CN110030887A - Integrated form impact piece component and its manufacturing method based on eutectic bonding technique - Google Patents
Integrated form impact piece component and its manufacturing method based on eutectic bonding technique Download PDFInfo
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- CN110030887A CN110030887A CN201910430625.4A CN201910430625A CN110030887A CN 110030887 A CN110030887 A CN 110030887A CN 201910430625 A CN201910430625 A CN 201910430625A CN 110030887 A CN110030887 A CN 110030887A
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- eutectic bonding
- gun barrel
- film flying
- bonding pad
- metal layer
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42C—AMMUNITION FUZES; ARMING OR SAFETY MEANS THEREFOR
- F42C19/00—Details of fuzes
- F42C19/08—Primers; Detonators
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a kind of, and the integrated form based on eutectic bonding technique impacts piece component, including gun barrel, film flying, Exploding Foil component and cable, it is equipped in gun barrel upper surface and accelerates bore, the first eutectic bonding pad is equipped in gun barrel lower surface and film flying loads chamber, and film flying filling chamber is connected with bore is accelerated；Exploding Foil component includes ceramic substrate, and surface is equipped with Exploding Foil and the second eutectic bonding pad corresponding with the first eutectic bonding pad on a ceramic substrate, and offers the array via hole through ceramic substrate and Exploding Foil on a ceramic substrate；The film flying filling that film flying is installed on gun barrel is intracavitary, and gun barrel is integrated with Exploding Foil component by the eutectic bonding of the first eutectic bonding pad and the second eutectic bonding pad, and cable welding is in ceramic substrate lower surface.Impact piece component of the invention by eutectic bonding technique by ceramic substrate and with film flying load chamber gun barrel integrate, have good reliability, integrated level height can mass manufacture the characteristics of.
Description
Technical field
The present invention relates to priming system technical field, in particular to a kind of integrated form based on eutectic bonding technique impacts piece group
Part and its manufacturing method.
Background technique
Slapper detonator is applied primarily to the initiation system of high value ammunition because of its higher intrinsic safety at present
In.To be widely applied it more, its low energy, miniaturization, integrated and inexpensive manufacturing method must be carried out
Research.Conventional impact piece detonator main component has bridge foil substrate, Exploding Foil, film flying, gun barrel and originates powder column, and each component is first discrete
For hand assembled at detonator, complex manufacturing process, gun barrel and quick-fried area are consistent to alignment request height, axial pre tightening force again after machine-shaping
Property it is poor, be unfavorable for mass manufacture.Its substrate material is mostly aluminum oxide ceramic piece, and film flying often uses Kapton, big gun
Cylinder mostly uses all preferable stainless steel of intensity and machinability or sapphire material.It is impacted currently based on the integrated form of MEMS technology
Piece component integrates or directly grows on silicon wafer photoresist etc. by way of mostly using glass substrate to be bonded with silicon gun barrel silicon glass
The gun barrel of material, insulation performance, substrate intensity, film flying and gun barrel structural parameters and performance all hardly result in guarantee.
Summary of the invention
It is insufficient in above-mentioned background technique the purpose of the present invention is overcoming, a kind of integrated form based on eutectic bonding technique is provided
Impact piece component and its manufacturing method, wherein the integrated form impacts piece component and uses the ceramic substrate with array via hole, and polyamides is sub-
Ceramic substrate is integrated with the gun barrel for loading chamber with film flying by eutectic bonding technique, is had reliable by amine film flyer driven
Property good, integrated level it is high can mass manufacture the characteristics of.
In order to reach above-mentioned technical effect, the present invention takes following technical scheme:
A kind of integrated form impact piece component based on eutectic bonding technique, including gun barrel, film flying, Exploding Foil component and electricity
Cable is equipped in the gun barrel upper surface and accelerates bore, is equipped with the first eutectic bonding pad in gun barrel lower surface and film flying loads chamber,
Wherein the shape of film flying filling chamber is consistent with film flying shape, and film flying filling chamber is connected with bore is accelerated；The explosion
Foil component includes ceramic substrate, on a ceramic substrate surface be equipped with Exploding Foil and with the first eutectic bonding pad corresponding second
Eutectic bonding pad, and the array via hole through ceramic substrate and Exploding Foil is offered on a ceramic substrate；
The film flying be installed on gun barrel film flying filling it is intracavitary, and film flying and film flying filling chamber be fitted close, gun barrel with it is quick-fried
Fried foil component is integrated by the eutectic bonding of the first eutectic bonding pad and the second eutectic bonding pad, the cable
It is welded in ceramic substrate lower surface.
Further, the Exploding Foil, the first eutectic bonding pad, the second eutectic bonding pad are made of copper or aluminium,
And/or the gun barrel is made of High Resistivity Si or aluminium oxide ceramics and/or the film flying is made of Kapton.
Further, the film flying is adhesively fixed after being installed on the film flying filling chamber of gun barrel by bonding agent.
Further, patch solder pad is additionally provided between cable and ceramic substrate, the ceramic substrate passes through patch
Welding procedure positioning welding is on cable.
Meanwhile the invention also discloses a kind of manufacturers of above-mentioned integrated form impact piece component based on eutectic bonding technique
Method, comprising the following steps:
A. the deposited metal layer on the ceramic substrate with array via hole；
B. the light of Exploding Foil and the second eutectic bonding pad is prepared by photoetching process on the metal layer of ceramic substrate
Resist mask, and corrode metal layer and form Exploding Foil and the second eutectic bonding pad；
C. deposited metal layer and the first eutectic bonding is prepared by photoetching process on the metal layer of gun barrel on gun barrel
Then the photoresist mask of pad corrodes metal layer and forms the first eutectic bonding pad；Meanwhile film flying dress is etched on gun barrel
It fills out chamber and accelerates bore structure；
D. the film flying filling for film flying being packed into gun barrel is intracavitary；
E. eutectic bonding technique is used, it will by the eutectic bonding of the first eutectic bonding pad and the second eutectic bonding pad
The gun barrel and Exploding Foil component for being mounted with film flying integrate, and form impact piece component；
F. piece component positioning welding will be impacted on cable.
Further, in the step A and step C it is method deposited metal layer by magnetron sputtering.
Further, the gun barrel using the double high resistant silicon wafers of throwing of dioxygen as substrate, and the step C specifically include it is following
Step:
C1. the photoresist mask that film flying loads chamber and acceleration bore is prepared in gun barrel two sides respectively by photoetching process,
And film flying filling is etched using dry etch process and accelerates bore structure；
C2. film flying loads the side deposited metal layer of chamber on gun barrel, and is prepared on the metal layer by photoetching process
Then the photoresist mask of first eutectic bonding pad corrodes metal layer and forms the first eutectic bonding pad.
Further, the gun barrel uses alumina ceramic plate as substrate, and the step C specifically includes following step
It is rapid:
C1. the deposited metal layer on gun barrel side, and the first eutectic bonding is prepared by photoetching process on the metal layer
Then the photoresist mask of pad corrodes metal layer and forms the first eutectic bonding pad；
C2. film flying filling chamber is etched using laser processing technology on gun barrel and accelerates bore structure.
Further, the step D specifically: the film flying that film flying made of Kapton is packed into gun barrel is loaded into chamber
It is interior, and fixed by glue.
Further, the metal layer is copper or aluminum metal layer, and it is specifically using patch that piece component is impacted in the step F
Piece welding procedure simultaneously passes through patch solder pad positioning welding on cable.
Compared with prior art, the present invention have it is below the utility model has the advantages that
In the integrated form impact piece component of the invention based on eutectic bonding technique, it is this often that aluminium oxide ceramics can be used
Ceramic substrate of the potsherd of rule as Exploding Foil component, has higher intensity and hardness, and Exploding Foil work has been effectively ensured
With the efficient output of process, meanwhile, Exploding Foil pad is guided into the ceramic substrate back side by using the mode of array via hole, favorably
In reducing entire size of components, guarantee the reliability of its effect；And traditional Kapton can be used in film flying, passes through gun barrel
On film flying filling chamber installation enter, the thickness of film flying can be made controllable using the design of independent film flying, ensure that integrated package is defeated
Consistency and reliability out；And the corresponding position on ceramic substrate and gun barrel makes metal pad respectively, using eutectic key
Technique is closed, in the process by control tolerance and bonding pressing force, integrates Exploding Foil, film flying and gun barrel reliably, protects
The alignment of gun barrel and bridge zone is demonstrate,proved；So that integrated impact piece component reduces assembly difficulty, the outer of Slapper detonator is reduced
Shape size improves its scope of application, realizes the integrated and mass of manufacturing process.
Detailed description of the invention
Fig. 1 is that the integrated form impact piece component overall structure based on eutectic bonding technique of one embodiment of the present of invention is shown
It is intended to.
Fig. 2 is the structural schematic diagram of the gun barrel of one embodiment of the present of invention.
Fig. 3 is the structural schematic diagram of the Exploding Foil component of one embodiment of the present of invention.
Appended drawing reference: 1- gun barrel, 2- film flying, 3- Exploding Foil, 4- ceramic substrate, 5- cable, 6- patch solder pad, 7- gusts
Column via hole, 8- eutectic bonding pad component, 9- film flying load chamber, and 10- accelerates bore, 81- the first eutectic bonding pad, 82- the
Two eutectic bonding pads.
Specific embodiment
Below with reference to the embodiment of the present invention, the invention will be further elaborated.
Embodiment:
Embodiment one:
As shown in Figure 1, a kind of integrated form based on eutectic bonding technique impacts piece component, including gun barrel 1, film flying 2, explosion
Foil component and cable 5 accelerate bore 10 as shown in Fig. 2, being equipped in 1 upper surface of gun barrel, are equipped with the first eutectic in 1 lower surface of gun barrel
Bonding welding pad 81 and film flying load chamber 9, and wherein the shape of film flying filling chamber 9 is consistent with 2 shape of film flying, and film flying loads chamber
9 are connected with bore 10 is accelerated；As shown in figure 3, Exploding Foil component includes ceramic substrate 4, it is equipped in 4 upper surface of ceramic substrate quick-fried
Fried foil 3 and second eutectic bonding pad 82 corresponding with the first eutectic bonding pad 81, and offer and pass through on ceramic substrate 4
Wear the array via hole 7 of ceramic substrate 4 and Exploding Foil 3, wherein two array via holes 7 are only illustrated in Fig. 1.
Specifically, film flying 2 is installed in the film flying filling chamber 9 of gun barrel 1, and film flying 2 and film flying filling chamber 9 are fitted close,
Film flying loads chamber 9 and applies certain pretightning force to the film flying 2 being mounted in it, and gun barrel 1 and Exploding Foil component pass through the first eutectic
The eutectic bonding of bonding welding pad 81 and the second eutectic bonding pad 82 and integrate, cable 5 is welded in 4 following table of ceramic substrate
Face, in the present embodiment, the corresponding position production eutectic bonding pad component 8 on ceramic substrate 4 and gun barrel 1 is (by the respectively
One eutectic bonding welding pad 81 and the first eutectic bonding pad 82 are constituted), using eutectic bonding technique, control can be passed through in integrating process
Tolerance processed and bonding pressing force integrate Exploding Foil 3, film flying 2 and gun barrel 1 reliably, ensure that gun barrel 1 and bridge zone
Alignment, and the integrated form impact piece component finally constituted has the advantages that assembly difficulty is low, Slapper detonator outer dimension is small,
Be conducive to promote its scope of application, and can realize the integrated and mass of manufacturing process.
Preferably, in the present embodiment, Exploding Foil 3, the first eutectic bonding pad 81, the second eutectic bonding pad 82 by
Copper or aluminium are made, and gun barrel 1 is made of High Resistivity Si or aluminium oxide ceramics, and film flying 2 is made of Kapton, in the present embodiment
Using the design that film flying 2 is set as to individual components, so that the thickness of film flying 2 is controllable, the one of integrated package output ensure that
Cause property and reliability.
In order to ensure stability that film flying 2 is mounted in film flying filling chamber 9, in the present embodiment, film flying 2 is installed on gun barrel 1
Film flying filling chamber 9 after be adhesively fixed by bonding agents such as glue.
Preferably, being additionally provided with patch solder pad 6, ceramic base between cable 5 and ceramic substrate 4 in the present embodiment
Piece 4 is by patch welding procedure positioning welding on cable 5.
Embodiment two
A kind of manufacturing method of above-mentioned integrated form impact piece component based on eutectic bonding technique is disclosed in the present embodiment,
The following steps are included:
A. copper or aluminum metal layer are deposited on the ceramic substrate 4 with array via hole 7 using the methods of magnetron sputtering；
B. Exploding Foil 3 and the second eutectic bonding pad 82 are prepared by photoetching process on the metal layer of ceramic substrate 4
Photoresist mask, and corrode metal layer and form Exploding Foil 3 and the second eutectic bonding pad 82；
C. copper or aluminum metal layer are deposited on gun barrel 1 and prepare first by photoetching process on the metal layer of gun barrel 1
Then the photoresist mask of eutectic bonding pad 81 corrodes metal layer and forms the first eutectic bonding pad 81；Meanwhile in gun barrel 1
On etch film flying filling chamber 9 and accelerate 10 structure of bore；
Wherein, if gun barrel 1 throws high resistant silicon wafers as substrate using dioxygen pair, step C is specially following steps:
C1. film flying filling chamber 9 is prepared in 1 two sides of gun barrel respectively by photoetching process and the photoresist of bore 10 is accelerated to cover
Mould, and the filling of film flying 2 is etched using dry etch process and accelerates 10 structure of bore；
C2. using the methods of magnetron sputtering on gun barrel 1 film flying filling chamber 9 side deposition copper or aluminum metal layer, and
The photoresist mask of the first eutectic bonding pad 81 is prepared on metal layer by photoetching process, then corrodes metal layer and forms the
One eutectic bonding welding pad 81；
If gun barrel 1 is using alumina ceramic plate as substrate, step C is specially following steps:
C1. copper or aluminum metal layer are deposited on 1 side of gun barrel using the methods of magnetron sputtering, and passes through light on the metal layer
Carving technology prepares the photoresist mask of the first eutectic bonding pad 81, then corrodes metal layer and forms the first eutectic bonding pad
81；
C2. film flying filling chamber 9 is etched using laser processing technology on gun barrel 1 and accelerates 10 structure of bore；
It should be noted that the shape of film flying filling chamber 9 need to be kept with film flying 2 when specifically, making film flying filling chamber 9 in step C
Unanimously, and film flying 2 be installed on film flying filling chamber 9 after, film flying load chamber 9 cope with film flying 2 have certain pretightning force.
D. the film flying 2 made of Kapton is packed into the film flying filling chamber 9 of gun barrel 1, and tentatively solid by glue
It is fixed；
E. eutectic bonding technique is used, the eutectic key of the first eutectic bonding pad 81 and the second eutectic bonding pad 82 is passed through
Conjunction integrates the gun barrel 1 for being mounted with film flying 2 with Exploding Foil component, forms impact piece component；
F. impact piece component using patch welding procedure and is passed through into 6 positioning welding of patch solder pad on cable 5.
In integrated form impact piece of the present embodiment based on eutectic bonding technique, gun barrel 1 is integrated on position in situ
Film flying load chamber 9, by film flying load chamber 9 etching depth control and eutectic bonding axial pressing force, realize film flying 2 with
Exploding Foil 3, the reliable compression of gun barrel 1, and the first eutectic bonding pad 81 is integrated in film flying filling 9 side of chamber；Exploding Foil component
3 pad of Exploding Foil is guided into 4 bottom surface of ceramic substrate by way of array via hole 7, and is integrated with second in 3 side of Exploding Foil and is total to
Brilliant bonding welding pad 82；After film flying 2 is put into the film flying filling chamber 9 in gun barrel 1, by the eutectic bonding technique of precision positioning,
2 gun barrel of film flying, 1 component and Exploding Foil component integrate, and form impact piece component, then will collection by the way of patch welding
Impact piece component positioning welding after is on cable 5, and therefore, the impact piece component of the integrated form of the technical program passes through eutectic
Bonding technology and internal structure design realize the Integrated manufacture of impact piece component using the structural material of mature and reliable, and having can
, integrated level good by property it is high can mass manufacture the characteristics of.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of integrated form based on eutectic bonding technique impacts piece component, which is characterized in that including gun barrel, film flying, Exploding Foil
Component and cable are equipped in the gun barrel upper surface and accelerate bore, are equipped with the first eutectic bonding pad in gun barrel lower surface and fly
Piece loads chamber, and film flying filling chamber is connected with bore is accelerated；The Exploding Foil component includes ceramic substrate, on a ceramic substrate
Surface is equipped with Exploding Foil and the second eutectic bonding pad corresponding with the first eutectic bonding pad, and opens up on a ceramic substrate
There is the array via hole through ceramic substrate and Exploding Foil；
The film flying filling that the film flying is installed on gun barrel is intracavitary, and gun barrel and Exploding Foil component pass through the first eutectic bonding pad and the
The eutectic bonding of two eutectic bonding pads and integrate, the cable welding is in ceramic substrate lower surface.
2. a kind of integrated form based on eutectic bonding technique according to claim 1 impacts piece component, which is characterized in that institute
State that Exploding Foil, the first eutectic bonding pad, the second eutectic bonding pad are made of copper or aluminium and/or the gun barrel is by high resistant
Silicon or aluminium oxide ceramics are made and/or the film flying is made of Kapton.
3. a kind of integrated form based on eutectic bonding technique according to claim 1 impacts piece component, which is characterized in that institute
State film flying be installed on gun barrel film flying filling chamber after be adhesively fixed by bonding agent.
4. a kind of integrated form based on eutectic bonding technique according to any one of claims 1 to 3 impacts piece component, special
Sign is, patch solder pad is additionally provided between cable and ceramic substrate, and the ceramic substrate is fixed by patch welding procedure
Position is welded on cable.
5. a kind of manufacturing method of the integrated form impact piece component based on eutectic bonding technique as described in claim 1, special
Sign is, comprising the following steps:
A. the deposited metal layer on the ceramic substrate with array via hole；
B. the photoresist of Exploding Foil and the second eutectic bonding pad is prepared by photoetching process on the metal layer of ceramic substrate
Mask, and corrode metal layer and form Exploding Foil and the second eutectic bonding pad；
C. deposited metal layer and the first eutectic bonding pad is prepared by photoetching process on the metal layer of gun barrel on gun barrel
Photoresist mask, then corrode metal layer formed the first eutectic bonding pad；Meanwhile film flying filling chamber is etched on gun barrel
With acceleration bore structure；
D. the film flying filling for film flying being packed into gun barrel is intracavitary；
E. eutectic bonding technique is used, will be installed by the eutectic bonding of the first eutectic bonding pad and the second eutectic bonding pad
The gun barrel of film flying is integrated with Exploding Foil component, forms impact piece component；
F. piece component positioning welding will be impacted on cable.
6. the manufacturing method of the integrated form impact piece component according to claim 5 based on eutectic bonding technique, feature
It is, is the method deposited metal layer by magnetron sputtering in the step A and step C.
7. the manufacturing method of the integrated form impact piece component according to claim 5 based on eutectic bonding technique, feature
Be, the gun barrel using the double high resistant silicon wafers of throwing of dioxygen as substrate, and the step C specifically includes the following steps:
C1. film flying is prepared in gun barrel two sides respectively by photoetching process and loads the photoresist mask of chamber and acceleration bore, and adopted
Film flying filling is etched with dry etch process and accelerates bore structure；
C2. film flying loads the side deposited metal layer of chamber on gun barrel, and prepares first by photoetching process on the metal layer
Then the photoresist mask of eutectic bonding pad corrodes metal layer and forms the first eutectic bonding pad.
8. the manufacturing method of the integrated form impact piece component according to claim 5 based on eutectic bonding technique, feature
Be, the gun barrel using alumina ceramic plate as substrate, and the step C specifically includes the following steps:
C1. the deposited metal layer on gun barrel side, and the first eutectic bonding pad is prepared by photoetching process on the metal layer
Photoresist mask, then corrode metal layer formed the first eutectic bonding pad；
C2. film flying filling chamber is etched using laser processing technology on gun barrel and accelerates bore structure.
9. the manufacturing method of the integrated form impact piece component according to claim 5 based on eutectic bonding technique, feature
It is, the step D specifically: the film flying filling that film flying made of Kapton is packed into gun barrel is intracavitary, and passes through glue
It is fixed.
10. according to the manufacturer of the integrated form impact piece component based on eutectic bonding technique any in claim 5 to 9
Method, which is characterized in that the metal layer is copper or aluminum metal layer, and it is specifically to use patch that piece component is impacted in the step F
Welding procedure simultaneously passes through patch solder pad positioning welding on cable.
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| CN201910430625.4A CN110030887B (en) | 2019-05-22 | 2019-05-22 | Integrated impact sheet assembly based on eutectic bonding process and manufacturing method thereof |
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| CN201910430625.4A CN110030887B (en) | 2019-05-22 | 2019-05-22 | Integrated impact sheet assembly based on eutectic bonding process and manufacturing method thereof |
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| CN110993560A (en) * | 2019-11-13 | 2020-04-10 | 天津津航计算技术研究所 | Three-dimensional integrated packaging method |
| CN114111474A (en) * | 2021-12-07 | 2022-03-01 | 北京智芯传感科技有限公司 | MEMS impact sheet and wafer-level preparation method thereof |
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| CN114111474A (en) * | 2021-12-07 | 2022-03-01 | 北京智芯传感科技有限公司 | MEMS impact sheet and wafer-level preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN110030887B (en) | 2023-10-20 |
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