CN109973482A - A kind of heat-conducting substrate and radiating block bond compacting machine - Google Patents
A kind of heat-conducting substrate and radiating block bond compacting machine Download PDFInfo
- Publication number
- CN109973482A CN109973482A CN201910266952.0A CN201910266952A CN109973482A CN 109973482 A CN109973482 A CN 109973482A CN 201910266952 A CN201910266952 A CN 201910266952A CN 109973482 A CN109973482 A CN 109973482A
- Authority
- CN
- China
- Prior art keywords
- fixed
- radiating block
- heat
- plate
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 238000009434 installation Methods 0.000 claims abstract description 27
- 230000008878 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- 238000009835 boiling Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat-conducting substrates and radiating block to bond compacting machine, including rack, and the top surface of the top plate of the rack, which is fixed with, compresses support frame and annular installation sleeve；The annular installation sleeve is in the underface of the upper top plate for compressing support frame；Clamping motor is fixed in the middle part of the top surface of the upper top plate for compressing support frame, the output shaft of clamping motor passes through the upper top plate for compressing support frame and is connected with vertical screw rod by shaft coupling, the bottom end of vertical screw rod is bolted with lifting swivel nut, and the bottom end for going up and down swivel nut is fixed with compact heap；Mounting blocks are inserted in the middle part of the annular installation sleeve, has in the middle part of the top surface of mounting blocks and places groove, and the bottom surface for placing groove, which is pressed against, radiating block, and radiating block sleeve is in placing groove, and upper compact heap is against radiating block.It can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.
Description
Technical field
The present invention relates to LED lamp accessory manufacture technology field, more specifically to a kind of heat-conducting substrate and radiating block
Bond compacting machine.
Background technique
It is required to installation aluminum substrate on the general pcb board of its in existing LED lamp, needs fixed dissipate at the back side of aluminum substrate
Heat block, radiating block are generally fixed by bolts either thermoconductive glue with aluminum substrate and fixed, fixed using thermoconductive glue, are needed
Will be using manually radiating block and aluminum substrate be squeezed, the pressure of manual compression is uneven, and effect is limited, bonds insecure.
Summary of the invention
The purpose of the present invention is to the deficiencies of the prior art, and provide a kind of heat-conducting substrate and radiating block bonding compresses
Machine, it can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.
Technology solution of the invention is as follows:
A kind of heat-conducting substrate and radiating block bond compacting machine, including rack, the top surface of the top plate of the rack are fixed with
Compress support frame and annular installation sleeve；
The annular installation sleeve is in the underface of the upper top plate for compressing support frame；
Clamping motor is fixed in the middle part of the top surface of the upper top plate for compressing support frame, the output shaft of clamping motor passes through upper compression
The top plate of support frame is simultaneously connected with vertical screw rod by shaft coupling, and the bottom end of vertical screw rod is bolted with lifting swivel nut, goes up and down swivel nut
Bottom end be fixed with compact heap；
It is inserted with mounting blocks in the middle part of the annular installation sleeve, has in the middle part of the top surface of mounting blocks and places groove, place
The bottom surface of groove, which is pressed against, radiating block, and radiating block sleeve is in placing groove, and upper compact heap is against radiating block.
Further, the middle top surface of the top plate of the rack has installation groove, and fixed plate sleeve is in installation groove
In, the bottom surface of fixed plate is fixed on the bottom surface of installation groove；
The bottom surface of mounting blocks is fixed with multiple guide posts, pair that the bottom end sleeve of guide post is formed in the top surface of fixed plate
In the positioning shrinkage pool answered, guide post upper sleeve has buffer spring, and the bottom end of buffer spring is fixed on the top surface of fixed plate, buffering
The top of spring is fixed on the bottom surface of mounting blocks.
Further, it is respectively and fixedly provided with adjusting compression cylinder on the lateral wall of left and right two of the annular installation sleeve, adjusted
The push rod of section compression cylinder protrudes into annular installation sleeve and is fixed with arc adjusting block.
Further, elasticity layer is fixed on the inner sidewall of the arc adjusting block, elastic laminate leans against radiating block
Top sidewall.
Further, the bottom surface for placing groove is fixed with bottom resilient bed course, and the bottom surface of radiating block is pressed against bottom
On the top surface of portion's elastic insert.
Further, there is lower groove in the middle part of the bottom surface of the upper compact heap, electric boiling plate sleeve is in lower groove, electricity
Heating plate is fixed on the top surface of lower groove, and protection heat-conducting plate is fixed on the bottom surface of pressure plate and covers electric boiling plate, electricity
It is close to the top surface of protection heat-conducting plate in the bottom surface of heating plate.
Further, the upper compact heap top surface is fixed with multiple guide sleeves, the bottom surface of the upper top plate for compressing support frame
Multiple guide rods are fixed with, guide rod sleeve is in corresponding guide sleeve.
Further, the top surface of the radiating block is coated with conducting adhesive layer, and heat-conducting substrate is bonded in conducting adhesive layer
Top surface on, protection heat-conducting plate be pressed against on the top surface of heat-conducting substrate.
The beneficial effects of the present invention are:
It can be by radiating block and heat-conducting substrate automatic impaction, and it is equally loaded, is adhesively fixed securely, effect is good.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the partial enlarged view of Fig. 1；
Fig. 3 is the partial enlarged view of another part of Fig. 1.
Specific embodiment
Embodiment: as shown in Fig. 1 to Fig. 3, a kind of heat-conducting substrate and radiating block bond compacting machine, including rack 10, described
The top surface of the top plate of rack 10, which is fixed with, compresses support frame 11 and annular installation sleeve 12；
The annular installation sleeve 12 is in the underface of the upper top plate for compressing support frame 11；
It is fixed with clamping motor 111 in the middle part of the top surface of the upper top plate for compressing support frame 11, the output shaft of clamping motor 111 is worn
It crosses the top plate for compressing support frame 11 and vertical screw rod 112 is connected with by shaft coupling, the bottom end of vertical screw rod 112 is bolted with liter
Swivel nut 113 drops, and the bottom end of lifting swivel nut 113 is fixed with compact heap 13；
The middle part of the annular installation sleeve 12 is inserted with mounting blocks 14, has in the middle part of the top surface of mounting blocks 14 and places groove
141, the bottom surface for placing groove 141, which is pressed against, radiating block 100, and 100 sleeve of radiating block is in placing groove 141, upper compact heap 13
Against radiating block 100.
Further, the middle top surface of the top plate of the rack 10 has installation groove 15, and 16 sleeve of fixed plate is being pacified
It fills in groove 15, the bottom surface of fixed plate 16 is fixed on the bottom surface of installation groove 15；
The bottom surface of mounting blocks 14 is fixed with multiple guide posts 142, and the bottom end sleeve of guide post 142 is in the top surface of fixed plate 16
In the corresponding positioning shrinkage pool 161 formed, 142 upper sleeve of guide post has buffer spring 1, and the bottom end of buffer spring 1 is fixed on
On the top surface of fixed plate 16, the top of buffer spring 1 is fixed on the bottom surface of mounting blocks 14.
Further, adjusting compression cylinder is respectively and fixedly provided on the lateral wall of left and right two of the annular installation sleeve 12
20, the push rod for adjusting compression cylinder 20 protrudes into annular installation sleeve 12 and is fixed with arc adjusting block 21.
Further, elasticity layer 22 is fixed on the inner sidewall of the arc adjusting block 21, elastic layer 22 is pressed against scattered
The top sidewall of heat block 100.
Further, the bottom surface for placing groove 141 is fixed with bottom resilient bed course 143, the bottom surface of radiating block 100
It is pressed against on the top surface of bottom resilient bed course 143.
Further, there is lower groove 131 in the middle part of the bottom surface of the upper compact heap 13,132 sleeve of electric boiling plate is under
In groove 131, electric boiling plate 132 is fixed on the top surface of lower groove 131, and protection heat-conducting plate 133 is fixed on pressure plate 13
On bottom surface and electric boiling plate 132 is covered, the top surface of protection heat-conducting plate 133 is close in the bottom surface of electric boiling plate 132.
Further, 13 top surface of upper compact heap is fixed with multiple guide sleeves 134, the upper top plate for compressing support frame 11
Bottom surface be fixed with multiple guide rods 17,17 sleeve of guide rod is in corresponding guide sleeve 134.
Further, the top surface of the radiating block 100 is coated with conducting adhesive layer 200, and heat-conducting substrate 300, which is bonded in, leads
On the top surface of hot adhesion layer 200, protection heat-conducting plate 133 is pressed against on the top surface of heat-conducting substrate 300.
When the present embodiment is in use, the bottom surface of radiating block 100 is pressed against on the top surface of bottom resilient bed course 143, then,
By two adjust compression cylinders 20 push rod push so that the top of radiating block 100 be clamped in two arc adjusting blocks 21 it
Between, elastic layer 22 is pressed against the top sidewall of radiating block 100, then, conducting adhesive is coated on the top surface of radiating block 100,
Conducting adhesive layer 200 is formed, then heat-conducting substrate 300 is bonded on the top surface of conducting adhesive layer 200, then, by compressing electricity
Machine 111 is run, so that vertical screw rod 112 rotates, so that lifting swivel nut 113 declines, so that upper compact heap 13 declines, passes through protection
Heat-conducting plate 133 is pressed against on the top surface of heat-conducting substrate 300 and is compressed, and it is good to compress effect；
And when ambient temperature is relatively low, in order to guarantee the metallicity of heat-conducting substrate 300, can be firstly placed on before gluing
It on the top surface of radiating block 100, is run by clamping motor 111, so that protection heat-conducting plate 133 is pressed against the top of heat-conducting substrate 300
On face, and electric boiling plate 132 is opened, realization is thermally conductive, and gluing bonding is carried out after then being promoted again and is compressed, very convenient；
Wherein, compression cylinder 20 is adjusted in the present embodiment to be connected by connecting tube with control valve, control valve passes through connection
Pipe is connected with air pump, and electric boiling plate 132, clamping motor 111 and air pump, control valve pass through connecting line and be electrically connected with control host
It connects, is operated by control host control, air pump, control valve and control host are common structure, are no longer described in detail, in attached drawing
It does not show.
Claims (8)
1. a kind of heat-conducting substrate and radiating block bond compacting machine, including rack (10), it is characterised in that: the top of the rack (10)
The top surface of plate, which is fixed with, compresses support frame (11) and annular installation sleeve (12)；
The annular installation sleeve (12) is in the underface of the upper top plate for compressing support frame (11)；
It is fixed with clamping motor (111) in the middle part of the top surface of the upper top plate for compressing support frame (11), the output shaft of clamping motor (111)
Across the upper top plate for compressing support frame (11) and it is connected with vertical screw rod (112) by shaft coupling, the bottom end of vertical screw rod (112)
It is bolted with lifting swivel nut (113), the bottom end of lifting swivel nut (113) is fixed with compact heap (13)；
It is inserted with mounting blocks (14) in the middle part of the annular installation sleeve (12), has placement recessed in the middle part of the top surface of mounting blocks (14)
Slot (141), the bottom surface for placing groove (141), which is pressed against, to be had radiating block (100), and radiating block (100) sleeve is placing groove (141)
In, upper compact heap (13) is opposite radiating block (100).
2. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the rack (10)
Top plate middle top surface have installation groove (15), fixed plate (16) sleeve in installation groove (15), fixed plate (16)
Bottom surface is fixed on the bottom surface of installation groove (15)；
The bottom surface of mounting blocks (14) is fixed with multiple guide posts (142), and the bottom end sleeve of guide post (142) is in fixed plate (16)
In the corresponding positioning shrinkage pool (161) that top surface forms, guide post (142) upper sleeve has buffer spring (1), buffer spring (1)
Bottom end be fixed on the top surface of fixed plate (16), the top of buffer spring (1) is fixed on the bottom surface of mounting blocks (14).
3. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the annular installation
It is respectively and fixedly provided on the lateral wall of left and right two of sleeve (12) and adjusts compression cylinder (20), the push rod for adjusting compression cylinder (20) protrudes into
In annular installation sleeve (12) and it is fixed with arc adjusting block (21).
4. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 3, it is characterised in that: the arc is adjusted
It is fixed on the inner sidewall of block (21) elasticity layer (22), elastic layer (22) is pressed against the top sidewall of radiating block (100).
5. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the placement groove
(141) bottom surface is fixed with bottom resilient bed course (143), and the bottom surface of radiating block (100) is pressed against bottom resilient bed course (143)
On top surface.
6. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the upper compact heap
(13) there are lower groove (131) in the middle part of bottom surface, electric boiling plate (132) sleeve is in lower groove (131), electric boiling plate (132)
It is fixed on the top surface of lower groove (131), protection heat-conducting plate (133), which is fixed on the bottom surface of pressure plate (13) and covers electricity, to be added
The top surface of protection heat-conducting plate (133) is close in hot plate (132), the bottom surface of electric boiling plate (132).
7. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 1, it is characterised in that: the upper compact heap
(13) top surface is fixed with multiple guide sleeves (134), and the bottom surface of the upper top plate for compressing support frame (11) is fixed with multiple guide rods
(17), guide rod (17) sleeve is in corresponding guide sleeve (134).
8. a kind of heat-conducting substrate and radiating block bond compacting machine according to claim 6, it is characterised in that: the radiating block
(100) top surface is coated with conducting adhesive layer (200), and heat-conducting substrate (300) is bonded on the top surface of conducting adhesive layer (200),
Protection heat-conducting plate (133) is pressed against on the top surface of heat-conducting substrate (300).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910266952.0A CN109973482A (en) | 2019-04-03 | 2019-04-03 | A kind of heat-conducting substrate and radiating block bond compacting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910266952.0A CN109973482A (en) | 2019-04-03 | 2019-04-03 | A kind of heat-conducting substrate and radiating block bond compacting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109973482A true CN109973482A (en) | 2019-07-05 |
Family
ID=67082756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910266952.0A Withdrawn CN109973482A (en) | 2019-04-03 | 2019-04-03 | A kind of heat-conducting substrate and radiating block bond compacting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109973482A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110345141A (en) * | 2019-08-15 | 2019-10-18 | 中国商用飞机有限责任公司北京民用飞机技术研究中心 | A kind of adhesive tool |
| CN110549121A (en) * | 2019-10-11 | 2019-12-10 | 叶良军 | radiating block punching and tapping all-in-one machine for LED lighting assembly |
| CN110725839A (en) * | 2019-10-25 | 2020-01-24 | 蔡玉红 | New material manufacturing is with pressurization adhesive device |
| CN110834172A (en) * | 2019-11-15 | 2020-02-25 | 苏州默声熙达设备科技有限公司 | Fixing mechanism for welding air guide support of ventilation filter |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845333A (en) * | 1987-02-26 | 1989-07-04 | Masato Hidata | Welding method and apparatus |
| CN105903797A (en) * | 2016-05-31 | 2016-08-31 | 佛山市联智新创科技有限公司 | Punch forming mechanism for steel plate |
| CN108465837A (en) * | 2018-05-28 | 2018-08-31 | 佛山市达普光机电科技有限公司 | A kind of single-ended compression borehole drill construction of high-precision thin-wall circular tube |
| CN108971888A (en) * | 2018-08-02 | 2018-12-11 | 东莞市联洲知识产权运营管理有限公司 | A kind of metal alloy sleeve-mounted mechanism |
| CN109230791A (en) * | 2018-10-17 | 2019-01-18 | 苏州华策纺织科技有限公司 | A kind of cloth adherency organisation of working |
| CN208575286U (en) * | 2018-05-28 | 2019-03-05 | 佛山市达普光机电科技有限公司 | A kind of high-precision round tube compression borehole drill construction |
-
2019
- 2019-04-03 CN CN201910266952.0A patent/CN109973482A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845333A (en) * | 1987-02-26 | 1989-07-04 | Masato Hidata | Welding method and apparatus |
| CN105903797A (en) * | 2016-05-31 | 2016-08-31 | 佛山市联智新创科技有限公司 | Punch forming mechanism for steel plate |
| CN108465837A (en) * | 2018-05-28 | 2018-08-31 | 佛山市达普光机电科技有限公司 | A kind of single-ended compression borehole drill construction of high-precision thin-wall circular tube |
| CN208575286U (en) * | 2018-05-28 | 2019-03-05 | 佛山市达普光机电科技有限公司 | A kind of high-precision round tube compression borehole drill construction |
| CN108971888A (en) * | 2018-08-02 | 2018-12-11 | 东莞市联洲知识产权运营管理有限公司 | A kind of metal alloy sleeve-mounted mechanism |
| CN109230791A (en) * | 2018-10-17 | 2019-01-18 | 苏州华策纺织科技有限公司 | A kind of cloth adherency organisation of working |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110345141A (en) * | 2019-08-15 | 2019-10-18 | 中国商用飞机有限责任公司北京民用飞机技术研究中心 | A kind of adhesive tool |
| CN110549121A (en) * | 2019-10-11 | 2019-12-10 | 叶良军 | radiating block punching and tapping all-in-one machine for LED lighting assembly |
| CN110725839A (en) * | 2019-10-25 | 2020-01-24 | 蔡玉红 | New material manufacturing is with pressurization adhesive device |
| CN110725839B (en) * | 2019-10-25 | 2020-10-02 | 嵊州亿源投资管理有限公司 | New material manufacturing is with pressurization adhesive device |
| CN110834172A (en) * | 2019-11-15 | 2020-02-25 | 苏州默声熙达设备科技有限公司 | Fixing mechanism for welding air guide support of ventilation filter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109973482A (en) | A kind of heat-conducting substrate and radiating block bond compacting machine | |
| CN204681604U (en) | Energising curing | |
| CN207267800U (en) | A kind of room is built automatically clamps elevating mechanism with aluminium alloy glass forms | |
| CN109944852A (en) | A kind of heat-conducting substrate and radiating block bond compacting machine radiating block positioning mechanism | |
| CN105530343B (en) | A kind of cell phone rear cover assembly equipment | |
| CN210174238U (en) | Bubble-free back glue laminating clamping and pressing device | |
| CN207093530U (en) | It is a kind of to compress the device for pasting carpet pedal pad | |
| CN217144405U (en) | Press-fit device for ceramic wafer | |
| CN210067371U (en) | Attachment device for architectural decoration glass | |
| CN205890122U (en) | Suppression anchor clamps of gaseous ultrasonic transducer piezoelectric patches and matching layer | |
| CN210609905U (en) | Full-automatic PCB board inlayer circuit board's compression fittings | |
| CN106058635B (en) | Multi-single-tube semiconductor laser alignment fixture | |
| CN213108593U (en) | Whole-curved surface vacuumizing screen-pasting defoaming curing all-in-one machine | |
| CN207139681U (en) | A kind of lamp bar assembly fixture and lamp strip unit match somebody with somebody device | |
| CN106061130A (en) | Chip down-pressing and fixing mechanism of communication circuit board | |
| CN207900906U (en) | A kind of sticky wax jig of single-sided polishing hard brittle material piece | |
| CN211073267U (en) | Fixing device is used in processing of solar photovoltaic board | |
| CN207162265U (en) | A kind of adjustable for height LED exposed lamps of lamp bead | |
| CN110774718A (en) | Plate bonding and pressing mechanism with heating function | |
| CN216435848U (en) | MEMS flexible lead bonding equipment | |
| CN112186073A (en) | Intelligent balancing device for vacuum laminated board | |
| CN220209848U (en) | Electromechanical installation pipeline equipment | |
| CN205466066U (en) | Anchor clamps that installation thing to sit on was used | |
| CN210798700U (en) | Protection component for installing hollow glass | |
| CN219923542U (en) | Circuit board coating fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190705 |
|
| WW01 | Invention patent application withdrawn after publication |