CN109890134A - A kind of flexible circuit board - Google Patents
A kind of flexible circuit board Download PDFInfo
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- CN109890134A CN109890134A CN201910110103.6A CN201910110103A CN109890134A CN 109890134 A CN109890134 A CN 109890134A CN 201910110103 A CN201910110103 A CN 201910110103A CN 109890134 A CN109890134 A CN 109890134A
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- fpc
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Abstract
The embodiment of the present application discloses a kind of FPC, and the FPC includes: substrate layer；First signal transmitting layer and second signal transport layer, are respectively formed at the upper and lower surfaces of the substrate layer；At least one via hole, the via hole is used to accommodate the connector on peripheral circuit for connecting first signal transmitting layer, the substrate layer and the second signal transport layer, with the connection established between the FPC and the peripheral circuit.
Description
Technical field
The invention relates to signal transmission technology fields, relate to, but are not limited to a kind of flexible circuit board.
Background technique
Flexible circuit board (Flexible Printed Circuit, FPC) since the advent of the world, due to it is frivolous, flexible,
It occupies little space, bend the advantages that freedom degree is high and be widely used in electronics, electric appliance, automobile, medical or similar products field.Especially
In optical communication field, under the miniaturization, highly integrated, high-speed requirement of photoelectric device and optical-electric module, the application of FPC is more next
It is more.
Optical device conventional at present, be all by FPC and other printed circuit boards (Printed Circuit Board,
PCB) module is welded, and disassembly is extremely inconvenient, the FPC of high speed signal is especially used for transmission, due to being unable to control secondary welding
Solder dosage, leads to after sealing-off again that impedance mismatching is serious at pad, influences on signal transmission quality very big.
Summary of the invention
In view of this, the embodiment of the present application be solve the problems, such as it is existing in the prior art at least one and a kind of flexibility is provided
Circuit board.
The technical solution of the embodiment of the present application is achieved in that
The embodiment of the present application provides a kind of FPC, and the FPC includes: substrate layer；First signal transmitting layer and second signal pass
Defeated layer is respectively formed at the upper and lower surfaces of the substrate layer；At least one via hole, the via hole is for connecting described the
One signal transmitting layer, the substrate layer and the second signal transport layer, and for accommodating the connector on peripheral circuit, to build
Stand the connection between the FPC and the peripheral circuit.
By the way that via hole is arranged on FPC in the embodiment of the present application, and each transport layer and substrate layer are connected by via hole, it will
In connector insertion via hole on peripheral circuit, avoids sealing-off repeatedly and cause impedance mismatching, improve the reliability and load of FPC
Stream ability.
Detailed description of the invention
Fig. 1 is a kind of the schematic diagram of the section structure one of FPC provided by the embodiments of the present application；
Fig. 2 is a kind of the schematic diagram of the section structure two of FPC provided by the embodiments of the present application；
Fig. 3 is a kind of top view of first pad provided by the embodiments of the present application；
Fig. 4 is a kind of the schematic diagram of the section structure three of FPC provided by the embodiments of the present application；
Fig. 5 is a kind of structural schematic diagram that FPC is connect with optical device and pcb board provided by the embodiments of the present application；
Fig. 6 is the electrical block diagram provided by the embodiments of the present application for forming open circuit minor matters；
Fig. 7 is the equivalent matched figure of open circuit minor matters provided by the embodiments of the present application；
Fig. 8 is a kind of the schematic diagram of the section structure four of FPC provided by the embodiments of the present application.
Specific embodiment
Currently, in carrying out FPC design process, it can be using the connection type of crimping, i.e., by fixture, by FPC pad
To press with other PCB pads, carries out signal transmission, although this mode eliminates pad impedance mismatching caused by multiple sealing-off,
But fixture process procedure is increased, and not can guarantee pad and closely crimp completely, not only there are physical tolerances causes crimping not tight
The impedance mismatching of generation, there is also the insufficient risks of power supply signal current-carrying.
For the problems of in the related technology, the embodiment of the present application provides a kind of detachable FPC, and the FPC is available
In but be not limited to optical device, patched with module pcb board by increasing connector pad on FPC and connect, and give letter at a high speed
The design method of number pad impedance matching.By connector grafting, high speed pads impedance mismatching caused by sealing-off repeatedly is avoided,
Improve the reliability and current-carrying capability of crimping mode；By high speed pads impedance design, the impedance for improving high speed pads is suitable
With property, it is beneficial to high speed transmission of signals.Since FPC is two-ply, than relatively thin, connector pad can not be referred to plate thickness by lower layer
Impedance matching is carried out, the present invention provides a kind of high speed pads impedance design method and improves height by optimization design high speed pads
The impedance of fast pad, is beneficial to high speed transmission of signals, and connect with optical device can be by pad joint welding or metal by the FPC
Contact pin carries out inserting weldering.
The technical solution of the application is further elaborated on reference to the accompanying drawings and examples.
The embodiment of the present application provides a kind of FPC, the cross-section structure signal that Fig. 1 is a kind of FPC provided by the embodiments of the present application
Figure one, as shown in Figure 1, the FPC includes: substrate layer 101；
First signal transmitting layer 102 and second signal transport layer 103 are respectively formed at the upper surface of the substrate layer 101
The lower surface and；
At least one via hole 105, the via hole 105 is for connecting first signal transmitting layer 102, the substrate layer
101 and the second signal transport layer 103, and for accommodating the connector on peripheral circuit, to establish the FPC and described outer
Enclose the connection between circuit.
Here, substrate layer is formed by flexible high frequency material, wherein the dielectric constant of the flexibility high frequency material is stable, is lost
Tangent value is low, and the thickness of the substrate layer is more than or equal to 0.01 millimeter and is less than or equal to 0.4 millimeter, to guarantee that FPC's is counter-bending
Property, it is the printed conductor between each layer of connection that via hole, which is also plated through-hole, can establish after power on circuitry and pass through via hole
Realize the electrical connection between each component that it is connected.
In the embodiment of the present application, since the connector on peripheral circuit is inserted into the via hole being arranged on FPC, when FPC is accessed
Circuit and after being powered, the inner wall based on via hole are coated with metal layer, and the via hole is by the first signal transmitting layer, substrate layer
It is connected with second signal transport layer, then can be realized being electrically connected between FPC and peripheral circuit, and pass through the first signal transmitting layer
Corresponding signal is transmitted with second signal transport layer.Here, peripheral circuit can be other pcb boards independently of FPC, connector
It can be the contact pin being arranged on the pcb board or other can be inserted on FPC and are capable of conductive metal component, as long as energy
Connector via hole set enough and on FPC matches, here it is possible to pass through surface mounting technology (Surface
Mounted Technology, STM) technique prepares the connector on pcb board, it is of course also possible to make in other way
The standby connector.
It, can be according to the ruler of peripheral circuit and the FPC circuit layer to be connect or connector in the embodiment of the present application
It is very little that via hole is set, for example, when only needing that plug connector is inserted into via hole from unilateral side, then the via hole can not through FPC, if
Wish to be inserted into via hole from bilateral by connector, then the via hole is needed through FPC.
In other examples, the via hole runs through first signal transmitting layer, the substrate layer and described second
Signal transmitting layer, to connect first signal transmitting layer, the substrate layer and the second signal transport layer.
In other examples, the first signal transmssion line, first signal is distributed in first signal transmitting layer
Transmission line is used for transmission single-ended signal or differential signal；Second signal transmission line, institute is distributed in the second signal transport layer
It states second signal transmission line and is used for transmission direct current signal.
Here, if the first signal transmssion line is high-speed signal transmission lines, it can be used for transmitting high speed signal or direct current
Signal, high speed signal include but is not limited to single-ended signal or differential signal.If second signal transmission line is high speed signal biography
Defeated line, then can be used for transmitting high speed signal or direct current signal, and high speed signal includes but is not limited to single-ended signal or difference letter
Number.Here, the first signal transmitting layer and second signal transport layer are respectively arranged at the upper and lower surfaces of substrate layer, it is also necessary to
First signals layer and second signal layer are set to the superficial layer of FPC, in order to avoid influence the transmission quality of signal.
In the embodiment of the present application, the via hole being arranged on FPC is connect by connector with pcb board, is taken compared to regular bond pads
Connection type is welded, the detachability of FPC is increased, compared to the connection transmission mode of contact pads crimping, increases FPC connection
Reliability, also simplify device assembling process procedure, advantageously reduce circuit design cost.
The embodiment of the present application provides another kind FPC, and Fig. 2 is that a kind of cross-section structure of FPC provided by the embodiments of the present application shows
It is intended to two, as shown in Fig. 2, the FPC includes: substrate layer 201；
First signal transmitting layer 202 and second signal transport layer 203 are respectively formed at the upper surface of the substrate layer 201
The lower surface and；
At least one first pad 204, via hole 205 is provided on each first pad 204, and the via hole 205 is used
In connection first signal transmitting layer 202, the substrate layer 201 and the second signal transport layer 203, and for outside accommodating
The connector on circuit is enclosed, with the connection established between the FPC and the peripheral circuit.
Here, the first pad be connector pad, and the connector pad by via hole and be formed in via hole one end or
The sheet metal at both ends is formed.If the via hole runs through the first signal transmitting layer, substrate layer and second signal transport layer, via hole
Both ends be respectively arranged with sheet metal, the first pad, and the center of the sheet metal is collectively formed in the sheet metal and via hole
Run through by the via hole；If the via hole does not extend through the first signal transmitting layer, substrate layer and second signal transport layer, via hole
Open end is provided with sheet metal, and the first pad is collectively formed in the sheet metal and via hole, and the center of the sheet metal is by this
Via hole runs through.In the embodiment of the present application, by the way that connector pad is arranged, since pad is provided with via hole and sheet metal, inciting somebody to action
Connector on peripheral circuit is inserted into after the via hole on the first pad, additionally it is possible to further by connector welding in sheet metal
On, to prevent connector from falling off, increase the stability of circuit.
It wherein, can be by each first pad and same or different when being provided with multiple first pads on FPC
Peripheral circuit establishes connection, and the via hole being arranged on the first pad is at least one, as long as the size of the first pad meets via hole
Diametric requirements, and match with the connector on corresponding peripheral circuit.For example, a plug connector on peripheral circuit
There are two contact pins for upper setting, and the connector only need to establish connection with first pad on FPC, then need in first weldering
Two via holes are set on disk, to match with the connector.
In other examples, the diameter of the via hole is according to the size of first pad, the thickness of the substrate layer
Degree, the dielectric constant of the substrate layer and dielectric constant determine.
Here, if via hole is cylinder, the diameter of via hole is according to the size of first pad, the substrate layer
Thickness, the dielectric constant of the substrate layer and dielectric constant determine.Wherein, the size of the first pad is generally the table of the first pad
Area, and the surface area of the first pad is related to the shape of the first pad, substrate layer is formed by flexible high frequency material, and the base
The thickness of material layer is more than or equal to 0.01 millimeter and less than or equal to 0.4 millimeter, and the dielectric constant of substrate layer is the material by substrate layer
It determines, dielectric constant k=9.0 × 109N.m2/c2, wherein N indicates the unit (newton) of power, and m indicates the unit of distance
(rice), c indicate the unit (coulomb) of the quantity of electric charge.
In other examples, first pad is rectangle, and the diameter d of the via hole meets formula (1):
Wherein, h is the thickness of the substrate layer, and k is dielectric constant, k=9.0 × 109N.m2/c2, ε is the substrate layer
Dielectric constant, a be first pad length, b be first pad width, ln indicate natural logrithm, i.e., with normal
Number e is the logarithm of the truth of a matter.
In other examples, the size of first pad is determined according to the diameter of the via hole, and described first
The length and width of pad is all larger than the diameter equal to the via hole.
Fig. 3 is a kind of top view of first pad provided by the embodiments of the present application, as shown in figure 3, the first pad 301 is length
Rectangular, the length of first pad is a, width b, and the center of the first pad is provided with via hole 302, the via hole 302
Diameter be d, in the embodiment of the present application, the length a and width b of the first pad are all larger than the diameter d equal to via hole.
In the embodiment of the present application, for the transmission structure of existing optical device FPC, by increasing connector pad on FPC,
It is connect by connector with pcb board, meets optical device and the dismountable demand of module pcb board, and provide a kind of high speed pads
Impedance design method improves the impedance of high speed pads by optimization design high speed pads, is beneficial to high speed signal biography
It is defeated.
The embodiment of the present application provides another kind FPC, and Fig. 4 is that a kind of cross-section structure of FPC provided by the embodiments of the present application shows
It is intended to three, as shown in figure 4, the FPC includes: substrate layer 401；
First signal transmitting layer 402 and second signal transport layer 403 are respectively formed at the upper surface of the substrate layer 401
The lower surface and；
At least one via hole 404, the via hole 404 is for connecting first signal transmitting layer 402, the substrate layer
401 and the second signal transport layer 403, and for accommodating the connector on peripheral circuit, to establish the FPC and described outer
Enclose the connection between circuit；
Second pad 405, for being connect with the third pad on the ceramic cartridge of the optical device, to establish the FPC
Connection between optical device.
In the embodiment of the present application, FPC is connect with optical device can carry out inserting by pad joint welding or metal ferrule weldering, corresponding
Ground, the second pad can be connector pad or ordinary pads, if the second pad is connector pad, second pad
Can with the third pad grafting on the ceramic cartridge of optical device, to establish the connection between FPC and optical device；If the second weldering
Disk is ordinary pads, then second pad can with the third pad joint welding on the ceramic cartridge of optical device, to establish FPC and light
Connection between device.
Fig. 5 is a kind of structural schematic diagram that FPC is connect with optical device and pcb board provided by the embodiments of the present application, such as Fig. 5 institute
Show, be illustrated with 4 groups of high-speed signal transmission lines, the top layer of FPC is provided with the first pad 501, and first pad 501
Be provided centrally with via hole 502, the first pad 501 can be carried out by the connector on the via hole 502 and pcb board that are arranged thereon
Grafting, the via hole 502 through connection FPC top layer to bottom, 4 groups of high-frequency signal transmission wires 503 (the first signal transmssion line and the
Binary signal transmission line) it is entirely located in the transmission of the surface layer FPC, and connect by the second pad 504 with optical device, GND network is located at base
The bottom of material layer, the reference ground as high-speed signal transmission lines, wherein the second pad 504 can for common joint welding pad or
Metal ferrule inserts weldering pad.Here it is possible to according to the dielectric constant of FPC substrate layer, the ruler of the thickness of substrate layer and the first pad
It is very little.For example, it is 0.12m millimeters etc. that via diameter, which is calculated, as long as guarantee via size and precision are within a preset range
It can.It is that 4 groups of double contact pin pads are also possible to single contact pin pad in other examples shown in Fig. 5, it can basis
It needs to set.
In the embodiment of the present application, FPC top layer is by being arranged metallization VIA at the center of the first pad, and the via hole is through company
Top layer is connect to bottom, equivalent to form a diameter as d, the metal open circuit minor matters that length is h, as shown in fig. 6, Fig. 6 shows shape
At the electrical block diagram of open circuit minor matters, substrate is run through by via hole 602 set on pad 601 in the embodiment of the present application
Layer 604 and other circuit layers form an open circuit minor matters, wherein the bottom of substrate layer is set to reference to ground 603.As shown in fig. 7,
Fig. 7 shows the equivalent matched figure of the open circuit minor matters, wherein Z is high resistant transmission line, and θ is impedance line electrical length.The application is implemented
In example, impedance conversion can be carried out by Ke Luoda conversion regime.
Here, high-frequency signal transmission wire transmission signal rate can be 25Gbit/s, if flexible circuit board is two-ply,
The dielectric constant of substrate layer can be 3.4, loss tangent 0.002,0.05 millimeter of substrate layer thickness, the length of the first pad
Degree is 0.6 millimeter, and width is 0.25 millimeter.
The embodiment of the present application provides another kind FPC, and Fig. 8 is that a kind of cross-section structure of FPC provided by the embodiments of the present application shows
It is intended to four, as shown in figure 8, the FPC includes: substrate layer 801；
First signal transmitting layer 802 and second signal transport layer 803 are respectively formed at the upper surface of the substrate layer 801
The lower surface and；
At least one via hole 804, the via hole 804 is for connecting first signal transmitting layer 802, the substrate layer
801 and the second signal transport layer 803, and for accommodating the connector on peripheral circuit, to establish the FPC and described outer
Enclose the connection between circuit；
Stiffening plate 805, the stiffening plate 805 are located at the side of the via hole 804 and the position with 804 face of via hole
It sets.
In other examples, the thermal expansion system for preparing material for preparing material Yu the substrate layer of the stiffening plate
Number is identical.
In the embodiment of the present application, by designing a kind of detachable FPC, by designing via hole on pad, realize that high speed is believed
Number pad impedance matching, FPC sequentially consist of top layer, middle layer and bottom.Wherein, middle layer is ground reference layer, is used for
Do high speed signal reflux reference；Signal transmitting layer is transmitted on the surface layer FPC respectively, and substrate layer is low using loss tangent value, and dielectric is normal
The stable flexible high frequency material of number, is used as transmission network medium carrier, increases the flexible disassembly between FPC and module pcb board
Energy.Since FPC is multitiered network, and plate is relatively thin, and therefore, there are a biggish parasitic capacitance, the application for connector pad
Embodiment provides a kind of method for designing the impedance of high speed signal pad simultaneously, by metallizing in the first pad center increase
Hole, it is humorous in high speed transmission of signals frequency range generation one according to the capacitive reactance of the equivalent open circuit minor matters of metallization VIA and pad parasitism
Vibration, in the resonance band, high speed transmission of signals parameter has reflection echo and the transmission attenuation of polar region, is equivalent to high speed signal and exists
Band-pass transmissions of this frequency range without Insertion Loss, achieve the effect that promotion signal transmission quality.
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment
A particular feature, structure, or characteristic includes at least one embodiment of the application.Therefore, occur everywhere in the whole instruction
" in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot
Structure or characteristic can combine in any suitable manner in one or more embodiments.It should be understood that in the various implementations of the application
In example, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, the execution sequence Ying Yiqi function of each process
It can be determined with internal logic, the implementation process without coping with the embodiment of the present application constitutes any restriction.Above-mentioned the embodiment of the present application
Serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
In several embodiments provided herein, it should be understood that disclosed device and method can pass through it
Its mode is realized.Apparatus embodiments described above are merely indicative, for example, the division of the unit, only
A kind of logical function partition, there may be another division manner in actual implementation, such as: multiple units or components can combine, or
It is desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed each composition portion
Mutual coupling or direct-coupling or communication connection is divided to can be through some interfaces, the INDIRECT COUPLING of equipment or unit
Or communication connection, it can be electrical, mechanical or other forms.
Above-mentioned unit as illustrated by the separation member, which can be or may not be, to be physically separated, aobvious as unit
The component shown can be or may not be physical unit；Both it can be located in one place, and may be distributed over multiple network lists
In member；Some or all of units can be selected to achieve the purpose of the solution of this embodiment according to the actual needs.
In addition, each functional unit in each embodiment of the application can be fully integrated in one processing unit, it can also
To be each unit individually as a unit, can also be integrated in one unit with two or more units；It is above-mentioned
Integrated unit both can take the form of hardware realization, can also realize in the form of hardware adds SFU software functional unit.
The above, only presently filed embodiment, but the protection scope of the application is not limited thereto, it is any to be familiar with
Those skilled in the art within the technical scope of the present application, can easily think of the change or the replacement, and should all cover
Within the protection scope of the application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (10)
1. a kind of flexible circuit board FPC, which is characterized in that the FPC includes:
Substrate layer；
First signal transmitting layer and second signal transport layer, are respectively formed at the upper and lower surfaces of the substrate layer；
At least one via hole, the via hole is for connecting first signal transmitting layer, the substrate layer and the second signal
Transport layer, and for accommodating the connector on peripheral circuit, with the connection established between the FPC and the peripheral circuit.
2. FPC according to claim 1, which is characterized in that the FPC further includes at least one first pad, Mei Yisuo
It states and is provided with the via hole on the first pad.
3. FPC according to claim 1 or 2, which is characterized in that the via hole runs through first signal transmitting layer, institute
Substrate layer and the second signal transport layer are stated, to connect first signal transmitting layer, the substrate layer and second letter
Number transport layer.
4. FPC according to claim 2, which is characterized in that the diameter of the via hole according to the size of first pad,
The thickness of the substrate layer, the dielectric constant of the substrate layer and dielectric constant determine.
5. FPC according to claim 4, which is characterized in that first pad is rectangle, the diameter d of the via hole
Meet formula:
Wherein, h is the thickness of the substrate layer, and k is dielectric constant, k=9.0 × 109N.m2/c2, ε is Jie of the substrate layer
Electric constant, a are the length of first pad, and b is the width of first pad.
6. FPC according to claim 4, which is characterized in that the size of first pad is according to the diameter of the via hole
It determines, and the length and width of first pad is all larger than the diameter equal to the via hole.
7. FPC according to claim 1, which is characterized in that the FPC further include:
Second pad, for being connect with the third pad on the ceramic cartridge of the optical device, to establish the FPC and optical device
Between connection.
8. FPC according to claim 1, which is characterized in that the FPC further includes stiffening plate, and the stiffening plate is located at institute
State the side of via hole and the position with the via hole face.
9. FPC according to claim 8, which is characterized in that the system for preparing material Yu the substrate layer of the stiffening plate
The thermal expansion coefficient of standby material is identical.
10. FPC according to claim 1, which is characterized in that the transmission of the first signal is distributed in first signal transmitting layer
Line, first signal transmssion line are used for transmission single-ended signal or differential signal；The second signal transport layer is distributed with
Binary signal transmission line, the second signal transmission line are used for transmission direct current signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910110103.6A CN109890134B (en) | 2019-02-11 | 2019-02-11 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910110103.6A CN109890134B (en) | 2019-02-11 | 2019-02-11 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109890134A true CN109890134A (en) | 2019-06-14 |
| CN109890134B CN109890134B (en) | 2021-03-12 |
Family
ID=66927969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910110103.6A Active CN109890134B (en) | 2019-02-11 | 2019-02-11 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109890134B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788886A (en) * | 2020-06-23 | 2021-05-11 | 北京可利尔福科技有限公司 | Electric signal transmission assembly, driver and camera module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111571A (en) * | 1994-10-06 | 1996-04-30 | Toshiba Chem Corp | Laminated board for printed circuit |
| CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN105848426A (en) * | 2016-03-30 | 2016-08-10 | 乐视控股（北京）有限公司 | Printed circuit board and manufacturing method thereof |
-
2019
- 2019-02-11 CN CN201910110103.6A patent/CN109890134B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111571A (en) * | 1994-10-06 | 1996-04-30 | Toshiba Chem Corp | Laminated board for printed circuit |
| CN104703390A (en) * | 2013-12-06 | 2015-06-10 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN105848426A (en) * | 2016-03-30 | 2016-08-10 | 乐视控股（北京）有限公司 | Printed circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112788886A (en) * | 2020-06-23 | 2021-05-11 | 北京可利尔福科技有限公司 | Electric signal transmission assembly, driver and camera module |
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| Publication number | Publication date |
|---|---|
| CN109890134B (en) | 2021-03-12 |
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