CN109976287A - PCBA prediction manufacture control method, device and electronic equipment - Google Patents
PCBA prediction manufacture control method, device and electronic equipment Download PDFInfo
- Publication number
- CN109976287A CN109976287A CN201910338018.5A CN201910338018A CN109976287A CN 109976287 A CN109976287 A CN 109976287A CN 201910338018 A CN201910338018 A CN 201910338018A CN 109976287 A CN109976287 A CN 109976287A
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- China
- Prior art keywords
- technological parameter
- key performance
- numerical value
- performance indicator
- production line
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32368—Quality control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The present invention provides a kind of PCBA to predict manufacture control method, device and electronic equipment, is related to PCBA manufacture control technology field, including the technological parameter on acquisition production line；KPI Key Performance Indicator numerical value is predicted based on technological parameter；KPI Key Performance Indicator numerical value is compared with defined standard value, manufacturing process is controlled according to comparison result.Prediction KPI Key Performance Indicator may be implemented in the present invention, reaches technological parameter Prior Control, reduces bad productivity.
Description
Technical field
The present invention relates to PCBA to manufacture control technology field, predicts manufacture control method, dress more particularly, to a kind of PCBA
It sets and electronic equipment.
Background technique
In PCBA (Printed Circuit Board+Assembly, printed circuit board) manufacturing process, traditional pass
Key performance indicators numerical control system is to carry out data acquisition based on the data having occurred and that, and calculate KPI Key Performance Indicator number
Value.It is to occur just being found after producing abnormal problem in this way, passively to the sprawling of abnormal problem and progress can only be deteriorated
Containment.In most cases, when the prior art monitors collected technological parameter, typically added using specifications control line
With control, when gauge wire is abnormal, exactly true defect is produced, and seriously affects product quality.
Summary of the invention
It, can be in view of this, the purpose of the present invention is to provide PCBA to predict manufacture control method, device and electronic equipment
It realizes prediction KPI Key Performance Indicator, reaches technological parameter Prior Control, reduce bad productivity.
In a first aspect, the embodiment of the invention provides a kind of PCBA to predict manufacture control method, wherein the method packet
It includes:
Acquire the technological parameter on production line；
KPI Key Performance Indicator numerical value is predicted based on the technological parameter；
The KPI Key Performance Indicator numerical value is compared with defined standard value, according to comparison result to manufacturing process into
Row control.
With reference to first aspect, the embodiment of the invention provides the first possible embodiments of first aspect, wherein institute
The step of stating based on technological parameter prediction KPI Key Performance Indicator numerical value, comprising:
Calculate the process capability index of the technological parameter；
KPI Key Performance Indicator numerical value is predicted according to the process capability index of the technological parameter.
With reference to first aspect, the embodiment of the invention provides second of possible embodiments of first aspect, wherein institute
State the step of controlling according to comparison result manufacturing process, comprising:
When comparison result is that the KPI Key Performance Indicator numerical value is more than defined standard value, alarm signal is issued；
Stop the manufacturing process and adjusting process parameter of production line based on the alarm signal；
Judge whether technological parameter adjusted revert within control line；
If not, continuing adjusting process parameter；
If so, the manufacturing process of restarting production line.
With reference to first aspect, the embodiment of the invention provides the third possible embodiments of first aspect, wherein institute
Stating alarm signal includes exceeded alarm signal and production alarm signal；The manufacture for stopping production line based on the alarm signal
The step of process and adjusting process parameter, comprising:
Stop the manufacturing process of production line according to exceeded alarm signal, and issues production alarm signal；
Production scene adjusting process parameter is notified based on the production alarm signal.
With reference to first aspect, the embodiment of the invention provides the 4th kind of possible embodiments of first aspect, wherein institute
The process capability index for stating technological parameter is greater than 1.33.
With reference to first aspect, the embodiment of the invention provides the 5th kind of possible embodiments of first aspect, wherein
After the step of prediction KPI Key Performance Indicator numerical value based on the technological parameter, which comprises
The KPI Key Performance Indicator numerical value is shown in screen.
With reference to first aspect, the embodiment of the invention provides the 6th kind of possible embodiments of first aspect, wherein institute
The step of stating the technological parameter on acquisition production line, comprising:
Acquisition such as the paste solder printing technological parameter on paste solder printing production line；The paste solder printing technological parameter includes: tin
The area of cream printing, height, volume, temperature and humidity.
Second aspect, the embodiment of the present invention also provide a kind of PCBA prediction manufacture control device, and described device includes:
Acquisition device, for acquiring the technological parameter on production line；
Prediction meanss, for predicting KPI Key Performance Indicator numerical value based on the technological parameter；
Control device is tied for being compared the KPI Key Performance Indicator numerical value with defined standard value according to comparing
Fruit controls manufacturing process.
The third aspect, the embodiment of the present invention also provide a kind of electronic equipment, including memory, processor, the memory
In be stored with the computer program that can be run on the processor, wherein processor execute computer program when realize first
The step of method described in aspect.
Fourth aspect, the embodiment of the present invention also provide a kind of computer-readable medium, the computer readable storage medium
On be stored with computer program, wherein when the computer program is run by processor execute first aspect described in method.
The embodiment of the present invention bring it is following the utility model has the advantages that
The present invention provides a kind of PCBA to predict on manufacture control method, device and electronic equipment, including acquisition production line
Technological parameter；KPI Key Performance Indicator numerical value is predicted based on technological parameter；By KPI Key Performance Indicator numerical value and defined standard value
It is compared, manufacturing process is controlled according to comparison result.Prediction KPI Key Performance Indicator may be implemented in the present invention, reaches work
Skill parameter Prior Control, reduces bad productivity.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention are in specification, claims
And specifically noted structure is achieved and obtained in attached drawing.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is PCBA provided in an embodiment of the present invention prediction manufacture control method flow chart；
Fig. 2 is PCBA provided in an embodiment of the present invention prediction manufacture control device schematic diagram.
Icon:
10- acquisition device；20- prediction meanss；30- control device.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Currently, traditional KPI Key Performance Indicator numerical control system can only be passively to exception in PCBA manufacturing process
The sprawling of problem is contained with deterioration, causes product quality poor.If capableing of the generation of look-ahead product quality exception,
And just alarm and intervened before generating extremely, in this way, the quantity of faulty goods will be effectively reduced in entire manufacture system.
Based on this, a kind of PCBA prediction manufacture control method, device and electronic equipment provided in an embodiment of the present invention can be with
It realizes prediction KPI Key Performance Indicator, reaches technological parameter Prior Control, reduce bad productivity.
To predict manufacture control to a kind of PCBA disclosed in the embodiment of the present invention first convenient for understanding the present embodiment
Method processed describes in detail.
Embodiment one:
Fig. 1 is a kind of PCBA prediction manufacture control method flow chart that the embodiment of the present invention one provides.
Referring to Fig.1, PCBA prediction manufacture control method specifically includes that
Step S100 acquires the technological parameter on production line；
Step S200 predicts KPI Key Performance Indicator numerical value based on technological parameter；
Further, the step of predicting KPI Key Performance Indicator numerical value based on technological parameter includes: to calculate the technological parameter
Process capability index, according to the process capability index of technological parameter predict KPI Key Performance Indicator numerical value.
After the step of predicting KPI Key Performance Indicator numerical value based on technological parameter, further includes: show crucial achievement in screen
Imitate index value.
For ease of understanding, by taking paste solder printing technique as an example, acquire production line on technological parameter the step of may include: to adopt
Collect the paste solder printing technological parameter on paste solder printing production line, paste solder printing technological parameter such as may include: paste solder printing
Area, height, volume, temperature and humidity.
Specifically, establishing prediction KPI (Key Performance Indicator, KPI Key Performance Indicator numerical value), exploitation is pre-
KPI algorithm is surveyed, prediction manufacture control method is constituted, so that prediction algorithm calculates prediction KPI in real time.
Wherein, KPI is to be configured, sampled by the key parameter of the input, output end to organization internal process, counted
It calculates, analysis, measures a kind of target formula weight level of control of process performance.
KPI Key Performance Indicator numerical value is compared, according to comparison result to manufacture by step S300 with defined standard value
Process is controlled.
Further, the step of manufacturing process being controlled according to comparison result, comprising: when comparison result is crucial achievement
When imitating index value more than defined standard value, alarm signal is issued；Stop the manufacturing process of production line simultaneously based on alarm signal
Adjusting process parameter；Judge whether technological parameter adjusted revert within control line；If not, continuing adjusting process ginseng
Number；If so, the manufacturing process of restarting production line.
In practical applications, control line such as includes: that the process capability index of technological parameter is greater than 1.33.
Further, the step of stopping the manufacturing process and adjusting process parameter of production line based on alarm signal, comprising: root
Stop the manufacturing process of production line according to exceeded alarm signal, and issues production alarm signal；Based on production alarm signal notice life
Produce live adjusting process parameter.
Specifically, acquiring the technological parameter of some quantizations in manufacturing process in real time, the CPK of these quantization parameters is calculated
(Process capability index, Measure of Process Capability), it is right using the CPK of parameter as the prediction KPI of the quantization parameter
The monitoring of manufacturing process switchs to control line from gauge wire, the KPI monitoring of control line, when an abnormality is discovered and technological parameter whether
It revert within control line, is the exception of trend, rather than the generation of specific defect, therefore have one to the monitoring of processing procedure health
Lead triggers adjusting process parameter when finding that manufacturing process parameter is abnormal immediately, allows manufacture system to return normal
Level will so realize zero-fault.
Wherein, CPK refers to that process capability meets the degree that target level of product quality requires (specification limit etc.), also referred to as process energy
Power index refers to actual processing ability of the process in certain time, under state of a control (stable state).
The PCBA prediction manufacture control method that foregoing invention embodiment provides, it is crucial by being primarily based on technological parameter prediction
Performance indicators numerical value；Then KPI Key Performance Indicator numerical value is compared with defined standard value, according to comparison result to manufacture
Process is controlled.So as to realize prediction KPI Key Performance Indicator, reaches technological parameter Prior Control, reduce bad production
Rate.
Embodiment two:
Fig. 2 is a kind of PCBA prediction manufacture control device schematic diagram provided by Embodiment 2 of the present invention.
Referring to Fig. 2, PCBA prediction manufacture control device is specifically included that
Acquisition device 10, for acquiring the technological parameter on production line；
Prediction meanss 20, for predicting KPI Key Performance Indicator numerical value based on technological parameter；
Control device 30, for KPI Key Performance Indicator numerical value to be compared with defined standard value, according to comparison result
Manufacturing process is controlled.
It is apparent to those skilled in the art that for convenience and simplicity of description, the device of foregoing description
Specific work process, can refer to corresponding processes in the foregoing method embodiment, details are not described herein.
The PCBA prediction manufacture control device that foregoing invention embodiment provides, it is crucial by being primarily based on technological parameter prediction
Performance indicators numerical value；Then KPI Key Performance Indicator numerical value is compared with defined standard value, according to comparison result to manufacture
Process is controlled.So as to realize prediction KPI Key Performance Indicator, reaches technological parameter Prior Control, reduce bad production
Rate.
Embodiment three:
The embodiment of the present invention provides a kind of electronic equipment, including memory, processor, and being stored in memory can be described
The computer program run on processor, wherein processor realizes side described in above-described embodiment one when executing computer program
The step of method.
The embodiment of the present invention also provide it is a kind of with processor can be performed non-volatile program code it is computer-readable
Medium, wherein said program code makes the processor execute method described in above-described embodiment one.
The flow chart and block diagram in the drawings show the system of multiple embodiments according to the present invention, method and computer journeys
The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation
A part of one module, section or code of table, a part of the module, section or code include one or more use
The executable instruction of the logic function as defined in realizing.It should also be noted that in some implementations as replacements, being marked in box
The function of note can also occur in a different order than that indicated in the drawings.For example, two continuous boxes can actually base
Originally it is performed in parallel, they can also be executed in the opposite order sometimes, and this depends on the function involved.It is also noted that
It is the combination of each box in block diagram and or flow chart and the box in block diagram and or flow chart, can uses and execute rule
The dedicated hardware based system of fixed function or movement is realized, or can use the group of specialized hardware and computer instruction
It closes to realize.
In addition, in the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
The computer program of the prediction manufacture of PCBA provided by embodiment of the present invention control method, device and electronic equipment produces
Product, the computer readable storage medium including storing the executable non-volatile program code of processor, said program code
Including instruction can be used for executing previous methods method as described in the examples, specific implementation can be found in embodiment of the method, herein
It repeats no more.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with
It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit,
Only a kind of logical function partition, there may be another division manner in actual implementation, in another example, multiple units or components can
To combine or be desirably integrated into another system, or some features can be ignored or not executed.Another point, it is shown or beg for
The mutual coupling, direct-coupling or communication connection of opinion can be through some communication interfaces, device or unit it is indirect
Coupling or communication connection can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme
's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit
It is that each unit physically exists alone, can also be integrated in one unit with two or more units.
It, can be with if the function is realized in the form of SFU software functional unit and when sold or used as an independent product
It is stored in the executable non-volatile computer-readable storage medium of a processor.Based on this understanding, of the invention
Technical solution substantially the part of the part that contributes to existing technology or the technical solution can be with software in other words
The form of product embodies, which is stored in a storage medium, including some instructions use so that
One computer equipment (can be personal computer, server or the network equipment etc.) executes each embodiment institute of the present invention
State all or part of the steps of method.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-
Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can be with
Store the medium of program code.
Finally, it should be noted that embodiment described above, only a specific embodiment of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, those skilled in the art should understand that: anyone skilled in the art
In the technical scope disclosed by the present invention, it can still modify to technical solution documented by previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention, should all cover in protection of the invention
Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of PCBA prediction manufacture control method, which is characterized in that the described method includes:
Acquire the technological parameter on production line；
KPI Key Performance Indicator numerical value is predicted based on the technological parameter；
The KPI Key Performance Indicator numerical value is compared with defined standard value, manufacturing process is controlled according to comparison result
System.
2. the method according to claim 1, wherein described predict KPI Key Performance Indicator based on the technological parameter
The step of numerical value, comprising:
Calculate the process capability index of the technological parameter；
KPI Key Performance Indicator numerical value is predicted according to the process capability index of the technological parameter.
3. being controlled manufacturing process the method according to claim 1, wherein described according to comparison result
Step, comprising:
When comparison result is that the KPI Key Performance Indicator numerical value is more than defined standard value, alarm signal is issued；
Stop the manufacturing process and adjusting process parameter of production line based on the alarm signal；
Judge whether technological parameter adjusted revert within control line；
If not, continuing adjusting process parameter；
If so, the manufacturing process of restarting production line.
4. according to the method described in claim 3, it is characterized in that, the alarm signal includes exceeded alarm signal and production report
Alert signal；The step of manufacturing process and adjusting process parameter for stopping production line based on the alarm signal, comprising:
Stop the manufacturing process of production line according to exceeded alarm signal, and issues production alarm signal；
Production scene adjusting process parameter is notified based on the production alarm signal.
5. according to the method described in claim 3, it is characterized in that, the process capability index of the technological parameter is greater than 1.33.
6. the method according to claim 1, wherein being referred to described based on technological parameter prediction Key Performance
After the step of marking numerical value, which comprises
The KPI Key Performance Indicator numerical value is shown in screen.
7. the method according to claim 1, wherein the step of technological parameter acquired on production line, packet
It includes:
Acquisition such as the paste solder printing technological parameter on paste solder printing production line；The paste solder printing technological parameter includes: tin cream print
The area of brush, height, volume, temperature and humidity.
8. a kind of PCBA prediction manufacture control device, which is characterized in that described device includes:
Acquisition device, for acquiring the technological parameter on production line；
Prediction meanss, for predicting KPI Key Performance Indicator numerical value based on the technological parameter；
Control device, for the KPI Key Performance Indicator numerical value to be compared with defined standard value, according to comparison result pair
Manufacturing process is controlled.
9. a kind of electronic equipment, including memory, processor, be stored in the memory to run on the processor
Computer program, which is characterized in that processor realizes that the claims 1 to 7 are described in any item when executing computer program
The step of method.
10. a kind of computer-readable medium, it is stored with computer program on the computer readable storage medium, feature exists
In the computer program executes described claim 1-7 any the method when being run by processor.
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| CN201910338018.5A CN109976287A (en) | 2019-04-25 | 2019-04-25 | PCBA prediction manufacture control method, device and electronic equipment |
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| CN201910338018.5A CN109976287A (en) | 2019-04-25 | 2019-04-25 | PCBA prediction manufacture control method, device and electronic equipment |
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