CN109973482A - A kind of heat-conducting substrate and radiating block bond compacting machine - Google Patents

A kind of heat-conducting substrate and radiating block bond compacting machine Download PDF

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Publication number
CN109973482A
CN109973482A CN201910266952.0A CN201910266952A CN109973482A CN 109973482 A CN109973482 A CN 109973482A CN 201910266952 A CN201910266952 A CN 201910266952A CN 109973482 A CN109973482 A CN 109973482A
Authority
CN
China
Prior art keywords
fixed
plate
radiating block
heat
sleeve
Prior art date
Application number
CN201910266952.0A
Other languages
Chinese (zh)
Inventor
查丽英
Original Assignee
查丽英
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 查丽英 filed Critical 查丽英
Priority to CN201910266952.0A priority Critical patent/CN109973482A/en
Publication of CN109973482A publication Critical patent/CN109973482A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16BDEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS, WEDGES, JOINTS OR JOINTING
    • F16B11/00Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks

Abstract

The invention discloses a kind of heat-conducting substrates and radiating block to bond compacting machine, including rack, and the top surface of the top plate of the rack, which is fixed with, compresses support frame and annular installation sleeve;The annular installation sleeve is in the underface of the upper top plate for compressing support frame;Clamping motor is fixed in the middle part of the top surface of the upper top plate for compressing support frame, the output shaft of clamping motor passes through the upper top plate for compressing support frame and is connected with vertical screw rod by shaft coupling, the bottom end of vertical screw rod is bolted with lifting swivel nut, and the bottom end for going up and down swivel nut is fixed with compact heap;Mounting blocks are inserted in the middle part of the annular installation sleeve, has in the middle part of the top surface of mounting blocks and places groove, and the bottom surface for placing groove, which is pressed against, radiating block, and radiating block sleeve is in placing groove, and upper compact heap is against radiating block.It can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.

Description

A kind of heat-conducting substrate and radiating block bond compacting machine

Technical field

The present invention relates to LED lamp accessory manufacture technology field, more specifically to a kind of heat-conducting substrate and radiating block Bond compacting machine.

Background technique

It is required to installation aluminum substrate on the general pcb board of its in existing LED lamp, needs fixed dissipate at the back side of aluminum substrate Heat block, radiating block are generally fixed by bolts either thermoconductive glue with aluminum substrate and fixed, fixed using thermoconductive glue, are needed Will be using manually radiating block and aluminum substrate be squeezed, the pressure of manual compression is uneven, and effect is limited, bonds insecure.

Summary of the invention

The purpose of the present invention is to the deficiencies of the prior art, and provide a kind of heat-conducting substrate and radiating block bonding compresses Machine, it can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.

Technology solution of the invention is as follows:

A kind of heat-conducting substrate and radiating block bond compacting machine, including rack, the top surface of the top plate of the rack are fixed with Compress support frame and annular installation sleeve;

The annular installation sleeve is in the underface of the upper top plate for compressing support frame;

Clamping motor is fixed in the middle part of the top surface of the upper top plate for compressing support frame, the output shaft of clamping motor passes through upper compression The top plate of support frame is simultaneously connected with vertical screw rod by shaft coupling, and the bottom end of vertical screw rod is bolted with lifting swivel nut, goes up and down swivel nut Bottom end be fixed with compact heap;

It is inserted with mounting blocks in the middle part of the annular installation sleeve, has in the middle part of the top surface of mounting blocks and places groove, place The bottom surface of groove, which is pressed against, radiating block, and radiating block sleeve is in placing groove, and upper compact heap is against radiating block.

Further, the middle top surface of the top plate of the rack has installation groove, and fixed plate sleeve is in installation groove In, the bottom surface of fixed plate is fixed on the bottom surface of installation groove;

The bottom surface of mounting blocks is fixed with multiple guide posts, pair that the bottom end sleeve of guide post is formed in the top surface of fixed plate In the positioning shrinkage pool answered, guide post upper sleeve has buffer spring, and the bottom end of buffer spring is fixed on the top surface of fixed plate, buffering The top of spring is fixed on the bottom surface of mounting blocks.

Further, it is respectively and fixedly provided with adjusting compression cylinder on the lateral wall of left and right two of the annular installation sleeve, adjusted The push rod of section compression cylinder protrudes into annular installation sleeve and is fixed with arc adjusting block.

Further, elasticity layer is fixed on the inner sidewall of the arc adjusting block, elastic laminate leans against radiating block Top sidewall.

Further, the bottom surface for placing groove is fixed with bottom resilient bed course, and the bottom surface of radiating block is pressed against bottom On the top surface of portion's elastic insert.

Further, there is lower groove in the middle part of the bottom surface of the upper compact heap, electric boiling plate sleeve is in lower groove, electricity Heating plate is fixed on the top surface of lower groove, and protection heat-conducting plate is fixed on the bottom surface of pressure plate and covers electric boiling plate, electricity It is close to the top surface of protection heat-conducting plate in the bottom surface of heating plate.

Further, the upper compact heap top surface is fixed with multiple guide sleeves, the bottom surface of the upper top plate for compressing support frame Multiple guide rods are fixed with, guide rod sleeve is in corresponding guide sleeve.

Further, the top surface of the radiating block is coated with conducting adhesive layer, and heat-conducting substrate is bonded in conducting adhesive layer Top surface on, protection heat-conducting plate be pressed against on the top surface of heat-conducting substrate.

The beneficial effects of the present invention are:

It can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.

Detailed description of the invention

Fig. 1 is the structural diagram of the present invention;

Fig. 2 is the partial enlarged view of Fig. 1;

Fig. 3 is the partial enlarged view of another part of Fig. 1.

Specific embodiment

Embodiment: as shown in Fig. 1 to Fig. 3, a kind of heat-conducting substrate and radiating block bond compacting machine, including rack 10, described The top surface of the top plate of rack 10, which is fixed with, compresses support frame 11 and annular installation sleeve 12;

The annular installation sleeve 12 is in the underface of the upper top plate for compressing support frame 11;

It is fixed with clamping motor 111 in the middle part of the top surface of the upper top plate for compressing support frame 11, the output shaft of clamping motor 111 is worn It crosses the top plate for compressing support frame 11 and vertical screw rod 112 is connected with by shaft coupling, the bottom end of vertical screw rod 112 is bolted with liter Swivel nut 113 drops, and the bottom end of lifting swivel nut 113 is fixed with compact heap 13;

The middle part of the annular installation sleeve 12 is inserted with mounting blocks 14, has in the middle part of the top surface of mounting blocks 14 and places groove 141, the bottom surface for placing groove 141, which is pressed against, radiating block 100, and 100 sleeve of radiating block is in placing groove 141, upper compact heap 13 Against radiating block 100.

Further, the middle top surface of the top plate of the rack 10 has installation groove 15, and 16 sleeve of fixed plate is being pacified It fills in groove 15, the bottom surface of fixed plate 16 is fixed on the bottom surface of installation groove 15;

The bottom surface of mounting blocks 14 is fixed with multiple guide posts 142, and the bottom end sleeve of guide post 142 is in the top surface of fixed plate 16 In the corresponding positioning shrinkage pool 161 formed, 142 upper sleeve of guide post has buffer spring 1, and the bottom end of buffer spring 1 is fixed on On the top surface of fixed plate 16, the top of buffer spring 1 is fixed on the bottom surface of mounting blocks 14.

Further, adjusting compression cylinder is respectively and fixedly provided on the lateral wall of left and right two of the annular installation sleeve 12 20, the push rod for adjusting compression cylinder 20 protrudes into annular installation sleeve 12 and is fixed with arc adjusting block 21.

Further, elasticity layer 22 is fixed on the inner sidewall of the arc adjusting block 21, elastic layer 22 is pressed against scattered The top sidewall of heat block 100.

Further, the bottom surface for placing groove 141 is fixed with bottom resilient bed course 143, the bottom surface of radiating block 100 It is pressed against on the top surface of bottom resilient bed course 143.

Further, there is lower groove 131 in the middle part of the bottom surface of the upper compact heap 13,132 sleeve of electric boiling plate is under In groove 131, electric boiling plate 132 is fixed on the top surface of lower groove 131, and protection heat-conducting plate 133 is fixed on pressure plate 13 On bottom surface and electric boiling plate 132 is covered, the top surface of protection heat-conducting plate 133 is close in the bottom surface of electric boiling plate 132.

Further, 13 top surface of upper compact heap is fixed with multiple guide sleeves 134, the upper top plate for compressing support frame 11 Bottom surface be fixed with multiple guide rods 17,17 sleeve of guide rod is in corresponding guide sleeve 134.

Further, the top surface of the radiating block 100 is coated with conducting adhesive layer 200, and heat-conducting substrate 300, which is bonded in, leads On the top surface of hot adhesion layer 200, protection heat-conducting plate 133 is pressed against on the top surface of heat-conducting substrate 300.

When the present embodiment is in use, the bottom surface of radiating block 100 is pressed against on the top surface of bottom resilient bed course 143, then, By two adjust compression cylinders 20 push rod push so that the top of radiating block 100 be clamped in two arc adjusting blocks 21 it Between, elastic layer 22 is pressed against the top sidewall of radiating block 100, then, conducting adhesive is coated on the top surface of radiating block 100, Conducting adhesive layer 200 is formed, then heat-conducting substrate 300 is bonded on the top surface of conducting adhesive layer 200, then, by compressing electricity Machine 111 is run, so that vertical screw rod 112 rotates, so that lifting swivel nut 113 declines, so that upper compact heap 13 declines, passes through protection Heat-conducting plate 133 is pressed against on the top surface of heat-conducting substrate 300 and is compressed, and it is good to compress effect;

And when ambient temperature is relatively low, in order to guarantee the metallicity of heat-conducting substrate 300, can be firstly placed on before gluing It on the top surface of radiating block 100, is run by clamping motor 111, so that protection heat-conducting plate 133 is pressed against the top of heat-conducting substrate 300 On face, and electric boiling plate 132 is opened, realization is thermally conductive, and gluing bonding is carried out after then being promoted again and is compressed, very convenient;

Wherein, compression cylinder 20 is adjusted in the present embodiment to be connected by connecting tube with control valve, control valve passes through connection Pipe is connected with air pump, and electric boiling plate 132, clamping motor 111 and air pump, control valve pass through connecting line and be electrically connected with control host It connects, is operated by control host control, air pump, control valve and control host are common structure, are no longer described in detail, in attached drawing It does not show.

Claims (8)

1. a kind of heat-conducting substrate and radiating block bond compacting machine, including rack (10), it is characterised in that: the top of the rack (10) The top surface of plate, which is fixed with, compresses support frame (11) and annular installation sleeve (12);
The annular installation sleeve (12) is in the underface of the upper top plate for compressing support frame (11);
It is fixed with clamping motor (111) in the middle part of the top surface of the upper top plate for compressing support frame (11), the output shaft of clamping motor (111) Across the upper top plate for compressing support frame (11) and it is connected with vertical screw rod (112) by shaft coupling, the bottom end of vertical screw rod (112) It is bolted with lifting swivel nut (113), the bottom end of lifting swivel nut (113) is fixed with compact heap (13);
It is inserted with mounting blocks (14) in the middle part of the annular installation sleeve (12), has placement recessed in the middle part of the top surface of mounting blocks (14) Slot (141), the bottom surface for placing groove (141), which is pressed against, to be had radiating block (100), and radiating block (100) sleeve is placing groove (141) In, upper compact heap (13) is opposite radiating block (100).
2. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the rack (10) Top plate middle top surface have installation groove (15), fixed plate (16) sleeve in installation groove (15), fixed plate (16) Bottom surface is fixed on the bottom surface of installation groove (15);
The bottom surface of mounting blocks (14) is fixed with multiple guide posts (142), and the bottom end sleeve of guide post (142) is in fixed plate (16) In the corresponding positioning shrinkage pool (161) that top surface forms, guide post (142) upper sleeve has buffer spring (1), buffer spring (1) Bottom end be fixed on the top surface of fixed plate (16), the top of buffer spring (1) is fixed on the bottom surface of mounting blocks (14).
3. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the annular installation It is respectively and fixedly provided on the lateral wall of left and right two of sleeve (12) and adjusts compression cylinder (20), the push rod for adjusting compression cylinder (20) protrudes into In annular installation sleeve (12) and it is fixed with arc adjusting block (21).
4. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 3, it is characterised in that: the arc is adjusted It is fixed on the inner sidewall of block (21) elasticity layer (22), elastic layer (22) is pressed against the top sidewall of radiating block (100).
5. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the placement groove (141) bottom surface is fixed with bottom resilient bed course (143), and the bottom surface of radiating block (100) is pressed against bottom resilient bed course (143) On top surface.
6. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the upper compact heap (13) there are lower groove (131) in the middle part of bottom surface, electric boiling plate (132) sleeve is in lower groove (131), electric boiling plate (132) It is fixed on the top surface of lower groove (131), protection heat-conducting plate (133), which is fixed on the bottom surface of pressure plate (13) and covers electricity, to be added The top surface of protection heat-conducting plate (133) is close in hot plate (132), the bottom surface of electric boiling plate (132).
7. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the upper compact heap (13) top surface is fixed with multiple guide sleeves (134), and the bottom surface of the upper top plate for compressing support frame (11) is fixed with multiple guide rods (17), guide rod (17) sleeve is in corresponding guide sleeve (134).
8. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 6, it is characterised in that: the radiating block (100) top surface is coated with conducting adhesive layer (200), and heat-conducting substrate (300) is bonded on the top surface of conducting adhesive layer (200), Protection heat-conducting plate (133) is pressed against on the top surface of heat-conducting substrate (300).
CN201910266952.0A 2019-04-03 2019-04-03 A kind of heat-conducting substrate and radiating block bond compacting machine CN109973482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910266952.0A CN109973482A (en) 2019-04-03 2019-04-03 A kind of heat-conducting substrate and radiating block bond compacting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910266952.0A CN109973482A (en) 2019-04-03 2019-04-03 A kind of heat-conducting substrate and radiating block bond compacting machine

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Publication Number Publication Date
CN109973482A true CN109973482A (en) 2019-07-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110549121A (en) * 2019-10-11 2019-12-10 叶良军 radiating block punching and tapping all-in-one machine for LED lighting assembly
CN110725839A (en) * 2019-10-25 2020-01-24 蔡玉红 New material manufacturing is with pressurization adhesive device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845333A (en) * 1987-02-26 1989-07-04 Masato Hidata Welding method and apparatus
CN105903797A (en) * 2016-05-31 2016-08-31 佛山市联智新创科技有限公司 Punch forming mechanism for steel plate
CN108465837A (en) * 2018-05-28 2018-08-31 佛山市达普光机电科技有限公司 A kind of single-ended compression borehole drill construction of high-precision thin-wall circular tube
CN108971888A (en) * 2018-08-02 2018-12-11 东莞市联洲知识产权运营管理有限公司 A kind of metal alloy sleeve-mounted mechanism
CN109230791A (en) * 2018-10-17 2019-01-18 苏州华策纺织科技有限公司 A kind of cloth adherency organisation of working
CN208575286U (en) * 2018-05-28 2019-03-05 佛山市达普光机电科技有限公司 A kind of high-precision round tube compression borehole drill construction

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845333A (en) * 1987-02-26 1989-07-04 Masato Hidata Welding method and apparatus
CN105903797A (en) * 2016-05-31 2016-08-31 佛山市联智新创科技有限公司 Punch forming mechanism for steel plate
CN108465837A (en) * 2018-05-28 2018-08-31 佛山市达普光机电科技有限公司 A kind of single-ended compression borehole drill construction of high-precision thin-wall circular tube
CN208575286U (en) * 2018-05-28 2019-03-05 佛山市达普光机电科技有限公司 A kind of high-precision round tube compression borehole drill construction
CN108971888A (en) * 2018-08-02 2018-12-11 东莞市联洲知识产权运营管理有限公司 A kind of metal alloy sleeve-mounted mechanism
CN109230791A (en) * 2018-10-17 2019-01-18 苏州华策纺织科技有限公司 A kind of cloth adherency organisation of working

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110549121A (en) * 2019-10-11 2019-12-10 叶良军 radiating block punching and tapping all-in-one machine for LED lighting assembly
CN110725839A (en) * 2019-10-25 2020-01-24 蔡玉红 New material manufacturing is with pressurization adhesive device
CN110725839B (en) * 2019-10-25 2020-10-02 嵊州亿源投资管理有限公司 New material manufacturing is with pressurization adhesive device

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