CN109957366A - A kind of epoxy-polyamide resin adhesive - Google Patents
A kind of epoxy-polyamide resin adhesive Download PDFInfo
- Publication number
- CN109957366A CN109957366A CN201711404060.XA CN201711404060A CN109957366A CN 109957366 A CN109957366 A CN 109957366A CN 201711404060 A CN201711404060 A CN 201711404060A CN 109957366 A CN109957366 A CN 109957366A
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- CN
- China
- Prior art keywords
- epoxy
- polyamide
- liquid
- resin
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of epoxy-polyamide resin adhesives and preparation method thereof, the adhesive belongs to chemical building material field, produce the raw material that the adhesive uses includes: liquid-state epoxy resin 33%-35%, liquid polyamide 28%-30%, epoxy propane butyl ether 20%, tertiary amine 8%, anti-aging agent 2%, vitreous silica silicon powder 4%, barium stearate 3% by weight ratio, by blending at a certain temperature come finished product；The product processes are simple, and polyamide can improve brittleness, improve cementability, and adding polyamide in the epoxy makes the cementability of adhesive be greatly improved, and product is mainly adapted to metal and nonmetallic bonding.
Description
Technical field:
Product of the present invention belongs to chemical building material field, and in particular to a kind of preparation side of epoxy-polyamide resin adhesive
Method.
Background technique:
High-molecular compound in all molecular structures containing epoxy group is referred to as epoxy resin, to metal and nonmetallic after solidification
The surface of material has excellent adhesive strength, and shrinkage when epoxy resin cure is low, and the internal stress of generation is small, this is also helped
It is a kind of important materials for making bonding agent in improving adhesion strength, the synthesis of above-mentioned many performances makes epoxy-resin systems
With dimensional stability outstanding and durability；Epoxy resin is general and auxiliary material uses simultaneously, and to obtain application value, auxiliary material can
It is selected by different purposes, conventional additives have following a few classes: curing agent, modifying agent, filler, diluent, stabilizer etc..Its
Middle curing agent is essential additive, and either making bonding agent, coating, castable all needs addition curing agent, otherwise epoxy
Resin cannot solidify.Common epoxy curing agent has fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, acid anhydrides, resinae, uncle
Amine；The effect of modifying agent is commonly used and is changed to improve the flexibility of epoxy resin, shearing resistance, bending resistance, anti-impact, raising insulation performance etc.
Property agent have: impact strength and anti-stripping performance can be improved in the tertiary butyraldehyde of polysulfide rubber, polyamide, polyvinyl alcohol, polysulfide rubber, gather
Amide resin can improve brittleness, improve cementability, and shock resistance flexibility can be improved in the tertiary butyraldehyde of polyvinyl alcohol, generally modifying agent
Dosage is more, flexible just bigger, but the heat distortion temperature of resin just also commonly use for the flexibility for improving resin by corresponding decline
Toughener.Product of the present invention is exactly the adhesive made of epoxy resin addition polyamide, and polyamide can improve crisp
Property, cementability is improved, adding polyamide in the epoxy makes the cementability of adhesive be greatly improved,
It is mainly adapted to metal and nonmetallic bonding.
Summary of the invention:
Present invention mainly solves the problem of be to provide a kind of epoxy-polyamide resin adhesive and preparation method thereof, production
The raw material that the adhesive uses includes: liquid-state epoxy resin 33%-35%, liquid polyamide 28%-30%, ring by weight ratio
Ethylene Oxide butyl ether 20%, tertiary amine 8%, anti-aging agent 2%, vitreous silica silicon powder 4%, barium stearate 3%.
The technical solution adopted by the present invention is that:
(1) liquid-state epoxy resin of formula ratio is sent into chemical reaction kettle, the propylene oxide butyl of formula ratio is added while stirring
Ether, while the temperature in chemical reaction kettle is increased to 50-52 DEG C, the liquid polyamide of formula ratio, stirring is then added
Reaction 1.2-1.3 hours.
(2) it is cooled to room temperature, continues to stir, the tertiary amine, anti-aging agent, vitreous silica silicon powder, stearic acid of formula ratio is added
Barium is stirred to react 0.2-0.3 hours.
Preferably, the purity of the liquid-state epoxy resin is 95%.
Preferably, the purity of the liquid polyamide is 90%.
The beneficial effects of the present invention are: a kind of epoxy-polyamide resin adhesive and preparation method thereof is provided, it should
Product processes are simple, and polyamide can improve brittleness, improve cementability, add polyamide in the epoxy
The cementability of adhesive is set to be greatly improved, product is mainly adapted to metal and nonmetallic bonding.
Specific embodiment:
Embodiment 1
The liquid-state epoxy resin that total amount is 33% will be accounted for and be sent into chemical reaction kettle, be added account for the epoxy third that total amount is 20% while stirring
Alkane butyl ether, while the temperature in chemical reaction kettle is increased to 50 DEG C, it is then added and accounts for the liquid polyamide resin that total amount is 30%
Rouge is stirred to react 1.3 hours；Be cooled to room temperature, continue to stir, be added and account for tertiary amine that total amount is 8%, account for total amount be 2% it is anti-old
Agent accounts for vitreous silica silicon powder that total amount is 4%, accounts for the barium stearate that total amount is 3%, is stirred to react 0.2 hour.
Embodiment 2
The liquid-state epoxy resin that total amount is 34% will be accounted for and be sent into chemical reaction kettle, be added account for the epoxy third that total amount is 20% while stirring
Alkane butyl ether, while the temperature in chemical reaction kettle is increased to 51 DEG C, it is then added and accounts for the liquid polyamide resin that total amount is 29%
Rouge is stirred to react 1.25 hours；Be cooled to room temperature, continue to stir, be added and account for tertiary amine that total amount is 8%, account for total amount be 2% it is anti-old
Agent accounts for vitreous silica silicon powder that total amount is 4%, accounts for the barium stearate that total amount is 3%, is stirred to react 0.25 hour.
Embodiment 3
The liquid-state epoxy resin that total amount is 35% will be accounted for and be sent into chemical reaction kettle, be added account for the epoxy third that total amount is 20% while stirring
Alkane butyl ether, while the temperature in chemical reaction kettle is increased to 52 DEG C, it is then added and accounts for the liquid polyamide resin that total amount is 28%
Rouge is stirred to react 1.2 hours；Be cooled to room temperature, continue to stir, be added and account for tertiary amine that total amount is 8%, account for total amount be 2% it is anti-old
Agent accounts for vitreous silica silicon powder that total amount is 4%, accounts for the barium stearate that total amount is 3%, is stirred to react 0.3 hour.
Claims (3)
1. a kind of epoxy-polyamide resin adhesive, produce the raw material that the adhesive uses includes: liquid by weight ratio
Epoxy resin 33%-35%, liquid polyamide 28%-30%, epoxy propane butyl ether 20%, tertiary amine 8%, anti-aging agent 2%, melting
Quartzy silicon powder 4%, barium stearate 3%, it is characterized in that:
(1) liquid-state epoxy resin of formula ratio is sent into chemical reaction kettle, the propylene oxide butyl of formula ratio is added while stirring
Ether, while the temperature in chemical reaction kettle is increased to 50-52 DEG C, the liquid polyamide of formula ratio, stirring is then added
Reaction 1.2-1.3 hours；
(2) it is cooled to room temperature, continues to stir, the tertiary amine, anti-aging agent, vitreous silica silicon powder, barium stearate of formula ratio is added, stirs
Mix reaction 0.2-0.3 hours.
2. a kind of epoxy-polyamide resin adhesive according to claim 1, it is characterized in that: the liquid ring
The purity of oxygen resin is 95%.
3. a kind of epoxy-polyamide resin adhesive according to claim 1, it is characterized in that: the liquid is poly-
The purity of amide resin is 90%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711404060.XA CN109957366A (en) | 2017-12-22 | 2017-12-22 | A kind of epoxy-polyamide resin adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711404060.XA CN109957366A (en) | 2017-12-22 | 2017-12-22 | A kind of epoxy-polyamide resin adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109957366A true CN109957366A (en) | 2019-07-02 |
Family
ID=67019319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711404060.XA Pending CN109957366A (en) | 2017-12-22 | 2017-12-22 | A kind of epoxy-polyamide resin adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109957366A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423563A (en) * | 2019-09-12 | 2019-11-08 | 常州斯威克光伏新材料有限公司 | A kind of wet-heat resisting conductive adhesive film and preparation method thereof |
| CN114479738A (en) * | 2022-03-29 | 2022-05-13 | 上海喆航航空科技有限公司 | Preparation method and use method of body composite material adhesive |
-
2017
- 2017-12-22 CN CN201711404060.XA patent/CN109957366A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423563A (en) * | 2019-09-12 | 2019-11-08 | 常州斯威克光伏新材料有限公司 | A kind of wet-heat resisting conductive adhesive film and preparation method thereof |
| CN114479738A (en) * | 2022-03-29 | 2022-05-13 | 上海喆航航空科技有限公司 | Preparation method and use method of body composite material adhesive |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190702 |
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| WD01 | Invention patent application deemed withdrawn after publication |