CN109890137A - A kind of circuit board assemblies and electronic equipment - Google Patents
A kind of circuit board assemblies and electronic equipment Download PDFInfo
- Publication number
- CN109890137A CN109890137A CN201910223217.1A CN201910223217A CN109890137A CN 109890137 A CN109890137 A CN 109890137A CN 201910223217 A CN201910223217 A CN 201910223217A CN 109890137 A CN109890137 A CN 109890137A
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- circuit board
- connecting plate
- circuit
- occlusion structure
- joint face
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Abstract
The present invention provides a kind of circuit board assemblies and electronic equipment, wherein circuit board assemblies include: two circuit boards being oppositely arranged；Circuit connecting plate is arranged between two circuit boards, and connects two circuit boards；Wherein, the joint face being connected on circuit connecting plate with each circuit board is provided with the first occlusion structure, the joint face being connected on circuit board with circuit connecting plate is provided with the second occlusion structure, and when circuit connecting plate is connect with circuit board, the first occlusion structure and the second occlusion structure are cooperatively connected.The present invention can make to limit between circuit connecting plate and circuit board by the first occlusion structure and the mating connection of the second occlusion structure to fix, and limits the displacement of relative motion between circuit connecting plate and circuit board, promotes the mechanical coupling strength of circuit board assemblies.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of circuit board assemblies and electronic equipment.
Background technique
With the arrival in 5G epoch, PCB (Printed Circuit Board, the printing electricity of the electronic equipments such as smart phone
Road plate) on the electronic device that needs to carry it is more and more, and in a limited space under, PCB surface product is more and more not enough.
For this purpose, some products are attempted to use 3D stack manner, that is, by two pieces of PCB in thickness direction (Z-direction) heap laying up
It sets, to expand PCB usable area by the space for expanding thickness direction.In general, this 3D stack manner is by the title of image
For " sandwich " structure.
However, above-mentioned " sandwich " structure is more fragile in terms of reliability, when product is by falling, collide iso-stress punching
Hit, i.e., PCB construction by horizontal direction impact force when, since the mechanical coupling strength between each PCB is inadequate, will lead to
PCB is subjected to displacement, and the electric connecting relation between PCB can be destroyed when displacement is excessive.
Summary of the invention
The present invention provides a kind of circuit board assemblies and electronic equipment, to solve each PCB of PCB construction in the prior art
Between mechanical coupling strength deficiency problem.
In order to solve the above-mentioned technical problem, the present invention is implemented as follows:
In a first aspect, the embodiment of the present invention provides a kind of circuit board assemblies, comprising:
Two circuit boards being oppositely arranged；
Circuit connecting plate is arranged between two circuit boards, and connects two circuit boards；
Wherein, the joint face being connected on circuit connecting plate with each circuit board is provided with the first occlusion structure, circuit board
The upper joint face being connected with circuit connecting plate is provided with the second occlusion structure, when circuit connecting plate is connect with circuit board, first
Occlusion structure and the second occlusion structure are cooperatively connected.
Second aspect, the embodiment of the present invention provides a kind of electronic equipment, including above-mentioned circuit board assemblies.
In the embodiment of the present invention, it is arranged between two circuit boards by circuit connecting plate, and connects two circuit boards, electricity
The joint face being connected on the connecting plate of road with each circuit board is respectively set the first occlusion structure, on circuit board with circuit connecting plate
The second occlusion structure is arranged in the joint face being connected, and connects circuit by the first occlusion structure and the mating connection of the second occlusion structure
It limits and fixes between fishplate bar and circuit board, limit the displacement of relative motion between circuit connecting plate and circuit board, promote electricity
The mechanical coupling strength of road board group part.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 shows a kind of illustrative structural schematic diagrams of circuit board assemblies provided in an embodiment of the present invention；
Fig. 2 indicates the A-A diagrammatic cross-section of circuit board assemblies shown in FIG. 1；
Fig. 3 indicates a kind of illustrative structural schematic diagram of the circuit board of circuit board assemblies provided in an embodiment of the present invention；
Fig. 4 indicates a kind of illustrative structural representation of the circuit connecting plate of circuit board assemblies provided in an embodiment of the present invention
Figure；
Fig. 5 indicates the illustrative structural schematic diagram of another kind of circuit board assemblies provided in an embodiment of the present invention；
Fig. 6 indicates the illustrative structural representation of another kind of the circuit board of circuit board assemblies provided in an embodiment of the present invention
Figure；
Fig. 7 indicates that the illustrative structure of the another kind of the circuit connecting plate of circuit board assemblies provided in an embodiment of the present invention is shown
It is intended to；
Fig. 8 shows the B-B diagrammatic cross-sections of circuit connecting plate shown in Fig. 7；
Fig. 9 indicates another illustrative structural schematic diagram of circuit board assemblies provided in an embodiment of the present invention；
Figure 10 indicates another illustrative structural schematic diagram of circuit board assemblies provided in an embodiment of the present invention.
Specific embodiment
To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with attached drawing and tool
Body embodiment is described in detail.
Referring to Figure 1 to Figure 10, the embodiment of the present invention provides a kind of circuit board assemblies, may include:
Two circuit boards 11 being oppositely arranged；
Circuit connecting plate 12 is arranged between two circuit boards 11, and connects two circuit boards 11；
Wherein, the joint face being connected on circuit connecting plate 12 with each circuit board 11 is provided with the first occlusion structure, electricity
The joint face being connected on road plate 11 with circuit connecting plate 12 is provided with the second occlusion structure, circuit connecting plate 12 and circuit board 11
When connection, the first occlusion structure and the second occlusion structure are cooperatively connected.
In the embodiment of the present invention, two circuit boards 11 stack setting, and are set to two circuits by circuit connecting plate 12
It between plate 11, is separately connected with two circuit boards 11, and utilizes the company being connected on circuit connecting plate 12 with each circuit board 11
The first occlusion structure is respectively set in junction, joint face setting the second occlusion knot being connected on circuit board 11 with circuit connecting plate 12
Structure makes to limit between circuit connecting plate 12 and circuit board 11 solid by the first occlusion structure and the mating connection of the second occlusion structure
It is fixed, the displacement of relative motion between circuit connecting plate 12 and circuit board 11 is limited, the mechanical connection of circuit board assemblies is promoted
Intensity.
Wherein, in some optional embodiments of the present invention, as shown in figure 3, the second occlusion structure may include being set to
Groove 131 on the joint face that circuit board 11 is connected with circuit connecting plate 12, as shown in figure 4, on circuit connecting plate 12 with electricity
The entire joint face that road plate 11 is connected is formed as being connected on the first occlusion structure namely circuit connecting plate 12 with circuit board 11
Entire joint face directly as the first occlusion structure, as depicted in figs. 1 and 2, when circuit connecting plate 12 is connect with circuit board 11,
The entire joint face being connected on circuit connecting plate 12 with circuit board 11 is arranged in groove 131.In the embodiment of the present invention, pass through
The entire joint face being connected on circuit connecting plate 12 with circuit board 11 is arranged in the groove 131 of the second occlusion structure, makes electricity
It limits and fixes between road connecting plate 12 and circuit board 11, limit the position of relative motion between circuit connecting plate 12 and circuit board 11
Shifting amount promotes the mechanical coupling strength of circuit board assemblies.
In the embodiment of the present invention, one in the first occlusion structure and the second occlusion structure may include protrusion 132, the
Another in one occlusion structure and the second occlusion structure may include the groove 131 with 132 cooperation of protrusion.Here, pass through
Groove 131 is correspondingly arranged with protrusion 132, so that the first occlusion structure and the limit of the second occlusion structure cooperate.For example, in an example
In, the first occlusion structure includes groove 131, and the second occlusion structure includes the protrusion 132 being engaged with 131 phase of groove；Alternatively, another
In one example, the first occlusion structure includes groove 131, and the second occlusion structure includes the protrusion 132 being engaged with 131 phase of groove.Its
In, in the embodiment of the present invention, the structure size of groove 131 and protrusion 132 can be carried out according to practical structures design requirement
Setting, is not construed as limiting here.
Advantageously, in some optional embodiments of the present invention, as shown in Fig. 5, Fig. 9 and Figure 10, the first occlusion structure packet
At least one groove 131 and at least one protrusion 132 are included, the second occlusion structure includes at least one protrusion 132 and at least one
Groove 131.In the embodiment of the present invention, an at least groove 131 is respectively set by the first occlusion structure and the second occlusion structure
With at least one protrusion 132, in this way, the first occlusion structure and the second occlusion structure shape can be made as shown in Fig. 6, Fig. 7 and Fig. 8
As the dentalation of groove 131 and raised 132 alternate settings, so as to further promote circuit connecting plate 12 and circuit board
It limits and fixes between 11, promote the mechanical coupling strength of circuit board assemblies.Wherein, knot is engaged with second for the first occlusion structure
The number of the groove 131 and protrusion 132 that are arranged on structure can be configured according to practical structures design requirement, not limited here
It is fixed.
In some optional embodiments of the present invention, it can be connected on circuit connecting plate 12 with each circuit board 11
All or part of region of joint face, and, the whole for the joint face being connected on circuit board 11 with circuit connecting plate 12 or portion
Subregion respectively corresponds pad 14 of the setting for welding, then by 14 spot welding of pad so that circuit connecting plate 12 and circuit board
11 securely connections.
Fig. 3, Fig. 4, Fig. 6 and Fig. 7 are referred to, optionally, in some embodiment of the invention, the first occlusion structure and second
It is respectively corresponded on occlusion structure and is provided with pad 14, the first occlusion structure is connect with the second occlusion structure by 14 spot welding of pad.
Optionally, as shown in figure 5, in the joint face being connected on circuit connecting plate 12 with each circuit board 11 except the first occlusion structure with
The pad 14 of outer region setting, can not in the same plane, i.e., in the two with the pad 14 being arranged on the first occlusion structure
The pad 14 of setting has difference in height；Similarly, second is removed in the joint face being connected on circuit board 11 with circuit connecting plate 12
The pad 14 of region setting other than occlusion structure, equally can not be same flat with the pad 14 being arranged on the second occlusion structure
On face, i.e., the pad 14 being arranged in the two equally has difference in height.
Optionally, in some embodiment of the invention, as shown in figure 9, groove 131 and protrusion 132 between gap filling
There is welding material 15.In the embodiment of the present invention, by groove 131 and protrusion 132 between gap filling welding material 15 so that
It preferably can securely be limited between groove 131 and protrusion 132, elevating mechanism bonding strength.Specifically, can be by mounting
When, in the welding material 15 of the underfill predetermined thickness of groove 131, it is assembled in circuit connecting plate 12 and circuit board 11
Afterwards, i.e. groove 131 with protrusion 132 is engaged limit, and the excessive welding material 15 in the bottom of groove 131 will spill over groove 131
At Sidewall spacers, the backfill of the Sidewall spacers of groove 131 is got up after then being welded by high temperature reflux so that groove 131 with
Protrusion 132 forms and structure is firmly fixed.Wherein, in the embodiment of the present invention, which can be tin cream.
Wherein, in some optional embodiments of the present invention, it is connected on circuit connecting plate 12 with each circuit board 11
Joint face is provided with metal clips 16 and/or metal connection point, the joint face being connected on circuit board 11 with circuit connecting plate 12
It is provided with metal connection point and/or metal clips 16；Pass through metal clips 16 and metal connection point abutting contact, circuit connecting plate
12 are electrically connected with each circuit board 11.In the embodiment of the present invention, by circuit connecting plate 12 with each 11 phase of circuit board
The joint face affixed metal elastic slice 16 of connection and/or by bare metal layer formed metal connection point, it is corresponding, in circuit board 11
The upper joint face setting metal connection point being connected with circuit connecting plate 12 and/or metal clips 16, in this way, in circuit connecting plate
12 with circuit board 11 when connecting, by metal clips 16 and metal connection point abutting contact, can be realized circuit connecting plate 12 with
Electrical connection between circuit board 11.In one example, as shown in Figure 10, it is connected on circuit connecting plate 12 with each circuit board 11
The joint face connect is pasted with metal clips 16, the joint face being connected on road plate 11 with circuit connecting plate 12 be provided with for gold
Belong to the metal connection point of 16 abutting contact of elastic slice.Optionally, as shown in Figure 10, on circuit connecting plate 12 with each 11 phase of circuit board
The metal clips 16 and/or metal connection point of region setting in the joint face of connection in addition to the first occlusion structure, with first
The metal clips 16 and/or metal connection point being arranged on occlusion structure can not in the same plane, i.e., the gold being arranged in the two
Belonging to elastic slice 16 and/or metal connection point has difference in height；Similarly, the connection being connected on circuit board 11 with circuit connecting plate 12
In the metal connection point and/or metal clips 16, with the second occlusion structure of region setting in face in addition to the second occlusion structure
The metal connection point and/or metal clips 16 of setting equally can not in the same plane, i.e., the metal connection being arranged in the two
Point and/or metal clips 16 equally have difference in height.
Further, in order to ensure the secured connection between circuit connecting plate 12 and circuit board 11, circuit board assemblies may be used also
To include fixed structure, circuit connecting plate 12 is fixedly connected with circuit board 11 by fixed structure.Optionally, which can
Think buckle structure, i.e. circuit board assemblies can also include buckle structure, and circuit connecting plate 12 and circuit board 11 pass through the buckle
Structure is fixedly connected；Specifically, buckle structure may include the first fastener and the second fastener being mutually fastened and connected, and first
Fastener is set on circuit board 11, and the second fastener is set on circuit connecting plate 12, is blocked by the first fastener and second
The fasten and coordinate of fastener can be such that circuit connecting plate 12 is fixedly connected with circuit board 11.Optionally, which may include
Fastener and fixation hole, wherein be correspondingly arranged on fixation hole on circuit board 11 and circuit connecting plate 12, be arranged in by fastener
Fixation hole, circuit connecting plate 12 are fixedly connected with circuit board 11.
In addition, in the embodiment of the present invention, in order to ensure circuit board assemblies can carry enough electronic components, the circuit board
11 and circuit connecting plate 12 on electronic component can be set.Wherein, in some alternative embodiments, such as Fig. 1 to Fig. 7 institute
Show, circuit connecting plate 12 is vertically arranged with circuit board 11, and circuit connecting plate 12 and circuit board 11 enclose and set to form cavity, in the cavity
Electronic component can be set；That is, circuit connecting plate 12 is vertically installed between two circuit boards 11 being oppositely arranged, it is opposite to set
It can be set on two opposite surfaces of two circuit boards 11 set and electronic component be respectively set, it is to be understood that circuit connects
Electronic component equally can be set in the part that fishplate bar 12 is set between two circuit boards 11.Wherein, which can
To be an integral molding structure, the section of the circuit connecting plate 12 is at enclosed construction.
Optionally, in some embodiments of the invention, circuit connecting plate 12 can form a predetermined shape for intermediate hollow out
Plate frame structure, which can design according to practical structures and be configured, such as the predetermined shape can be rectangle.
In the embodiment of the present invention, by being extremely arranged between two circuit boards, and two circuit boards, circuit connecting plate are connected
The first occlusion structure is respectively set in the upper joint face being connected with each circuit board, is connected on circuit board with circuit connecting plate
The second occlusion structure is arranged in joint face, makes circuit connecting plate and electricity by the first occlusion structure and the mating connection of the second occlusion structure
It limits and fixes between the plate of road, limit the displacement of relative motion between circuit connecting plate and circuit board, promote circuit board assemblies
Mechanical coupling strength.
In addition, the embodiment of the present invention also provides a kind of electronic equipment, including above-mentioned circuit board assemblies.
In the embodiment of the present invention, which can be mobile phone or tablet computer.Certainly, which does not limit to
It may be laptop computer (Laptop Computer) or personal digital assistant (Personal in mobile phone and tablet computer
Digital Assistant, PDA) etc..
In the embodiment of the present invention, the electronic equipment with foregoing circuit board group part, since circuit board assemblies can limit electricity
The displacement of relative motion between road connecting plate and circuit board, promotes the mechanical coupling strength of circuit board assemblies, therefore, Neng Gouti
Rise the structural stability of electronic equipment and the reliability of electrical connection.
It should be understood that in the description of specification, reference term " embodiment ", " one embodiment " or " some realities mentioned
Apply example " mean that a particular feature, structure, or characteristic related with embodiment is included at least one embodiment of the present invention or shows
In example.Therefore, " in one embodiment " that occurs everywhere in the whole instruction, " in one embodiment " or " in some implementations
In example " not necessarily refer to identical embodiment.In addition, the element described in an attached drawing of the invention or a kind of embodiment,
Structure or feature can be with element shown in one or more of the other attached drawing or embodiment, structure or features with any suitable
Mode combines.
It should be noted that in one or more embodiments herein, the terms "include", "comprise" or its is any
Other variants are intended to non-exclusive inclusion, so that including process, method, article or the device of a series of elements
Include not only those elements, but also including other elements that are not explicitly listed, or further includes for this process, side
Method, article or the intrinsic element of device.In the absence of more restrictions, limited by sentence "including a ..."
Element, it is not excluded that there is also other identical elements in process, method, article or the device for including the element.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation ",
Terms such as " settings " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be with
It is mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside a element.For the ordinary skill in the art, Ke Yigen
The concrete meaning of above-mentioned term in the present invention is understood according to concrete condition.
In addition, the present invention can in different embodiments or examples repeat reference numerals and/or letter.This repetition be for
Simplified and clear purpose, itself do not indicate discussed various embodiments and/or be arranged between relationship.
In addition, relational terms such as first and second and the like are used merely to an entity in inventive embodiments
Or operation is distinguished with another entity or operation, is existed without necessarily requiring or implying between these entities or operation
Any actual relationship or order.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (10)
1. a kind of circuit board assemblies characterized by comprising
Two circuit boards being oppositely arranged；
Circuit connecting plate, be arranged between two circuit boards, and with two circuit board electrical connections；
Wherein, the joint face being connected on the circuit connecting plate with each circuit board is provided with the first occlusion structure, institute
It states the joint face being connected on circuit board with the circuit connecting plate and is provided with the second occlusion structure, the circuit connecting plate and institute
When stating circuit board connection, first occlusion structure and second occlusion structure are cooperatively connected.
2. circuit board assemblies according to claim 1, which is characterized in that second occlusion structure is described including being set to
The groove on joint face that circuit board is connected with the circuit connecting plate is connected on the circuit connecting plate with the circuit board
The entire joint face connect is formed as first occlusion structure, when the circuit connecting plate is connect with the circuit board, the electricity
The entire joint face being connected on the connecting plate of road with the circuit board is arranged in the groove.
3. circuit board assemblies according to claim 1, which is characterized in that first occlusion structure is engaged with described second
One in structure includes protrusion, first occlusion structure and another in second occlusion structure include with it is described
The groove of male cooperation.
4. circuit board assemblies according to claim 3, which is characterized in that first occlusion structure includes that at least one is recessed
Slot and at least one protrusion, second occlusion structure include at least one protrusion and at least one groove.
5. according to the described in any item circuit board assemblies of claim 2 to 4, which is characterized in that first occlusion structure and institute
It states and is correspondingly arranged on pad on the second occlusion structure, first occlusion structure and second occlusion structure pass through the pad
Spot welding connection.
6. circuit board assemblies according to any one of claims 3 to 4, which is characterized in that the groove and the protrusion
Between gap filling have welding material.
7. circuit board assemblies according to any one of claims 1 to 4, which is characterized in that on the circuit connecting plate and often
The joint face that one circuit board is connected is provided with metal clips and/or metal connection point, on the circuit board with the electricity
The joint face that road connecting plate is connected is provided with the metal connection point and/or metal clips；Pass through the metal clips and institute
Metal connection point abutting contact is stated, the circuit connecting plate and each circuit board are electrically connected.
8. circuit board assemblies according to claim 7, which is characterized in that it further include buckle structure, the circuit connecting plate
It is fixedly connected with the circuit board by the buckle structure.
9. circuit board assemblies according to claim 1, which is characterized in that the circuit connecting plate is vertical with the circuit board
Setting, the circuit connecting plate and the circuit board, which enclose, to be set to form cavity.
10. a kind of electronic equipment, which is characterized in that including circuit board assemblies as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910223217.1A CN109890137B (en) | 2019-03-22 | 2019-03-22 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910223217.1A CN109890137B (en) | 2019-03-22 | 2019-03-22 | Circuit board assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109890137A true CN109890137A (en) | 2019-06-14 |
| CN109890137B CN109890137B (en) | 2020-10-02 |
Family
ID=66933745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910223217.1A Active CN109890137B (en) | 2019-03-22 | 2019-03-22 | Circuit board assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109890137B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
| CN110519919A (en) * | 2019-09-05 | 2019-11-29 | 维沃移动通信有限公司 | Frame-type pinboard and preparation method thereof, circuit board arrangement and electronic equipment |
| CN114094419A (en) * | 2020-07-16 | 2022-02-25 | 佳能株式会社 | Intermediate connection member for electrically interconnecting two circuit units |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124082A (en) * | 2006-11-08 | 2008-05-29 | Sumitomo Electric Ind Ltd | Connection structure and connection method of wiring board |
| CN100563405C (en) * | 2004-02-02 | 2009-11-25 | 松下电器产业株式会社 | Stereoscopic electronic circuit device and relaying substrate and trunk shelf |
| US20100101847A1 (en) * | 2008-10-28 | 2010-04-29 | Samsung Electro-Mechanics Co., Ltd. | Electronic component embedded printed circuit board and manufacturing method thereof |
| CN206210798U (en) * | 2016-10-31 | 2017-05-31 | 昆山国显光电有限公司 | A kind of FPC, TFT substrate and package assembling |
| US20170318671A1 (en) * | 2016-04-29 | 2017-11-02 | Kinsus Interconnect Technology Corp. | Multi-layer circuit board |
| CN208227439U (en) * | 2018-05-02 | 2018-12-11 | 猫岐智能科技（上海）有限公司 | A kind of concave-convex complementary pcb board structure |
-
2019
- 2019-03-22 CN CN201910223217.1A patent/CN109890137B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100563405C (en) * | 2004-02-02 | 2009-11-25 | 松下电器产业株式会社 | Stereoscopic electronic circuit device and relaying substrate and trunk shelf |
| JP2008124082A (en) * | 2006-11-08 | 2008-05-29 | Sumitomo Electric Ind Ltd | Connection structure and connection method of wiring board |
| US20100101847A1 (en) * | 2008-10-28 | 2010-04-29 | Samsung Electro-Mechanics Co., Ltd. | Electronic component embedded printed circuit board and manufacturing method thereof |
| US20170318671A1 (en) * | 2016-04-29 | 2017-11-02 | Kinsus Interconnect Technology Corp. | Multi-layer circuit board |
| CN206210798U (en) * | 2016-10-31 | 2017-05-31 | 昆山国显光电有限公司 | A kind of FPC, TFT substrate and package assembling |
| CN208227439U (en) * | 2018-05-02 | 2018-12-11 | 猫岐智能科技（上海）有限公司 | A kind of concave-convex complementary pcb board structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110312363A (en) * | 2019-06-24 | 2019-10-08 | 维沃移动通信有限公司 | A kind of printed circuit-board assembly and terminal |
| US11778744B2 (en) | 2019-06-24 | 2023-10-03 | Vivo Mobile Communication Co., Ltd. | Printed circuit board assembly and terminal |
| CN110519919A (en) * | 2019-09-05 | 2019-11-29 | 维沃移动通信有限公司 | Frame-type pinboard and preparation method thereof, circuit board arrangement and electronic equipment |
| CN114094419A (en) * | 2020-07-16 | 2022-02-25 | 佳能株式会社 | Intermediate connection member for electrically interconnecting two circuit units |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109890137B (en) | 2020-10-02 |
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