CN109948297B - Micro-module temperature field simulation method and device, computer equipment and storage medium - Google Patents
Micro-module temperature field simulation method and device, computer equipment and storage medium Download PDFInfo
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Abstract
The invention relates to a micro-module temperature field simulation method, a device, computer equipment and a storage medium, wherein the method comprises the steps of obtaining micro-module information; simulating an air conditioner arrangement scheme among micro-module columns according to the micro-module information; acquiring micro-module information and machine room information; and simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information. According to the invention, the air conditioner arrangement scheme among the micro-module columns is preliminarily determined according to the micro-module information, parameters are adjusted in real time according to the established three-dimensional model and the CFD calculation simulation process to output a first arrangement scheme meeting the requirements, the three-dimensional model established according to the micro-module information and the machine room information is matched with the CFD calculation simulation process, and the parameters are adjusted in real time according to the analysis result to output a second arrangement scheme meeting the requirements, so that an energy-saving temperature field is simulated, local hot spots or cold spots are scientifically predicted, and a more suitable temperature field arrangement mode is obtained.
Description
Technical Field
The present invention relates to a method for processing data of a micro-module, and more particularly to a method, an apparatus, a computer device and a storage medium for simulating a temperature field of a micro-module.
Background
As shown in fig. 1 and fig. 2, the current micro-module data center is rapidly developed, and the micro-module data center integrates the systems of a rack, an air conditioner, wiring, power distribution, monitoring, illumination and the like of a traditional machine room into a whole, and adopts modularized components and unified interface standards to realize rapid and flexible deployment and later extension of the data center, so that the construction cost can be greatly reduced, the construction and deployment period of the data center can be shortened, and the deployment mobility and flexibility of the data center are enhanced. CFD (computational fluid dynamics ) is an emerging interdisciplinary discipline of fluid mechanics and computer science, which starts with computational methods that utilize the rapid computational power of computers to obtain an approximate solution of the fluid control equation. CFD has emerged in the 60 s of the 20 th century, and with the rapid development of computers after the 90 s, CFD has developed rapidly, and has become an important means in product development along with experimental hydrodynamics. The communication equipment needs to operate in strict environmental protection, and the dependency of the equipment in the IDC machine room on the environment is higher. The machine room air conditioner and the micro-module air conditioner are used for controlling the temperature, humidity, cleanliness, air flow speed and other environmental parameters in the machine room and the micro-module, so that the machine room environment is ensured to meet the requirements of communication equipment, the temperature and the humidity are both carried by air flow, the air flow is the most direct expression form of the machine room air conditioner to the environment, and the machine room air conditioner has good air flow organization, so that the machine room air conditioner not only can save energy, but also can ensure the safe and stable operation of equipment.
The traditional machine room air conditioner design mode is selected to perform load calculation, airflow organization, system design and equipment selection according to relevant regulations, but for whether the number and arrangement of air conditioners among specific micro module rows are reasonable, how the micro module groups are arranged in the machine room can influence heat dissipation, whether local hot spots or cold spots exist can not be predicted scientifically, whether the air conditioner capacity quantity is proper, how the air conditioner capacity quantity is more energy-saving can only be determined through formulas and experience, and a scientific decision can not be made.
Therefore, it is necessary to design a new method to simulate the energy-saving temperature field and scientifically predict the local hot spots or cold spots so as to obtain a more suitable temperature field arrangement mode.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a micro-module temperature field simulation method, a micro-module temperature field simulation device, computer equipment and a storage medium.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the micro-module temperature field simulation method comprises the following steps:
acquiring micro-module information;
simulating an air conditioner arrangement scheme among micro-module columns according to the micro-module information;
acquiring micro-module information and machine room information;
and simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information.
The further technical scheme is as follows: the simulation of the air conditioner arrangement scheme among the micro module columns according to the micro module information comprises the following steps:
simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information to obtain a first arrangement scheme;
establishing a three-dimensional model according to a first arrangement scheme to obtain a first model;
setting parameters of the first model to obtain first initial parameters;
adopting CFD and calculating a simulation process of the first model according to the first initial parameters so as to obtain a first simulation result;
analyzing according to the first simulation result to obtain a first analysis result;
judging whether the first analysis result meets the set condition or not;
if not, adjusting parameters in the inter-column air-conditioning arrangement scheme in the micro module, and returning to the inter-column air-conditioning arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme.
The further technical scheme is as follows: the micro-module information comprises the shape and size of the inter-column air conditioners, the refrigerating capacity of the inter-column air conditioners, the number of the inter-column air conditioners, the arrangement condition of the inter-column air conditioners and the heat dissipation condition of inter-column air conditioner equipment.
The further technical scheme is as follows: the judging whether the first analysis result meets the set condition comprises the following steps:
Judging whether a local hot spot or a cold spot exists in the first analysis result;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the main reference value in the first analysis result is larger than a first threshold value;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the first analysis result is smaller than a second threshold value;
if yes, the first analysis result does not meet the set condition.
The further technical scheme is as follows: the adjusting parameters in the air conditioner arrangement scheme between columns in the micro module comprises the following steps:
and when the first analysis result has local hot spots or cold spots, adjusting the number or the positions of the air conditioners in the inter-column air conditioner arrangement scheme in the micro module, and/or adjusting the relative arrangement mode of the inter-column air conditioners in the inter-column air conditioner arrangement scheme in the micro module into a staggered arrangement mode of the inter-column air conditioners.
The further technical scheme is as follows: the simulation of the arrangement scheme of the micro-modules in the machine room is carried out according to the micro-module information and the machine room information, and the simulation comprises the following steps:
simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information to obtain a second arrangement scheme;
establishing a three-dimensional model according to the second arrangement scheme to obtain a second model;
Setting parameters of the second model to obtain second initial parameters;
adopting CFD and calculating a simulation process of the second model according to the second initial parameters so as to obtain a second simulation result;
analyzing according to the second simulation result to obtain a second analysis result;
judging whether the second analysis result meets the set condition;
if not, adjusting parameters in the micro-module arrangement scheme in the micro-machine room, and returning the micro-module arrangement scheme in the simulation machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme.
The further technical scheme is as follows: the judging whether the second analysis result meets the set condition comprises the following steps:
judging whether a local hot spot or a cold spot exists in the second analysis result;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the main reference value in the second analysis result is larger than a third threshold value;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the second analysis result is smaller than a fourth threshold value;
if yes, the second analysis result does not meet the set condition;
the adjusting parameters in the micro module arrangement scheme in the micro machine room comprises the following steps:
And when the first analysis result has a local hot spot or cold spot, adjusting the number and the positions of the micro modules in the micro module arrangement scheme in the micro machine room.
The invention also provides a micro-module temperature field simulation device, which comprises:
the first information acquisition unit is used for acquiring micro-module information;
the first simulation unit is used for simulating an air conditioner arrangement scheme among the micro module columns according to the micro module information;
the second information acquisition unit is used for acquiring the micro-module information and the machine room information;
and the second simulation unit is used for simulating the arrangement scheme of the micro-modules in the machine room according to the micro-module information and the machine room information.
The invention also provides a computer device which comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the method when executing the computer program.
The present invention also provides a storage medium storing a computer program which, when executed by a processor, performs the above-described method.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the air conditioner arrangement scheme among the micro-module columns is preliminarily determined according to the micro-module information, the simulation process is calculated according to the established three-dimensional model in cooperation with the CFD, and parameters are adjusted in real time according to the analysis result so as to output a first arrangement scheme meeting the requirements, the micro-module arrangement scheme in the machine room is preliminarily determined according to the micro-module information and the machine room information, the simulation process is calculated according to the established three-dimensional model in cooperation with the CFD, and the parameters are adjusted in real time according to the analysis result so as to output a second arrangement scheme meeting the requirements, so that the simulation of an energy-saving temperature field and the scientific prediction of local hot spots or cold spots are realized, and a more suitable temperature field arrangement mode is obtained.
The invention is further described below with reference to the drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a prior art micro-module;
FIG. 2 is a schematic diagram of a prior art micro-module;
fig. 3 is a schematic diagram of an application scenario of a micro-module temperature field simulation method according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart of a method for simulating a temperature field of a micro module according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart of a micro-module temperature field simulation method according to an embodiment of the present invention;
FIG. 6 is a schematic view of a sub-flow of a method for simulating a temperature field of a micro-module according to an embodiment of the present invention;
FIG. 7 is a schematic flow chart of a micro-module temperature field simulation method according to an embodiment of the present invention;
FIG. 8 is a schematic flow chart of a micro-module temperature field simulation method according to an embodiment of the present invention;
Fig. 9 is a schematic diagram of an arrangement scheme of air conditioners between columns in a micro module according to an embodiment of the present invention;
fig. 10 is a schematic diagram of an arrangement scheme of micro-modules in a machine room according to an embodiment of the present invention;
FIG. 11 is a schematic block diagram of a micro-module temperature field simulation device provided by an embodiment of the present invention;
fig. 12 is a schematic block diagram of a computer device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 3 and fig. 4, fig. 3 is a schematic diagram of an application scenario of a micro-module temperature field simulation method according to an embodiment of the present invention. Fig. 4 is a schematic flow chart of a method for simulating a temperature field of a micro module according to an embodiment of the present invention. The micro-module temperature field simulation method is applied to the server. The micro-module temperature field simulation method is applied to the server. The server performs data interaction with the terminal, micro-module information and machine room information are input to the terminal by means of the terminal, the server performs simulation calculation on an inter-column air conditioner arrangement scheme in the micro-module and a micro-module arrangement scheme in the machine room by means of a CFD technology, parameters are adjusted, and the adjusted scheme is output.
Fig. 4 is a flow chart of a method for simulating a temperature field of a micro module according to an embodiment of the present invention. As shown in fig. 4, the method includes the following steps S110 to S140.
S110, acquiring micro-module information.
In this embodiment, the micro-module information includes a shape and a size of the inter-row air conditioner, a cooling capacity of the inter-row air conditioner, the number of the inter-row air conditioners, an arrangement condition of the inter-row air conditioners, and a heat dissipation condition of the inter-row air conditioner.
The micro-module information designed by the designer can be input from the terminal, and the reference can be made to the existing micro-module information.
S120, simulating an air conditioner arrangement scheme among the micro module columns according to the micro module information.
The micro-module inter-column air conditioner arrangement scheme adopts symmetrical position layout, namely the number of inter-column air conditioners is double, or asymmetrical position layout, namely the number of inter-column air conditioners is singular, and the position distribution of an IT cabinet, the power consumption distribution of IT equipment planned to be installed in the cabinet, the single refrigerating capacity and the number of inter-column air conditioners and the like are combined, and the layout positions of the inter-column air conditioners are determined by predicting temperature fields and the distribution of local hot spots/cold spots through different schemes of different layouts of the inter-column air conditioners through three-dimensional modeling and CFD simulation and comparing the efficiency and the effect of a refrigerating system.
In one embodiment, referring to fig. 5, the step S120 may include steps S121 to S128.
S121, simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme.
In the present embodiment, the first arrangement plan refers to a plan formed by inputting initial values according to a design plan preliminarily formed by a designer.
According to the information of the micro-modules and the scheme formed by the preliminary design of the designer, a preliminary air-conditioning arrangement scheme between the inner columns of the micro-modules can be formed.
S122, building a three-dimensional model according to the first arrangement scheme to obtain a first model.
In this embodiment, the first model refers to a three-dimensional model established according to the first arrangement scheme and the flow field information.
For example, referring to fig. 9, when the micro-module information selects the air conditioner refrigeration parameters, heat source data, etc., a local expansion flow field is added during arrangement, and the three-dimensional model is established as shown in fig. 9.
S123, setting parameters of the first model to obtain first initial parameters.
In the present embodiment, the first initial parameter refers to a parameter under a set condition.
Due to the complexity of the computation, some assumptions must be made to simplify the computation process. The simulation process makes the following assumptions: the indoor gas is in a low-speed flowing state, can be regarded as incompressible fluid, and dissipates heat caused by the action of viscous force of the fluid; the flow state is steady-state turbulence; the change in fluid density only affects the buoyancy lift; the wall bodies of the data center are made of homogeneous materials, the heat conductivity coefficient is stable and unchanged, the heat conductivity coefficient of the wall bodies is 0.19W/m < 2 >, the density is 1200kg/m < 3 >, the specific heat capacity is 1500J/kg.K, the surface heat generation rate is 0.92, and the solar reflectance is 0; conductivity was ignored as 0S/m; the air density is constant, specifically 1.29kg/m3, the laminar air flow viscosity is constant, specifically 0.000018kg/ms, the heat conductivity coefficient is constant, specifically 0.026W/mK, and the specific heat capacity is constant, specifically 1005J/kg.K; the volume expansion rate with temperature is 0.0033 l/DEG C; the molar mass was 28.9kg/kmol and the reference pressure was 101.3kPa; irrespective of the traffic relaxation factor; irrespective of humidity effects.
S124, calculating a simulation process of the first model by adopting CFD and according to the first initial parameters so as to obtain a first simulation result.
In this embodiment, the first simulation result refers to a result obtained by performing simulation calculation on the first model of the first initial parameter setting by using specialized CFD software.
S125, analyzing according to the first simulation result to obtain a first analysis result.
In this embodiment, the first analysis result refers to the corresponding index obtained by analysis and calculation on the basis that the relevant specification, namely, class AB machine room, is satisfied, here, the interior of the micro module satisfies 23±1 ℃, and class C machine room satisfies 18 to 28 ℃.
S126, judging whether the first analysis result meets the set condition.
In one embodiment, referring to fig. 6, the step S126 may include steps S1261 to S1265.
S1261, judging whether a local hot spot or a cold spot exists in the first analysis result;
s1262, if yes, the first analysis result does not meet the set condition;
and S1263, if not, judging whether the main reference value in the first analysis result is larger than a first threshold value.
In the present embodiment, the first threshold value is a main reference value PUE close to 1, and the base is 2.
The main reference value PUE (power usage efficiency, power Usage Effectiveness) is an index for evaluating the energy efficiency of the data center, is the ratio of all the energy consumed by the data center to the energy used by IT (information technology ) rack loads, and is the inverse ratio of DCIE (data center infrastructure efficiency ). Where PUE = total equipment energy consumption of data center/IT equipment energy consumption, PUE is a ratio, the benchmark is 2, the closer to 1 the better the energy efficiency level.
The PUE value has become a measure of the efficiency of power usage in internationally popular data centers. The PUE value is the ratio of all energy consumed by the data center to the energy consumed by the IT load. The closer the PUE value is to 1, the higher the degree of greenization of one data center.
The parameters are modified for a plurality of times to obtain a plurality of schemes, the values of the schemes are used for comparison, and the smaller the main reference value PUE is, the better the scheme is.
If yes, return to step S1262;
s1264, if not, judging whether the secondary reference value in the first analysis result is smaller than a second threshold value.
The second threshold value refers to a reference value of the cooling efficiency and the effect EER value, and the higher the cooling efficiency and the effect EER value, the better the scheme.
The parameters are modified a plurality of times to obtain a plurality of schemes, and the values of the schemes are used for comparison, wherein the larger the secondary reference value EER is, the better the scheme is. EER (refrigeration coefficient of performance of air conditioner, energy Efficiency Ratio) is also known as energy efficiency ratio, representing the unit power cooling capacity of the air conditioner. The higher the EER value, the more heat is absorbed by evaporation in the air conditioner or the less electricity is consumed by the compressor, i.e. the less electricity is spent, resulting in a cooler effect.
If yes, return to step S1262;
S1265, if not, the first analysis result meets the set condition;
s127, if not, adjusting parameters in the inter-column air conditioner arrangement scheme in the micro module, and returning to the step S121;
specifically, when the first analysis result has a local hot spot or cold spot, the number or the position of the air conditioners in the inter-column air conditioner arrangement scheme in the micro module is adjusted, and/or the relative arrangement mode of the inter-column air conditioners in the inter-column air conditioner arrangement scheme in the micro module is adjusted to be an staggered arrangement mode of the inter-column air conditioners.
And S128, if yes, outputting a first arrangement scheme.
The first arrangement scheme is output to a terminal for display so that constructors and designers can review in time.
S130, acquiring micro-module information and machine room information.
In this embodiment, the micro-module information includes a shape and a size of the inter-row air conditioner, a cooling capacity of the inter-row air conditioner, the number of the inter-row air conditioners, an arrangement condition of the inter-row air conditioners, and a heat dissipation condition of the inter-row air conditioner.
The machine room information comprises the places, the layer heights, door and window openings, the refrigerating capacity, the quantity, the arrangement position of air outlets, wall heat conduction information and the like of the machine room air conditioner.
And S140, simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information.
The arrangement scheme of the micro-modules in the machine room refers to the scheme that the micro-modules are arranged in the machine room, and the air conditioner of the machine room and the micro-modules are required to control the temperature, humidity, cleanliness, air flow speed and other environmental parameters in the machine room and the micro-modules, so that the environment of the machine room is ensured to meet the requirements of communication equipment. The temperature and the humidity are carried by air flow, and the air flow is the most direct expression form of the machine room air conditioner for environment protection. The good airflow organization can save energy and ensure the safe and stable operation of the equipment.
In one embodiment, referring to fig. 7, the step S140 may include steps S141 to S148.
S141, simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme.
In the present embodiment, the first arrangement plan refers to a plan formed by inputting initial values according to a design plan preliminarily formed by a designer.
According to the micro module information, the machine room information and the scheme formed by the preliminary design of the designer, a preliminary micro module arrangement scheme in the machine room can be formed.
S142, building a three-dimensional model according to the second arrangement scheme to obtain a second model.
In this embodiment, the second model refers to a three-dimensional model established according to the second arrangement scheme and the flow field information.
For example, when the micro-module information selects air conditioning refrigeration parameters, heat source data and the like, the machine room information selects a machine room space as a three-dimensional geometric space; the three-dimensional model formed when the machine room air conditioner is the air conditioner refrigeration parameter is shown in fig. 10.
S143, setting parameters of the second model to obtain second initial parameters.
In the present embodiment, the second initial parameter refers to a parameter under a set condition.
Due to the complexity of the computation, some assumptions must be made to simplify the computation process. The simulation process makes the following assumptions: the indoor gas is in a low-speed flowing state, can be regarded as incompressible fluid, and dissipates heat caused by the action of viscous force of the fluid; the flow state is steady-state turbulence; the change in fluid density only affects the buoyancy lift; the wall bodies of the data center are made of homogeneous materials, the heat conductivity coefficient is stable and unchanged, the heat conductivity coefficient of the wall bodies is 0.19W/m < 2 >, the density is 1200kg/m < 3 >, the specific heat capacity is 1500J/kg.K, the surface heat generation rate is 0.92, and the solar reflectance is 0; conductivity was ignored as 0S/m; the air density is constant, specifically 1.29kg/m3, the laminar air flow viscosity is constant, specifically 0.000018kg/ms, the heat conductivity coefficient is constant, specifically 0.026W/mK, and the specific heat capacity is constant, specifically 1005J/kg.K; the volume expansion rate with temperature is 0.0033 l/DEG C; the molar mass was 28.9kg/kmol and the reference pressure was 101.3kPa; irrespective of the traffic relaxation factor; irrespective of humidity effects.
S144, calculating a simulation process of the second model by adopting CFD and according to the second initial parameters so as to obtain a second simulation result.
In this embodiment, the second simulation result refers to a result obtained by performing simulation calculation on the second model of the second initial parameter setting by using specialized CFD software.
S145, analyzing according to the second simulation result to obtain a second analysis result.
In this embodiment, the second analysis result refers to the corresponding index obtained by analysis and calculation on the basis that the relevant specification, namely, class AB machine room, is satisfied, here, the interior of the micro module satisfies 23±1 ℃, and class C machine room satisfies 18 to 28 ℃.
S146, judging whether the second analysis result meets the set condition.
In one embodiment, referring to fig. 8, the step S146 may include steps S1461 to S1465.
S1461, judging whether a local hot spot or a cold spot exists in the second analysis result;
s1462, if yes, the second analysis result does not meet the set condition;
s1463, if not, judging whether the main reference value in the second analysis result is larger than a third threshold value;
if yes, return to S1462.
In the present embodiment, the third threshold value is a main reference value PUE close to 1, and the base is 2.
The main reference value PUE (power usage efficiency, power Usage Effectiveness) is an index for evaluating the energy efficiency of the data center, is the ratio of all the energy consumed by the data center to the energy used by IT (information technology ) rack loads, and is the inverse ratio of DCIE (data center infrastructure efficiency ). Where PUE = total equipment energy consumption of data center/IT equipment energy consumption, PUE is a ratio, the benchmark is 2, the closer to 1 the better the energy efficiency level.
The PUE value has become a measure of the efficiency of power usage in internationally popular data centers. The PUE value is the ratio of all energy consumed by the data center to the energy consumed by the IT load. The closer the PUE value is to 1, the higher the degree of greenization of one data center.
The parameters are modified for a plurality of times to obtain a plurality of schemes, the values of the schemes are used for comparison, and the smaller the main reference value PUE is, the better the scheme is.
S1464, if not, judging whether the secondary reference value in the second analysis result is smaller than a fourth threshold value;
if yes, return to S1462.
The fourth threshold value refers to a reference value of the cooling efficiency and the effect EER value, and the higher the cooling efficiency and the effect EER value, the better the scheme.
The parameters are modified a plurality of times to obtain a plurality of schemes, and the values of the schemes are used for comparison, wherein the larger the secondary reference value EER is, the better the scheme is. EER (refrigeration coefficient of performance of air conditioner, energy Efficiency Ratio) is also known as energy efficiency ratio, representing the unit power cooling capacity of the air conditioner. The higher the EER value, the more heat is absorbed by evaporation in the air conditioner or the less electricity is consumed by the compressor, i.e. the less electricity is spent, resulting in a cooler effect.
S1465, if not, the second analysis result meets the set condition;
and S147, if not, adjusting parameters in the micro-module arrangement scheme in the micro machine room, and returning to the step S141.
Specifically, when the first analysis result has a local hot spot or cold spot, the number and the positions of the micro modules in the micro module arrangement scheme in the micro machine room are adjusted.
S148, if not, outputting a second arrangement scheme.
And outputting the second arrangement scheme to a terminal for display so as to be convenient for constructors and designers to review in time.
In the initial stage of the design of the micro-module, the CFD (computational fluid dynamics ) simulation technology is used for carrying out dynamic simulation analysis on the heat flow fields in the micro-module and in the machine room environment by combining with the machine room on-site environment conditions, predicting the temperature field distribution, the change trend of the temperature field, the local hot spots or cold spots in the micro-module and in the machine room environment, comprehensively evaluating the refrigerating effect of the row-level air conditioner capacity, the number of main machines and the standby machines and the space position layout of the refrigerating system, selecting whether the closed form is reasonable or not, and the like. The air conditioner comprises a machine room air conditioner and a micro module inter-column air conditioner. The micromodules and the machine room are built into the whole flow field during analysis, as they will interact with each other.
According to the micro-module temperature field simulation method, the micro-module air conditioner arrangement scheme among micro-module columns is preliminarily determined according to the micro-module information, the simulation process is calculated according to the established three-dimensional model in cooperation with CFD, parameters are adjusted in real time according to the analysis result, so that a first arrangement scheme meeting the requirements is output, the micro-module arrangement scheme in the machine room is preliminarily determined according to the micro-module information and the machine room information, the simulation process is calculated according to the established three-dimensional model in cooperation with CFD, the parameters are adjusted in real time according to the analysis result, so that a second arrangement scheme meeting the requirements is output, the effects of simulating an energy-saving temperature field and scientifically predicting local hot spots or cold spots are achieved, and a more suitable temperature field arrangement mode is obtained.
Fig. 11 is a schematic block diagram of a micro-module temperature field simulation apparatus 300 according to an embodiment of the present invention. As shown in fig. 11, the present invention further provides a micro-module temperature field simulation device 300 corresponding to the above micro-module temperature field simulation method. The micro-module temperature field simulation apparatus 300 includes a unit for performing the above-described micro-module temperature field simulation method, and may be configured in a server.
Specifically, referring to fig. 11, the micro-module temperature field simulation apparatus 300 includes:
A first information acquisition unit 301 configured to acquire micro-module information;
the first simulation unit 302 is configured to simulate an air conditioner arrangement scheme between micro module columns according to the micro module information;
a second information obtaining unit 303, configured to obtain micro module information and machine room information;
and the second simulation unit 304 is configured to simulate an arrangement scheme of the micro-modules in the machine room according to the micro-module information and the machine room information.
In an embodiment, the first information obtaining unit 302 includes:
the first arrangement scheme obtaining subunit is used for simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme;
the first modeling subunit is used for building a three-dimensional model according to a first arrangement scheme so as to obtain a first model;
the first setting subunit is used for setting parameters of the first model to obtain first initial parameters;
the first calculating subunit is used for calculating a simulation process of the first model by adopting CFD and according to the first initial parameters so as to obtain a first simulation result;
the first analysis subunit is used for analyzing according to the first simulation result to obtain a first analysis result;
the first judging subunit is used for judging whether the first analysis result meets the set condition or not;
And the first adjusting subunit is used for adjusting parameters in the inter-column air conditioner arrangement scheme in the micro module if not.
In an embodiment, the first determining subunit includes:
the first local judging module is used for judging whether a first analysis result has local hot spots or cold spots; if yes, the first analysis result does not meet the set condition;
the first reference value judging module is used for judging whether the main reference value in the first analysis result is larger than a first threshold value or not if not; if yes, the first analysis result does not meet the set condition;
the second reference value judging module is used for judging whether the secondary reference value in the first analysis result is smaller than a second threshold value or not if not; if yes, the first analysis result does not meet the set condition.
In one embodiment, the second simulation unit 304 includes:
the second arrangement scheme obtaining subunit is used for simulating the arrangement scheme of the micro-modules in the machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme;
the second modeling subunit is used for building a three-dimensional model according to a second arrangement scheme so as to obtain a second model;
the second setting subunit is used for setting parameters of the second model to obtain second initial parameters;
The second calculating subunit is used for calculating a simulation process of the second model by adopting CFD and according to the second initial parameters so as to obtain a second simulation result;
the second analysis subunit is used for analyzing according to the second simulation result to obtain a second analysis result;
a second judging subunit, configured to judge whether the second analysis result meets a set condition;
and the second adjusting subunit is used for adjusting parameters in the micro module arrangement scheme in the micro machine room if not.
In an embodiment, the second judging subunit includes:
the second local judging module is used for judging whether a local hot spot or a cold spot exists in the second analysis result; if yes, the second analysis result does not meet the set condition;
the third reference value judging module is used for judging whether the main reference value in the second analysis result is larger than a third threshold value or not if not; if yes, the second analysis result does not meet the set condition;
a fourth reference value judging module, configured to judge whether the secondary reference value in the second analysis result is smaller than a fourth threshold value if not; if yes, the second analysis result does not meet the set condition.
It should be noted that, as will be clearly understood by those skilled in the art, the specific implementation process of the micro-module temperature field simulation device 300 and each unit may refer to the corresponding description in the foregoing method embodiment, and for convenience and brevity of description, the description is omitted here.
The above-described micro-module temperature field simulation apparatus 300 may be implemented in the form of a computer program that can be run on a computer device as shown in fig. 12.
Referring to fig. 12, fig. 12 is a schematic block diagram of a computer device according to an embodiment of the present application. The computer device 500 may be a server.
With reference to FIG. 12, the computer device 500 includes a processor 502, memory, and a network interface 505 connected by a system bus 501, where the memory may include a non-volatile storage medium 503 and an internal memory 504.
The non-volatile storage medium 503 may store an operating system 5031 and a computer program 5032. The computer program 5032 includes program instructions that, when executed, cause the processor 502 to perform a micro-module temperature field simulation method.
The processor 502 is used to provide computing and control capabilities to support the operation of the overall computer device 500.
The internal memory 504 provides an environment for the execution of a computer program 5032 in the non-volatile storage medium 503, which computer program 5032, when executed by the processor 502, causes the processor 502 to perform a micro-module temperature field simulation method.
The network interface 505 is used for network communication with other devices. Those skilled in the art will appreciate that the architecture shown in fig. 12 is merely a block diagram of a portion of the architecture in connection with the present application and is not intended to limit the computer device 500 to which the present application is applied, and that a particular computer device 500 may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
Wherein the processor 502 is configured to execute a computer program 5032 stored in a memory to implement the steps of:
acquiring micro-module information;
simulating an air conditioner arrangement scheme among micro-module columns according to the micro-module information;
acquiring micro-module information and machine room information;
and simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information.
In one embodiment, the processor 502 performs the following steps when implementing the simulation step of the air conditioning arrangement scheme between micro module columns according to the micro module information:
simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information to obtain a first arrangement scheme;
establishing a three-dimensional model according to a first arrangement scheme to obtain a first model;
setting parameters of the first model to obtain first initial parameters;
adopting CFD and calculating a simulation process of the first model according to the first initial parameters so as to obtain a first simulation result;
analyzing according to the first simulation result to obtain a first analysis result;
judging whether the first analysis result meets the set condition or not;
if not, adjusting parameters in the inter-column air-conditioning arrangement scheme in the micro module, and returning to the inter-column air-conditioning arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme.
The micro-module information comprises the shape and size of the inter-column air conditioner, the refrigerating capacity of the inter-column air conditioner, the quantity of the inter-column air conditioner, the arrangement condition of the inter-column air conditioner and the heat dissipation condition of inter-column air conditioner equipment.
In one embodiment, when the step of determining whether the first analysis result meets the set condition is implemented by the processor 502, the following steps are specifically implemented:
judging whether a local hot spot or a cold spot exists in the first analysis result;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the main reference value in the first analysis result is larger than a first threshold value;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the first analysis result is smaller than a second threshold value;
if yes, the first analysis result does not meet the set condition.
In one embodiment, the processor 502 implements the following steps in the adjustment of parameters in the inter-column air conditioning arrangement scheme in the micro module:
and when the first analysis result has local hot spots or cold spots, adjusting the number or the positions of the air conditioners in the inter-column air conditioner arrangement scheme in the micro module, and/or adjusting the relative arrangement mode of the inter-column air conditioners in the inter-column air conditioner arrangement scheme in the micro module into a staggered arrangement mode of the inter-column air conditioners.
In an embodiment, when implementing the simulation step of the arrangement scheme of the micro modules in the machine room according to the micro module information and the machine room information, the processor 502 specifically implements the following steps:
simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information to obtain a second arrangement scheme;
establishing a three-dimensional model according to the second arrangement scheme to obtain a second model;
setting parameters of the second model to obtain second initial parameters;
adopting CFD and calculating a simulation process of the second model according to the second initial parameters so as to obtain a second simulation result;
analyzing according to the second simulation result to obtain a second analysis result;
judging whether the second analysis result meets the set condition;
if not, adjusting parameters in the micro-module arrangement scheme in the micro-machine room, and returning the micro-module arrangement scheme in the simulation machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme.
In one embodiment, when the step of determining whether the second analysis result meets the set condition is implemented by the processor 502, the following steps are specifically implemented:
judging whether a local hot spot or a cold spot exists in the second analysis result;
If yes, the second analysis result does not meet the set condition;
if not, judging whether the main reference value in the second analysis result is larger than a third threshold value;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the second analysis result is smaller than a fourth threshold value;
if yes, the second analysis result does not meet the set condition.
In one embodiment, the processor 502 implements the following steps when implementing the step of adjusting parameters in the arrangement of the micro modules in the micro machine room:
and when the first analysis result has a local hot spot or cold spot, adjusting the number and the positions of the micro modules in the micro module arrangement scheme in the micro machine room.
It should be appreciated that in embodiments of the present application, the processor 502 may be a central processing unit (Central Processing Unit, CPU), the processor 502 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSPs), application specific integrated circuits (Application Specific Integrated Circuit, ASICs), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. Wherein the general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
Those skilled in the art will appreciate that all or part of the flow in a method embodying the above described embodiments may be accomplished by computer programs instructing the relevant hardware. The computer program comprises program instructions, and the computer program can be stored in a storage medium, which is a computer readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the flow steps of the embodiments of the method described above.
Accordingly, the present invention also provides a storage medium. The storage medium may be a computer readable storage medium. The storage medium stores a computer program which, when executed by a processor, causes the processor to perform the steps of:
acquiring micro-module information;
simulating an air conditioner arrangement scheme among micro-module columns according to the micro-module information;
acquiring micro-module information and machine room information;
and simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information.
In one embodiment, when the processor executes the computer program to implement the simulation step of the inter-micro module row air conditioning arrangement scheme according to the micro module information, the processor specifically implements the following steps:
Simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information to obtain a first arrangement scheme;
establishing a three-dimensional model according to a first arrangement scheme to obtain a first model;
setting parameters of the first model to obtain first initial parameters;
adopting CFD and calculating a simulation process of the first model according to the first initial parameters so as to obtain a first simulation result;
analyzing according to the first simulation result to obtain a first analysis result;
judging whether the first analysis result meets the set condition or not;
if not, adjusting parameters in the inter-column air-conditioning arrangement scheme in the micro module, and returning to the inter-column air-conditioning arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme.
The micro-module information comprises the shape and size of the inter-column air conditioner, the refrigerating capacity of the inter-column air conditioner, the quantity of the inter-column air conditioner, the arrangement condition of the inter-column air conditioner and the heat dissipation condition of inter-column air conditioner equipment.
In one embodiment, when the processor executes the computer program to implement the step of determining whether the first analysis result meets the set condition, the method specifically includes the following steps:
judging whether a local hot spot or a cold spot exists in the first analysis result;
If yes, the first analysis result does not meet the set condition;
if not, judging whether the main reference value in the first analysis result is larger than a first threshold value;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the first analysis result is smaller than a second threshold value;
if yes, the first analysis result does not meet the set condition.
In one embodiment, the processor, when executing the computer program to implement the step of adjusting parameters in the inter-column air conditioning arrangement within the micro module, specifically implements the steps of:
and when the first analysis result has local hot spots or cold spots, adjusting the number or the positions of the air conditioners in the inter-column air conditioner arrangement scheme in the micro module, and/or adjusting the relative arrangement mode of the inter-column air conditioners in the inter-column air conditioner arrangement scheme in the micro module into a staggered arrangement mode of the inter-column air conditioners.
In an embodiment, when the processor executes the computer program to implement the simulation step of the arrangement scheme of the micro modules in the machine room according to the micro module information and the machine room information, the processor specifically implements the following steps:
simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information to obtain a second arrangement scheme;
Establishing a three-dimensional model according to the second arrangement scheme to obtain a second model;
setting parameters of the second model to obtain second initial parameters;
adopting CFD and calculating a simulation process of the second model according to the second initial parameters so as to obtain a second simulation result;
analyzing according to the second simulation result to obtain a second analysis result;
judging whether the second analysis result meets the set condition;
if not, adjusting parameters in the micro-module arrangement scheme in the micro-machine room, and returning the micro-module arrangement scheme in the simulation machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme.
In one embodiment, when the processor executes the computer program to implement the step of determining whether the second analysis result meets the set condition, the method specifically includes the following steps:
judging whether a local hot spot or a cold spot exists in the second analysis result;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the main reference value in the second analysis result is larger than a third threshold value;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the second analysis result is smaller than a fourth threshold value;
If yes, the second analysis result does not meet the set condition.
In one embodiment, when the processor executes the computer program to implement the step of adjusting parameters in the arrangement scheme of the micro modules in the micro machine room, the following steps are specifically implemented:
and when the first analysis result has a local hot spot or cold spot, adjusting the number and the positions of the micro modules in the micro module arrangement scheme in the micro machine room.
The storage medium may be a U-disk, a removable hard disk, a Read-Only Memory (ROM), a magnetic disk, or an optical disk, or other various computer-readable storage media that can store program codes.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps described in connection with the embodiments disclosed herein may be embodied in electronic hardware, in computer software, or in a combination of the two, and that the elements and steps of the examples have been generally described in terms of function in the foregoing description to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of each unit is only one logic function division, and there may be another division manner in actual implementation. For example, multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed.
The steps in the method of the embodiment of the invention can be sequentially adjusted, combined and deleted according to actual needs. The units in the device of the embodiment of the invention can be combined, divided and deleted according to actual needs. In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The integrated unit may be stored in a storage medium if implemented in the form of a software functional unit and sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention is essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a terminal, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (7)
1. The micro-module temperature field simulation method is characterized by comprising the following steps of:
acquiring micro-module information;
simulating an air conditioner arrangement scheme among micro-module columns according to the micro-module information;
acquiring micro-module information and machine room information;
simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information;
the simulation of the air conditioner arrangement scheme among the micro module columns according to the micro module information comprises the following steps:
simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information to obtain a first arrangement scheme;
establishing a three-dimensional model according to a first arrangement scheme to obtain a first model;
setting parameters of the first model to obtain first initial parameters;
adopting CFD and calculating a simulation process of the first model according to the first initial parameters so as to obtain a first simulation result;
Analyzing according to the first simulation result to obtain a first analysis result;
judging whether the first analysis result meets the set condition or not;
if not, adjusting parameters in the inter-column air-conditioning arrangement scheme in the micro module, and returning to the inter-column air-conditioning arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme;
the judging whether the first analysis result meets the set condition comprises the following steps:
judging whether a local hot spot or a cold spot exists in the first analysis result;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the main reference value in the first analysis result is larger than a first threshold value;
if yes, the first analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the first analysis result is smaller than a second threshold value;
if yes, the first analysis result does not meet the set condition;
the adjusting parameters in the air conditioner arrangement scheme between columns in the micro module comprises the following steps:
and when the first analysis result has local hot spots or cold spots, adjusting the number or the positions of the air conditioners in the inter-column air conditioner arrangement scheme in the micro module, and/or adjusting the relative arrangement mode of the inter-column air conditioners in the inter-column air conditioner arrangement scheme in the micro module into a staggered arrangement mode of the inter-column air conditioners.
2. The method for simulating a temperature field of a micro-module according to claim 1, wherein the micro-module information includes a shape and a size of an inter-column air conditioner, a cooling capacity of the inter-column air conditioner, a number of the inter-column air conditioners, an arrangement condition of the inter-column air conditioners, and a heat dissipation condition of the inter-column air conditioner.
3. The method for simulating a temperature field of a micro module according to claim 1, wherein the simulating an arrangement of micro modules in a machine room according to the micro module information and the machine room information comprises:
simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information to obtain a second arrangement scheme;
establishing a three-dimensional model according to the second arrangement scheme to obtain a second model;
setting parameters of the second model to obtain second initial parameters;
adopting CFD and calculating a simulation process of the second model according to the second initial parameters so as to obtain a second simulation result;
analyzing according to the second simulation result to obtain a second analysis result;
judging whether the second analysis result meets the set condition;
if not, adjusting parameters in the micro-module arrangement scheme in the micro-machine room, and returning the micro-module arrangement scheme in the simulation machine room according to the micro-module information and the machine room information so as to obtain a second arrangement scheme.
4. The method for simulating a temperature field of a micro-module according to claim 3, wherein determining whether the second analysis result satisfies a set condition comprises:
judging whether a local hot spot or a cold spot exists in the second analysis result;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the main reference value in the second analysis result is larger than a third threshold value;
if yes, the second analysis result does not meet the set condition;
if not, judging whether the secondary reference value in the second analysis result is smaller than a fourth threshold value;
if yes, the second analysis result does not meet the set condition;
the adjusting parameters in the micro module arrangement scheme in the micro machine room comprises the following steps:
and when the first analysis result has a local hot spot or cold spot, adjusting the number and the positions of the micro modules in the micro module arrangement scheme in the micro machine room.
5. Micro-module temperature field analogue means, its characterized in that includes:
the first information acquisition unit is used for acquiring micro-module information;
the first simulation unit is used for simulating an air conditioner arrangement scheme among the micro module columns according to the micro module information;
the second information acquisition unit is used for acquiring the micro-module information and the machine room information;
The second simulation unit is used for simulating a micro-module arrangement scheme in the machine room according to the micro-module information and the machine room information;
the first information acquisition unit includes:
the first arrangement scheme obtaining subunit is used for simulating an inter-column air conditioner arrangement scheme in the micro module according to the micro module information so as to obtain a first arrangement scheme;
the first modeling subunit is used for building a three-dimensional model according to a first arrangement scheme so as to obtain a first model;
the first setting subunit is used for setting parameters of the first model to obtain first initial parameters;
the first calculating subunit is used for calculating a simulation process of the first model by adopting CFD and according to the first initial parameters so as to obtain a first simulation result;
the first analysis subunit is used for analyzing according to the first simulation result to obtain a first analysis result;
the first judging subunit is used for judging whether the first analysis result meets the set condition or not;
the first adjusting subunit is used for adjusting parameters in the inter-column air conditioner arrangement scheme in the micro module if not;
the first judgment subunit includes:
the first local judging module is used for judging whether a first analysis result has local hot spots or cold spots; if yes, the first analysis result does not meet the set condition;
The first reference value judging module is used for judging whether the main reference value in the first analysis result is larger than a first threshold value or not if not; if yes, the first analysis result does not meet the set condition;
the second reference value judging module is used for judging whether the secondary reference value in the first analysis result is smaller than a second threshold value or not if not; if yes, the first analysis result does not meet the set condition.
6. A computer device, characterized in that it comprises a memory on which a computer program is stored and a processor which, when executing the computer program, implements the method according to any of claims 1-4.
7. A storage medium storing a computer program which, when executed by a processor, performs the method of any one of claims 1-4.
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| CN110765518A (en) * | 2019-09-30 | 2020-02-07 | 万翼科技有限公司 | Indoor environment simulation method and related equipment |
| CN110967125B (en) * | 2019-12-26 | 2021-02-12 | 哈尔滨雷士丹电气科技有限公司 | Data machine room temperature distribution detection method and detection system thereof |
| CN111859615A (en) * | 2020-06-12 | 2020-10-30 | 菲尼克斯(上海)环境控制技术有限公司 | Micro-module data center air conditioner design method based on CFD simulation |
| CN113835460B (en) * | 2021-11-23 | 2022-05-03 | 中铁建设集团有限公司 | Data computer lab intelligence environmental control system based on hydrodynamics analog digital twin |
| CN115551317B (en) * | 2022-10-24 | 2023-12-12 | 南京群顶科技股份有限公司 | Load prediction method for data machine room operation control based on weather forecast |
| CN115700334A (en) * | 2022-10-31 | 2023-02-07 | 国联江森自控绿色科技(无锡)有限公司 | Efficient machine room heating and ventilation equipment management system and method based on Internet of things |
| CN116911015B (en) * | 2023-07-14 | 2024-02-06 | 广州唐邦信息科技有限公司 | Micro-module machine room design and management method |
| CN117412555A (en) * | 2023-10-13 | 2024-01-16 | 晋永源科技(深圳)有限公司 | Air conditioner temperature control system of data center computer lab |
| CN117493821B (en) * | 2024-01-03 | 2024-05-10 | 深圳市博控科技有限公司 | Method and system for monitoring environment of micro-module machine room |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106502125A (en) * | 2016-12-20 | 2017-03-15 | 浪潮通信信息系统有限公司 | A kind of machine room efficiency optimisation technique linked based on data simulation and rotating ring |
| CN107133286A (en) * | 2017-04-18 | 2017-09-05 | 浙江中烟工业有限责任公司 | A kind of three-dimensional map generalization of computer room temperature parameter distribution and analysis method and system |
| CN107506516A (en) * | 2017-07-03 | 2017-12-22 | 华中科技大学 | A kind of communications equipment room flow field model is established and analysis method and system |
| CN107632524A (en) * | 2017-10-25 | 2018-01-26 | 华中科技大学 | A kind of communication machine room temperature model predictive control method and system |
-
2019
- 2019-04-09 CN CN201910282068.6A patent/CN109948297B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106502125A (en) * | 2016-12-20 | 2017-03-15 | 浪潮通信信息系统有限公司 | A kind of machine room efficiency optimisation technique linked based on data simulation and rotating ring |
| CN107133286A (en) * | 2017-04-18 | 2017-09-05 | 浙江中烟工业有限责任公司 | A kind of three-dimensional map generalization of computer room temperature parameter distribution and analysis method and system |
| CN107506516A (en) * | 2017-07-03 | 2017-12-22 | 华中科技大学 | A kind of communications equipment room flow field model is established and analysis method and system |
| CN107632524A (en) * | 2017-10-25 | 2018-01-26 | 华中科技大学 | A kind of communication machine room temperature model predictive control method and system |
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