CN109887974B - Organic light emitting diode display and manufacturing method thereof - Google Patents
Organic light emitting diode display and manufacturing method thereof Download PDFInfo
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- CN109887974B CN109887974B CN201910154452.8A CN201910154452A CN109887974B CN 109887974 B CN109887974 B CN 109887974B CN 201910154452 A CN201910154452 A CN 201910154452A CN 109887974 B CN109887974 B CN 109887974B
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Abstract
The invention provides an organic light emitting diode display and a manufacturing method thereof, wherein the method comprises the following steps: fabricating a scattering film, comprising: manufacturing a covering layer on the substrate; patterning the covering layer to form a plurality of first convex parts and first flat parts which are arranged at intervals; forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion; sequentially manufacturing an organic light-emitting display layer and a barrier layer on a substrate; turning over the scattering film and attaching the scattering film to the barrier layer; peeling the substrate from the cover layer; and manufacturing an encapsulation layer on the covering layer. The organic light-emitting diode display and the manufacturing method thereof can improve the light-emitting efficiency of the display.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to an organic light-emitting diode display and a manufacturing method thereof.
[ background of the invention ]
An Organic Light-Emitting Diode (OLED) is also called an Organic electroluminescent display. The OLED display technology has advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and very high response speed, and is therefore widely used.
However, the OLED device generally includes an anode, an organic light emitting layer, and a cathode, the cathode is generally disposed on the top of the OLED device, and since the cathode of the top-emission OLED device is a metal electrode, and the metal absorbs light easily, the loss of light emitted from the display is large, and the light emitting efficiency is low.
Therefore, it is necessary to provide an organic light emitting diode display and a method for manufacturing the same to solve the problems of the prior art.
[ summary of the invention ]
The invention aims to provide an organic light emitting diode display and a manufacturing method thereof, which can improve the light extraction efficiency.
In order to solve the above technical problems, the present invention provides a method for manufacturing an organic light emitting diode display, comprising:
fabricating a scattering film, comprising:
manufacturing a covering layer on the substrate;
patterning the covering layer to form a plurality of first convex parts and first flat parts which are arranged at intervals;
forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion;
sequentially manufacturing an organic light-emitting display layer and a barrier layer on a substrate;
turning over the scattering film and attaching the scattering film to the barrier layer;
peeling the substrate from the cover layer;
and manufacturing an encapsulation layer on the covering layer.
The present invention also provides an organic light emitting diode display, which includes:
a substrate base plate;
the organic light-emitting display layer is arranged on the substrate base plate;
a barrier layer disposed on the organic light emitting display layer;
the diffusion barrier layer, locate on the barrier layer, it includes:
the protective layer comprises a second flat part and a plurality of second convex parts arranged at intervals, and the second convex parts are positioned on the second flat part;
the covering layer is positioned on the protective layer and comprises a first flat part and a plurality of first convex parts arranged at intervals; the position of the second convex part corresponds to the position of the gap between the first convex parts;
and the packaging layer is arranged on the scattering film.
The organic light emitting diode display and the manufacturing method thereof of the invention are characterized in that a scattering film is manufactured on an organic light emitting display layer, specifically a covering layer is manufactured on a substrate, and the covering layer is subjected to patterning treatment to form a plurality of first convex parts and first flat parts; forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion; and attaching the scattering film to the organic light-emitting display layer, and peeling the substrate to obtain the organic light-emitting diode display, so that the light path of light scattering is increased, and the light extraction efficiency is improved.
[ description of the drawings ]
FIG. 1 is a schematic structural diagram of a first step of a method for fabricating an organic light emitting diode display according to the present invention;
FIG. 2 is a schematic diagram of a substrate structure in a scattering film of an OLED display according to the present invention;
FIG. 3 is a schematic diagram of a second step of the first step of the method for fabricating an OLED display according to the present invention;
FIG. 4 is a schematic structural diagram of a third step of the first step of the method for fabricating an OLED display according to the present invention;
FIG. 5 is a schematic structural diagram of a second step of the method for fabricating an OLED display according to the present invention;
FIG. 6 is a schematic structural diagram of a third step of the method for fabricating an OLED display according to the present invention;
FIG. 7 is a schematic structural diagram of a fourth step of the method for fabricating an OLED display according to the present invention;
FIG. 8 is a schematic structural diagram of a fifth step of the method for fabricating an OLED display according to the present invention;
FIG. 9 is a schematic structural diagram of a sixth step of the method for fabricating an OLED display according to the present invention;
fig. 10 is a schematic structural diagram of a seventh step of the method for manufacturing an organic light emitting diode display according to the present invention.
[ detailed description ] embodiments
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc. refer to directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first step of a method for manufacturing an organic light emitting diode display according to the present invention.
The invention relates to a method for manufacturing an organic light-emitting diode display, which comprises the following steps:
s101, manufacturing a scattering film, wherein the scattering film comprises:
s21, manufacturing a covering layer on the substrate;
as shown in fig. 1, a complete cover layer 12 is formed on the substrate 11, for example, by spin coating or drop coating the cover layer 12.
In one embodiment, the substrate 11 is a silicon wafer in order to improve the flatness of the cover layer.
In order to facilitate the peeling of the substrate, i.e. before the step of forming the cover layer on the substrate, the method further comprises;
s21', hydrophobic-treating the substrate to form hydrophobic groups on the surface of the substrate on the side close to the cover layer.
For example, as shown in fig. 2, the substrate 11 is subjected to hydrophobic treatment to form hydrophobic groups 101 on a surface of the substrate 11 on a side close to the cover layer 12. Such as hydrophobic groups 101 formed on the upper surface of the substrate 11.
S22, patterning the covering layer to form a plurality of first convex parts and first flat parts;
as shown in fig. 3, the cover layer 12 is patterned to form a first flat portion 121 and a plurality of first convex portions 122 disposed at intervals; that is, the first convex portion 122 is located on the first flat portion 121. The patterning process may be one of maskless laser processing, mask lithography (exposure, development, etc.), nanoimprinting, and the like.
Wherein the cross-sectional shape of the first protrusion 122 may be a semicircle, a matrix, a cone, a trapezoid, or the like.
S23, forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion;
as shown in fig. 4, the protective layer 13 is formed on the first convex portion 122 and the first flat portion 121 not covered with the first convex portion 122, thereby completing the fabrication of the scattering film. The difference between the refractive index of the material of the cover layer 12 and the refractive index of the material of the protective layer 13 is smaller than a preset value. I.e. the refractive index of the material of the cover layer 12 is close to the refractive index of the material of the protective layer 13.
In one embodiment, the material of the cover layer 12 is a photoresist material, and the material of the protection layer 13 is an organic material.
The protective layer 13 is produced, for example, by spin coating, drop coating or ink jet printing.
The protective layer 13 includes a second flat portion 131 and a plurality of second convex portions 132 arranged at intervals, the second convex portions 132 are located below the second flat portion 131, and the positions of the second convex portions 132 correspond to the positions of the gaps between the first convex portions 122.
S102, sequentially manufacturing an organic light-emitting display layer and a blocking layer on a substrate;
as shown in fig. 5, an organic light emitting display layer 22 and a barrier layer 23 are sequentially formed on a base substrate 21; the organic light emitting display layer 22 includes an anode, an organic light emitting layer, and a cathode. The barrier layer 23 serves to block water and oxygen to protect the organic light emitting display layer 22.
S103, turning over the scattering film and attaching the scattering film to the barrier layer;
as shown in fig. 6, after the scattering film is turned over, the scattering film is attached to the barrier layer 23, and the final structure is as shown in fig. 7, in which the protective layer 13 is close to the barrier layer 23. For example, the protective layer 13 faces downward. In one embodiment, the attaching the scattering film to the barrier layer includes:
and S1031, pressing the scattering film on the barrier layer 23, wherein the protective layer 13 is close to the barrier layer 23. The direction of the pressure is indicated by the arrow in fig. 6.
In order to improve the bonding effect, the material of the barrier layer 23 is the same as the material of the protective layer 13.
The diffusion film may also be subjected to low-temperature heating before being laminated on the barrier layer 23.
S104, stripping the substrate from the covering layer;
as shown in fig. 8, the substrate 11 is peeled off the cover layer 12, for example, by mechanical peeling or by laser cutting the substrate 11.
S105, manufacturing an encapsulation layer on the scattering film.
As shown in fig. 9, an encapsulation layer 24 is formed on the cover layer 12, and an organic light emitting diode display is obtained. The encapsulation layer 24 has a structure in which inorganic layers and organic layers are alternately arranged.
The method further comprises the following steps:
and S106, manufacturing a glass cover plate on the packaging layer.
As shown in fig. 10, a glass cover plate 25 is fabricated on the encapsulation layer 24.
As shown in fig. 9 and 10, the present invention also provides an organic light emitting diode display including a substrate 21, an organic light emitting display layer 22, a barrier layer 23, a scattering film 10, and an encapsulation layer 24. A glass cover plate 25 may also be included.
An organic light emitting display layer 22 is provided on the base substrate 21;
the barrier layer 23 is disposed on the organic light emitting display layer 22.
The scattering film 10 is disposed on the barrier layer 23, and the scattering film 10 includes a protective layer 13 and a cover layer 12. The cover layer 12 is located on the protective layer 13.
Referring to fig. 4, the protection layer 13 includes a second flat portion 131 and a plurality of second convex portions 132 disposed at intervals, the second convex portions 132 are located on the second flat portion 131, wherein the second convex portions 132 are located at positions corresponding to positions of gaps between the first convex portions 122. The cover layer 12 includes a first flat portion 121 and a plurality of first convex portions 122 disposed at intervals.
An encapsulation layer 24 is disposed on the scattering film 10, in particular on the cover layer 12.
The material of the barrier layer 23 is the same as the material of the protective layer 13.
The scattering film is additionally arranged on the organic light-emitting display layer and comprises the protective layer and the covering layer, and the protective layer and the covering layer are both provided with the convex parts, so that the light-emitting angle of light is changed through the convex parts, the light path of light scattering is increased, and the light-emitting efficiency is improved.
The organic light emitting diode display and the manufacturing method thereof of the invention are characterized in that a scattering film is manufactured on an organic light emitting display layer, specifically a covering layer is manufactured on a substrate, and the covering layer is subjected to patterning treatment to form a plurality of first convex parts and first flat parts; forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion; and attaching the scattering film to the organic light-emitting display layer, and peeling the substrate to obtain the organic light-emitting diode display, so that the light path of light scattering is increased, and the light extraction efficiency is improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (6)
1. A method for manufacturing an organic light emitting diode display is characterized by comprising the following steps:
fabricating a scattering film, comprising:
providing a substrate, wherein the substrate is a silicon wafer, and carrying out hydrophobic treatment on the substrate to form a hydrophobic group on the surface of one side of the substrate, which is close to the covering layer;
fabricating the cover layer on the substrate;
patterning the covering layer to form a plurality of first convex parts and first flat parts which are arranged at intervals;
forming a protective layer on the first convex portion and the first flat portion not covered by the first convex portion; the difference between the refractive index of the material of the covering layer and the refractive index of the material of the protective layer is smaller than a preset value;
sequentially manufacturing an organic light-emitting display layer and a barrier layer on a substrate;
turning over the scattering film and attaching the scattering film to the barrier layer;
peeling the substrate from the cover layer;
and manufacturing an encapsulation layer on the covering layer.
2. The method of claim 1, wherein the step of attaching the scattering film to the barrier layer comprises:
and pressing the scattering film on the barrier layer.
3. The method of claim 2, wherein the material of the barrier layer and the material of the protective layer are the same.
4. The method of manufacturing an organic light-emitting diode display according to claim 3, wherein before the step of laminating the scattering film on the barrier layer, the method further comprises:
heating the scattering film.
5. The method of manufacturing an organic light emitting diode display according to claim 1,
the covering layer is made of a photoresist material, and the protective layer is made of an organic material.
6. The method of fabricating an organic light emitting diode display of claim 1, further comprising:
and manufacturing a glass cover plate on the packaging layer.
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| CN201910154452.8A CN109887974B (en) | 2019-03-01 | 2019-03-01 | Organic light emitting diode display and manufacturing method thereof |
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| CN201910154452.8A CN109887974B (en) | 2019-03-01 | 2019-03-01 | Organic light emitting diode display and manufacturing method thereof |
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| CN109887974B true CN109887974B (en) | 2021-07-23 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103959107A (en) * | 2011-11-30 | 2014-07-30 | 富士胶片株式会社 | Light-diffusing transfer material, method for forming light diffusion layer, organic electroluminescent device, and method for manufacturing organic electroluminescent device |
| KR20150011908A (en) * | 2013-07-24 | 2015-02-03 | 엔라이팅 주식회사 | High efficient light extracting substrate and display panel and manufacturing methods thereof |
| CN105612436A (en) * | 2013-10-18 | 2016-05-25 | 高通Mems科技公司 | Embedded surface diffuser |
| CN106104841A (en) * | 2014-03-19 | 2016-11-09 | 3M创新有限公司 | Nanostructured for white light quality OLED device |
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- 2019-03-01 CN CN201910154452.8A patent/CN109887974B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103959107A (en) * | 2011-11-30 | 2014-07-30 | 富士胶片株式会社 | Light-diffusing transfer material, method for forming light diffusion layer, organic electroluminescent device, and method for manufacturing organic electroluminescent device |
| KR20150011908A (en) * | 2013-07-24 | 2015-02-03 | 엔라이팅 주식회사 | High efficient light extracting substrate and display panel and manufacturing methods thereof |
| CN105612436A (en) * | 2013-10-18 | 2016-05-25 | 高通Mems科技公司 | Embedded surface diffuser |
| CN106104841A (en) * | 2014-03-19 | 2016-11-09 | 3M创新有限公司 | Nanostructured for white light quality OLED device |
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| CN109887974A (en) | 2019-06-14 |
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