments, the structure of auxiliary stand can also be designed as to triangle, five sides
Shape, hexagon, circle or ellipse only need auxiliary stand to have the area of accommodating chip 103 in the space of the chip
Domain.
Step S300: by the auxiliary stand after grinding and polishing around the chip be arranged it is described it is heat sink on, it is described
The height of auxiliary stand is higher than the highest point height of the lead.
In embodiments of the present invention, it is arranged on heat sink 102 using the auxiliary stand after grinding and polishing around chip 103,
I.e. auxiliary stand by 103 frame of chip on heat sink 102 in intermediate region, while also by 104 frame of lead wherein, to chip 103
Protective effect is played with lead 104.
Due to the auxiliary stand upper and lower surface finish and flatness height after grinding and polishing, following table on auxiliary stand ensure that
The height in face is consistent, when can guarantee that the subsequent back side to chip 103 carries out grinding sample preparation, will not generate the generation of chip 103
Inclination causes chip 103 to grind uneven or even damaged, can be improved the lossless sample preparation success rate of chip sample.
In order to avoid causing to damage to lead 104 when the subsequent back side to chip 103 carries out grinding sample preparation, auxiliary stand
Design height be higher than the highest point height of lead 104.In a preferred embodiment, it is desirable that the height of auxiliary stand is at least
It is 50 μm higher than 104 highest point height of lead.Specifically, can be high by highest point of the optical measurement microscope to lead 104
Degree measures, and then selects the satisfactory cushion block composition auxiliary stand of height dimension again.
In embodiments of the present invention, the auxiliary stand after polishing is bonded on heat sink 102 by bonding agent, bonding agent can
Choose normal temperature cure glue or hot setting glue, it is desirable that 150 DEG C or more high temperature can be born after bonding agent solidification.
S400: Xiang Suoshu auxiliary stand of step fills fixed bonding agent in the space of the chip.
In embodiments of the present invention, fixed bonding agent is filled in the space of the chip to auxiliary stand, be used for
Play the role of in subsequent grinding sample preparation to chip 103 and lead 104 positioning and protection, prevent chip 103 and lead 104 by
Damage.
In a specific embodiment, such as auxiliary stand is rectangular-ambulatory-plane auxiliary stand, will be fixed with rectangular-ambulatory-plane auxiliary
Heat sink the 102 of bracket are put on warm table, and the temperature of warm table is increased to 120 DEG C, and the rectangular-ambulatory-plane to rectangular-ambulatory-plane auxiliary stand is empty
Interior to fill fixed bonding agent 106, fixed bonding agent 106 is optionally hot melt bonding agent capable of washing, such as is heated capable of washing viscous
The preferred paraffin of agent is connect, as long as can also be that other can play temporarily assembles substance, have stronger cohesive force, be able to maintain material
Expect that most precise and tiny structure, handled can be by the binder that reheats or removed with different solvents.Hot melt can
The melt temperature of bonding agent is cleaned between 80~130 DEG C, there is certain hardness after solidification, can be cleaned with organic solvent, heat
Melt bonding agent capable of washing melt temperature be not suitable for it is excessively high, prevent high temperature it is excessively high cause form rectangular-ambulatory-plane auxiliary stand cushion block phase
Mutually separation and rectangular-ambulatory-plane auxiliary stand fall off from heat sink 102, and assembling is caused to fail.
Step S500: the auxiliary stand for filling the fixed bonding agent is placed on carrying away from the heat sink side
On piece, to form the clamp body of the fixed chip.
In embodiments of the present invention, carrying tablet 107 is placed on the warm table with preset temperature, it then will with tweezers
Auxiliary stand is placed on carrying tablet 107 away from heat sink 102 side, that is, the contact of the end face of carrying tablet 107 and auxiliary stand,
Between be filled with fixed bonding agent 106, fixed bonding agent 106 preferably heats bonding agent capable of washing.Wherein, warm table is pre-
If temperature is optionally 120 DEG C, between 80~130 DEG C of melt temperature range that heat bonding agent capable of washing.It presses heat sink
102, carrying tablet 107 is removed, when heating bonding agent cooled and solidified capable of washing, carrying tablet 107, auxiliary stand, chip 103 and heat
Heavy 102 groups of clamp bodies as fixed chip 103.
In conjunction with the embodiment of the present invention, carrying tablet 107 is optionally sheet glass, in a specific embodiment, glass
The length, width and height size of piece is respectively 3mm, 1mm and 1mm.It is recognised that carrying tablet 107 can also be other materials, it is only necessary to have
There are bearing function and thermally conductive function, is not specifically limited herein.
In conjunction with the embodiment of the present invention, deviate from the heat in the auxiliary stand that will fill the fixed bonding agent
Heavy side is placed on carrying tablet, after forming the clamp body of the fixed chip, in order to further guarantee heat sink 102, core
The combination fastness of piece 103, auxiliary stand and carrying tablet 107, as shown in figure 4, can also be located on carrying tablet 107 heat sink
102 sides coat adhesive 108 and carry out secondary curing, and adhesive coverage is heat sink 102 and auxiliary stand, and viscous with carrying tablet 107
It closes, to form the clamp body of fixed chip 103.Adhesive 108 is optionally uv-curable glue or normal temperature cure glue.
Step S600: the carrying tablet is bonded on grinder, using default grinding method to the chip back
The clamp body is polished directly, to produce chip sample to be analyzed.
In conjunction with the embodiment of the present invention, the carrying tablet 107 for being fixed with the clamp body of chip 103 is bonded in autogenous mill
On fixture, then the clamp body for being fixed with chip 103 is successively roughly ground, chemical grinding and polishing treatment, to produce nothing
The chip sample to be analyzed of damage.
The chip sample to be analyzed obtained according to corase grinding, chemical grinding and polishing treatment, as shown in figure 5, can not break
The backing substrate 109 and lead solder-joint 110 of chip 103 are preferably obtained in the case where bad lead 104, are the back side of chip 103
Failure positioning analysis provides reliable and stable sample and electric connection mode.
In alternative embodiments, carrying tablet 107 is bonded in the fixture of autogenous mill using normal temperature cure glue
On.
In conjunction with the embodiment of the present invention, refering to Fig. 6, in order to adequately illustrate the specific implementation process of step S600 in more detail,
The specific steps being polished directly using default grinding method to the clamp body of the chip back are said below
It is bright:
Step S610: it is described heat sink that corase grinding removal is carried out to the clamp body of the chip back.
In conjunction with the embodiment of the present invention, corase grinding being carried out to the clamp body at 103 back side of chip and is referred to, corase grinding gets rid of heat sink 102,
Corase grinding uses surface roughness for 14 μm of abrasive sheet, and the revolving speed that corase grinding is arranged is 60 revs/min of kinds, until 103 back side of chip
Heat sink 102 grinding finishes stopping.
Step S620: to remove it is described it is heat sink after the clamp body carry out chemical grinding, expose the back side of the chip
The solder joint of substrate and the lead.
In conjunction with the embodiment of the present invention, chemical grinding is carried out to the clamp body after removal heat sink 102, chemical grinding is using configuration
Grinding and polishing liquid, be arranged chemical grinding revolving speed be 60 revs/min of kinds, quickly remove the metal between heat sink 102 and chip 103
Electrode and golden tin solder 1012, the backing substrate 109 and lead solder-joint 110 of exposed chip 103.
In a preferred embodiment, the grinding and polishing liquid of configuration is that cerium oxide that granular size is 0.5 μm and particle are big
Small is the grinding and polishing liquid that 0.1 μm of silica is hybridly prepared into, such as fixed bonding agent is paraffin, using the grinding and polishing
Liquid can cause chip caused by reacting deposit damaged to avoid reacting with fixed bonding agent.
Step S630: being processed by shot blasting the back side of the chip, and the backing substrate grinding of the chip is smooth.
In conjunction with the embodiment of the present invention, the back side of chip 103 is processed by shot blasting, polishing treatment use surface roughness for
0.3 μm of abrasive sheet, setting revolving speed are 45 revs/min of kinds, 103 backing substrate 109 of chip are ground smooth bright and clean.
Chip sample production method provided in an embodiment of the present invention for failure analysis, auxiliary stand is set around chip
It sets, fills fixed bonding agent in the space of the chip in auxiliary stand, can guarantee chip during the grinding process not
It can move, avoid grinding uneven, improve chip sample and be prepared into power；The height of auxiliary stand is higher than lead most
High point height can increase the protection to lead, convenient for directly carrying out chip back failure analysis after sample preparation success.
The grinding and polishing liquid of configuration, can promote grinding efficiency, save when further, to chip back progress chemical grinding
About milling time, and will not be chemically reacted with fixed bonding agent, avoid chip caused by reaction deposit damaged, finally
Uniform, complete, bright and clean chip sample surface is obtained, the success rate of lossless sample preparation is improved.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of chip sample production method for failure analysis characterized by comprising
Heating remove with the heat sink of chip, the chip back be mounted on it is described it is heat sink on, the chip front side and the heat
It is heavy to be connected with lead；
Auxiliary stand is formed using cushion block, the upper and lower surface of the auxiliary stand is polished directly；
By the auxiliary stand after grinding and polishing around the chip be arranged it is described it is heat sink on, the height of the auxiliary stand
It is higher than the highest point height of the lead；
Fixed bonding agent is filled in the space of the chip to the auxiliary stand；
It is solid to be formed by being placed on carrying tablet away from the heat sink side for the auxiliary stand for filling the fixed bonding agent
The clamp body of the fixed chip；
The carrying tablet is bonded on grinder, is carried out using the clamp body of the default grinding method to the chip back
Grinding and polishing, to produce chip sample to be analyzed.
2. chip sample production method according to claim 1, which is characterized in that described using cushion block composition auxiliary branch
Frame specifically includes:
Four pieces of cushion block bondings are formed by rectangular-ambulatory-plane auxiliary stands using bicomponent epoxy resin glue.
3. chip sample production method according to claim 1, which is characterized in that it is described will be described auxiliary after grinding and polishing
Help bracket around the chip setting it is described it is heat sink on, specifically include:
The auxiliary stand after grinding and polishing is arranged around the die bonding described heat sink using normal temperature cure glue
On.
4. chip sample production method according to claim 1, which is characterized in that the surrounding to the auxiliary stand
Fixed bonding agent is filled in the space of the chip, is specifically included:
The described of the auxiliary stand will be fixed with heat sink to be placed on the warm table with preset temperature；
Fixed bonding agent is filled to the space around the chip of the auxiliary stand.
5. chip sample production method according to claim 4, which is characterized in that described to fill the fixed bonding agent
The auxiliary stand be placed on carrying tablet away from the heat sink side, to form the clamp body of the fixed chip, specifically
Include:
The carrying tablet is placed on the warm table with preset temperature；
By being placed on the carrying tablet away from the heat sink side for the auxiliary stand for filling the fixed bonding agent；
Press described heat sink, remove the carrying tablet, the carrying tablet, the auxiliary stand and the heat sink formation it is fixed described in
The clamp body of chip.
6. chip sample production method according to claim 4, which is characterized in that the fixed bonding agent is that hot melt can be clear
Wash bonding agent.
7. chip sample production method according to claim 1, which is characterized in that the fixed bonding will be filled described
The auxiliary stand of agent is placed on carrying tablet away from the heat sink side, with formed the fixed chip clamp body it
Afterwards, further includes:
Adhesive is coated on the carrying tablet and carries out secondary curing, and described adhesive covers described heat sink and described auxiliary branch
Frame.
8. chip sample production method according to claim 7, which is characterized in that described adhesive be uv-curable glue or
Normal temperature cure glue.
9. chip sample production method according to claim 1, which is characterized in that described to use default grinding method to institute
The clamp body for stating chip back is polished directly, and is specifically included:
It is described heat sink that corase grinding removal is carried out to the clamp body of the chip back；
To remove it is described it is heat sink after the clamp body carry out chemical grinding, expose the backing substrate and the lead of the chip
Solder joint；
The back side of the chip is processed by shot blasting, the backing substrate grinding of the chip is smooth.
10. chip sample production method according to claim 9, which is characterized in that the grinding for the chemical grinding
Polishing fluid are as follows: grinding and polishing liquid made of cerium oxide and silica mixed preparing.
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| CN111812124A (en) * | 2020-06-24 | 2020-10-23 | 上海华力集成电路制造有限公司 | Failure analysis layer removing method |
| CN112345336A (en) * | 2020-10-12 | 2021-02-09 | 上海华力集成电路制造有限公司 | Method for polishing back of ultra-small sample |
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| CN114414322A (en) * | 2021-12-10 | 2022-04-29 | 上海精密计量测试研究所 | Pouring reversible component sample preparation grinding method |
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| CN114486439B (en) * | 2022-01-27 | 2023-08-29 | 上海季丰电子股份有限公司 | Method for taking crystal grains in back-illuminated CMOS sensor and application |
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