CN109994536A - Tft array substrate and OLED display panel - Google Patents

Tft array substrate and OLED display panel Download PDF

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Publication number
CN109994536A
CN109994536A CN201910351231.XA CN201910351231A CN109994536A CN 109994536 A CN109994536 A CN 109994536A CN 201910351231 A CN201910351231 A CN 201910351231A CN 109994536 A CN109994536 A CN 109994536A
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China
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electrode layer
layer
transparent electrode
anode
tft array
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CN201910351231.XA
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余赟
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201910351231.XA priority Critical patent/CN109994536A/en
Priority to PCT/CN2019/094536 priority patent/WO2020220463A1/en
Publication of CN109994536A publication Critical patent/CN109994536A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8051Anodes
    • H10K59/80515Anodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/813Anodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • H10K59/1315Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65OLEDs integrated with inorganic image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80521Cathodes characterised by their shape

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention provides a kind of tft array substrate and OLED display panel.Tft array substrate of the invention includes substrate, TFT layer, planarization layer and anode layer, substrate includes camera shooting Head Section, anode layer includes the first anode in camera shooting Head Section, the first anode includes the first bottom transparent electrode layer set gradually, first metal electrode layer and the first top transparent electrode layer, first metal electrode layer has the first part of grid-shaped structure, the first part has multiple hollow holes, first top transparent electrode layer fills multiple hollow holes, to greatly improve the penetrance of the first anode, and reduce the resistance value of the first anode, the quality of product is effectively promoted.

Description

Tft array substrate and OLED display panel
Technical field
The present invention relates to field of display technology more particularly to a kind of tft array substrate and OLED display panels.
Background technique
Organic LED display device (Organic Light Emitting Display, OLED) has spontaneous Light, driving voltage are low, luminous efficiency is high, the response time is short, clarity and contrast are high, nearly 180 ° of visual angles, use temperature ranges Width is known as being the display for most having development potentiality by industry, it can be achieved that many advantages, such as Flexible Displays are with large area total colouring Device.
OLED according to driving method can be divided into passive matrix OLED (Passive Matrix OLED, PMOLED) and Active array type OLED (Active Matrix OLED, AMOLED) two major classes, i.e. directly addressing and thin film transistor (TFT) (TFT) square Battle array two classes of addressing.Wherein, AMOLED has the pixel in array arrangement, belongs to active display type, luminous efficacy is high, usually As large scale display device high-definition.OLED device generally includes: substrate, is set to anode at the anode on substrate On hole injection layer, the hole transmission layer on hole injection layer, the luminescent layer on hole transmission layer, be set to shine Electron transfer layer on layer, the electron injecting layer on electron transfer layer and the cathode on electron injecting layer.OLED device The principle of luminosity of part is semiconductor material and luminous organic material under electric field driven, causes to send out with compound by carrier injection Light.Specifically, electrons and holes are injected into electron transfer layer from cathode and anode respectively and hole passes under certain voltage driving Defeated layer, electrons and holes pass through electron transfer layer respectively and hole transmission layer moves to luminescent layer, and meet in luminescent layer, shape At exciton and excite light emitting molecule, the latter issues visible light by radiative relaxation.
With the development of display technology, the display device using comprehensive screen design is more and more popular with consumers.It is existing There is technology that can use the lower camera technology of screen to be promoted and shield accounting to realize screen design comprehensively, using camera technology under shielding OLED display panel corresponds to camera and is provided with camera shooting head region, the camera shooting head region needs do not shown when using camera and With high light transmittance, normally shown when not using camera.
Referring to Fig. 1, a kind of existing tft array substrate using the OLED display panel for shielding lower camera technology includes Substrate 100, the planarization layer 300 on TFT layer 200, is set on planarization layer 300 TFT layer 200 on substrate 100 Anode layer 400 and the pixel defining layer 500 on anode layer 400.The substrate 100 include effective display area 110 and with The adjacent camera shooting Head Section 120 in effective display area 110.The anode layer 400 includes the first anode in effective display area 110 410 and positioned at camera shooting Head Section 120 in second plate 420, the first anode 410 include the first tin indium oxide (ITO) layer 4101, the silver layer 4102 in the first ITO layer 4101 and the second ITO layer 4103 being set on silver-colored (Ag) layer 4102, described the Two anode 420 is whole to be made of ITO.In order to guarantee the translucency of second plate 420, the thickness of second plate 420 generally compared with Thin (preferably 40nm), electric conductivity it is poor (resistance value be about ITO/Ag/ITO structure electrode (thickness use 15nm/ 140nm/15nm) 200 times), leading to luminescence display, there are signal delays in the process, influence 420 corresponding position of second plate Display effect causes luminous efficiency to reduce, and since the first anode 410 is different from the film layer structure of second plate 420, processing procedure Quantity increases, and the production cost increases.
Summary of the invention
The purpose of the present invention is to provide a kind of tft array substrates, and the penetrance for imaging anode in Head Section is high, and resistance value Smaller, product quality is high.
Another object of the present invention is to provide a kind of OLED display panels, and the penetrance for imaging anode in Head Section is high, and Resistance value is smaller, and product quality is high.
To achieve the above object, present invention firstly provides a kind of tft array substrates, the TFT including substrate, on substrate Layer, the planarization layer on TFT layer and the anode layer on planarization layer;
The substrate includes camera shooting Head Section;The anode layer includes the first anode in camera shooting Head Section;Described first Anode includes the first bottom transparent electrode layer on planarization layer, the first metal electrode on the first bottom transparent electrode layer Layer and the first top transparent electrode layer on the first metal electrode layer and the first bottom transparent electrode layer;The first metal electricity Pole layer includes the first part of grid-shaped structure, which has multiple hollow holes, first top transparent electrode layer Fill multiple hollow holes.
The thickness of first top transparent electrode layer is uniform.
It is described first top transparent electrode layer with a thickness of 15~60nm;First metal electrode layer with a thickness of 30~ 80nm;First bottom transparent electrode layer with a thickness of 5~10nm.
First top transparent electrode layer is located at the thickness of the part on the first metal electrode layer less than the first transparent electricity in top Pole layer is located at the thickness of the part on the first bottom transparent electrode layer.
First top transparent electrode layer is located at pushing up with a thickness of 7~15nm, first for the part on the first metal electrode layer Transparent electrode layer be located at the part on the first bottom transparent electrode layer with a thickness of 15~60nm.
The material of first bottom transparent electrode layer is tin indium oxide, and the material of first metal electrode layer is silver, institute The material for stating the first top transparent electrode layer is tin indium oxide.
The substrate further includes the effective display area adjacent with camera shooting Head Section;The anode layer further includes being located at effectively display Second plate in area;
The second plate includes the second bottom transparent electrode layer being set on planarization layer, is set to the second bottom transparent electrode layer On the second metal electrode layer and on the second metal electrode layer second top transparent electrode layer;Second metal electrode layer For whole face structure.
It is described second top transparent electrode layer with a thickness of 15~60nm;Second metal electrode layer with a thickness of 30~ 80nm;Second bottom transparent electrode layer with a thickness of 5~10nm;
The material of second bottom transparent electrode layer is tin indium oxide, and the material of second metal electrode layer is silver, institute The material for stating the second top transparent electrode layer is tin indium oxide.
The grid line width of the first part is 2~8 μm.
The tft array substrate further includes the pixel defining layer on planarization layer and anode layer;The pixel definition Layer is equipped with corresponding the first opening being located above first part.
The hollow out rate of the first part is 50%~70%.
The present invention also provides a kind of OLED display panels, including above-mentioned tft array substrate.
Beneficial effects of the present invention: tft array substrate of the invention includes substrate, TFT layer, planarization layer and anode layer, Substrate includes camera shooting Head Section, and anode layer includes the first anode in camera shooting Head Section, and the first anode includes the set gradually One bottom transparent electrode layer, the first metal electrode layer and the first top transparent electrode layer, the first metal electrode layer includes grid-shaped knot The first part of structure, the first part have multiple hollow holes, and first top transparent electrode layer fills multiple hollow holes, thus The penetrance of the first anode is greatly improved, and reduces the resistance value of the first anode, the quality of product is effectively promoted. The penetrance of anode is high in the camera shooting Head Section of OLED display panel of the invention, and resistance value is smaller, and product quality is high.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is that a kind of section view of existing tft array substrate using the OLED display panel for shielding lower camera technology is shown It is intended to;
Fig. 2 is the schematic cross-sectional view of the first embodiment of tft array substrate of the invention;
Fig. 3 is the schematic top plan view of first part in the first metal electrode layer of tft array substrate of the invention;
Fig. 4 is the partial sectional view of the first anode of the first embodiment of tft array substrate of the invention;
Fig. 5 is the schematic cross-sectional view of the second embodiment of tft array substrate of the invention;
Fig. 6 is the partial sectional view of the first anode of the second embodiment of tft array substrate of the invention.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention Example and its attached drawing are described in detail.
Referring to Fig. 2, the tft array substrate of the first embodiment of the present invention includes substrate 10, the TFT on substrate 10 Layer 20, the planarization layer 30 on TFT layer 20 and the anode layer 40 on planarization layer 30.
The substrate 10 includes camera shooting Head Section 11.The anode layer 40 includes the first anode in camera shooting Head Section 11 41.The first anode 41 includes the first bottom transparent electrode layer 411 being set on planarization layer 30, is set to the first bottom transparent electrode Layer 411 on the first metal electrode layer 412 and on the first metal electrode layer 412 and the first bottom transparent electrode layer 411 First top transparent electrode layer 413.The first part A of first metal electrode layer 412 including grid-shaped structure, this first Divide A that there are multiple hollow hole V, first top transparent electrode layer 413 fills multiple hollow hole V.
Specifically, incorporated by reference to Fig. 2 and Fig. 4, in the first embodiment of the present invention, first top transparent electrode layer 413 Thickness it is uniform, in order to reduce the first anode 41 in the region hollow hole V and the region hollow hole V between exterior domain Difference is shown caused by current density difference, in the first embodiment of the present invention, the thickness of first top transparent electrode layer 413 Degree is 15~60nm, first metal electrode layer 412 with a thickness of 30~80nm, first bottom transparent electrode layer 411 With a thickness of 5~10nm, to reduce the fine difference of electric conductivity in small area.
Specifically, the material of first bottom transparent electrode layer 411 is tin indium oxide, first metal electrode layer 412 Material be silver, it is described first top transparent electrode layer 413 material be tin indium oxide.
Specifically, the substrate 10 further includes the effective display area 12 adjacent with camera shooting Head Section 11.The anode layer 40 is also Including the second plate 42 being located in effective display area 12.The second plate 42 includes the second bottom on planarization layer 30 Transparent electrode layer 421, the second metal electrode layer 422 on the second bottom transparent electrode layer 421 and be set to the second metal electrode The second top transparent electrode layer 423 on layer 422.Second metal electrode layer 422 is whole face structure.
Further, it is described second top transparent electrode layer 423 with a thickness of 15~60nm.Second metal electrode layer 422 with a thickness of 30~80nm.Second bottom transparent electrode layer 421 with a thickness of 5~10nm.Second bottom transparent electrode The material of layer 421 is tin indium oxide, and the material of second metal electrode layer 422 is silver, second top transparent electrode layer 423 Material be tin indium oxide.
Preferably, the grid line width of the first part A is 2~8 μm.
Specifically, the tft array substrate further includes the pixel defining layer 50 on planarization layer 30 and anode layer 40. The pixel defining layer 50, which is equipped with corresponding the first opening 51 being located above first part A and corresponds to, is located at 42 top of second plate The second opening 52, when the later use tft array substrate makes OLED display panel, first part A and OLED device Luminous zone is corresponding.
Preferably, the hollow out rate of the first part A is the region 50%~70% namely multiple hollow hole V area It is the 50%~70% of the edge first part A institute's envelope surface product.
Specifically, referring to Fig. 3, in the preferred embodiment of the present invention, the first part A include outline border A1 and Multiple diamond A2, multiple first stripes A3, multiple second stripes A4, multiple third stripes on the inside of outline border A1 A5 and multiple Article 4 shapes portion A6.The multiple diamond A2 arranges in array.With any two phase in a line diamond A2 Adjacent diamond A2 has opposite apex angle and opposite apex angle is through one first stripes A3 connection, in same row diamond A2 times Two adjacent diamond A2 that anticipate have opposite apex angle and opposite apex angle is through one second stripes A4 connection.Multiple diamonds In A2, its in the apex angle of outermost diamond A2 other than the apex angle being connect with the first stripes A3 and the second stripes A4 He connect through multiple third stripes A5 with outline border A1 apex angle respectively.In the adjacent diamond A2 of any four, have opposite The opposite one Article 4 shape portion A6 connection of side of two diamond A2 of side.In the preferred embodiment, by outline border A1, Multiple diamond A2, multiple first stripes A3, multiple second stripes A4, multiple third stripes A5 and multiple Article 4 shapes Portion A6 crosses multiple hollow hole V.Certainly, in other embodiments of the invention, other forms can also be used in first part A Fenestral fabric with multiple hollow hole V, will not influence realization of the invention.
Specifically, the substrate 10 is flexible substrate, and the first fexible film 101, first including being cascading is slow Layer 102, the second fexible film 103 and second buffer layer 104 are rushed, the TFT layer 20 is set in second buffer layer 104, and first is soft Property film 101 and the second fexible film 103 material be polyimides (PI).
Specifically, the TFT layer 20 include in the second buffer layer 104 and be located in camera shooting Head Section 11 it is first active Layer 211, is set to second buffer layer at the second active layer 212 in second buffer layer 104 and in effective display area 12 104, the first active layer 211 and first grid insulating layer 22 on the second active layer 212, be set on first grid insulating layer 22 and The first bottom-gate 231 above the first active layer 211 is set on first grid insulating layer 22 and is located at the second active layer 212 top the second bottom-gate 232, in first grid insulating layer 22, the first bottom-gate 231 and the second bottom-gate 232 Second grid insulating layer 24, the first top-gated pole on second grid insulating layer 24 and above the first bottom-gate 231 251, on second grid insulating layer 24 and be located above the second bottom-gate 232 the second top-gated pole 252, set on second grid Insulating layer 24, the first top-gated pole 251 and interlayer insulating film 26 on the second top-gated pole 252 are set on interlayer insulating film 26 and position In the first source electrode 271 and the first drain electrode 272 in camera shooting Head Section 11 and it is set on interlayer insulating film 26 and is located at effectively display The second source electrode 273 and the second drain electrode 274 in area 12.Interlayer insulating film 26, second grid insulating layer 24 and first grid insulation It is set above the both ends of corresponding first active layer 211 of layer 22 there are two the first via hole 261, first source electrode 271 and first drains 272 two end in contact respectively through two the first via holes 261 and the first active layer 211, interlayer insulating film 26, second grid insulating layer 24 and corresponding second active layer 212 of first grid insulating layer 22 both ends above set that there are two the second via hole 262, second sources Two end in contact of pole 273 and the second drain electrode 274 respectively through two the second via holes 262 and the second active layer 212.The planarization layer A top in 30 corresponding first source electrodes 271 and the first drain electrode 272 is equipped with third via hole 31, and the first anode 41 is through third via hole 31 contact with one in the first source electrode 271 and the first drain electrode 272.Corresponding second source electrode 273 and second of the planarization layer 30 A top in drain electrode 274 is equipped with the 4th via hole 32, and second plate 42 is through the 4th via hole 32 and the second source electrode 273 and the second leakage A contact in pole 274.
Specifically, the tft array substrate further includes the spacer material (PS) 60 in pixel defining layer 50.
Incorporated by reference to Fig. 5 and Fig. 6, the difference of the tft array substrate of the second embodiment of the present invention and above-mentioned first embodiment It is, it is close with the electric current between exterior domain in the region hollow hole V and the region hollow hole V in order to reduce the first anode 41 It spends and shows difference caused by difference, the first top of setting transparent electrode layer 413 is located at the thickness of the part on the first metal electrode layer 412 It spends and is located at the thickness of the part on the first bottom transparent electrode layer 411 less than the first top transparent electrode layer 413, specially described the One metal electrode layer 412 with a thickness of 30~80nm and the base with a thickness of 5~10nm of first bottom transparent electrode layer 411 On plinth, first top transparent electrode layer 413 be located at the part on the first metal electrode layer 412 with a thickness of 7~15nm, first Top transparent electrode layer 413 be located at the part on the first bottom transparent electrode layer 411 with a thickness of 15~60nm, to reduce cell The fine difference of electric conductivity within the scope of domain, remaining is identical with the first embodiment, and details are not described herein.
It should be noted that the first anode 41 in tft array substrate setting camera shooting Head Section 11 of the invention includes successively The first bottom transparent electrode layer 411, the first metal electrode layer 412 and the first top transparent electrode layer 413 being arranged, and it is arranged first Metal electrode layer 412 includes the first part A of grid-shaped structure, and first part A has multiple hollow hole V, and the first top is saturating Prescribed electrode layer 413 fills multiple hollow hole V, due to the grid-shaped structure of first part A and has multiple hollow hole V, so that the The penetrance with higher of one metal electrode layer 412, so that the whole penetrance with higher of the first anode 41, convenient for screen The realization of lower camera technology, simultaneously because the first anode 41 adds the knot of one layer of metal electrode layer using two layers of transparent electrode layer Structure, the whole resistance value of the first anode 41 is smaller, avoid the resistance value of the first anode 41 excessive in OLED display panel with the Luminous efficiency caused by the display effect of one anode, 41 corresponding position has an impact reduces, and the quality of product is effectively promoted.
Based on the same inventive concept, the present invention also provides a kind of OLED display panel, including above-mentioned tft array substrate, Repeated description no longer is carried out to the structure of tft array substrate herein.Other than above-mentioned tft array substrate, the OLED is shown Panel further includes the luminescent layer in the first opening 51 and the second opening 52 and the cathode on luminescent layer to form OLED Device.
It should be noted that the first anode 41 in OLED display panel setting camera shooting Head Section 11 of the invention includes successively The first bottom transparent electrode layer 411, the first metal electrode layer 412 and the first top transparent electrode layer 413 being arranged, and it is arranged first Metal electrode layer 412 includes the first part A of grid-shaped structure, and first part A has multiple hollow hole V, and the first top is saturating Prescribed electrode layer 413 fills multiple hollow hole V, due to the grid-shaped structure of first part A and has multiple hollow hole V, so that the The penetrance with higher of one metal electrode layer 412, so that the whole penetrance with higher of the first anode 41, convenient for screen The realization of lower camera technology, simultaneously because the first anode 41 adds the knot of one layer of metal electrode layer using two layers of transparent electrode layer Structure, the whole resistance value of the first anode 41 is smaller, avoid the resistance value of the first anode 41 excessive in OLED display panel with the Luminous efficiency caused by the display effect of one anode, 41 corresponding position has an impact reduces, and the quality of product is effectively promoted.
In conclusion tft array substrate of the invention includes substrate, TFT layer, planarization layer and anode layer, substrate includes Head Section is imaged, anode layer includes the first anode in camera shooting Head Section, which includes that the first bottom for setting gradually is saturating Prescribed electrode layer, the first metal electrode layer and the first top transparent electrode layer, the first metal electrode layer include the of grid-shaped structure A part, the first part have multiple hollow holes, and first top transparent electrode layer fills multiple hollow holes, to mention significantly The penetrance of the first anode has been risen, and has reduced the resistance value of the first anode, the quality of product is effectively promoted.The present invention OLED display panel camera shooting Head Section in anode penetrance it is high, and resistance value is smaller, and product quality is high.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention Protection scope.

Claims (12)

1. a kind of tft array substrate, which is characterized in that including substrate (10), the TFT layer (20) being set on substrate (10), be set to Planarization layer (30) on TFT layer (20) and the anode layer (40) on planarization layer (30);
The substrate (10) includes camera shooting Head Section (11);The anode layer (40) includes the first sun in camera shooting Head Section (11) Pole (41);The first anode (41) includes the first bottom transparent electrode layer (411) being set on planarization layer (30), is set to first The first metal electrode layer (412) on bottom transparent electrode layer (411) and it is set to the first metal electrode layer (412) and the first bottom is saturating The first top transparent electrode layer (413) on prescribed electrode layer (411);First metal electrode layer (412) includes grid-shaped knot The first part (A) of structure, the first part (A) have multiple hollow holes (V), first top transparent electrode layer (413) filling Multiple hollow holes (V).
2. tft array substrate as described in claim 1, which is characterized in that the thickness on first top transparent electrode layer (413) Uniformly.
3. tft array substrate as claimed in claim 2, which is characterized in that the thickness on first top transparent electrode layer (413) For 15~60nm;First metal electrode layer (412) with a thickness of 30~80nm;First bottom transparent electrode layer (411) With a thickness of 5~10nm.
4. tft array substrate as described in claim 1, which is characterized in that first top transparent electrode layer (413) is located at the The thickness of part on one metal electrode layer (412) is located at the first bottom transparent electrode layer less than the first top transparent electrode layer (413) (411) thickness of the part on.
5. tft array substrate as claimed in claim 4, which is characterized in that first top transparent electrode layer (413) is located at the Part on one metal electrode layer (412) with a thickness of 7~15nm, it is transparent that the first top transparent electrode layer (413) is located at the first bottom Part on electrode layer (411) with a thickness of 15~60nm.
6. tft array substrate as described in claim 1, which is characterized in that the material of first bottom transparent electrode layer (411) For tin indium oxide, the material of first metal electrode layer (412) is silver, the material on first top transparent electrode layer (413) For tin indium oxide.
7. tft array substrate as described in claim 1, which is characterized in that the substrate (10) further includes and images Head Section (11) adjacent effective display area (12);The anode layer (40) further includes the second plate in effective display area (12) (42);
The second plate (42) includes the second bottom transparent electrode layer (421) being set on planarization layer (30), is set to the second bottom The second metal electrode layer (422) on transparent electrode layer (421) and the second top on the second metal electrode layer (422) are transparent Electrode layer (423);Second metal electrode layer (422) is whole face structure.
8. tft array substrate as claimed in claim 7, which is characterized in that the thickness on second top transparent electrode layer (423) For 15~60nm;Second metal electrode layer (422) with a thickness of 30~80nm;Second bottom transparent electrode layer (421) With a thickness of 5~10nm;
The material of second bottom transparent electrode layer (421) is tin indium oxide, and the material of second metal electrode layer (422) is The material of silver, second top transparent electrode layer (423) is tin indium oxide.
9. tft array substrate as described in claim 1, which is characterized in that the grid line width of the first part (A) is 2~8 μm。
10. tft array substrate as described in claim 1, which is characterized in that further include being set to planarization layer (30) and anode layer (40) pixel defining layer (50) on;The pixel defining layer (50) is equipped with corresponding first be located above first part (A) and opens Mouth (51).
11. tft array substrate as described in claim 1, which is characterized in that the hollow out rate of the first part (A) is 50% ~70%.
12. a kind of OLED display panel, which is characterized in that including tft array base such as of any of claims 1-11 Plate.
CN201910351231.XA 2019-04-28 2019-04-28 Tft array substrate and OLED display panel Pending CN109994536A (en)

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PCT/CN2019/094536 WO2020220463A1 (en) 2019-04-28 2019-07-03 Tft array substrate and oled display panel

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CN113327961A (en) * 2021-05-21 2021-08-31 武汉华星光电技术有限公司 OLED display panel, preparation method thereof and OLED display device
WO2021176519A1 (en) * 2020-03-02 2021-09-10 シャープ株式会社 Display device and production method therefor
CN113488511A (en) * 2021-06-22 2021-10-08 深圳市华星光电半导体显示技术有限公司 Array substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240118420A (en) * 2023-01-27 2024-08-05 엘지디스플레이 주식회사 Display device and display panel

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692186B2 (en) * 2002-01-24 2010-04-06 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
CN101783395A (en) * 2009-01-20 2010-07-21 京东方科技集团股份有限公司 Organic electroluminescence component and manufacturing method thereof
CN103579436A (en) * 2012-07-18 2014-02-12 广东量晶光电科技有限公司 Semiconductor light emitting structure and manufacturing method thereof
US20140191202A1 (en) * 2013-01-04 2014-07-10 Lg Display Co., Ltd. Oled micro-cavity structure and method of making
US20170012147A1 (en) * 2015-07-06 2017-01-12 Electronics And Telecommunications Research Institute Method for manufacturing transparent electrode
US20170263883A1 (en) * 2015-09-22 2017-09-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Organic Light Emitting Diode Device and Array Substrate
CN107359268A (en) * 2017-06-15 2017-11-17 武汉华星光电半导体显示技术有限公司 Transparent OLED display panel and preparation method thereof
CN108389879A (en) * 2017-09-30 2018-08-10 云谷(固安)科技有限公司 Display screen and electronic equipment
CN109256396A (en) * 2018-09-04 2019-01-22 京东方科技集团股份有限公司 A kind of translucent display substrate and transparent display panel

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4378186B2 (en) * 2004-02-06 2009-12-02 キヤノン株式会社 Organic EL element array
JP3915810B2 (en) * 2004-02-26 2007-05-16 セイコーエプソン株式会社 ORGANIC ELECTROLUMINESCENCE DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
US7737464B2 (en) * 2006-11-10 2010-06-15 Canon Kabushiki Kaisha Organic light emitting apparatus
KR20140020565A (en) * 2012-08-09 2014-02-19 삼성디스플레이 주식회사 Organic light emitting display apparatus and method of manufacturing organic light emitting display apparatus
CN107622749B (en) * 2017-09-08 2019-10-01 上海天马有机发光显示技术有限公司 A kind of display panel, electroluminescence display panel and display device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692186B2 (en) * 2002-01-24 2010-04-06 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
CN101783395A (en) * 2009-01-20 2010-07-21 京东方科技集团股份有限公司 Organic electroluminescence component and manufacturing method thereof
CN103579436A (en) * 2012-07-18 2014-02-12 广东量晶光电科技有限公司 Semiconductor light emitting structure and manufacturing method thereof
US20140191202A1 (en) * 2013-01-04 2014-07-10 Lg Display Co., Ltd. Oled micro-cavity structure and method of making
US20170012147A1 (en) * 2015-07-06 2017-01-12 Electronics And Telecommunications Research Institute Method for manufacturing transparent electrode
US20170263883A1 (en) * 2015-09-22 2017-09-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Organic Light Emitting Diode Device and Array Substrate
CN107359268A (en) * 2017-06-15 2017-11-17 武汉华星光电半导体显示技术有限公司 Transparent OLED display panel and preparation method thereof
CN108389879A (en) * 2017-09-30 2018-08-10 云谷(固安)科技有限公司 Display screen and electronic equipment
CN109256396A (en) * 2018-09-04 2019-01-22 京东方科技集团股份有限公司 A kind of translucent display substrate and transparent display panel

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021017322A1 (en) * 2019-07-30 2021-02-04 武汉华星光电半导体显示技术有限公司 Organic light emitting diode display panel and manufacturing method therefor
CN110571247B (en) * 2019-08-15 2021-09-03 武汉华星光电半导体显示技术有限公司 Display panel and display device
WO2021027060A1 (en) * 2019-08-15 2021-02-18 武汉华星光电半导体显示技术有限公司 Display panel and display device
US11374075B2 (en) 2019-08-15 2022-06-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Bendable display panel and bendable display device provided with through groove in bending display region
CN110571247A (en) * 2019-08-15 2019-12-13 武汉华星光电半导体显示技术有限公司 Display panel and display device
WO2021046982A1 (en) * 2019-09-10 2021-03-18 武汉华星光电半导体显示技术有限公司 Display panel, electronic apparatus and method for operating electronic apparatus
WO2021077606A1 (en) * 2019-10-25 2021-04-29 武汉华星光电半导体显示技术有限公司 Display panel and terminal apparatus used therefor
CN110853497A (en) * 2019-10-25 2020-02-28 武汉华星光电半导体显示技术有限公司 Display panel and terminal device thereof
CN111129088A (en) * 2019-12-17 2020-05-08 武汉华星光电半导体显示技术有限公司 Organic light emitting diode display device
WO2021120428A1 (en) * 2019-12-17 2021-06-24 武汉华星光电半导体显示技术有限公司 Organic light-emitting diode display device
CN111162199A (en) * 2020-01-02 2020-05-15 昆山国显光电有限公司 Display panel and display device
WO2021135784A1 (en) * 2020-01-02 2021-07-08 昆山国显光电有限公司 Display panel and display apparatus
WO2021155627A1 (en) * 2020-02-07 2021-08-12 武汉华星光电半导体显示技术有限公司 Oled display device
WO2021176519A1 (en) * 2020-03-02 2021-09-10 シャープ株式会社 Display device and production method therefor
CN111755613A (en) * 2020-06-16 2020-10-09 武汉华星光电半导体显示技术有限公司 Display panel, preparation method thereof and display device
CN112271195A (en) * 2020-10-22 2021-01-26 Oppo广东移动通信有限公司 Light-emitting element, preparation method thereof, display screen and electronic device
WO2022083279A1 (en) * 2020-10-22 2022-04-28 Oppo广东移动通信有限公司 Light-emitting element and manufacturing method therefor, display screen, and electronic device
CN113327961A (en) * 2021-05-21 2021-08-31 武汉华星光电技术有限公司 OLED display panel, preparation method thereof and OLED display device
CN113488511A (en) * 2021-06-22 2021-10-08 深圳市华星光电半导体显示技术有限公司 Array substrate
CN113488511B (en) * 2021-06-22 2022-10-04 深圳市华星光电半导体显示技术有限公司 Array substrate
US12114546B2 (en) 2021-06-22 2024-10-08 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Array substrate including connection layer and display panel having the same

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