CN110014560A - A kind of plastic cement leaded light board machining process of 1.1mm or less thickness - Google Patents

A kind of plastic cement leaded light board machining process of 1.1mm or less thickness Download PDF

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Publication number
CN110014560A
CN110014560A CN201910274544.XA CN201910274544A CN110014560A CN 110014560 A CN110014560 A CN 110014560A CN 201910274544 A CN201910274544 A CN 201910274544A CN 110014560 A CN110014560 A CN 110014560A
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CN
China
Prior art keywords
plastic cement
light guide
guide plate
less thickness
machining process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910274544.XA
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Chinese (zh)
Inventor
张立明
甘业华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Chengguang Co Ltd
Original Assignee
Shenzhen Chengguang Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Chengguang Co Ltd filed Critical Shenzhen Chengguang Co Ltd
Priority to CN201910274544.XA priority Critical patent/CN110014560A/en
Publication of CN110014560A publication Critical patent/CN110014560A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033Means for improving the coupling-out of light from the light guide
    • G02B6/0035Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G02B6/0043Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided on the surface of the light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0065Manufacturing aspects; Material aspects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • B29L2011/0075Light guides, optical cables

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)

Abstract

A kind of plastic cement leaded light board machining process of 1.1mm or less thickness, step includes that the plastic grains of selection 100%PMMA are raw material, the primary plastic cement light guide plate of 1.1mm thickness is squeezed by extruder, primary plastic cement light guide plate is cut into specification secondary plastic cement light guide plate with light guide plate guillotine and polishing grinding forms, screen print lattice-point design and halftone production are carried out according to secondary plastic cement light guide plate, multilayer secondary plastic cement light guide plate is superimposed and carries out deformation process, then site silk-screen is carried out, detection optical property and bad flaw are carried out to the secondary plastic cement light guide plate after solidification, it will test qualified secondary plastic cement light guide plate to stick protective film and carry out laminating shaping;Compared with prior art, the beneficial effects of the present invention are: light guide plate can be made 1.1mm or less thickness, is applied in 18.5 cun or more backlights by the plastic material by the way that high cost glass material to be changed to low cost, effectively reduce the production cost of light guide plate, reduced thickness and indeformable.

Description

A kind of plastic cement leaded light board machining process of 1.1mm or less thickness
[technical field]
The present invention relates to light guide plate technical fields, are specifically related to a kind of plastic cement light guide plate processing of 1.1mm or less thickness Technique.
[background technique]
In applying in a backlight, existing light guide plate mainly includes glass light guide plate and plastic cement light guide plate.Existing glass Glass light guide plate is because its guide-lighting performance is good, very little of expanding with heat and contract with cold, it is easy to it is made 1.1mm or less thickness, but glass light guide plate Production cost is much higher than plastic cement light guide plate;Cost is relatively low for existing plastic cement light guide plate, but since plastic cement light guide plate expands with heat and contract with cold Performance it is strong, the plastic cement light guide plate routinely produced is all greater than 1.5mm thickness, is not available in 18.5 cun or more backlights.
In consideration of it, it is really necessary to provide a kind of plastic cement leaded light board machining process of 1.1mm or less thickness to overcome existing skill The deficiency of art.
[summary of the invention]
The object of the present invention is to provide a kind of plastic cement leaded light board machining process of 1.1mm or less thickness, it is intended to it is practical will be high Cost glass material is changed to the plastic material of low cost, and 1.1mm or less thickness is made in light guide plate, is carried on the back applied to 18.5 cun or more In light, the production cost of light guide plate is reduced, reduced thickness and prevent from deforming.
To achieve the goals above, the present invention provide a kind of 1.1mm or less thickness plastic cement leaded light board machining process it is main The following steps are included:
Step SO1, the plastic grains for choosing 100%PMMA are raw material, and the primary of 1.1mm thickness is squeezed by extruder Plastic cement light guide plate;
Primary plastic cement light guide plate is cut into specification secondary plastic cement light guide plate with light guide plate guillotine and polished by step SO2 Polishing molding;
Step SO3 carries out screen print lattice-point design according to secondary plastic cement light guide plate and halftone makes;
Multilayer secondary plastic cement light guide plate is superimposed and carries out deformation process by step SO4, then carries out site silk-screen, Environment after the silk-screen of site at 100 ° of constant temperature is solidified;
Step SO5 carries out detection optical property to the secondary plastic cement light guide plate after solidification and bad flaw, sort is put It sets;
Step SO6 will test qualified secondary plastic cement light guide plate and stick protective film and carry out laminating shaping, in constant temperature and humidity It is stored 24 hours in environment;
Step SO7, pack shipment and with in backlight module.
In a preferred embodiment, the specification of the primary plastic cement light guide plate is 1260mm × 1090mm × 1.1mm, Density=1.19g/cm of primary plastic cement light guide plate3
In a preferred embodiment, the primary plastic cement leaded light plate thickness that 1.1mm thickness is squeezed by extruder Spend tolerance≤soil 0.1mm.
In a preferred embodiment, before step SO1, the plastic grains also pass through drying process before squeezing, Drying temperature is 85-90 degrees Celsius, drying time 3-5 hour.
In a preferred embodiment, described multilayer secondary plastic cement light guide plate is superimposed carries out deformation process Temperature is 30 degrees Celsius, and degree humidity is 50%.
In a preferred embodiment, the environment after the site silk-screen at 100 ° of constant temperature carries out cured temperature error At positive and negative 2 degrees Celsius.
In a preferred embodiment, the method for laminating shaping are as follows: be superimposed upon 30 secondary plastic cement light guide plates Together, it and is placed in marble platform, top applies pressure, pressure size 50N by smooth object, and environment temperature is taken the photograph for 30 Family name's degree, degree humidity are 50%.
Compared with prior art, a kind of plastic cement leaded light board machining process of 1.1mm or less thickness provided by the invention has Beneficial effect is: the plastic material by the way that high cost glass material to be changed to low cost, successively passes through extrusion forming, cuts, throws Light guide plate, can be made 1.1mm or less thickness by light polishing, site silk-screen, detection and the process for packing shipment, be applied to 18.5 In the very little above backlight, the production cost of light guide plate is effectively reduced, reduced thickness and indeformable.
[Detailed description of the invention]
Fig. 1 is the flow chart of the plastic cement leaded light board machining process of 1.1mm or less thickness provided by the invention.
Fig. 2 is the schematic diagram of primary plastic cement light guide plate.
Fig. 3 is the schematic diagram of secondary plastic cement light guide plate.
Fig. 4 is the schematic diagram for carrying out the secondary plastic cement light guide plate after the silk-screen of site.
Fig. 5 is the schematic diagram for laminate the secondary plastic cement light guide plate of shaping.
[specific embodiment]
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited by the specific embodiments disclosed below.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level ", "left", "right" and similar statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Referring to Fig. 1, the present invention provides a kind of plastic cement leaded light board machining process of 1.1mm or less thickness.
In an embodiment of the present invention, the plastic cement leaded light board machining process of 1.1mm or less the thickness mainly includes following Step:
Step SO1, the plastic grains for choosing 100%PMMA are raw material, and the primary of 1.1mm thickness is squeezed by extruder Plastic cement light guide plate.
It is understood that referring to Fig. 2, squeezing the weight G of plastic grain by quantity n, the plate of primary plastic cement light guide plate Material density β and primary plastic cement leaded light plate bulk V determines, i.e. G=V × β × n.Wherein the specification of primary plastic cement light guide plate is 1260mm × 1090mm × 1.1mm (is applied in 18.5 cun or less backlights) after conveniently cutting, the density of primary plastic cement light guide plate =1.19g/cm3.The primary plastic cement light guide plate squeezed out by extruder, thickness deviation≤soil 0.1mm.Inspection before extruder booting It looks into equipment voltage and whether air pressure, temperature meets specified value, plastic grains will first pass through drying process before squeezing, and drying temperature is 85-90 degrees Celsius, drying time 3-5 hour.When extruder squeezes, extruder barrel rear part temperature is 200-220 degrees Celsius, in Portion's temperature is 210-230 degrees Celsius, and front temperature is 220-240 degrees Celsius, and processing melt temperature is 230-250 degrees Celsius, mould Temperature is 50-90 degrees Celsius, and speed is selected as medium partially slow.
Primary plastic cement light guide plate is cut into specification secondary plastic cement light guide plate with light guide plate guillotine and polished by step SO2 Polishing molding.
It is understood that referring to Fig. 3, light guide plate guillotine is typically provided deep bid saw and shallow bid saw, in this technology side It is preferably sawed using shallow bid in case, shallow bid saw cuts precision height, it is possible to reduce chipping occurs during cutting, collapses angle, white edge, indigo plant The generation on side, shield trace and anti-knife mark.It is worth noting that checking whether voltage and air pressure are providing before the booting of light guide plate guillotine Value, when cutting primary plastic cement light guide plate with light guide plate guillotine every time, needs to clean light guide plate guillotine, in case light guide plate is cut Pin on machine worktable damages primary plastic cement light guide plate.
Step SO3 carries out screen print lattice-point design according to secondary plastic cement light guide plate and halftone makes.
It is understood that light guide plate is optical, brightness and uniformity, image quality macro-effect substantially by screen print lattice-point Lai It determines, screen print lattice-point design is exactly according to optical principle (refraction and reflection, LED point light source is become area source) to light guide plate silk Print does a layout;Silk-screen needs a fixed halftone just can pass through the film, exposure by net-point printing on light guide plate, Site is formed on grenadine;Silk-screen is exactly by the site on grenadine, and ink knife moves back and forth on halftone and arrives ink penetration Ink point is formed on light guide plate, after isothermal curing, eventually forms the finished product light guide plate with optical effect.
Multilayer secondary plastic cement light guide plate is superimposed and carries out deformation process by step SO4, then carries out site silk-screen, Environment after the silk-screen of site at 100 ° of constant temperature is solidified.
It is understood that referring to Fig. 4, since secondary plastic cement light guide plate is made of plastic material, with heat expansion The characteristic of shrinkage is expanded with heat and contract with cold with certain stress, smaller more easily-deformable with thickness proportion in area, so in order to remain unchanged Shape must increase thickness, and multilayer secondary plastic cement light guide plate is superimposed, and multilayer secondary plastic cement light guide plate is superimposed The temperature for carrying out deformation process is 30 degrees Celsius, and degree humidity is 50%.Deformation process is exactly to keep plate indeformable before printing, Convenient for being accurately laid out ink point on plate, 100 degree of constant temperature, which are that ink solidification needs temperature, is determined by ink performance It is fixed, it is high to damage ink performance, it is low and solidification effect is not achieved, therefore, after the silk-screen of site 100 ° of constant temperature environment into The cured temperature error of row is at positive and negative 2 degrees Celsius.
Step SO5 carries out detection optical property to the secondary plastic cement light guide plate after solidification and bad flaw, sort is put It sets.
It is understood that detection optical property specifically includes that brightness, the uniformity, coloration, brightness comes according to customer demand Fixed, the uniformity is determined according to professional standard, that is, uses nine grids rule, the smallest uniformity numerical value and maximum uniformity numerical value Ratio be greater than or equal to 75% for qualification, coloration determines according to professional standard, light and enters the difference of photochromic coordinate out and is less than or waits It is qualification in 0.01.Bad flaw mainly includes white point, white group, dim spot, dark group, reticulate pattern print, scratch, bright spot and connects point.
Step SO6 will test qualified secondary plastic cement light guide plate and stick protective film and carry out laminating shaping, in constant temperature and humidity It is stored 24 hours in environment.
It is understood that referring to Fig. 5, since secondary plastic cement light guide plate has obvious temperature after high temperature with external environment Difference prevents ambient temperature variation from causing to deform, so must carry out laminating shaping, the method for laminating shaping are as follows: will 30 secondary plastic cement light guide plates are superimposed, and are placed in marble platform, and top applies pressure, pressure by smooth object Size is 50N, and environment temperature is 30 degrees Celsius, and degree humidity is 50%.
Step SO7, pack shipment and with in backlight module.
Compared with prior art, a kind of plastic cement leaded light board machining process of 1.1mm or less thickness provided by the invention has Beneficial effect is: the plastic material by the way that high cost glass material to be changed to low cost, successively passes through extrusion forming, cuts, throws Light guide plate, can be made 1.1mm or less thickness by light polishing, site silk-screen, detection and the process for packing shipment, be applied to 18.5 In the very little above backlight, the production cost of light guide plate is effectively reduced, reduced thickness and indeformable.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (7)

1. a kind of plastic cement leaded light board machining process of 1.1mm or less thickness, it is characterised in that: mainly comprise the steps that
Step SO1, the plastic grains for choosing 100%PMMA are raw material, and the primary plastic cement of 1.1mm thickness is squeezed by extruder Light guide plate;
Primary plastic cement light guide plate is cut into specification secondary plastic cement light guide plate and polishing grinding with light guide plate guillotine by step SO2 Molding;
Step SO3 carries out screen print lattice-point design according to secondary plastic cement light guide plate and halftone makes;
Multilayer secondary plastic cement light guide plate is superimposed and carries out deformation process by step SO4, then carries out site silk-screen, site Environment after silk-screen at 100 ° of constant temperature is solidified;
Step SO5 carries out detection optical property and bad flaw to the secondary plastic cement light guide plate after solidification, and sort is placed;
Step SO6 will test qualified secondary plastic cement light guide plate and stick protective film and carry out laminating shaping, in constant-temperature constant-humidity environment Middle storage 24 hours;
Step SO7, pack shipment and with in backlight module.
2. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: the primary The specification of plastic cement light guide plate is 1260mm × 1090mm × 1.1mm, density=1.19g/cm of primary plastic cement light guide plate3
3. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: described to pass through Extruder is squeezed into primary plastic cement light guide plate tolerance≤soil 0.1mm of 1.1mm thickness.
4. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: in step SO1 Before, drying process is also passed through before the plastic grains squeeze, drying temperature is 85-90 degrees Celsius, drying time 3-5 hour.
5. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: it is described will be more It is 30 degrees Celsius that hierarchical level plastic cement light guide plate, which is superimposed and carries out the temperature of deformation process, and degree humidity is 50%.
6. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: the site Environment after silk-screen at 100 ° of constant temperature carries out cured temperature error at positive and negative 2 degrees Celsius.
7. the plastic cement leaded light board machining process of 1.1mm or less thickness as described in claim 1, it is characterised in that: described to laminate The method of shaping is that 30 secondary plastic cement light guide plates are superimposed, and is placed in marble platform, and top passes through smooth Object applies pressure, pressure size 50N, and environment temperature is 30 degrees Celsius, and degree humidity is 50%.
CN201910274544.XA 2019-04-08 2019-04-08 A kind of plastic cement leaded light board machining process of 1.1mm or less thickness Pending CN110014560A (en)

Priority Applications (1)

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CN201910274544.XA CN110014560A (en) 2019-04-08 2019-04-08 A kind of plastic cement leaded light board machining process of 1.1mm or less thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910274544.XA CN110014560A (en) 2019-04-08 2019-04-08 A kind of plastic cement leaded light board machining process of 1.1mm or less thickness

Publications (1)

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CN110014560A true CN110014560A (en) 2019-07-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201867509U (en) * 2010-12-03 2011-06-15 东莞市康德五金电子有限公司 Novel light guide plate
JP2012189667A (en) * 2011-03-09 2012-10-04 Toppan Printing Co Ltd Light guide plate
CN102729460A (en) * 2012-06-28 2012-10-17 苏州佳宏光电有限公司 Warpage back-pressing apparatus and warpage back-pressing method adopting the same
KR20160004495A (en) * 2014-07-02 2016-01-13 (주)세진티에스 Ultra thin and flat type Light guide panel having LED light receiving part and Method for manufacturing the same
CN105403949A (en) * 2015-12-22 2016-03-16 翰博高新材料(合肥)股份有限公司 Thin-type light guiding plate and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201867509U (en) * 2010-12-03 2011-06-15 东莞市康德五金电子有限公司 Novel light guide plate
JP2012189667A (en) * 2011-03-09 2012-10-04 Toppan Printing Co Ltd Light guide plate
CN102729460A (en) * 2012-06-28 2012-10-17 苏州佳宏光电有限公司 Warpage back-pressing apparatus and warpage back-pressing method adopting the same
KR20160004495A (en) * 2014-07-02 2016-01-13 (주)세진티에스 Ultra thin and flat type Light guide panel having LED light receiving part and Method for manufacturing the same
CN105403949A (en) * 2015-12-22 2016-03-16 翰博高新材料(合肥)股份有限公司 Thin-type light guiding plate and preparation method thereof

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Application publication date: 20190716