CN109885016A - Semiconductor machining system - Google Patents
Semiconductor machining system Download PDFInfo
- Publication number
- CN109885016A CN109885016A CN201711279701.3A CN201711279701A CN109885016A CN 109885016 A CN109885016 A CN 109885016A CN 201711279701 A CN201711279701 A CN 201711279701A CN 109885016 A CN109885016 A CN 109885016A
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- China
- Prior art keywords
- controller
- terminal
- master controller
- machining system
- access port
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Abstract
A kind of semiconductor machining system, comprising: operating terminal, for controlling master controller；One first controller；And multiple second controllers, it is serially connected with first controller；Wherein, when original state, it is master controller that the operating terminal, which manipulates first controller, and the multiple second controller is from controller, and the master controller is controlled by the operating terminal, described to be controlled by the master controller from controller；When the master controller fault, the operating terminal manipulates one in the multiple second controller as master controller；The multiple second controller in addition to the second controller for being set to master controller is to be controlled by the second controller being steered as master controller from controller.
Description
Technical field
The present invention relates to field of semiconductor processing more particularly to a kind of semiconductor machining systems.
Background technique
A single board in existing semiconductor machining system usually contains multiple wafer cassette device for loading, and each
Board is provided solely for a site and carries out system line.Specifically, the single board in existing semiconductor machining system uses 1
A controlling terminal IPC (master controller) controls the multiple wafer cassette device for loading.
Once master controller fault, being electrically connected between all wafer cassette device for loading and semiconductor machining system can
It terminates, so as to cause all equal cisco unity malfunctions of wafer cassette device for loading, causes greater loss to semiconductor production.
Summary of the invention
In view of this, it is necessary to provide a kind of semiconductor machining systems, it is possible to reduce because being damaged caused by master controller fault
It loses.
A kind of semiconductor machining system, comprising: operating terminal, for controlling master controller；One first controller；And it is multiple
Second controller is serially connected with first controller；Wherein, when original state, operating terminal manipulation first control
Device is master controller, and the multiple second controller is from controller, and the master controller is controlled by the operating terminal, described
It is controlled by the master controller from controller；When the master controller fault, the operating terminal manipulation the multiple second
One in controller is master controller；The multiple second in addition to the second controller for being set to master controller
Controller is to be controlled by the second controller for being set to master controller from controller.
It further, further include one first wafer cassette device for loading, the first wafer cassette device for loading is controlled by described
First controller.
It further, further include multiple second wafer cassette device for loading, the multiple second wafer cassette device for loading and institute
Multiple second controllers are stated to correspond and be controlled by corresponding second controller.
Further, a porous data out splice going splice, each second controller are provided on first controller
On be provided with one second data access port, each second data access port is serially connected with the porous data output and connects
Head.
Further, the operating terminal is directly electrically connected with the master controller always；When original state, the behaviour
Make terminal to be electrically connected with first controller；When the master controller fault, the operating terminal and based on being set
The second controller of controller is electrically connected.
Further, the operating terminal includes a terminal data interface, is provided with one first on first controller
Data access port is additionally provided with a third data access port on each second controller；When original state, described
One data access port connects with the terminal data interface；When the master controller fault, it is set as the described of main control
Third data access port on second controller connects with the terminal data interface.
Further, the operating terminal includes multiple terminal data interfaces, and one is provided on first controller
One data access port is additionally provided with a third data access port on each second controller, and first data connect
Inbound port is connected by a first switching element with a terminal data interface, and each third data access port passes through
One second switch element connects with a terminal data interface；When original state, the first switching element closure, Duo Gesuo
Second switch element is stated to disconnect；When the master controller fault, connection is set as the second controller of main control
Second switch element is opened.
Further, the quantity of the terminal data interface is greater than or equal to first controller and the multiple second
The quantity of controller and.
Further, the operation control terminal includes operation interface, and the operation interface is for manipulating the first switch
The switch of element and the second switch element.
Further, the operation control terminal includes control system, and the control system automatically controls the first switch
The switch of element, the second switch element.
The semiconductor machining system of the technical program embodiment can use other controllers instead in master controller fault
Control operation is carried out for master controller, the situation that master controller fault can not also be operated from controller will not occur, it can be maximum
The reduction of degree caused by master controller fault because losing.
Detailed description of the invention
Fig. 1 is the module diagram for the semiconductor machining system that first embodiment of the invention provides.
Fig. 2 is that the semiconductor machining system that first embodiment of the invention provides sets second controller as master controller
Module diagram.
Fig. 3 is the module map for the semiconductor machining system that second embodiment of the invention provides.
Fig. 4 is that the semiconductor machining system that second embodiment of the invention provides sets second controller as master controller
Module diagram.
Fig. 5 is the module map for the semiconductor machining system that third embodiment of the invention provides.
Fig. 6 is that the semiconductor machining system that third embodiment of the invention provides sets second controller as master controller
Module diagram.
Main element symbol description
Semiconductor machining system 100,200,300
Operating terminal 10
First controller 20
Second controller 30
First wafer cassette device for loading 40
Second wafer cassette device for loading 50
Operation interface 11
Control system 12
Terminal data interface 13
First data access port 21
Porous data out splice going splice 22
Second data access port 31
Third data access port 32
First switching element 60
Second switch element 61
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Fig. 1 to 2 is please referred to, first embodiment of the invention provides a kind of semiconductor machining system 100, the semiconductor machining
System 100 includes: operating terminal 10, one first controller 20, multiple second controllers 30, one first wafer cassette device for loading 40
And multiple second wafer cassette device for loading 50.
The operating terminal 10 includes operation interface 11, control system 12 and a terminal data interface 13.
The operation interface 11 manipulates semiconductor machining system 100 for user, such as described in open and close
Semiconductor machining system 100 calls or saves history machined parameters, setting first controller 20 and the multiple second control
One in device 30 processed be master controller, modify to the machined parameters of the master controller of the semiconductor machining system 100
Etc..
The control system 12 is used to respond the operation of the operation interface 11, and for generating and sending control data extremely
The master controller of the semiconductor machining system 100.
The control system 12 defaults first controller 20 and the multiple second control other than the master controller
Device 30 processed be from controller, it is described to be controlled by the master controller from controller.
In the present embodiment, the terminal data interface 13 is used for for the master controller with the semiconductor machining system 100
It is electrically connected, to realize that the data between the control system 12 and the master controller of the semiconductor machining system 100 pass
It is defeated.
First controller 20 connects with the first wafer cassette device for loading 40, for controlling first wafer cassette
Device for loading 40 operates.
One first data access port 21, a porous data out splice going splice are provided on first controller 20
(socket)22。
Wherein, first data access port 21 can connect with the terminal data interface 13 so as to carry out data
Transmission.
First data access port 21 connects with the porous data out splice going splice (socket) 22, so as to carry out
Data transmission.
The porous data out splice going splice 22 is for going here and there the multiple second controller 30 and first controller 20
It connects.
Wherein, the quantity of the hole location (not shown) of the porous data out splice going splice 22 is greater than or equal to the multiple second
The quantity of controller 30.
Multiple second controllers 30 are serially connected with first controller 20；Multiple second controllers 30 and multiple second wafers
Box device for loading 50 connects one to one.
Wherein, each second controller 30 is transported for controlling a corresponding second wafer cassette device for loading 50
Make.
Each second controller 30 is provided with one second data access port 31 and a third data access port
32。
Wherein, second data access port 31 of each second controller 30 is exported with the porous data
One hole location of connector 22 connects, third data access port 32 can connect with the terminal data interface 13 so as to
Carry out data transmission.
When original state, first data access port 21 is connected with the terminal data interface 13, each described
It is off-state between the third data access port 32 and the terminal data interface 13 of second controller 30；The behaviour
It is master controller that control system 12, which controls first controller 20, and is directly manipulated to the master controller, the manipulation
It is from controller that system 12, which controls the multiple second controller 30, and the multiple second controller 30 is from control in the main control
Device carries out the processing of semiconductor.
First data access end is disconnected manually when first controller 20 breaks down referring to Fig. 2
Mouth 21 is electrically connected with the terminal data interface 13, and the third data access port of a second controller 30 is arranged
32 are electrically connected with the terminal data interface 13；The institute that the control of control system 12 is electrically connected with terminal data interface 13
Stating second controller 30 is master controller, and is directly manipulated to the master controller, and the control system 12 controls remaining
The multiple second controller 30 be from controller, remaining the multiple second controller 30 is from control in the main control
Device carries out the processing of semiconductor.
When breaking down as a second controller 30 for master controller, the behaviour similar with the last period is repeated
Make, it is master controller that another second controller 30, which is arranged, carries out the processing of semiconductor.
Fig. 3 to Fig. 4 is please referred to, second embodiment of the invention provides a kind of semiconductor machining system 200, and the semiconductor adds
Work system 200 is similar with the semiconductor machining system 100 of first embodiment, and difference is: the terminal of the operating terminal 10
The quantity of data-interface 13 be it is multiple, and the quantity of the terminal data interface 13 be greater than or equal to first controller 20 with
The quantity of the multiple second controller 30 and；It is opened by one first first data access port 21 of first controller 20
It closes element 60 to connect with a terminal data interface 13, the third data access port of each the multiple second controller 30
32 are connected by a second switch element 61 with a terminal data interface 13.
Wherein, the quantity of the terminal data interface 13 is greater than or equal to first controller 20 and the multiple second
The quantity of controller 30 and, so as to support the addition of controller.
In the present embodiment, the controllable first switching element 60 of the operation interface 11 and second switch element 61 are opened
It closes.
When original state, the institute between first data access port 21 and the terminal data interface 13 is manually controlled
The closure of first switching element 60 is stated, so that first data access port 21 is electrically connected with the terminal data interface 13,
And manually control each second controller 30 third data access port 32 and the terminal data interface 13 it
Between the second switch element 61 disconnect, thus the third data access port 32 of each second controller 30 with
It is off-state between the terminal data interface 13；It is main control that the control system 12, which controls first controller 20,
Device, and directly the master controller is manipulated, it is from control that the control system 12, which controls the multiple second controller 30,
Device processed, the multiple second controller 30, in the master controller, carry out the processing of semiconductor from control.
First data access end is manually controlled when first controller 20 breaks down referring to Fig. 4
The first switching element 60 between mouth 21 and the terminal data interface 13 disconnects, thus first data access port
21 are electrically connected with the terminal data interface 13 disconnection, and manually control the third data of the second controller 30
The second switch element 61 closure between access interface 32 and the terminal data interface 13, thus make this described second
The third data access port 32 of controller 30 is electrically connected with the terminal data interface 13；The control system 12 control with
The second controller 30 that terminal data interface 13 is electrically connected is master controller, and is directly grasped to the master controller
Control, it is from controller that the control system 12, which controls remaining the multiple second controller 30, remaining the multiple second
Controller 30, in the master controller, carries out the processing of semiconductor from control.
When breaking down as a second controller 30 for master controller, the behaviour similar with the last period is repeated
Make, it is master controller that another second controller 30, which is arranged, carries out the processing of semiconductor.
In other embodiments, when first controller 20 breaks down, first data can also still be kept
The first switching element 60 between access interface 21 and the terminal data interface 13 is closed.
Fig. 5 and Fig. 6 is please referred to, third embodiment of the invention provides a kind of semiconductor machining system 300, and the semiconductor adds
Work system 300 is similar with the semiconductor machining system 200 of second embodiment, and difference is: not needing to manually control described the
The closure and disconnection of one switch element 60 and the second switch element 61, the control system 12 is preinstalled with software, and (figure is not
Show), the closure of the first switching element 60 and multiple second switch elements 61 can be automatically controlled and disconnect and from
The dynamic controller for selecting to go on well is master controller.
Referring to Fig. 5, the control system 12 automatically controls first data access port 21 and institute when original state
The first switching element 60 between terminal data interface 13 is stated to be closed, thus first data access port 21 with it is described
Terminal data interface 13 is electrically connected, and controls third data access port 32 and the institute of each second controller 30
It states the second switch element 61 between terminal data interface 13 to disconnect, thus described the of each second controller 30
It is off-state between three data access ports 32 and the terminal data interface 13；The control system 12 controls described first
Controller 20 is master controller, and is directly manipulated to the master controller, and the control system 12 controls the multiple the
Two controllers 30 are from controller, and the multiple second controller 30, in the master controller, carries out the processing of semiconductor from control.
Referring to Fig. 6, the control system 12 disconnects described first automatically when first controller 20 breaks down
The first switching element 60 between data access port 21 and the terminal data interface 13, so that first data connect
The disconnection of inbound port 21 and the terminal data interface 13 be electrically connected, and described the of one second controller 30 of closure automatically
The second switch element 61 between three data access ports 32 and the terminal data interface 13, thus make this described second
The third data access port 32 of controller 30 is electrically connected with the terminal data interface 13；The control system 12 control with
The second controller 30 that terminal data interface 13 is electrically connected is master controller, and is directly grasped to the master controller
Control, it is from controller that the control system 12, which controls remaining the multiple second controller 30, remaining the multiple second
Controller 30, in the master controller, carries out the processing of semiconductor from control.
When breaking down as a second controller 30 for master controller, the behaviour similar with the last period is repeated
Make, it is master controller that another second controller 30, which is arranged, carries out the processing of semiconductor.
In other embodiments, when first controller 20 breaks down, first data can also still be kept
The first switching element 60 between access interface 21 and the terminal data interface 13 is open state.
The semiconductor machining system of the technical program embodiment, including first controller 20 and multiple second controls
Device 30, each second controller 30 not only can be in the first controller 20 (initial master controller) normal operations
When, be controlled by first controller 20 (initial master controller) as from controller, can also in master controller fault,
One of that master controller is used as to carry out control operation, other second controllers 30 are still used as from controller, not
It can be reduced to the greatest extent because of main control because master controller fault, which occurs, leads to the situation that can not also operate from controller
It is lost caused by device failure.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (10)
1. a kind of semiconductor machining system, comprising:
Operating terminal, for controlling master controller；
One first controller；And
Multiple second controllers are serially connected with first controller；
Wherein, when original state, it is master controller that the operating terminal, which manipulates first controller, the multiple second control
Device is from controller, and the master controller is controlled by the operating terminal, described to be controlled by the master controller from controller；
When the master controller fault, the operating terminal manipulates one in the multiple second controller as main control
Device；The multiple second controller in addition to the second controller for being set to master controller is to be controlled by from controller
It is set to the second controller of master controller.
2. semiconductor machining system as described in claim 1, it is characterised in that: it further include one first wafer cassette device for loading,
The first wafer cassette device for loading is controlled by first controller.
3. semiconductor machining system as described in claim 1, it is characterised in that: further include that multiple second wafer cassettes are loaded into dress
It sets, the multiple second wafer cassette device for loading corresponds with the multiple second controller and is controlled by corresponding second control
Device processed.
4. semiconductor machining system as described in claim 1, it is characterised in that: it is porous to be provided with one on first controller
Data out splice going splice is provided with one second data access port on each second controller, and each second data connect
Inbound port is serially connected with the porous data out splice going splice.
5. semiconductor machining system as described in claim 1, it is characterised in that: the operating terminal always directly with the master
Controller is electrically connected；When original state, the operating terminal is electrically connected with first controller；When the master controller
When failure, the operating terminal is electrically connected with the second controller for being set to master controller.
6. semiconductor machining system as claimed in claim 5, it is characterised in that: the operating terminal includes that a terminal data connects
Mouthful, one first data access port is provided on first controller, and one the is additionally provided on each second controller
Three data access ports；When original state, first data access port connects with the terminal data interface；As the master
When controller failure, it is set as third data access port and the number of terminals on the second controller of main control
Connect according to interface.
7. semiconductor machining system as claimed in claim 5, it is characterised in that: the operating terminal includes multiple terminal datas
Interface is provided with one first data access port on first controller, is additionally provided with one on each second controller
Third data access port, first data access port pass through a first switching element and a terminal data interface phase
It connects, each third data access port is connected by a second switch element with a terminal data interface；Initial shape
When state, the first switching element closure, multiple second switch elements are disconnected；When the master controller fault, even
Connect the second switch element unlatching for being set as the second controller of main control.
8. semiconductor machining system as claimed in claim 7, it is characterised in that: the quantity of the terminal data interface be greater than or
Equal to first controller and the multiple second controller quantity and.
9. semiconductor machining system as claimed in claim 7, it is characterised in that: the operation control terminal includes operation interface,
The operation interface is used to manipulate the switch of the first switching element and the second switch element.
10. semiconductor machining system as claimed in claim 7, it is characterised in that: the operation control terminal includes control system,
The control system automatically controls the switch of the first switching element, the second switch element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711279701.3A CN109885016A (en) | 2017-12-06 | 2017-12-06 | Semiconductor machining system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711279701.3A CN109885016A (en) | 2017-12-06 | 2017-12-06 | Semiconductor machining system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109885016A true CN109885016A (en) | 2019-06-14 |
Family
ID=66924436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711279701.3A Pending CN109885016A (en) | 2017-12-06 | 2017-12-06 | Semiconductor machining system |
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| Country | Link |
|---|---|
| CN (1) | CN109885016A (en) |
Citations (7)
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| CN101750977A (en) * | 2008-11-27 | 2010-06-23 | 细美事有限公司 | System and method for controlling semiconductor manufacturing equipment using user interface |
| CN101916217A (en) * | 2010-08-04 | 2010-12-15 | 中兴通讯股份有限公司 | Method, control device and system for switching a plurality of controllers |
| CN103076772A (en) * | 2012-12-20 | 2013-05-01 | 光达光电设备科技（嘉兴）有限公司 | Semiconductor production system |
| CN104283710A (en) * | 2014-08-18 | 2015-01-14 | 四川长虹电器股份有限公司 | Database cluster fault handling method and management server |
| CN104679710A (en) * | 2013-11-28 | 2015-06-03 | 中国科学院沈阳自动化研究所 | Software fault quick recovery method for semiconductor production line transportation system |
| CN105841305A (en) * | 2016-04-20 | 2016-08-10 | 珠海格力电器股份有限公司 | Device group control system |
-
2017
- 2017-12-06 CN CN201711279701.3A patent/CN109885016A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09144714A (en) * | 1995-11-24 | 1997-06-03 | Hitachi Ltd | Overload prevention method, device and semiconductor manufacturing device using thereof |
| CN101750977A (en) * | 2008-11-27 | 2010-06-23 | 细美事有限公司 | System and method for controlling semiconductor manufacturing equipment using user interface |
| CN101916217A (en) * | 2010-08-04 | 2010-12-15 | 中兴通讯股份有限公司 | Method, control device and system for switching a plurality of controllers |
| CN103076772A (en) * | 2012-12-20 | 2013-05-01 | 光达光电设备科技（嘉兴）有限公司 | Semiconductor production system |
| CN104679710A (en) * | 2013-11-28 | 2015-06-03 | 中国科学院沈阳自动化研究所 | Software fault quick recovery method for semiconductor production line transportation system |
| CN104283710A (en) * | 2014-08-18 | 2015-01-14 | 四川长虹电器股份有限公司 | Database cluster fault handling method and management server |
| CN105841305A (en) * | 2016-04-20 | 2016-08-10 | 珠海格力电器股份有限公司 | Device group control system |
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Application publication date: 20190614 |
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