CN109887957B

CN109887957B - Organic light emitting diode back plate structure

Info

Publication number: CN109887957B
Application number: CN201910085787.9A
Authority: CN
Inventors: 范英春; 张晓星
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2019-01-29
Filing date: 2019-01-29
Publication date: 2021-01-01
Anticipated expiration: 2039-01-29
Also published as: CN109887957A; WO2020155468A1

Abstract

The present disclosure provides an organic light emitting diode back panel structure. The organic light emitting diode backboard structure comprises a backboard, a plurality of pattern structures, a flat layer, an anode layer and an ink layer. The pattern structure is disposed on the back plate. The planarization layer is disposed on the pattern structure. The anode layer is disposed on the planar layer. The ink layer is disposed on the anode layer. The pattern structures are evenly distributed along a length of the back plate such that the ink layer is evenly distributed along the length of the back plate. The invention can improve the flatness of the back plate structure of the organic light-emitting diode.

Description

Organic light emitting diode back plate structure

[ technical field ] A method for producing a semiconductor device

The disclosure relates to the field of display technologies, and in particular, to an organic light emitting diode (oled) backplane structure.

[ background of the invention ]

The organic light emitting diode display has good display characteristics and quality, such as light weight, short response time, low driving voltage, good display color, and wide display viewing angle, and is widely noticed by consumers.

In the existing technology of Ink-jet printing (IJP) organic light emitting diode display, in order to control the uniformity of the Ink-jet printing organic light emitting diode display, the flatness of the organic light emitting diode back plate structure is controlled within a certain range. However, the conventional back plate structure of the organic light emitting diode has an uneven problem.

Therefore, there is a need to provide a back plate structure of an organic light emitting diode to solve the problems of the prior art.

[ summary of the invention ]

In order to solve the above-mentioned problems, an objective of the present disclosure is to provide an oled backplane structure, which can improve the flatness of the oled backplane structure.

To achieve the above objective, the present disclosure provides an organic light emitting diode back panel structure. The organic light emitting diode backboard structure comprises a backboard, a plurality of pattern structures, a flat layer, an anode layer and an ink layer. The pattern structure is disposed on the back plate. The planarization layer is disposed on the pattern structure. The anode layer is disposed on the planar layer. The ink layer is disposed on the anode layer. The pattern structures are evenly distributed along a length of the back plate such that the ink layer is evenly distributed along the length of the back plate.

In one embodiment of the present disclosure, the pattern structure has the same thickness along the length of the back plate.

In one embodiment of the present disclosure, the pattern structures are disposed at equal intervals along the length of the back plate.

In one embodiment of the present disclosure, any two adjacent pattern structures are parallel to each other along the length of the back plate.

In one embodiment of the present disclosure, a portion of the pattern structure is a dummy pattern structure.

In one embodiment of the present disclosure, a portion of the pattern structures are parallel to each other along the length of the back plate, and another portion of the pattern structures is connected to one end of the portion of the pattern structures.

In one embodiment of the present disclosure, the ink layer has substantially the same thickness along the length of the backplate.

In one embodiment of the present disclosure, the oled backplane structure further includes a pixel isolation layer disposed on the planarization layer and surrounding the ink layer.

In an embodiment of the disclosure, the oled backplane structure further includes a cover plate and a blocking member, the cover plate and the backplane are disposed opposite to each other, and the blocking member connects the cover plate and the planarization layer.

In one embodiment of the present disclosure, the backplane is a thin film transistor backplane.

Due to the organic light emitting diode back plate structure in the embodiment of the disclosure, the pattern structures are uniformly distributed along the length of the back plate, so that the ink layer is uniformly distributed along the length of the back plate, and the flatness of the organic light emitting diode back plate structure can be improved.

In order to make the aforementioned and other aspects of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below:

[ description of the drawings ]

FIG. 1 is a schematic structural diagram of an OLED backplane structure according to an embodiment of the present disclosure;

FIG. 2 is a schematic top view illustrating an OLED backplane structure according to an embodiment of the present disclosure; and

fig. 3 is a schematic top view illustrating a back plate structure of an oled according to an embodiment of the disclosure.

[ detailed description ] embodiments

In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below. Furthermore, directional phrases used in this disclosure, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for the purpose of illustration and understanding of the present disclosure, and are not used to limit the present disclosure.

In the drawings, elements having similar structures are denoted by the same reference numerals.

Referring to fig. 1-3, an embodiment of the present disclosure provides an organic light emitting diode back panel structure. The oled backplane structure 100 includes a backplane 110, a plurality of pattern structures 120, a planarization layer 130, an anode layer 140, and an ink layer 150. The pattern structure 120 is disposed on the back plate 110. The planarization layer 130 is disposed on the pattern structure 120. The anode layer 140 is disposed on the planarization layer 130. The ink layer 150 is disposed on the anode layer 140. The pattern structures 120 are evenly distributed along the length of the back plate 110 such that the ink layer 150 is evenly distributed along the length of the back plate 110.

The organic light emitting diode back plate structure 100 improves the flatness of the planarization layer 130 and the organic light emitting diode back plate structure 100 through the pattern structure 120 uniformly distributed under the anode layer 140.

In addition, in the oled backplane structure 100, the pattern structures 120 are uniformly distributed along the length of the backplane 110, so that the ink layers 150 are uniformly distributed along the length of the backplane 110. Since the ink layer 150 is uniformly distributed in the pixel, the uniformity and efficiency of light emission in the pixel are improved, and the lifetime of the oled backplane structure 100 is also increased.

Specifically, the backplane 110 is a thin film transistor backplane. The pattern structure 120 has the same thickness along the length of the back plate 110. The ink layer 150 has substantially the same thickness along the length of the back plate 110. Since the ink layer 150 in a pixel has substantially the same thickness along the length of the backplane 110, uniformity and efficiency of light emission in a pixel is improved, and the lifetime of the oled backplane structure 100 is also increased.

Referring to fig. 1-3, in one embodiment of the present disclosure, the oled backplane structure 100 further includes a pixel isolation layer 160, wherein the pixel isolation layer 160 is disposed on the planarization layer 130 and surrounds the ink layer 150. The oled backplane structure 100 further includes a cover plate 170 and a dam (dam)180, the cover plate 170 is disposed opposite to the backplane 110, and the dam 180 connects the cover plate 170 and the planarization layer 130. The material of the cover plate 170 includes glass, for example.

Referring to fig. 1 and 2, the pattern structures 120 are disposed at equal intervals along the length of the back plate 110. Any two adjacent pattern structures 120 are parallel to each other along the length of the back plate 110. Part of the pattern structure 120 is a dummy pattern structure 122.

Referring to fig. 1 and 3, a portion of the pattern structures 120(124) are parallel to each other along the length of the back plate 110, and another portion of the pattern structures 120(126) are connected to one end of the portion of the pattern structures 120.

Although the disclosure has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. The present disclosure includes all such modifications and alterations, and is limited only by the scope of the appended claims. In particular regard to the various functions performed by the above described components, the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the specification. In addition, while a particular feature of the specification may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application. Furthermore, to the extent that the terms "includes," has, "" contains, "or variants thereof are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.

The foregoing is merely a preferred embodiment of the present disclosure, and it should be noted that modifications and refinements may be made by those skilled in the art without departing from the principle of the present disclosure, and these modifications and refinements should also be construed as the protection scope of the present disclosure.

Claims

1. An organic light emitting diode back plate structure, comprising:

a back plate;

a plurality of pattern structures disposed on the back plate;

a planarization layer disposed on the pattern structure;

an anode layer disposed on the planarization layer; and

an ink layer disposed on the anode layer;

wherein the pattern structures are uniformly distributed along the length of the backsheet such that the ink layers are uniformly distributed along the length of the backsheet, the pattern structures have the same thickness along the length of the backsheet, the pattern structures are equally spaced along the length of the backsheet, any two adjacent pattern structures are parallel to each other along the length of the backsheet, one part of the parallel pattern structures is a dummy pattern structure, the other part of the parallel pattern structures is not a dummy pattern structure, and in addition, the other part of the pattern structures connects one end of a plurality of the parallel pattern structures, and the ink layers have the same thickness along the length of the backsheet.

2. The organic light emitting diode backplane structure of claim 1, further comprising a pixel isolation layer disposed on the planarization layer and surrounding the ink layer.

3. The oled backplate structure of claim 1, further comprising a cover plate and a stop member, wherein the cover plate is disposed opposite to the backplate, and the stop member connects the cover plate and the planarization layer.

4. The oled backplane structure of claim 1, wherein said backplane is a thin film transistor backplane.