CN109975689A - A kind of integrated circuit IO characteristic intelligent tester - Google Patents
A kind of integrated circuit IO characteristic intelligent tester Download PDFInfo
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- CN109975689A CN109975689A CN201910241029.1A CN201910241029A CN109975689A CN 109975689 A CN109975689 A CN 109975689A CN 201910241029 A CN201910241029 A CN 201910241029A CN 109975689 A CN109975689 A CN 109975689A
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- power supply
- current detection
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- 238000001514 detection method Methods 0.000 claims abstract description 31
- 230000001105 regulatory effect Effects 0.000 claims abstract description 20
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 11
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000002262 irrigation Effects 0.000 description 4
- 238000003973 irrigation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of integrated circuit IO characteristic intelligent testers, its main feature is that the tester is made of single-chip microcontroller, regulated power supply module, LCD touch display module, relay module and current detection module, chip to be detected is serially connected between relay module and current detection module, performance detection is carried out to the ESD diode of chip, the single-chip microcontroller is connect with regulated power supply module, LCD touch display module, relay module and current detection module；The current detection module is connect with regulated power supply module；The relay module connects eight 4 turns of 16 decoders using No. 117 relays.The present invention has test error small compared with prior art, prevents signal cross-talk, effectively power supply is avoided to flow backward, convenient test, reduces maloperation in test process and endangers caused by chip.
Description
Technical field
It is especially a kind of to pass through the integrated electricity of control relay on-off detection the present invention relates to ic test technique field
The intelligent tester of each IO characteristic in road.
Background technique
In integrated circuit, with the continuous reduction of process, the increase of chip operation speed, the pin of chip is increasingly
More, its spacing is smaller and smaller.The signal continuity of each pin, the design levels such as Power Integrity of circuit directly affect system
Overall performance.Static discharge be cause all components or IC system cause excessive electric stress destroy the main reason for,
Simultaneously because the reduction of device, PN junction depth shoal, the introducing of silicide, so that ESD electrostatic breakdown easily occurs.Cope with ESD
Electrostatic is shielded when electrostatic phenomenon is except test, is changed outside hardware arrangement, and when chip manufacturing can generally be arranged two inside chip pin
Pole pipe.
Whether no matter integrated circuit tests Power Integrity, signal continuity, diode working properly, is required to pass through survey
IO characteristic curve is tried to evaluate and test performance.Test I/O curve generally uses point contact type contact measurement, as integrated circuit is more and more multiple
Miscellaneous technological development is not easy measurement and the chip more to some pins for pin after some encapsulation, and artificial point contact type is surveyed
Often workload is huge for amount, and difficulty rises, and is easy careless omission, and there are errors etc. for test.In addition ESD diode conducting voltage compared with
It is small, need both ends that 0-1V variable power supply is added to measure IV characteristic curve.The regulated power supply of the prior art can not be accomplished close to 0V
Output if raising voltage manufacture 1V voltage difference using both sides, and can lead to the problem of electric current reverse irrigation.
Summary of the invention
The purpose of the present invention is in view of the deficiencies of the prior art and provide a kind of integrated circuit IO characteristic intelligent tester,
Using the regulated power supply of program-controlled 117 road relay on-off and single-chip microcontroller DAC control, the transient current that current detecting chip is exported
It with ESD diode two sides voltage and standard feature curve comparison, is shown, is judged between each pin of chip by external LCD display
Diode whether connect with it is working properly, structure is simple, convenient test, safe and reliable, high sensitivity, out-put supply adjust
It is convenient, flexible, it effectively prevent electric current to flow backward, improves measuring accuracy, realize full automatic working, substitute the people of artificial point contact type measurement
Power wastes and avoids pin careless omission and operating error etc., the encapsulated circuit of all kinds of chips is particularly suitable for, in ic core
There is stronger practical value in the ESD diode detection of piece.
The object of the present invention is achieved like this: a kind of integrated circuit IO characteristic intelligent tester, its main feature is that the test
Instrument is made of single-chip microcontroller, regulated power supply module, LCD touch display module, relay module and current detection module, will be to be detected
Chip is serially connected between relay module and current detection module, and the ESD diode for treating detection chip carries out performance detection, institute
Each pin of single-chip microcontroller is stated to connect with regulated power supply module, LCD touch display module, relay module and current detection module respectively
It connects；The current detection module is connect with regulated power supply module.
The relay module connects eight 4 turns of 16 decoders by No. 117 relays and forms.
The single-chip microcontroller uses STM32f767 type single-chip microcontroller.
Compared with the prior art, the present invention has the following advantages:
(1) it in gating chip when IO, selects relay rather than analog switch, i.e., is only constituted back with purely mechanic connection type
Road effectively prevent signal cross-talk.
(2) when measuring IO characteristic, need both ends that 0~1V variable power supply is added to measure IV characteristic curve, regulated power supply without
Method accomplishes to export close to 0V, if raising voltage manufacture 1V voltage difference using both sides, and electric current reverse irrigation can be led to the problem of, two
Pole pipe one end applies 1.5~2.5v voltage, the mode of another section of application 1.5v voltage, make two sections of diode equivalent pressure differences 0~
1v, at the same using not only can absorbing current again can sink current tps51200 chip output 1.5v level, effectively power supply is avoided to flow backward, and
Realize that opposite 0~1V is exported.
(3) for the chips of the different pins of different encapsulation, need to only change chip to be measured pedestal and relay line with
And mating portions code, test can be facilitated.
(4), can be light using touch screen and full automatic algorithm, fast and accurate completion measurement, and pass through display screen
Result displaying is carried out, cost of labor and test error is effectively reduced.
(5) when test job, chip to be measured does not need to power, and does not need then to weld if straight cutting cake core, effectively protects drop
Maloperation is endangered caused by chip in low test process.
(6) system reset can be realized by key, it is convenient and safe.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is that the present invention uses schematic diagram；
Fig. 3 is 1.5~2.5V adjustable power circuit figure of regulated power supply module；
Fig. 4 is current detection module circuit diagram；
Fig. 5 is three-level relay exchange network circuit diagram；
Fig. 6 is positive instrumentation plan；
Fig. 7 is reverse measuremenet schematic diagram；
Fig. 8 is relay circuit figure.
Specific embodiment
Refering to attached drawing 1, the present invention is by single-chip microcontroller 1, regulated power supply module 2, LCD touch display module 3, relay module 4
With current detection module 5 form, each pin of the single-chip microcontroller 1 respectively with regulated power supply module 2, LCD touch display module 3,
Relay module 4 and current detection module 5 connect；The relay module 4 connects eight 4 turns 16 decodings by No. 117 relays
Device composition；The current detection module 5 is connect with regulated power supply module 2；The single-chip microcontroller 1 uses STM32f767 type single-chip microcontroller.
Below by taking the test of M4A chip as an example, the present invention is described in further detail.
Embodiment 1
Refering to attached drawing 2, chip to be detected (M4A) 6 is serially connected between relay module 4 and current detection module 5, and with
Single-chip microcontroller 1 is control core, treats all ESD diodes in detection chip 6 and carries out performance detection, wherein regulated power supply module 2
Output 1.5~2.5V voltage is controlled by single-chip microcontroller 1, is exported simultaneously
1.5V fixed voltage, two voltages are connected to the ESD diode two sides of chip 6 to be detected, constitute 0~1V pressure difference.After
Electrical appliance module 4 includes two parts in the test of M4A chip 6: since 6 pin of M4A chip is more, being decoded using eight 4 turns 16
Device preferably resolves single-chip microcontroller 1 and controls the inadequate problem of pin.The on-off of program-controlled No. 117 relay, in chip 6 to be detected
When not powering on, the ESD diode between each pin or so circuit is constituted, chip 6 to be detected is the encapsulation of 133 foot straight cuttings, in system board
On have a chip pad, when test, plugs, and treats 6 welding equivalent damage of detection chip.Current detection module 5 uses
Lmp8603 chip cooperates resistance to carry out current measurement, measurement result by voltage output, the foot of ADC all the way through STM32 read in into
Row compares, and shows test result finally by LCD touch display module 3.LCD touch display module 3 is handed over when testing for user
Mutually, comprising: chip information starts test, pause test, stops test, the test of selection section, current testing progress and test
As a result display, above-mentioned each functional module can work independently, and close or remove and do not interfere with each other.
Refering to attached drawing 3, the regulated power supply module 2 is made of 1.5V fixed power source and 1.5~2.5V regulated power supply, i.e., directly
Flow voltage transformation module DCDC and resistance R1~R3The single-chip microcontroller 1 of connection, resistance R1~R3One end and DC voltage conversion module
The FB pin of DCDC simultaneously connects；Resistance R1The other end connect with the OUTPUT pin of DC voltage conversion module DCDC；Resistance R2's
The other end is connect with the DAC pin of single-chip microcontroller 1；Resistance R3The other end ground connection.Regulated power supply module 2 passes through the DAC of single-chip microcontroller 1
Change voltage at the FB of DC voltage conversion module DCDC, generates 1.5~2.5V of voltage adjustable voltage, voltage is by following (a)
(b) formula calculates:
In 1.5~2.5V adjustable voltage, resistance value is computed desirable R1=R2=R3=10K, due to chip 6 to be detected
In ESD diode conducting voltage it is smaller, need to add 0~1V variable power supply to measure IV characteristic curve at both ends.Existing skill
The regulated power supply of art can not be accomplished to export close to 0V, if raising voltage manufacture 1V voltage difference using both sides, and can generate electric current
The phenomenon that reverse irrigation.The present invention, which is used, applies 1.5~2.5v voltage in diode one end, and the other end applies the mode of 1.5v voltage,
Make two sections of diode equivalent 0~1V of pressure difference, using not only can absorbing current but also can sink current tps51200 chip output 1.5v electricity
It is flat, preferably solve the problems, such as the reverse irrigation of two power supplys.
Refering to attached drawing 4,1 foot and 8 feet are sealed among circuit under test, 8 feet are into 1 foot goes out, while connecting between 1 foot and 8 feet
Resistance Rx, both ends are connected in parallel with a capacitor, for filtering.LMP8603 chip passes through the voltage value at the both ends detection resistance Rx, by institute
It measuring and is exported after voltage value is amplified by amplification factor by 5 foot of LMP8603 chip, output valve is directly connected to the ADC of single-chip microcontroller 1,
Analogue data is converted into number, is further processed.Offset control offset constraint in LMP8603 chip, here
It being connected at 3.3V, 3 foot, 4 foot of LMP8603 chip is for controlling amplification factor, when it, which crosses capacitor, is grounded again,
LMP8603 can amplify 100 times.
The present invention is performed such chip detection: regulated power supply module 2 being connect with chip 6 to be detected, current detecting
Module 5 connect using current detecting chip lmp8603 with single-chip microcontroller 1, at current measurement end input and output connect respectively 1.5V and
1.5~2.5V adjustable voltage generates 0~1V relative voltage drop.The output end of current detecting chip lmp860 is exported to chip
The end ADC of STM32, to measure the diode that digital micro-mirror chip (M4A) prevents ESD event and is arranged, both ends it is opposite 0~
Whether 1V changes under voltage, compare corresponding IV characteristic curve, all worked just with all diodes in determination chip 6 to be detected
Normal state.
Refering to attached drawing 5, since there are 9 kinds of distribution modes, the present embodiment to use for 201 ESD diodes in chip 6 to be detected
The connection type of three-level relay exchange network designs 117 relays and constitutes different circuit under STM32 control, reapplies
Current detecting chip is to detect IV curve.Since the pin of chip 6 to be detected is more, can solve using 4 turn of 16 decoder
Single-chip microcontroller 1 controls the inadequate problem of pin.Relay module 4 is formed by including No. 117 relays with eight 4 turns of 16 decoders,
Wherein four three class control relays are to select forward and reverse measuring diode, respectively attached M, X, N, Y shown in fig. 5 tetra-
It is a, connection X and Y relay when forward direction measurement, connection M and N relay when reverse measuremenet；Wherein 5 Two-stage control relays are used
With the common IO of control selections, power supply and GND, and selection measurement LVDS or ESD diode, respectively attached A- shown in fig. 5 >
B1；D->B2；D->C；1.5V->C；B1- > B2 is selected according to the different connections that the inside of chip to be measured need to measure, remaining
For level-one relay, whether to control the connection of chip 6 to be detected each pin.
Refering to attached drawing 6, when the ESD diode in chip 6 to be detected is tested: being equipped with two poles between DATA_3_p and 3P3
Pipe, anode connect IO4Place, cathode connect 3P3Place, then when measuring its forward characteristic: relay Y between connection 1.5~2.5V power supply and D,
Relay between D and B2, relay between B2 and B1, relay between B1 and DATA_3_p, between pin 3P3 and A relay and A with
Relay X between 1.5V may make up the voltage difference of 0~1V of the diode or so, and carry out current measurement.
Refering to attached drawing 7, when measuring its reverse characteristic: remaining relay is disconnected with positive connection, X, Y, is connected to M and N, is carried out
Current measurement.
Refering to attached drawing 8, the relay module 4 using including No. 117 relays and eight 4 turns of 16 decoders, due to
6 pin of detection chip is more, and it is inadequate to solve the problems, such as that single-chip microcontroller 1 controls pin using 4 turn of 16 decoder.Program-controlled 117 tunnel relay
Device on-off, when constituting chip 6 to be detected and not powering on, ESD diode between each pin or so circuit.It is non-analog using relay
Switch, it is intended to be disconnected using the connection that purely mechanic mode carries out circuit, effectively prevent signal cross-talk.When single-chip microcontroller 1 without output or
When exporting low level, NPN triode collector and emitter are disconnected, and relay does not power, do not work at this time, Relay_OUT
It is disconnected with Relay_IN pin；When one high level of output of single-chip microcontroller 1, so that NPN triode collector and emitter are connected, this
When relay in ground connect, relay Inner Constitution active channel after connection, internal inductance coil working, which picks up switch, to be closed
It closes, so that Relay_OUT is connected to Relay_IN pin in attached drawing 8, external circuit on-off is further constituted, shown in attached drawing 8
The electric energy that diode D is stored for release relay internal inductance coil after relay shutdown.
Above only the present invention is further illustrated, and not to limit this patent, all is equivalence enforcement of the present invention,
It is intended to be limited solely by within the scope of the claims of this patent.
Claims (3)
1. a kind of integrated circuit IO characteristic intelligent tester, it is characterised in that the tester by single-chip microcontroller, regulated power supply module,
LCD touch display module, relay module and current detection module composition, are serially connected in relay module and electricity for chip to be detected
Flow detection module between, treat detection chip ESD diode carry out performance detection, each pin of single-chip microcontroller respectively with it is adjustable
Power module, LCD touch display module, relay module are connected with current detection module；The current detection module with it is adjustable
Power module connection.
2. integrated circuit IO characteristic intelligent tester according to claim 1, it is characterised in that the relay module is by 117
Road relay connects eight 4 turns of 16 decoders compositions.
3. integrated circuit IO characteristic intelligent tester according to claim 1, it is characterised in that the single-chip microcontroller uses
STM32f767 type single-chip microcontroller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910241029.1A CN109975689A (en) | 2019-03-28 | 2019-03-28 | A kind of integrated circuit IO characteristic intelligent tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910241029.1A CN109975689A (en) | 2019-03-28 | 2019-03-28 | A kind of integrated circuit IO characteristic intelligent tester |
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| Publication Number | Publication Date |
|---|---|
| CN109975689A true CN109975689A (en) | 2019-07-05 |
Family
ID=67081129
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| CN201910241029.1A Pending CN109975689A (en) | 2019-03-28 | 2019-03-28 | A kind of integrated circuit IO characteristic intelligent tester |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111060836A (en) * | 2019-12-12 | 2020-04-24 | 无锡职业技术学院 | High-precision hybrid integrated circuit test jig isolation protection structure |
| CN112275667A (en) * | 2020-09-29 | 2021-01-29 | 成都嘉纳海威科技有限责任公司 | Chip ESD diode process defect detection method based on difference comparison method |
| CN112964979A (en) * | 2021-02-03 | 2021-06-15 | 华东师范大学 | Integrated circuit chip packaging test system |
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| US4291302A (en) * | 1978-11-13 | 1981-09-22 | King Gordon A | Lamp monitoring circuits |
| CN85104182A (en) * | 1985-05-28 | 1986-11-26 | 上海市轻工业研究所 | The method of on-line measuring transistor and device |
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| CN111060836A (en) * | 2019-12-12 | 2020-04-24 | 无锡职业技术学院 | High-precision hybrid integrated circuit test jig isolation protection structure |
| CN112275667A (en) * | 2020-09-29 | 2021-01-29 | 成都嘉纳海威科技有限责任公司 | Chip ESD diode process defect detection method based on difference comparison method |
| CN112964979A (en) * | 2021-02-03 | 2021-06-15 | 华东师范大学 | Integrated circuit chip packaging test system |
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Application publication date: 20190705 |