CN109930021A - A kind of copper-based silicon dioxide composite material and preparation method thereof - Google Patents

A kind of copper-based silicon dioxide composite material and preparation method thereof Download PDF

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CN109930021A
CN109930021A CN201711376253.9A CN201711376253A CN109930021A CN 109930021 A CN109930021 A CN 109930021A CN 201711376253 A CN201711376253 A CN 201711376253A CN 109930021 A CN109930021 A CN 109930021A
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copper
composite material
silicon dioxide
dioxide composite
based silicon
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CN109930021B (en
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刘冬梅
王强松
刘芳
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GRIMN Engineering Technology Research Institute Co Ltd
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Beijing General Research Institute for Non Ferrous Metals
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Abstract

The present invention relates to a kind of copper-based silicon dioxide composite materials and preparation method thereof, belong to metal material and its preparation technical field.The mass percentage composition of the composite material are as follows: tin: 0.5~10%, graphite: 10~25%, silica: 2~8%, nano silica: 0~2%, surplus is copper.Preparation step are as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product.Cu-base composites tensile strength prepared by the present invention is higher than 300MPa, and yield strength is suitable with common copper-based Al 2 O 3 composition, and wear rate is lower than 1 × 10‑9cm3·J‑1, for heat-resistance coefficient higher than 35000, heat resistance and wear-resisting property are more preferable than copper-based Al 2 O 3 composition, therefore the wear part of material production can meet the needs of product or equipment work normally for a long time under higher temperature conditions.

Description

A kind of copper-based silicon dioxide composite material and preparation method thereof
Technical field
The present invention relates to a kind of copper-based silicon dioxide composite materials and preparation method thereof, in particular to a kind of to rub in high temperature height The alloy and preparation method thereof used under environment is wiped, metal material and its preparation technical field are belonged to.
Background technique
Cu-base composites are used as aircraft, automobile, steamer and engineering machine due to its good wearability, thermal conductivity etc. The brake of tool etc. and brake apparatus are widely used in the high-tech sectors such as electromechanics, aerospace, microelectronics.Both at home and abroad to being applied under high temperature Cu-base composites research it is long-standing, and formd copper-base composite oxidate, carbide, boride and nitride etc. Industrialize series of products.
As equipment is to high speed, overload direction development, wearability and heat resistance to copper base friction material propose higher It is required that.The result of study of Cu-base composites shows: using nanometer Al2O3, nanometer ZrO2Equal nano-scale oxides increase as disperse The copper-based nano composite material mutually prepared by force forms the hard of Dispersed precipitate using particle enhancing technology in soft tough Cu matrix Particle improves intensity, the wearability of material, while being able to maintain copper itself high thermal conductivity, improves softening properties resistant to high temperatures, Achieve the effect that conductive and intensity, wear-resisting property are comprehensive to improve, has the advantages that other intensifying methods are incomparable.Therefore, will Nanometer oxide material is applied to copper-based wear-resistant material, provides new way to improve the tribological property of wear-resistant material.
According to data at home and abroad, studying at present more is Cu/Al2O3Composite material.Nano-meter SiO_22(n-SiO2) due to it Special structure and there is the characteristics such as light weight, wear-resisting, high temperature resistant, corrosion-resistant and thermal expansion coefficient be small, thermally conductive, electric conductivity Although being declined, higher level is remained at, and its price is only nanometer Al2O3Half.However, due to n- SiO2Easily reunite, be not easy in Copper substrate evenly dispersed, leads to the SiO prepared2Enhance Cu-base composites performance and Cu/ Al2O3Composite material is compared to having no advantage, therefore by n-SiO2It is not much and sees for the research of Copper substrate as reinforced phase.
In recent years, Cu-base composites are increasingly used in every field as wear part.Therefore, it develops A kind of copper-based silicon dioxide composite material with higher-strength, high-wearing feature, low cost used under high temperature environment, is allowed to Applied to the manufacture of the fields such as aerospace, automobile hot environment brake parts, raising product quality and equipment are used There is great meaning in service life etc..
Summary of the invention
First problem to be solved by this invention is to provide a kind of with excellent mechanical performance, antiwear heat resisting performance, height Conductive, low-density copper-based silicon dioxide composite material, is allowed to for industry fields such as aerospace, vehicular traffic, microelectronics.
Second Problem to be solved by this invention, which is to provide, a kind of has excellent mechanical performance, antiwear heat resisting performance, low The preparation method of density, highly conductive copper-based silicon dioxide composite material.
To achieve the goals above, the invention adopts the following technical scheme:
A kind of copper-based silicon dioxide composite material, i.e., a kind of nano silica enhance Cu-base composites, quality hundred Divide than composition are as follows: tin: 0.5~10%, graphite: 10~25%, silica: 2~8%, nano silica: 0~2%, it is remaining Amount is copper.
Preferably, the mass percentage composition of above-mentioned Cu-base composites are as follows: tin: 1~5%, graphite: 17~20%, two Silica: 3~6%, nano silica: 0.3~1.5%, surplus is copper.
Wherein, mass percent≤0.1% of inevitable impurity.
Role is as follows in the composite for the above components element:
Graphite: graphite has the function of improving Cu-base composites greasy property, especially high temperature lubrication property, but graphite Matter is soft, so excessive addition can reduce the mechanical property of composite material.
Tin: on the one hand, tin can accelerate matrix densification process;On the other hand, tin cooperates with lubrication with excellent with graphite Effect, the antifriction performance of medium Copper-Graphite Composite can be greatly improved in Jia Xi, while the collaboration lubricating action of tin and graphite exists most Good cooperation, we are experiments have shown that Sn/ graphite quality ratio in 0.5~30 range, can obtain preferable collaboration lubricating action.
Silica: have the function of improving wearability, hardness and anti stick to Cu-base composites.
Nano silica: n-SiO2The high temperature resistance and wear-resisting property of Cu-base composites can be improved, simultaneously because Its nano effect can effectively hinder dislocation motion and Grain Boundary Sliding, have the function of significantly improving matrix strength;On the other hand, n- SiO2With SiO2The consistency of composite material can be improved in coupling.
Inventive silica enhances the preparation method of Cu-base composites, mainly includes raw material mixing, cold-press moulding, most The technique of pressure sintering afterwards, specific steps include: the preparation method of copper-based silicon dioxide composite material, include the following steps: to match Than weighing powder, by copper powder and nano silica the mixed powder ball milling in planetary high-energy ball mill in advance, later by it with Other all raw materials are placed in small-sized V-type batch mixer together and are uniformly mixed, and powder is then pressed into briquet in punching block;Finally Green compact is sintered in bell-type furnace.
In the present invention, with cathode copper, atomization tin powder, flake natural graphite, micron silica and nanometer titanium dioxide Silicon is raw material.The quality of used raw material is as follows: electrolytic copper powder average particle size≤74 μm, purity >=99.9wt%;Atomized tin The average particle size of powder is 40~50 μm, purity >=98wt%;Flake natural graphite average particle size is 140~160 μm, purity >= 99wt%;Micron order SiO2Average particle size is 40~50 μm, moisture content≤1wt%;Nano-meter SiO_22Average grain diameter be 20~ 40nm。
Firstly, by copper powder and nano silica in planetary high-energy ball mill 2~4h of ball milling, then with other raw materials 3~5h is remixed in V-type batch mixer together;The density for being pressed into briquet is 4~5g/cm3;Green compact is sintered in bell-type furnace When, sintering pressure is 1.0~4.0MPa, and sintering temperature is 800~1000 DEG C, and average heating rate is 4~7 DEG C/min, is being burnt Hydrogen reduction protective atmosphere is used during knot, sintering time is 20~40min, and finally furnace is cooled under protective atmosphere Finished product is made in room temperature.
300~500MPa of tensile strength of the copper-based silicon dioxide composite material of the present invention, yield strength is 200~ 300MPa, elongation are 5~15%, and dynamic friction coefficient is 0.054~0.080, confficient of static friction 0.12~0.15, wear rate 0.3~1.0 × 10-9cm3·J-1, heat-resistance coefficient 35000~50000, opposite heat resistance 1.0~1.5,5.5~8g of density cm3, resistivity 1.8~2.8 × 10-8Ω m, 50~85Hv of hardness.Compared with copper-based Al 2 O 3 composition, the present invention The tensile mechanical properties of prepared copper-based silicon dioxide composite material are suitable, and heating conduction, wear-resisting property are preferable, while at This is lower.
Compared with prior art, advantages of the present invention are as follows:
(1) present invention improves the mechanical property, wear-resisting of alloy by addition micron silica, nanomorphic silica Performance and heat resistance;Wear-resisting property can be improved in the addition of tin, accelerates matrix densification process;Graphite particle can be to Copper substrate Dispersion-strengtherning is played, and graphite has self-lubricating function and good heat resistance, improves the hardness of Copper substrate.Free state Hard nanometer particle is being can be distributed in friction process between friction pair, is played " ball effect ", is reduced friction factor and abrasion Rate.Work as n-SiO2Particle is distributed evenly in the matrix of copper base friction material, can effectively hinder dislocation motion and crystal boundary sliding It moves, improves the intensity and heat resistance of matrix.Copper-based silicon dioxide composite material designed by the present invention has good processability Can, compared with copper-based Al 2 O 3 composition, heat-resisting and wearability is more preferable.
(2) present invention keeps nano silica evenly dispersed in Copper substrate by preparatory high-energy ball milling, and it is multiple to reach raising The purpose of condensation material comprehensive performance.
(3) the copper-based silicon dioxide composite material prepared by the present invention, cost are lower.
Specific embodiment
Below in conjunction with example, present invention is further described in detail.
The preparation method of the copper-based silicon dioxide composite material of the present invention, preparation step are as follows: ingredient-high-energy ball milling-is mixed Material-cold moudling-pressure sintering-finished product.Its specific process step includes:
(1) high-energy ball milling: by load weighted electrolytic copper powder (average particle size≤74 μm, purity >=99.9wt%), nanoscale SiO2(average grain diameter is 20~40nm) is placed in planetary high-energy ball mill 2~4h of preparatory ball milling.
(2) raw material mixes: by copper-Nano-meter SiO_2 after ball milling2Mixed powder, atomization tin powder (average particle size be 40~50 μm, Purity >=98wt%), flake natural graphite (average particle size be 140~160 μm, purity >=99wt%), micron order SiO2It is (flat Equal granularity is 40~50 μm, moisture content≤1wt%) it is placed in 3~5h of mixing in small-sized V-type batch mixer;Employed in embodiment The quality of raw material is same as above.
(2) cold-press moulding: it is 4~5g/cm that powder, which is pressed into density, in the punching block of Ф 26mm × 6.5mm3Briquet;
(3) pressure sintering: green compact is sintered under 1.0~4.0MPa pressure in bell-type furnace, sintering temperature be 800~ 1000 DEG C, average heating rate is 4~7 DEG C/min, uses hydrogen reduction protective atmosphere during the sintering process, and sintering time is 20~40min, furnace is cooled to room temperature under last protective atmosphere, and finished product is made.
Embodiment 1
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 3h is placed in small-sized V-type batch mixer with other raw materials mixes 3h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 1.0MPa pressure in bell-type furnace, sintering temperature is 980 DEG C, is put down Equal heating rate is 6 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 40min is finally being protected Furnace is cooled to room temperature under property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 2
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 2h is placed in small-sized V-type batch mixer with other raw materials mixes 5h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 2.5MPa pressure in bell-type furnace, sintering temperature is 900 DEG C, is put down Equal heating rate is 5 DEG C/min, uses hydrogen reduction protective atmosphere during the sintering process, and sintering time 35min finally exists Furnace is cooled to room temperature under protective atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 3
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 4h is placed in small-sized V-type batch mixer with other raw materials mixes 5h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 3.5MPa pressure in bell-type furnace, sintering temperature is 800 DEG C, is put down Equal heating rate is 5 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 40min is finally being protected Furnace is cooled to room temperature under property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 4
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 3h is placed in small-sized V-type batch mixer with other raw materials mixes 3h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 2.0MPa pressure in bell-type furnace, sintering temperature is 850 DEG C, is put down Equal heating rate is 6 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 30min is finally being protected Furnace is cooled to room temperature under property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 5
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 3h is placed in small-sized V-type batch mixer with other raw materials mixes 4h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 3.0MPa pressure in bell-type furnace, sintering temperature is 950 DEG C, is put down Equal heating rate is 6 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 35min is finally being protected Furnace is cooled to room temperature under property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 6
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 3h is placed in small-sized V-type batch mixer with other raw materials mixes 3h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 1.0MPa pressure in bell-type furnace, sintering temperature is 1000 DEG C, Average heating rate is 4 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 25min is finally being protected Furnace is cooled to room temperature under shield property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
Embodiment 7
Its technological process of production method is as follows: ingredient-ball milling-mixing-cold moudling-pressure sintering-finished product
Detailed process are as follows: by ingredient composition shown in table 1, by copper and Nano-meter SiO_22Mixed powder ball milling in high energy ball mill 3h is placed in small-sized V-type batch mixer with other raw materials mixes 3h later;?Punching block in powder is suppressed It is 4~5g/cm at density3Briquet;Green compact is sintered under 4.0MPa pressure in bell-type furnace, sintering temperature is 800 DEG C, is put down Equal heating rate is 7 DEG C/min, uses restitutive protection's atmosphere during the sintering process, and sintering time 40min is finally being protected Furnace is cooled to room temperature under property atmosphere, and finished product is made.Prepared end properties is as shown in table 2.
A kind of copper-based silicon dioxide composite material of table 1 at being grouped as (wt.%)
The performance of table 2 embodiment and common Cu-base composites
The present invention finally improves alloy by addition tin, graphite, micron silica and nanometer grade silica Comprehensive mechanical property, wear-resisting and heat resistance, while guaranteeing that alloy has good processing performance;Pass through the side of powder metallurgy Method finally can get copper-based dioxide composite silicon materials.
As shown in table 2, the Cu-base composites tensile strength prepared by the present invention is higher than 300MPa, yield strength and common Copper-based compound aluminum oxide material it is suitable, wear rate be lower than 1.6 × 10-9cm3·J-1, heat-resistance coefficient is higher than 27900, resistance Rate is lower than 3.2 × 10-8cm3·J-1, density is lower than 8gcm3, heat resistance and wear-resisting property are than copper-based aluminum oxide composite wood Material is more preferable, therefore the wear part of material production can meet what product or equipment worked normally for a long time under higher temperature conditions Demand.
The present invention includes but is not limited to above embodiments, it is all carried out under the spirit and principles in the present invention it is any etc. With replacement or local improvement, all will be regarded as within protection scope of the present invention.

Claims (9)

1. a kind of copper-based silicon dioxide composite material, it is characterised in that: its mass percentage composition are as follows: tin: 0.5~10%, stone Ink: 10~25%, silica: 2~8%, nano silica: 0~2%, surplus is copper.
2. copper-based silicon dioxide composite material according to claim 1, it is characterised in that: the quality hundred of the composite material Divide than composition are as follows: tin: 1~5%, graphite: 17~20%, silica: 3~6%, nano silica: 0.3~1.5%, it is remaining Amount is copper.
3. copper-based silicon dioxide composite material according to claim 2, it is characterised in that: the composite material also includes miscellaneous Matter, mass percent≤0.1% of impurity.
4. the preparation method of copper-based silicon dioxide composite material according to any one of claim 1-3, including walk as follows Rapid: proportion weighs powder, by copper powder and the mixed powder of the nano silica ball milling in planetary high-energy ball mill in advance, then It is placed in V-type batch mixer and is uniformly mixed together with other raw materials, powder is then pressed into briquet in punching block;Finally by green compact It is sintered in bell-type furnace.
5. the preparation method of copper-based silicon dioxide composite material according to claim 4, it is characterised in that: the raw material of use For cathode copper, atomization tin powder, flake natural graphite, micron silica and nano silica.
6. the preparation method of copper-based silicon dioxide composite material according to claim 5, it is characterised in that: electrolytic copper powder is flat Equal granularity≤74 μm, purity >=99.9wt%;The average particle size of atomization tin powder is 40~50 μm, purity >=98wt%;Flakey Natural graphite average particle size is 140~160 μm, purity >=99wt%;Micron order SiO2Average particle size is 40~50 μm, and moisture contains Amount≤1wt%;Nano-meter SiO_22Average grain diameter is 20~40nm.
7. the preparation method of copper-based silicon dioxide composite material according to claim 4, it is characterised in that: copper powder and nanometer Ball-milling Time of the silica in planetary high-energy ball mill is 2~4h, mixed in V-type batch mixer together with other raw materials The conjunction time is 3~5h.
8. the preparation method of copper-based silicon dioxide composite material according to claim 4, it is characterised in that: the briquet Density is 4~5g/cm3
9. the preparation method of copper-based silicon dioxide composite material according to claim 4, it is characterised in that: by green compact in clock When being sintered in cover furnace, sintering pressure is 1.0~4.0MPa, and sintering temperature is 800~1000 DEG C, and average heating rate is 4~7 DEG C/min, hydrogen reduction protective atmosphere is used during the sintering process, and sintering time is 20~40min, finally in protectiveness gas Furnace is cooled to room temperature under atmosphere.
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