CN109962131A - 一种新型白光led器件的制备方法 - Google Patents

一种新型白光led器件的制备方法 Download PDF

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CN109962131A
CN109962131A CN201910149693.3A CN201910149693A CN109962131A CN 109962131 A CN109962131 A CN 109962131A CN 201910149693 A CN201910149693 A CN 201910149693A CN 109962131 A CN109962131 A CN 109962131A
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aln
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light led
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刘舸
王优
田青
周玲
孙光东
魏晓慧
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Huizhou University
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/025Physical imperfections, e.g. particular concentration or distribution of impurities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen

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Abstract

本发明涉及一种新型白光LED器件的制备方法,包括以下步骤:制备AlN晶体材料;对AlN晶体材料进行切割、打磨和抛光,制成表面平整的AlN薄片;对制成的AlN薄片进行清洗,清洗后对其进行烘烤以除去表面的水气与溶剂残留物;在AlN薄片上图形化电极并蒸镀金属电极;最后再进行氮气氛下的退火处理,制成新型白光LED器件。本发明直接采用气相传输法制备的AlN晶体材料作为功能材料,在晶体上制备电极后直接通电发光。该方法实现单一材料的白光输出,无需荧光粉的二次转换,因此器件结构更加简单紧凑,单晶状态的AlN功能层也能承载更大的功率密度。由于利用宽禁带半导体AlN材料禁带内的缺陷发光,使器件的发射光谱十分丰富,可覆盖整个可见光区域,且光色品质出色。

Description

一种新型白光LED器件的制备方法
技术领域
本发明涉及LED发光元器件制造领域,具体而言,涉及一种新型白光LED器件的制备方法。
背景技术
随着人们对环境的日益重视,节能环保这一新兴概念也在LED(Light EmittingDiode,发光二极管)行业开始升温。而以GaN(氮化镓)基LED为基础器件的白光LED技术也得到了迅猛发展。以GaN蓝光LED芯片作为激发源的白光LED单灯光源效率已达到130流明/瓦以上,远远超过了普通节能灯的光效,LED技术已开始全面进入通用照明市场。随着GaN基LED应用范围的进一步扩大,对LED器件发光效率的要求也越来越高,各种新的半导体材料、新的芯片制作工艺、新的器件结构不断推陈出新,以满足光源市场对LED光源的各种需求。
目前,传统的GaN基LED白光光源的主要发光机理是用蓝光或紫外LED激发荧光粉混合形成白光。该方法的主要缺陷在于GaN基外延膜的生长工艺复杂,设备昂贵,同时,荧光粉的使用也限制了器件的性能。
发明内容
针对上述问题,本发明提供一种直接采用AlN晶体材料作为功能材料,在晶体上制备电极后通电发光新型白光LED器件的制备方法,包括以下步骤:
一种新型白光LED器件的制备方法,包括以下步骤:
制备AlN晶体材料;
对AlN晶体材料进行切割、打磨和抛光,制成表面平整的AlN薄片;
对制成的AlN薄片进行清洗,清洗后对其进行烘烤以除去表面的水气与溶剂残留物;
在AlN薄片上图形化电极并蒸镀金属电极;
最后再进行氮气氛下的退火处理,制成新型白光LED器件。
进一步的,所述AlN晶体材料通过物理气相传输法制备。
进一步的,所述AlN晶体材料为铅锌矿结构的块状材料。
进一步的,制备AlN晶体材料在单一的氮气保护下进行。
进一步的,清洗时依次在丙酮、酒精、去离子水中进行超声清洗。
进一步的,图形化电极时,电极位于AlN薄片同侧的表面。
进一步的,所述AlN薄片的厚度为0.4mm~0.6mm。
进一步的,所述金属电极的材料选自铂、铜、铝、铟、镍以及铬。
一种白光LED器件,包括:作为单一发光材料的AlN薄片,其厚度为0.4mm~0.6mm且表面平整;以及直接形成在所述AlN薄片的其中一个平整的表面上的至少两个电极。
本发明提供了新型白光LED器件的制备方法,直接采用气相传输法制备的AlN晶体材料作为功能材料,在晶体上制备电极后直接通电发光。该方法实现单一材料的白光输出,无需荧光粉的二次转换,因此器件结构更加简单紧凑,单晶状态的AlN功能层也能承载更大的功率密度。由于利用宽禁带半导体AlN材料禁带内的缺陷发光,丰富的缺陷能级导致器件的发射光谱十分丰富,能完全覆盖整个可见光区域,光色品质也非常出色。本发明制备简单,工艺成本低。
附图说明
图1为本发明提供的新型白光LED器件的制备方法实施例步骤示意图。
具体实施方式
为了方便本领域的技术人员了解本发明的技术内容,下面结合附图及实施例对本发明做进一步的详细说明。
如图1所示,一较佳实施例中,本发明的新型白光LED器件的制备方法主要包括以下步骤:
S1,制备AlN(氮化铝)晶体材料,优选采用物理气相传输法(PVT),物理气相传输法可在晶体的生长制备过程中通过适当的参数调节,控制晶体的晶格结构、缺陷种类和缺陷密度,且PVT生长炉远较生长GaN薄膜的MOCVD(金属有机化合物化学气相沉淀)低廉。本实施例中,通过物理气相传输法在2300℃的氮气氛下生长制备出铅锌矿结构的AlN晶体材料,该AlN晶体材料具有丰富的缺陷能级,能够发射宽光谱的白光。
S2,对所得到的AlN晶体材料进行切割,并打磨抛光,得到厚度为0.4mm~0.6mm且表面平整的AlN晶体薄片。本实施例中,综合考虑成本和器件性能,AlN晶体薄片优选为厚度为0.5mm的方形薄片,其他实施例中,AlN晶体薄片可为其他规则形状,优选为轴对称图形。
S3,对准备好的AlN晶体薄片进行清洗,依次用丙酮,酒精,去离子水进行超声清洗,每次超声清洗5~10分钟,清洗结束后把样品放置在120℃的热板上烘烤20~30分钟,除去表面的水气与溶剂残留物。
S4,使用图形化工艺在AlN薄片同侧表面形成对称的电极图形,并蒸镀金属电极材料。其中,图形化工艺可采用例如光刻、漏板、压印或丝网印刷,电极材料选自铜、铝、铟、铂,可为其中一种或几种配合使用,电极材料中还包括过渡层材料镍或铬或镍和铬,过渡层材料增加了电极的粘附性。电极整体厚度为100nm。本实施例中,采用边长约50um的正方形电极,对称设置在方形AlN晶体薄片的一个表面上,并靠近方形AlN晶体薄片的短边。当AlN晶体薄片为其他规则的轴对称图形时,电极轴对称设置在AlN晶体薄片的对称轴两侧。
S5,对制备好的器件进行500℃下4~6小时的褪火处理,并采用氮气作为保护气体,褪火后即完成了基于AlN晶体的新型白光LED器件的制备。
本发明还提供了一种白光LED器件,其使用上述AlN薄片作用单一发光材料,其厚度为0.4mm~0.6mm且至表面平整;以及直接形成在所述AlN薄片的其中一个平整的表面上的至少两个电极。
虽然对本发明的描述是结合以上具体实施例进行的,但是,熟悉本技术领域的人员能够根据上述的内容进行许多替换、修改和变化、是显而易见的。因此,所有这样的替代、改进和变化都包括在附后的权利要求的精神和范围内。

Claims (9)

1.一种新型白光LED器件的制备方法,其特征在于,包括以下步骤:
制备AlN晶体材料;
对AlN晶体材料进行切割、打磨和抛光,制成表面平整的AlN薄片;
对制成的AlN薄片进行清洗,清洗后对其进行烘烤以除去表面的水气与溶剂残留物;
在AlN薄片上图形化电极并蒸镀金属电极;
最后再进行氮气氛下的退火处理,制成新型白光LED器件。
2.根据权利要求1所述的新型白光LED器件的制备方法,其特征在于,所述AlN晶体材料通过物理气相传输法制备。
3.根据权利要求2所述的新型白光LED器件的制备方法,其特征在于,所述AlN晶体材料为铅锌矿结构的块状材料。
4.根据权利要求3所述的新型白光LED器件的制备方法,其特征在于,制备AlN晶体材料在单一的氮气保护下进行。
5.根据权利要求1所述的新型白光LED器件的制备方法,其特征在于,清洗时依次在丙酮、酒精、去离子水中进行超声清洗。
6.根据权利要求1或3所述的新型白光LED器件的制备方法,其特征在于,图形化电极时,电极位于AlN薄片同侧的表面。
7.根据权利要求6所述的新型白光LED器件的制备方法,其特征在于,所述AlN薄片的厚度为0.4mm~0.6mm。
8.根据权利要求6所述的新型白光LED器件的制备方法,其特征在于,所述金属电极的材料选自铂、铜、铝、铟,还包括过渡材料镍或铬。
9.一种白光LED器件,其特征在于,包括:
作为单一发光材料的AlN薄片,其厚度为0.4mm~0.6mm且表面平整;以及
直接形成在所述AlN薄片的其中一个平整的表面上的至少两个电极。
CN201910149693.3A 2019-02-28 2019-02-28 一种新型白光led器件的制备方法 Withdrawn CN109962131A (zh)

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CN112599646A (zh) * 2020-12-25 2021-04-02 惠州学院 一种全光谱光电双通道器件及其制备方法和应用

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Publication number Priority date Publication date Assignee Title
WO2020173149A1 (zh) * 2019-02-28 2020-09-03 惠州学院 一种新型白光led器件的制备方法
CN112599646A (zh) * 2020-12-25 2021-04-02 惠州学院 一种全光谱光电双通道器件及其制备方法和应用

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Application publication date: 20190702