CN109919287B - Smart card with built-in metal foil pattern - Google Patents
Smart card with built-in metal foil pattern Download PDFInfo
- Publication number
- CN109919287B CN109919287B CN201910103120.7A CN201910103120A CN109919287B CN 109919287 B CN109919287 B CN 109919287B CN 201910103120 A CN201910103120 A CN 201910103120A CN 109919287 B CN109919287 B CN 109919287B
- Authority
- CN
- China
- Prior art keywords
- layer
- metal foil
- printing substrate
- substrate layer
- smart card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses an intelligent card with a built-in metal foil pattern, which comprises a chip module, a hot melt adhesive layer, an upper adhesive film layer, a metal foil pattern layer, an upper printing substrate layer, an element layer, a lower printing substrate layer and a lower adhesive film layer which are sequentially stacked. In addition, the preparation method of the intelligent card comprises the steps of preparing an upper printing substrate layer, preparing a metal foil pattern layer, preparing an element layer, preparing a lower printing substrate layer, preparing a card body and forming the intelligent card. The patterns of the product prepared by the invention cannot be worn or scratched, and the smart card has a firm integral structure, is flat and smooth, has fine lines, is extremely beautiful, is not easy to be imitated and has high safety; in addition, the preparation method has high efficiency and low preparation cost.
Description
Technical Field
The invention belongs to the field of smart cards, and particularly relates to a smart card with a built-in metal foil pattern.
Background
With the popularization of smart card technology, various magnetic cards and IC cards are widely applied to various fields such as schools, public transportation, social security, finance and the like. Along with the popularization and use of the smart card, people need the smart card to be printed with patterns to facilitate identification, but the problems of high manufacturing cost, wear resistance or unattractive appearance of the surface patterns of the existing smart card occur.
The metal pattern of smart card among the prior art can only be realized through the mode of high temperature thermoprint on card body surface, and the expensive mould of high temperature thermoprint needs customization, and the cost is higher, requires highly to equipment, can only scald little icon, slight characters etc. moreover, can't produce the pattern of large-scale pattern and high accuracy thin line, simultaneously because the thermoprint is on the surface, the phenomenon of scraping flower appears wearing and tearing easily. The patterns are fine, the appearance is not aesthetic, and the application and collection of the patterns are limited.
Disclosure of Invention
Aiming at the defects of the prior art. The invention provides a smart card with a built-in metal foil pattern. The pattern of the smart card cannot be abraded or scratched, the manufacturing cost is low, and the smart card is suitable for industrial mass production and manufacturing.
In addition, the invention also provides a preparation method of the smart card with the built-in metal foil pattern.
The utility model provides a smart card with built-in metal foil pattern, includes chip module, hot melt adhesive layer, rubberizing rete, metal foil pattern layer, last printing substrate layer, component layer, lower printing substrate layer and the lower gluey rete that stacks gradually the setting.
The chip module (provided by huada semiconductor limited) is mainly used for storing data information of the smart card; the hot melt adhesive layer is used for fixing the chip module; the gluing film layer is used for protecting the metal foil pattern layer and the upper printing substrate layer; the upper printing substrate layer is mainly used for printing surface patterns of the smart card, and the element layer and the chip module form a closed loop to perform information interaction induction with the outside. The lower printing substrate layer is mainly used for printing pattern information on the back of the smart card; the lower adhesive film is mainly used for protecting the lower printing substrate layer and can be provided with a magnetic strip.
Preferably, the metal foil used in the metal foil pattern layer is one or more selected from gold, silver and copper.
The melting temperature of the hot melt adhesive layer is 140-170 ℃, and the hot melt adhesive is the hot melt adhesive provided by HK150, HK190 or HK180 provided by the company Limited in the industry of containing China, or the hot melt adhesive provided by WJAF-01 or D860 provided by the company Limited in science and technology of Tianjin Jingoland.
The upper adhesive film layer and the lower adhesive film layer are transparent PVC adhesive tape films provided by Jiangsu Huaxin New materials GmbH.
Preferably, the lower adhesive film layer contains a magnetic strip.
The chip module has the size of 12-14mm (preferably 12.8mm) in length, 10-12mm (preferably 11.6mm) in width and 0.5-0.6mm (preferably 0.54mm) in thickness; the size of the smart card is 82-86mm (preferably 85.47-85.72mm), the width is 51-56mm (preferably 53.92-54.03mm), and the thickness is 0.78-2mm (preferably 0.78-0.86 mm).
The thickness of the hot melt adhesive layer is 0.01-0.05mm (preferably 0.03mm), the thickness of the upper adhesive film layer and the lower adhesive film layer are both 0.05-0.1mm (preferably 0.08mm), the thickness of the metal foil pattern layer is 0.01-0.05mm (preferably 0.04mm), the thickness of the upper printing substrate layer is 0.01-0.02mm (preferably 0.17mm), the thickness of the element layer is 0.3-0.4mm (preferably 0.37mm), and the thickness of the lower printing substrate layer is 0.01-0.02mm (preferably 0.17 mm).
A method for preparing a smart card with a built-in metal foil pattern comprises the following steps:
(1) preparation of the upper printing substrate layer: printing patterns on the surface of a PVC sheet or a paper sheet to form an upper printing substrate layer, printing in an offset printing mode according to the required patterns, and then silk-screen printing UV adhesive on the surface of the upper printing substrate layer (the silk-screen printing UV adhesive is a conventional silk-screen printing technology, the UV adhesive is provided by Shenzhen Shenxin special adhesive Limited company, and the model is DX06), wherein silk-screen printing plate making is required according to the shapes of the patterns during the silk-screen printing UV adhesive (the silk-screen printing UV adhesive forms the patterns finally required by the smart card, so that the area in which the UV adhesive is silk-screen printed is called a pattern area, and the area without the silk-screen printing UV adhesive is called a non-pattern area for standby;
(2) preparing a metal foil pattern layer: sticking the metal foil on the surface of the upper printing substrate layer treated in the step (1) through an unreeling and reeling device (the unreeling and reeling device is auxiliary equipment of a silk screen printing machine, the silk screen printing machine is provided by Gaofukou technology, Inc., Shenzhen), curing the UV adhesive of the upper printing substrate layer through a UV curing device (the UV curing device is a common UV curing device in the market), and stripping off the metal foil in the non-pattern area on the upper printing substrate layer (the pattern area is connected with the metal foil through the UV adhesive, and the non-pattern area does not have the UV adhesive, so the metal foil in the non-pattern area is relatively easy to remove) through a stripping device (the stripping device is auxiliary equipment of the silk screen printing machine, and the silk screen printing machine is provided by Gaofukou technology, Inc., in Shenzhen) for standby;
(3) preparation of element layer: embedding a copper wire into a PVC sheet in a coil form by using high-frequency vibration equipment (the high-frequency vibration equipment is a line burying machine and is provided by Beijing Dexin spring Internet of things science and technology Co., Ltd., and the frequency of the high-frequency vibration equipment in the working process is 65000 and 75000HZ), covering the PVC sheet on the surface of the copper wire, and then laminating the two PVC sheets for later use;
(4) preparation of the lower printed substrate layer: printing patterns on a PVC sheet or a paper sheet to form a lower printing substrate layer for later use;
(5) preparing a card body: covering a glue film layer on the metal foil pattern layer processed in the step (2), covering a lower glue film layer on the surface of the lower printing substrate layer formed in the step (4), binding the glue film layer, the metal foil layer, the upper printing substrate layer, the element layer, the lower printing substrate layer and the lower glue film layer (binding is used for preventing the materials from falling off and shifting in the laminating process), hot-pressing the bound materials for 5-40 minutes (preferably 15-30 minutes) at the temperature of 120-155 ℃ (preferably 140-150 ℃) and under the pressure of 1MPa-8MPa (preferably 2.5MPa-7MPa), and then cold-pressing for 15-20 minutes at the temperature of 5-25 ℃ and under the pressure of 7MPa-8.5MPa to obtain a card body;
(6) forming the smart card: and (4) punching the card body prepared in the step (5) into a standard card size, coating a hot melt adhesive layer on the upper adhesive film layer, and attaching a chip module on the hot melt adhesive layer to obtain the intelligent card with the built-in metal foil patterns.
The pattern comprises graphics or text, or a combination of graphics and text.
In the step (1), the manufactured silk-screen plate is loaded on a silk-screen printing machine, and the UV adhesive is silk-screen printed on the upper printing substrate layer, so that the patterns of the UV adhesive which are silk-screen better coincide with the patterns in the actual smart card. In the step (1), the thickness of the screen printing UV adhesive on the surface of the upper printing substrate layer is 0.01-0.03mm (preferably 0.02 mm).
In the step (2), the metal foil is adhered to the upper printing substrate layer through the UV adhesive of the silk screen printing.
In the step (3), the specific preparation process of the element layer is as follows: adopts a PVC (polyvinyl chloride) sheet of 0.15-0.19mm (preferably 0.17mm) of Jiangsu Huaxin New Material Co, embedding a metal copper wire in a sheet by high-frequency vibration equipment (the high-frequency vibration equipment is an embedding machine and is provided by Beijing Dexin spring Internet of things science and technology Co., Ltd., and the frequency of the high-frequency vibration equipment in the working process is 65000 and 75000HZ), then covering a layer of PVC sheet with the thickness of 0.15-0.19mm (preferably 0.17mm), binding at the temperature of 140 and 180 ℃ (the binding time is 1-3 seconds), and then pressing, the pressing comprises hot pressing and cold pressing, wherein the hot pressing temperature is 100-130 ℃, the pressure is 1MPa-8MPa, the hot pressing time is 10-20 minutes, the cold pressing temperature is 5-25 ℃, the pressure is 7MPa-8.5MPa, and the cold pressing time is 15-20 minutes.
The gluing film layer in the step (5) covers not only the metal foil patterns, but also the non-pattern areas on the surface of the printing substrate layer.
The binding in the step (5) is carried out at the temperature of 120 ℃ and 180 ℃ (preferably at the temperature of 140 ℃ and 180 ℃), and the binding time is 1-8 seconds (preferably 2-5 seconds).
In the step (5), the card body is treated under the condition that the temperature is 120-155 ℃ (preferably 140-150 ℃) and the pressure is 1-8 MPa (preferably 2.5-7 MPa), namely, hot pressing; the treatment of the card body at a temperature of 5-25 deg.c and a pressure of 7-8.5 MPa is called cold pressing.
Compared with the traditional hot stamping, the preparation of the metal foil pattern layer in the step (2) does not need to purchase an expensive hot stamping plate die, the cost is lower, and meanwhile, the cold hot stamping pattern is larger and more attractive than the hot stamping pattern, and the printing breadth is larger and flexible. In addition, compared with hot stamping, the process is more wear-resistant and oxidation-resistant because the protective film covers the metal foil, and the patterns are not easy to damage.
Compared with the prior art, the invention has the following beneficial effects:
(1) the patterns of the product prepared by the invention are not on the surface of the card, so the product cannot be worn or scratched, and the intelligent card has a firm integral structure and is not easy to damage;
(2) the pattern is flat and smooth, the grain is fine and smooth, and the appearance is very beautiful;
(3) the product prepared by the invention is not easy to be imitated and has high safety;
(4) the preparation method has high efficiency and low preparation cost.
Drawings
Fig. 1 is a diagram of a smart card prepared in example 2 of the present invention, in which 1 denotes a chip module, 2 denotes a hot-melt adhesive layer, 3 denotes an upper adhesive film layer, 4 denotes a metal foil pattern layer, 5 denotes an upper printed substrate layer, 6 denotes an element layer, 7 denotes a lower printed substrate layer, and 8 denotes a lower adhesive film layer.
Detailed Description
In order to further make the technical solutions of the present invention apparent to those skilled in the art, the following examples are given for illustration. It should be noted that the following examples are not intended to limit the scope of the claimed invention.
Example 1
The utility model provides a smart card with built-in metal foil pattern, includes chip module, hot melt adhesive layer, rubberizing rete, metal foil pattern layer, last printing substrate layer, component layer, lower printing substrate layer and the lower gluey rete that stacks gradually the setting.
The metal foil used in the metal foil pattern layer is gold.
The lower adhesive film layer contains a magnetic strip.
The hot melt adhesive of the hot melt adhesive layer is HK150 which is provided by the company Limited for the contained industry.
The upper adhesive film layer and the lower adhesive film layer are transparent PVC adhesive tape films provided by Jiangsu Huaxin New materials GmbH.
The chip module is 12mm long, 10mm wide and 0.5mm thick; the size of the smart card is 82mm in length, 51mm in width and 0.9mm in thickness.
A method for preparing a smart card with a built-in metal foil pattern comprises the following steps:
(1) preparation of the upper printing substrate layer: printing patterns on the surface of a PVC sheet or a paper sheet to form an upper printing substrate layer, printing in an offset printing mode according to the required patterns, and then silk-screen printing UV adhesive on the surface of the upper printing substrate layer (the silk-screen printing UV adhesive is a conventional silk-screen printing technology, the UV adhesive is provided by Shenzhen Shenxin special adhesive Limited company, and the model is DX06), wherein silk-screen printing plate making is required according to the shapes of the patterns during the silk-screen printing UV adhesive (the silk-screen printing UV adhesive forms the patterns finally required by the smart card, so that the area in which the UV adhesive is silk-screen printed is called a pattern area, and the area without the silk-screen printing UV adhesive is called a non-pattern area for standby;
(2) preparing a metal foil pattern layer: sticking the metal foil on the surface of the upper printing substrate layer processed in the step (1) through an unreeling and reeling device (the unreeling and reeling device is auxiliary equipment of a silk screen printing machine, the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive of the upper printing substrate layer is cured through a UV curing device, and then stripping off the metal foil in the non-pattern area on the upper printing substrate layer (the pattern area is connected with the metal foil through the UV adhesive, and the non-pattern area does not have the UV adhesive, so that the metal foil in the non-pattern area is relatively easy to remove) through a stripping device (the stripping device is auxiliary equipment of the silk screen printing machine, and the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive is used for standby;
(3) preparation of element layer: embedding a copper wire into a PVC sheet in a coil form by using high-frequency vibration equipment (the high-frequency vibration equipment is a line burying machine, is provided by Beijing Dexin spring Internet of things science and technology Co., Ltd., and has the frequency of 65000 in the working process), covering the surface of the PVC sheet with one PVC sheet, and laminating the two PVC sheets for later use;
(4) preparation of the lower printing substrate layer: printing patterns on a PVC sheet or a paper sheet to form a lower printing substrate layer for later use;
(5) preparing a card body: covering a glue film layer on the metal foil pattern layer processed in the step (2), covering a lower glue film layer on the surface of the lower printing substrate layer formed in the step (4), binding the glue film layer, the metal foil layer, the upper printing substrate layer, the element layer, the lower printing substrate layer and the lower glue film layer (binding is used for preventing the materials from falling off and shifting in the laminating process), hot-pressing the bound materials for 10 minutes under the conditions that the temperature is 120 ℃ and the pressure is 2.5MPa, and cold-pressing for 15 minutes under the conditions that the temperature is 10 ℃ and the pressure is 7MPa to obtain a card body;
(6) forming the smart card: and (4) punching the card body prepared in the step (5) into a standard card size, coating a hot melt adhesive layer on the upper adhesive film layer, and attaching a chip module on the hot melt adhesive layer to obtain the intelligent card with the built-in metal foil patterns.
The pattern comprises graphics or text, or a combination of graphics and text.
And (1) loading the manufactured silk-screen plate on a silk-screen printing machine and silk-screen printing UV (ultraviolet) adhesive on the upper printing substrate layer, so that the pattern of the silk-screen printing UV adhesive is better matched with the pattern in the actual smart card.
In the step (2), the metal foil is adhered to the upper printing substrate layer through the UV adhesive of the silk screen printing.
In the step (3), the specific preparation process of the element layer is as follows: adopt the PVC (polyvinyl chloride) sheet of 0.15mm of Jiangsu Huaxin new materials company Limited, bury metallic copper line in the sheet through high-frequency vibration equipment (high-frequency vibration equipment is the machine of burying a line, is provided by Beijing Dexin spring thing networking science and technology company Limited, the frequency in the high-frequency vibration equipment working process is 65000HZ), bind (bind time is 1 second) under 140 ℃ after covering a layer of PVC sheet of 0.15mm again, subsequently carry out the pressfitting, the pressfitting includes hot pressing and cold pressing, and the temperature of hot pressing is 100 ℃, and pressure is 1MPa, and the time of hot pressing is 10 minutes, and the temperature of cold pressing is 5 ℃, and pressure is 7MPa, and the time of cold pressing is 15 minutes.
The gluing film layer in the step (5) covers not only the metal foil patterns, but also the non-pattern areas on the surface of the printing substrate layer.
The binding in the step (5) is carried out at 120 ℃, and the binding time is 2 seconds.
Example 2
The utility model provides a smart card with built-in metal foil pattern, includes chip module 1, hot melt adhesive layer 2, rubberizing rete 3, metal foil pattern layer 4, upper printing substrate layer 5, component layer 6, lower printing substrate layer 7 and lower rubberizing rete 8 that stacks gradually the setting.
The metal foil used in the metal foil pattern layer is silver.
The lower adhesive film layer contains a magnetic strip.
The hot melt adhesive of the hot melt adhesive layer is a WJAF-01 hot melt adhesive provided by Tianjin Weijinolandao science and technology Limited.
The upper adhesive film layer and the lower adhesive film layer are transparent PVC adhesive tape films provided by Jiangsu Huaxin New materials GmbH.
The chip module is 12.8mm long, 11.6mm wide and 0.54mm thick; the size of the smart card is 85.47mm in length, 53.92mm in width and 1.1mm in thickness.
A method for preparing a smart card with a built-in metal foil pattern comprises the following steps:
(1) preparation of the upper printing substrate layer: printing patterns on the surface of a PVC sheet or a paper sheet to form an upper printing substrate layer, printing by adopting an offset printing mode according to the required patterns, and then printing a silk-screen UV adhesive on the surface of the upper printing substrate layer (the silk-screen UV adhesive is a conventional silk-screen technology, the UV adhesive is provided by Dexin special adhesive Limited company in Shenzhen, and the model is DX06), wherein the silk-screen UV adhesive needs to be subjected to plate making according to the shape of the patterns during silk-screen printing (the UV adhesive of the silk-screen forms the patterns finally required by the smart card, so that the area in which the UV adhesive is printed is called a pattern area, and the area without the silk-screen UV adhesive is called a non-pattern area) for standby;
(2) preparing a metal foil pattern layer: sticking the metal foil on the surface of the upper printing substrate layer processed in the step (1) through an unreeling and reeling device (the unreeling and reeling device is auxiliary equipment of a silk screen printing machine, the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive of the upper printing substrate layer is cured through a UV curing device, and then stripping off the metal foil in the non-pattern area on the upper printing substrate layer (the pattern area is connected with the metal foil through the UV adhesive, and the non-pattern area does not have the UV adhesive, so that the metal foil in the non-pattern area is relatively easy to remove) through a stripping device (the stripping device is auxiliary equipment of the silk screen printing machine, and the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive is used for standby;
(3) preparation of element layer: embedding a copper wire into a PVC sheet in a coil form by high-frequency vibration equipment (the high-frequency vibration equipment is a wire embedding machine, is provided by Beijing Dexin spring Internet of things science and technology Co., Ltd., and has the frequency of 70000HZ in the working process), covering the PVC sheet on the surface of the copper wire, and laminating two PVC sheets for later use;
(4) preparation of the lower printed substrate layer: printing patterns on a PVC sheet or a paper sheet to form a lower printing substrate layer for later use;
(5) preparing a card body: covering the metal foil pattern layer processed in the step (2) with an upper glue film layer, covering the surface of the lower printing substrate layer formed in the step (4) with a lower glue film layer, binding the upper glue film layer, the metal foil layer, the upper printing substrate layer, the element layer, the lower printing substrate layer and the lower glue film layer (binding is used for preventing the materials from falling off and shifting in the laminating process), hot-pressing the bound materials for 20 minutes under the conditions that the temperature is 145 ℃ and the pressure is 5MPa, and cold-pressing the bound materials for 20 minutes under the conditions that the temperature is 20 ℃ and the pressure is 8.0MPa to obtain a card body;
(6) forming the smart card: and (4) punching the card body prepared in the step (5) into a standard card size, coating a hot melt adhesive layer on the upper adhesive film layer, and attaching a chip module on the hot melt adhesive layer to obtain the intelligent card with the built-in metal foil patterns.
The pattern comprises graphics or text, or a combination of graphics and text.
And (1) loading the manufactured silk-screen plate on a silk-screen printing machine and silk-screen printing UV (ultraviolet) adhesive on the upper printing substrate layer, so that the pattern of the silk-screen printing UV adhesive is better matched with the pattern in the actual smart card.
In the step (2), the metal foil is adhered to the upper printing substrate layer through the UV adhesive of the silk screen printing.
In the step (3), the specific preparation process of the element layer is as follows: the method comprises the steps of adopting a PVC (polyvinyl chloride) sheet with the thickness of 0.17mm of Jiangsu Huaxin new material company Limited, burying a metal copper wire in the sheet through a high-frequency vibration device (the high-frequency vibration device is a wire burying machine and is provided by Beijing Dexin spring Internet of things science and technology company Limited, the frequency in the working process of the high-frequency vibration device is 70000HZ), then covering a layer of PVC sheet with the thickness of 0.17mm, binding at 150 ℃ (the binding time is 2 seconds), and then carrying out pressing, wherein the pressing comprises hot pressing and cold pressing, the temperature of the hot pressing is 120 ℃, the pressure of the hot pressing is 6MPa, the time of the hot pressing is 20 minutes, the temperature of the cold pressing is 15 ℃, the pressure of the cold pressing is 8MPa, and the time of the cold pressing is 20 minutes.
The gluing film layer in the step (5) not only covers the metal foil patterns, but also covers the non-pattern area on the surface of the printing substrate layer.
The binding in the step (5) is carried out at 150 ℃, and the binding time is 5 seconds.
Fig. 1 is a smart card prepared in example 2, in which 1 denotes a chip module, 2 denotes a hot-melt adhesive layer, 3 denotes an upper adhesive film layer, 4 denotes a metal foil pattern layer, 5 denotes an upper printed substrate layer, 6 denotes an element layer, 7 denotes a lower printed substrate layer, and 8 denotes a lower adhesive film layer.
Example 3
The utility model provides a smart card with built-in metal foil pattern, includes chip module, hot melt adhesive layer, rubberizing rete, metal foil pattern layer, last printing substrate layer, component layer, lower printing substrate layer and the lower gluey rete that stacks gradually the setting.
The metal foil used in the metal foil pattern layer is copper.
The hot melt adhesive of the hot melt adhesive layer is the hot melt adhesive with the model number of HK180 provided by the company Limited in the industry of containing.
The upper adhesive film layer and the lower adhesive film layer are transparent PVC adhesive tape films provided by Jiangsu Huaxin New materials GmbH.
The chip module is 14mm long, 12mm wide and 0.5mm thick; the size of the smart card is 86mm in length, 56mm in width and 1.16mm in thickness.
A method for preparing a smart card with a built-in metal foil pattern comprises the following steps:
(1) preparation of the upper printing substrate layer: printing patterns on the surface of a PVC sheet or a paper sheet to form an upper printing substrate layer, printing in an offset printing mode according to the required patterns, and then silk-screen printing UV adhesive on the surface of the upper printing substrate layer (the silk-screen printing UV adhesive is a conventional silk-screen printing technology, the UV adhesive is provided by Shenzhen Shenxin special adhesive Limited company, and the model is DX06), wherein silk-screen printing plate making is required according to the shapes of the patterns during the silk-screen printing UV adhesive (the silk-screen printing UV adhesive forms the patterns finally required by the smart card, so that the area in which the UV adhesive is silk-screen printed is called a pattern area, and the area without the silk-screen printing UV adhesive is called a non-pattern area for standby;
(2) preparing a metal foil pattern layer: sticking the metal foil on the surface of the upper printing substrate layer processed in the step (1) through an unreeling and reeling device (the unreeling and reeling device is auxiliary equipment of a silk screen printing machine, the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive of the upper printing substrate layer is cured through a UV curing device, and then stripping off the metal foil in the non-pattern area on the upper printing substrate layer (the pattern area is connected with the metal foil through the UV adhesive, and the non-pattern area does not have the UV adhesive, so that the metal foil in the non-pattern area is relatively easy to remove) through a stripping device (the stripping device is auxiliary equipment of the silk screen printing machine, and the silk screen printing machine is provided by Shenzhen Gaofukou technology, and the UV adhesive is used for standby;
(3) preparation of element layer: embedding a copper wire into a PVC sheet in a coil form by using high-frequency vibration equipment (the high-frequency vibration equipment is a wire burying machine and is provided by the technical and scientific companies of the Internet of things of Dexin spring Beijing, and the frequency of the high-frequency vibration equipment in the working process is 75000HZ), covering one PVC sheet on the surface of the copper wire, and then laminating two PVC sheets for later use;
(4) preparation of the lower printed substrate layer: printing patterns on a PVC sheet or a paper sheet to form a lower printing substrate layer for later use;
(5) preparing a card body: covering the metal foil pattern layer processed in the step (2) with an upper glue film layer, covering the surface of the lower printing substrate layer formed in the step (4) with a lower glue film layer, binding the upper glue film layer, the metal foil layer, the upper printing substrate layer, the element layer, the lower printing substrate layer and the lower glue film layer (binding is used for preventing the materials from falling off and shifting in the laminating process), hot-pressing the bound materials for 20 minutes under the conditions that the temperature is 150 ℃ and the pressure is 8MPa, and then cold-pressing for 15 minutes under the conditions that the temperature is 25 ℃ and the pressure is 8.5MPa to obtain a card body;
(6) forming the smart card: and (4) punching the card body prepared in the step (3) into a standard card size, coating a hot melt adhesive layer on the upper adhesive layer, and attaching a chip module on the hot melt adhesive layer to obtain the intelligent card with the built-in metal foil patterns.
The pattern comprises graphics or text, or a combination of graphics and text.
And (1) loading the manufactured silk-screen plate on a silk-screen printing machine and silk-screen printing UV (ultraviolet) adhesive on the upper printing substrate layer, so that the pattern of the silk-screen printing UV adhesive is better matched with the pattern in the actual smart card.
In the step (2), the metal foil is adhered to the upper printing substrate layer through the UV adhesive of the silk screen printing.
In the step (3), the specific preparation process of the element layer is as follows: the method comprises the steps of adopting a 0.19mm PVC (polyvinyl chloride) sheet of Jiangsu Huaxin new material company, burying a metal copper wire in the sheet through a high-frequency vibration device (the high-frequency vibration device is a wire burying machine and is provided by Beijing Dexin spring Internet of things science and technology company Limited, wherein the frequency in the working process of the high-frequency vibration device is 75000HZ), then covering a layer of 0.19mm PVC sheet, binding at 140 ℃ (the binding time is 3 seconds), and then pressing, wherein the pressing comprises hot pressing and cold pressing, the temperature of the hot pressing is 130 ℃, the pressure is 3MPa, the time of the hot pressing is 15 minutes, the temperature of the cold pressing is 25 ℃, the pressure is 7MPa, and the time of the cold pressing is 20 minutes.
The gluing film layer in the step (5) covers not only the metal foil patterns, but also the non-pattern areas on the surface of the printing substrate layer.
The binding in the step (5) is carried out at 180 ℃, and the binding time is 5 seconds.
Comparative example 1
Compared with example 2, step (1) in comparative example 1 uses a general adhesive instead of the UV adhesive, and step (2) also has no curing process, and the rest of the process is the same as example 2.
Comparative example 2
In comparison with example 3, the hot pressing in step (5) in comparative example 2 was hot pressed at a temperature of 160 ℃ and a pressure of 0.5MPa for 3 minutes, and then cold pressed at a temperature of 30 ℃ and a pressure of 5MPa for 15 minutes, and the rest of the procedure was the same as in example 3.
Product effectiveness testing
The products prepared in examples 1 to 3 and comparative examples 1 to 2 and a commercially available smart card were wet-milled (water was added to the rubbing surface) 1000 times under a pressure of 1Kg, and then the firmness of the whole smart card (firmness of the whole smart card was very firm, slight looseness, large looseness) and whether the pattern was sharp (the sharpness of the pattern was classified into very sharp, generally sharp, fuzzy and very fuzzy) were observed, and the results are shown in table 1.
Table 1:
as can be seen from the data in table 1, the products prepared in examples 1 to 3 have good firmness, and the overall firmness of the products is significantly better than the products prepared in comparative examples 1 to 2 and the commercially available smart cards, especially when the general adhesive is used in place of the UV adhesive in comparative example 1, which is disadvantageous for the firmness of the products. The good fastness of the products prepared in examples 1-3 indicates good adhesion between the patterned layer of metal foil and the adjacent layer. In addition, the products prepared in examples 1-3 protected the pattern well, and the pattern was clear even after multiple rubs.
Claims (8)
1. The smart card with the built-in metal foil pattern is characterized by comprising a chip module (1), a hot melt adhesive layer (2), an upper adhesive film layer (3), a metal foil pattern layer (4), an upper printing substrate layer (5), an element layer (6), a lower printing substrate layer (7) and a lower adhesive film layer (8) which are sequentially stacked;
the preparation method of the intelligent card comprises the following steps:
(1) preparation of the upper printing substrate layer: printing patterns on the surface of the sheet to form an upper printing substrate layer, and then silk-screening a UV adhesive on the surface of the upper printing substrate layer for later use;
(2) preparing a metal foil pattern layer: attaching a metal foil to the surface of the upper printing substrate layer treated in the step (1), then curing, and stripping the metal foil in the non-pattern area on the upper printing substrate layer for later use;
(3) preparation of element layer: embedding a copper wire into a PVC sheet, covering the PVC sheet on the surface of the PVC sheet, and then pressing for later use;
(4) preparation of the lower printed substrate layer: printing patterns on the sheet to form a lower printing substrate layer for later use;
(5) preparing a card body: binding the upper adhesive film layer, the metal foil layer, the upper printing substrate layer, the element layer, the lower printing substrate layer and the lower adhesive film layer, and then carrying out hot pressing and cold pressing to obtain a card body; the hot pressing is carried out for 5 to 40 minutes under the conditions that the temperature is 120 to 155 ℃ and the pressure is 1 to 8 MPa; the cold pressing is carried out for 15-20 minutes under the conditions that the temperature is 5-25 ℃ and the pressure is 7MPa-8.5 MPa;
(6) forming the smart card: coating a hot-melt adhesive layer on the adhesive coating film layer of the card body prepared in the step (5), and attaching a chip module on the hot-melt adhesive layer to obtain the intelligent card with the built-in metal foil pattern;
the gluing film layer in the step (5) covers not only the metal foil patterns, but also the non-pattern areas on the surface of the printing substrate layer.
2. The smart card of claim 1, wherein the metal foil used in the metal foil pattern layer is selected from one or more of gold, silver, and copper.
3. The smart card of claim 1 wherein the lower adhesive film layer comprises a magnetic strip.
4. The smart card of claim 1, wherein the thickness of the hot melt adhesive layer is 0.01-0.05mm, the thickness of the upper adhesive film layer and the thickness of the lower adhesive film layer are both 0.05-0.1mm, the thickness of the metal foil pattern layer is 0.01-0.05mm, the thickness of the upper printing substrate layer is 0.01-0.02mm, the thickness of the component layer is 0.3-0.4mm, and the thickness of the lower printing substrate layer is 0.01-0.02 mm.
5. The smart card of claim 1, wherein the smart card has dimensions of 82-86mm long, 51-56mm wide, and 0.3-1mm thick.
6. The smart card of claim 1, wherein the sheet in step (1) and step (4) is a PVC sheet or a paper sheet.
7. The smart card according to claim 1, wherein in the step (3), the specific preparation process of the component layer is as follows: the method comprises the steps of burying a metal copper wire in a PVC sheet with the thickness of 0.15-0.19mm, covering the PVC sheet with the thickness of 0.15-0.19mm, binding at 180 ℃ under 140-.
8. The smart card of claim 1, wherein the binding in step (5) is performed at 180 ℃ and the binding time is 1-8 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910103120.7A CN109919287B (en) | 2019-02-01 | 2019-02-01 | Smart card with built-in metal foil pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910103120.7A CN109919287B (en) | 2019-02-01 | 2019-02-01 | Smart card with built-in metal foil pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109919287A CN109919287A (en) | 2019-06-21 |
| CN109919287B true CN109919287B (en) | 2022-08-30 |
Family
ID=66961315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910103120.7A Active CN109919287B (en) | 2019-02-01 | 2019-02-01 | Smart card with built-in metal foil pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109919287B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552392A (en) * | 2013-10-30 | 2014-02-05 | 黄石捷德万达金卡有限公司 | Production method of large transaction card with internal stamping metal foils |
| CN204270338U (en) * | 2014-12-04 | 2015-04-15 | 东信和平科技股份有限公司 | A kind of double-interface card of all-metal material |
| CN205139969U (en) * | 2015-11-06 | 2016-04-06 | 黄石捷德万达金卡有限公司 | Intelligence transaction card containing metal level |
| CN107085740A (en) * | 2017-05-11 | 2017-08-22 | 金邦达有限公司 | A kind of smart card with metallic luster and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NZ743935A (en) * | 2014-05-22 | 2022-01-28 | Composecure Llc | Transaction and id cards having selected texture and coloring |
-
2019
- 2019-02-01 CN CN201910103120.7A patent/CN109919287B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103552392A (en) * | 2013-10-30 | 2014-02-05 | 黄石捷德万达金卡有限公司 | Production method of large transaction card with internal stamping metal foils |
| CN204270338U (en) * | 2014-12-04 | 2015-04-15 | 东信和平科技股份有限公司 | A kind of double-interface card of all-metal material |
| CN205139969U (en) * | 2015-11-06 | 2016-04-06 | 黄石捷德万达金卡有限公司 | Intelligence transaction card containing metal level |
| CN107085740A (en) * | 2017-05-11 | 2017-08-22 | 金邦达有限公司 | A kind of smart card with metallic luster and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109919287A (en) | 2019-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106462782B (en) | Transaction and ID card with selected texture and coloring | |
| US6908786B2 (en) | Method for producing a contactless chip card using transfer paper | |
| CA2928554A1 (en) | Multi-metal layered card | |
| CN103140864B (en) | A kind of RFID tag containing picture and text | |
| CN205139969U (en) | Intelligence transaction card containing metal level | |
| KR101699412B1 (en) | Metal card and method of manufacturing metal card method therefor | |
| CN107085740A (en) | A kind of smart card with metallic luster and preparation method thereof | |
| CN109919287B (en) | Smart card with built-in metal foil pattern | |
| CN206133622U (en) | Take smart card of texture | |
| CN201320858Y (en) | A holographic false proof card-protecting film | |
| KR101830255B1 (en) | Metallic card and the method for manufacturing the same | |
| US20220027702A1 (en) | Payment card and method for fabricating the same | |
| EP4189599A1 (en) | Identification card | |
| CN204160830U (en) | The specific complex layer making card or packaging material and the product made thereof | |
| CN203831880U (en) | Card or radio frequency identification class manufacturing composite material and card or radio frequency identification | |
| KR200221192Y1 (en) | Thin metal plastic card | |
| CN201655154U (en) | Multi-layered structure cold-wave tear-off-type anti-counterfeiting label | |
| CN206907064U (en) | A kind of smart card with metallic luster | |
| KR20100116754A (en) | Manufacturing process of precious metal card | |
| CN203211626U (en) | Composite anti-fake packing box | |
| CN207565221U (en) | A kind of smart card for inlaying paper-cut pattern | |
| JP5708137B2 (en) | Non-contact information media and booklet attached to non-contact information media | |
| CN104708928A (en) | Magnetic card and printing method thereof | |
| CN208673370U (en) | A kind of smart card | |
| CN221584994U (en) | Gold and silver banknote |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |