CN109873000A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
- Publication number
- CN109873000A CN109873000A CN201910113925.XA CN201910113925A CN109873000A CN 109873000 A CN109873000 A CN 109873000A CN 201910113925 A CN201910113925 A CN 201910113925A CN 109873000 A CN109873000 A CN 109873000A
- Authority
- CN
- China
- Prior art keywords
- reaction solution
- layer
- display panel
- preparation
- oxide gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of display panel and preparation method thereof, and the display panel includes: flexible base board, tft layer, conductive layer and electrode.The preparation method of the display panel includes: flexible base board setting steps, tft layer and electrode preparation step, gel coating step, bending step and sintering step.The technical effects of the invention are that the problem of reducing the stress that display panel is generated by bending, avoiding the occurrence of metallic film fracture.
Description
Technical field
The present invention relates to field of display, in particular to a kind of display panel and preparation method thereof.
Background technique
Display panel improves screen accounting, often by driving circuit section to reduce the length of frame in the prior art
It is folded into the bottom of display area, as shown in Figure 1, 2, existing display panel includes: flexible base board 100, tft layer
200, plain conductor 300 and flexible circuit board 400.The part that plain conductor 300 is pasted on flexible base board 100 is bent to display
The bottom in region, the flexible circuit board 400 equipped with integrated circuit unit are electrically connected to plain conductor 300 and are bent to display area bottom
The one end in portion forms the circuit connection of display panel.
However, plain conductor 300 during bending often because caused by plain conductor stress is excessive resistance increase, or even meeting
It is in the presence of being broken, so that the service life of plain conductor greatly shortens, is greatly shortened so as to cause the service life of display panel.
Summary of the invention
It is an object of the present invention to solve that plain conductor stress existing in the prior art is excessive, flexible base board bending is led
The metallic film fracture of cause influences the technical problems such as display effect.
To achieve the above object, the present invention provides a kind of display panel, comprising: flexible base board is divided into sequentially connected
First, second and third portion；Tft layer is attached at the surface of first side；Conductive layer is set to described
The surface of second and third portion side；And electrode, it is attached at first surface；One end is electrically connected to institute
Tft layer is stated, the other end is electrically connected to the conductive layer.
Further, the conductive layer includes gel layer, is attached at the surface of described second and third portion side,
And it is electrically connected to the electrode.
Further, the display panel further includes flexible circuit board, is equipped with an integrated circuit unit, is electrically connected to institute
State gel layer.
Further, the conductive layer includes metal carbonyl conducting layer, is attached at described second and third portion side
Surface, and it is electrically connected to the electrode；And gel layer, it is attached at the surface of the metal conducting layer side, and with described
Two corresponding.
Further, the display panel further includes flexible circuit board, is equipped with an integrated circuit unit, is electrically connected to institute
State metal conducting layer.
To achieve the above object, the present invention also provides a kind of preparation methods of display panel, include the following steps: flexible base
Plate setting steps provide a flexible base board, are divided into sequentially connected first, second and third portion；Tft layer
And electrode preparation step, a tft layer and an electrode are prepared in first upper surface of the flexible base board；Oxygen
Compound gel coating step is coated with oxide gel in second of the flexible base board, third portion and the electrode top；
Step is bent, bends the flexible base board, so that the third portion is parallel to described first, and second generation is curved
Folding；And sintering step, it is sintered the flexible base board, forms monoxide gel layer.
It further, further include following steps before the oxide gel application step；Oxide gel preparation step
Suddenly, oxide gel is prepared；The oxide gel preparation step includes: the first reaction solution preparation step, and indium nitrate is molten
Value 1/50~1/65 is added in a container in molar ratio for liquid and acetylacetone,2,4-pentanedione solution, forms one first reaction solution；Heating stepses, water
Bathe the first reaction solution described in heating stirring；Tin tetrachloride solution is dissolved in ethanol solution, forms one by the second reaction solution preparation step
Second reaction solution；Step is shaken, is shaken second reaction solution 10~20 minutes；Third reaction solution preparation step, in a reservoir
First reaction solution, second reaction solution and ethanolamine solutions are poured into, a third reaction solution is formed；Oxide sol preparation
Step, third reaction solution described in 60 DEG C~100 DEG C heating water baths, heating time are 20~40 minutes, obtain oxide sol；With
And oxide gel forming step, the oxide sol is set in the paraffin that temperature is 100 DEG C~150 DEG C, reaction 2~3
Hour, form oxide gel.
It further, further include following steps after the sintering step: flexible circuit board bonding step, bonding one
Flexible circuit board to partial oxide gel layer corresponding with the third portion, the flexible circuit board is equipped with an integrated circuit
Unit.
Further, it in the sintering step, is sintered in an oven, the oven straight air or oxygen；
Sintering range in the oven is 300 DEG C~500 DEG C；And/or the sintering time in the oven is 1~2 small
When.
To achieve the above object, the present invention also provides a kind of preparation methods of display panel, include the following steps: flexible base
Plate setting steps provide a flexible base board, are divided into sequentially connected first, second and third portion；Tft layer
And electrode preparation step, a tft layer and an electrode are prepared in first upper surface of the flexible base board；Gold
Belong to conductor layer preparation step, prepares a metal carbonyl conducting layer, and electricity in second of the flexible base board and third portion upper surface
It is connected to the electrode；Oxide gel application step is coated with oxide gel in the upper surface of the metal carbonyl conducting layer；Bending
Step bends the flexible base board, so that the third portion is parallel to described first, and described second bends；With
And sintering step, it is sintered the flexible base board, forms monoxide gel layer.
It further, further include following steps before the oxide gel application step；Oxide gel preparation step
Suddenly, oxide gel is prepared；The oxide gel preparation step includes: the first reaction solution preparation step, and indium nitrate is molten
Value 1/50~1/65 is added in a container in molar ratio for liquid and acetylacetone,2,4-pentanedione solution, forms one first reaction solution；Heating stepses, will
First reaction solution, which is placed on magnetic stirring apparatus, carries out heating water bath；Second reaction solution preparation step, by tin tetrachloride solution
It is dissolved in suitable ethanol solution, forms one second reaction solution；Shake step, using the second reaction solution 10 described in ultrasonic oscillation~
20 minutes；It is molten to pour into first reaction solution, second reaction solution and ethanol amine in a reservoir for third reaction solution preparation step
Liquid forms a third reaction solution；The third reaction solution is placed in 80 DEG C~100 DEG C water and adds by oxide sol preparation step
Heat, heating time are 20~40 minutes, obtain oxide sol；And oxide gel forming step, the oxide is molten
Glue is set in the paraffin that temperature is 100 DEG C~150 DEG C, is reacted 2~3 hours, and oxide gel is formed.
It further, further include following steps after the sintering step: flexible circuit board bonding step, bonding one
Flexible circuit board to partial oxide gel layer corresponding with the third portion, the flexible circuit board is equipped with an integrated circuit
Unit.
Further, it in the sintering step, is sintered in an oven, the oven straight air or oxygen；
Sintering range in the oven is 300 DEG C~500 DEG C；And/or the sintering time in the oven is 1~2 small
When.
The technical effects of the invention are that plain conductor in the prior art is changed to the conductive layer of gel quality, so that
Situations such as when bending excessive resistance, conductive fault rupture will not occur for conductive layer；When in the outside of existing plain conductor
After face adds oxide gel, when so that phenomenon of rupture occurring for the bending part of metal carbonyl conducting layer, it is covered on the plain conductor
The oxide gel layer of the top of layer can be filled and be covered in time, can shape after the oxide gel layer, which is sintered, to form a film
At good conductive layer, guarantees that electric conductivity is good, enhance the stress of conductive layer, improve the yield of display panel.
Detailed description of the invention
Fig. 1 is the structural schematic diagram after display panel bonding in the prior art；
Fig. 2 is the structural schematic diagram after display panel bending in the prior art；
Fig. 3 is the structural schematic diagram of display panel described in the embodiment of the present invention 1；
Fig. 4 is the division schematic diagram of flexible base board described in the embodiment of the present invention 1；
Fig. 5 is the flow chart of the preparation method of display panel described in the embodiment of the present invention 1；
Fig. 6 is tft layer described in the embodiment of the present invention 1 and the structural schematic diagram after electrode preparation step；
Fig. 7 is the flow chart of oxide gel preparation step described in the embodiment of the present invention 1；
Fig. 8 is the structural schematic diagram after oxide gel application step described in the embodiment of the present invention 1；
Fig. 9 is the structural schematic diagram after sintering step described in the embodiment of the present invention 1；
Figure 10 is the structural schematic diagram of display panel described in the embodiment of the present invention 2；
Figure 11 is the division schematic diagram of flexible base board described in the embodiment of the present invention 2；
Figure 12 is the flow chart of the preparation method of display panel described in the embodiment of the present invention 2；
Figure 13 is the structural schematic diagram after metal carbonyl conducting layer preparation step described in the embodiment of the present invention 2；
Figure 14 is the flow chart of oxide gel preparation step described in the embodiment of the present invention 2；
Figure 15 is the structural schematic diagram after oxide gel application step described in the embodiment of the present invention 2；
Figure 16 is the structural schematic diagram after sintering step described in the embodiment of the present invention 2.
Members mark is as follows:
100, flexible base board, 200, tft layer；300, plain conductor；400, flexible circuit board；
1, flexible base board；11, first；12, second；13, third portion；
2, tft layer；
31, oxide gel layer；32, metal carbonyl conducting layer；
4, electrode；
5, flexible circuit board.
Specific embodiment
Below in conjunction with Figure of description, the preferred embodiments of the present invention are described in detail, with complete to those of skill in the art
It is whole to introduce technology contents of the invention, prove that the present invention can be implemented with citing, so that technology contents disclosed by the invention are more
It is clear, so that will more readily understand how implement the present invention by those skilled in the art.However the present invention can pass through many differences
The embodiment of form emerges from, and protection scope of the present invention is not limited only to the embodiment mentioned in text, Examples below
The range that is not intended to limit the invention of explanation.
The direction term that the present invention is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", "
Side " etc. is only the direction in attached drawing, and direction term used herein is of the invention for explanation and illustration, rather than is used
To limit the scope of protection of the present invention.
In the accompanying drawings, the identical component of structure is indicated with same numbers label, everywhere the similar component of structure or function with
Like numeral label indicates.In addition, in order to facilitate understanding and description, the size and thickness of each component shown in the drawings are any
It shows, the present invention does not limit the size and thickness of each component.
When certain components, when being described as " " another component "upper", the component can be placed directly within described another group
On part；There may also be an intermediate module, the component is placed on the intermediate module, and the intermediate module is placed in another group
On part.When a component is described as " installation is extremely " or " being connected to " another component, the two can be understood as direct " installation "
Or " connection " or a component pass through an intermediate module " installation is extremely " or " being connected to " another component.
Embodiment 1
As shown in figure 3, the present invention provides a kind of display panel, comprising: flexible base board 1, tft layer 2, conductive layer,
Electrode 4 and flexible circuit board 5.
As shown in figure 4, flexible base board 1 is divided into sequentially connected first 11, second 12 and third portion 13.Wherein,
It is parallel to each other with third portion 13 for first 11, second 12 is bending part.
Tft layer 2 is attached at first 12 upper surface of flexible base board 1.
In the present embodiment, the conductive layer includes oxide gel layer 31.
Oxide gel layer 31 is attached at second 12 outer surface and the lower surface in third portion 13 of flexible base board 1.Oxygen
Compound gel layer 31 is the indium tin oxide films of gel quality, is had good conductive property, meanwhile, oxide gel layer 31
Gel material elasticity is good, cushion performance is good, has good stress when being bent.It is not likely to produce oxidation in the process of bending
The phenomenon that object gel fault rupture, improve the yield of display panel.
Electrode 4 is attached at first 11 upper surface of flexible base board 1, and one end is electrically connected to tft layer 2,
The other end is electrically connected to oxide gel layer 31, guarantees the electric connection between tft layer and oxide gel layer.
Flexible circuit board 5 is electrically connected to oxide gel layer 31, and flexible circuit board 5 is set to the third portion of flexible base board 1
The lower surface of 13 one end, flexible circuit board 5 is equipped with integrated circuit unit 51, and it is brilliant to constitute flexible circuit board, conductive layer and film
The electric connection of body tube layer guarantees that the circuit of display panel is complete, to guarantee the display effect of display panel.
Display panel described in the present embodiment has technical effect that, the plain conductor in existing display panel is changed to coagulate
The oxide gel layer on colloid ground, the gel material elasticity of oxide gel layer is good, cushion performance is good, has when being bent
Good stress.Under the premise of guaranteeing that electric conductivity is good, enhance the stress of oxide gel layer, it is solidifying to avoid the occurrence of oxide
The phenomenon that glue-line bending part resistance is excessive, fracture, improves the yield of display panel.
As shown in figure 5, the present embodiment also provides a kind of preparation method of display panel, including step S1~S7.
S1 flexible base board setting steps, provide a flexible base board, the flexible base board be divided into sequentially connected first,
Second and third portion.
It is thin to prepare one in first upper surface of the flexible base board for S2 tft layer and electrode preparation step
Film transistor layer and an electrode, one end of the electrode are electrically connected to the tft layer (referring to Fig. 6).
S3 oxide gel preparation step, prepares monoxide gel, and the gel preparation step includes the following steps
S31~S37 (referring to Fig. 7).
S31 the first reaction solution preparation step, by nitric acid solution of indium and acetylacetone,2,4-pentanedione solution value 1/50~1/65 in molar ratio
It is added in a container, the molar ratio of the nitric acid solution of indium and the acetylacetone,2,4-pentanedione solution is preferably 1 in the present embodiment:
58, form one first reaction solution, i.e. acetylacetone,2,4-pentanedione solution of indium.
First reaction solution is placed on magnetic stirring apparatus by S32 heating stepses, and 40 DEG C~60 DEG C of heating water bath stirs
It mixes 1~2 hour, the first reaction solution described in the heating water bath using 50 DEG C, accelerates the first reaction solution system in the present embodiment
The reaction speed of standby step.
Tin tetrachloride solution is dissolved in ethanol solution, forms one second reaction solution, i.e., by S33 the second reaction solution preparation step
Tin tetrachloride ethanol solution.
S34 shakes step, and the second reaction solution described in ultrasonic oscillation shakes 10~20 minutes, shakes in the present embodiment
15 minutes, so that the second reaction solution preparation step homogeneous reaction.
S35 third reaction solution preparation step pours into first reaction solution, second reaction solution and ethyl alcohol in a reservoir
Amine aqueous solution sufficiently forms third reaction solution after reaction, wherein the ethanolamine solutions are film forming accelerating.
S36 oxide sol preparation step, heats the third reaction solution in 60 DEG C~100 DEG C of water-bath, when heating
Between be 20~40 minutes, in the present embodiment, bath temperature be 80 DEG C, heating time be 30 minutes, obtain oxide sol.
The oxide sol is set in the paraffin that temperature is 100 DEG C~150 DEG C by S37 oxide gel forming step,
Reaction 2~3 hours, in the present embodiment, paraffin temperature are 130 DEG C, and the reaction time is 2 hours, form monoxide gel, this
When oxide gel be solid-liquid mixing, have viscosity, be convenient for subsequent oxide gel coating process.
The oxide gel is packed into coating machine platform, the of the flexible base board by S4 oxide gel application step
Two, the upper surface of third portion and the electrode be coated with the oxide gel, coater board can be used in the board,
Coater board is the coating machine platform (referring to Fig. 8) for being usually used in being coated with organic photoresists such as PI or PR, and the oxide gel has
Good electric conductivity after being connected with the electrode, guarantees the tft layer, the electrode and the oxide gel
It is electrically connected.
S5 bends step and using hot pressing bending method bends the flexible base board so that the third portion be parallel to it is described
First, and described second bends.During bending, since the oxide gel is soft and has bullet
Property, so not easy to break.
S6 sintering step is sintered in the oven of a straight air or oxygen, is burnt with 300 DEG C~500 DEG C of temperature
Tie the flexible base board 0.5~1.5 hour, in the present embodiment, sintering temperature is 400 DEG C, and the time is 1 hour, forms oxidation
Object gel layer (referring to Fig. 9).
S7 flexible circuit board bonding step, one flexible circuit board of bonding to partial oxide corresponding with the third portion
Gel layer, the flexible circuit board are equipped with an integrated circuit unit, guarantee the tft layer, the electrode, the oxygen
The electric connection of compound gel layer and the flexible circuit board.
The preparation method of display panel described in the present embodiment has technical effect that, by plain conductor in the prior art
It is changed to the oxide gel layer of gel quality, oxide gel layer has good electric conductivity.The gel material of oxide gel layer
Matter has good elasticity and resiliency, and the stress of oxide gel layer is good when being bent, and is less prone to resistance and increases, aoxidizes
The phenomenon that object gel layer bending part is broken, improves the yield of display panel.
Embodiment 2
As shown in Figure 10, the present embodiment provides a kind of display panels, comprising: flexible base board 1, tft layer 2, conduction
Layer, electrode 4 and flexible circuit board 5.
As shown in figure 11, flexible base board 1 is divided into sequentially connected first 11, second 12 and third portion 13.Wherein,
It is parallel to each other with third portion 13 for first 11, second 12 is bending part.
Tft layer 2 is attached at first 12 upper surface of flexible base board 1.
In the present embodiment, the conductive layer includes metal carbonyl conducting layer 32 and oxide gel layer 31.
Metal carbonyl conducting layer 32 is attached at second 12 outer surface and the lower surface in third portion 13 of flexible base board 1, oxidation
Object gel layer 31 is attached at the outer surface of metal carbonyl conducting layer 32, and oxide gel layer 31 is 12 corresponding with second.
Oxide gel layer 31 is the indium tin oxide films of gel quality, has good electric conductivity.Work as metal carbonyl conducting layer
Bending part occur phenomenon of rupture when, the oxide gel layer for being covered on the top of the metal carbonyl conducting layer can be filled out in time
It fills and covers, after the oxide gel layer, which is sintered, to form a film, good conductive layer can be formed, it is good to guarantee that display panel has
Electric conductivity, improve the yield of display panel.
Electrode 4 is attached at first 11 upper surface of flexible base board 1, and one end is electrically connected to tft layer 2,
The other end is electrically connected to metal carbonyl conducting layer 32, guarantees the electric connection between tft layer and conductive layer.
Flexible circuit board 5 is electrically connected to oxide gel layer 31, and flexible circuit board 5 is set to the third portion of flexible base board 1
The lower surface of 13 one end, flexible circuit board 5 is equipped with integrated circuit unit 51, and it is brilliant to constitute flexible circuit board, conductive layer and film
The electric connection of body tube layer guarantees that the circuit of display panel is complete, to guarantee the display effect of display panel.
Display panel described in the present embodiment has technical effect that, the outer surface of metal carbonyl conducting layer in the prior art
Increase oxide gel layer, oxide gel layer has good conductive property.When the bending part of metal carbonyl conducting layer occurs to break
When splitting phenomenon, the oxide gel for being covered on the top of the metal carbonyl conducting layer can be filled and be covered in time, will not be made
At the excessive problem of resistance.After the oxide gel, which is sintered, to form a film, good conductive layer can be formed, guarantees that electric conductivity is good
It is good, enhance the stress of conductive layer, improves the yield of display panel.
As shown in figure 12, the present embodiment also provides a kind of preparation method of display panel, including step S101~S108.
S101 flexible base board setting steps, provide a flexible base board, and the flexible base board is divided into sequentially connected first
Portion, second and third portion.
S102 tft layer and electrode preparation step prepare one in first upper surface of the flexible base board
Tft layer and an electrode, one end of the electrode are electrically connected to the tft layer.
S103 metal carbonyl conducting layer preparation step prepares a gold medal in second of the flexible base board and third portion upper surface
Belong to conductor layer, and be electrically connected to the electrode (referring to Figure 13), after the metal carbonyl conducting layer is connected with the electrode, described in guarantee
Electric connection between tft layer, the electrode and the metal carbonyl conducting layer.
S104 oxide gel preparation step, prepares monoxide gel, and the gel preparation step includes following step
Rapid S141~S147 (referring to Figure 14).
S141 the first reaction solution preparation step, by nitric acid solution of indium and acetylacetone,2,4-pentanedione solution value 1/50~1/65 in molar ratio
It is added in a container, the molar ratio of the nitric acid solution of indium and the acetylacetone,2,4-pentanedione solution is preferably 1 in the present embodiment:
58, form one first reaction solution, i.e. acetylacetone,2,4-pentanedione solution of indium.
First reaction solution is placed on magnetic stirring apparatus by S142 heating stepses, 40 DEG C~60 DEG C of heating water bath
Stirring 1~2 hour, the first reaction solution described in the heating water bath using 50 DEG C, accelerates first reaction solution in the present embodiment
The reaction speed of preparation step.
Tin tetrachloride solution is dissolved in ethanol solution, forms one second reaction solution, i.e., by S143 the second reaction solution preparation step
Tin tetrachloride ethanol solution.
S144 shakes step, and the second reaction solution described in ultrasonic oscillation shakes 10~20 minutes, shakes in the present embodiment
15 minutes, so that the second reaction solution preparation step homogeneous reaction.
S145 third reaction solution preparation step pours into first reaction solution, second reaction solution and second in a reservoir
Alkanolamine solution sufficiently forms third reaction solution after reaction, wherein the ethanolamine solutions are film forming accelerating.
S146 oxide sol preparation step, heats the third reaction solution in 60 DEG C~100 DEG C of water-bath, when heating
Between be 20~40 minutes, in the present embodiment, bath temperature be 80 DEG C, heating time be 30 minutes, obtain oxide sol.
The oxide sol is set to the paraffin that temperature is 100 DEG C~150 DEG C by S147 oxide gel forming step
In, it reacts 2~3 hours, in the present embodiment, paraffin temperature is 130 DEG C, and the reaction time is 2 hours, and it is solidifying to form monoxide
Glue, oxide gel at this time are solid-liquid mixing, have viscosity, are convenient for subsequent oxide gel coating process.
The oxide gel is packed into coating machine platform, in the metal carbonyl conducting layer by S105 oxide gel application step
It is coated with the oxide gel with the upper surface of second corresponding part, coater board can be used in the board,
Coater board is the coating machine platform for being usually used in being coated with organic photoresists such as PI or PR (referring to Figure 15).
S106 bends step and bends the flexible base board using hot pressing bending method, so that the third portion is parallel to institute
First is stated, and described second bends.During bending, what the metal carbonyl conducting layer may be broken shows
As, since the oxide gel is soft and has viscosity, so, the oxide gel above the metal carbonyl conducting layer is just
The part of good filling and covering fracture, the oxide gel have good electric conductivity, guarantee the metal carbonyl conducting layer and institute
State the electric connection between oxide gel.
S107 sintering step is sintered in the oven of a straight air or oxygen, with 300 DEG C~500 DEG C of temperature
It is sintered the flexible base board 0.5~1.5 hour, in the present embodiment, sintering temperature is 400 DEG C, and the time is 1 hour, forms oxygen
Compound gel layer (referring to Figure 16).
S108 flexible circuit board bonding step, one flexible circuit board of bonding to part metals corresponding with the third portion
Conductor layer, the flexible circuit board are equipped with an integrated circuit unit, guarantee the tft layer, the electrode, the gold
Belong to the electric connection of conductor layer, the oxide gel layer and the flexible circuit board, so that display panel has good lead
Electrical property.
The preparation method of display panel described in the present embodiment has technical effect that, leads in the metal of existing display panel
The lateral surface of line layer increases monoxide gel layer, and the oxide gel layer has good electric conductivity.Work as metal carbonyl conducting layer
Bending part occur phenomenon of rupture when, the oxide gel for being covered on the top of the metal carbonyl conducting layer can be filled in time
And covering can form good conductive layer after the oxide gel, which is sintered, to form a film, and guarantee that electric conductivity is good, enhancing is led
The stress of electric layer improves the yield of display panel.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (13)
1. a kind of display panel characterized by comprising
Flexible base board is divided into sequentially connected first, second and third portion；
Tft layer is attached at the surface of first side；
Conductive layer, set on described second and the surface of third portion side；And
Electrode is attached at first surface；One end is electrically connected to the tft layer, other end electrical connection
To the conductive layer.
2. display panel as described in claim 1, which is characterized in that the conductive layer includes
Gel layer, is attached at the surface of described second and third portion side, and is electrically connected to the electrode.
3. display panel as claimed in claim 2, which is characterized in that further include
Flexible circuit board is equipped with an integrated circuit unit, is electrically connected to the gel layer.
4. display panel as described in claim 1, which is characterized in that the conductive layer includes
Metal carbonyl conducting layer, is attached at the surface of described second and third portion side, and is electrically connected to the electrode；And
Gel layer is attached at the surface of the metal conducting layer side, and corresponding with described second.
5. display panel as claimed in claim 4, which is characterized in that further include
Flexible circuit board is equipped with an integrated circuit unit, is electrically connected to the metal conducting layer.
6. a kind of preparation method of display panel, which comprises the steps of:
Flexible base board setting steps provide a flexible base board, are divided into sequentially connected first, second and third portion；
Tft layer and electrode preparation step prepare a film crystal in first upper surface of the flexible base board
Tube layer and an electrode；
Oxide gel application step, in second of the flexible base board, third portion and electrode top coating oxidation
Object gel；
Step is bent, the flexible base board is bent, so that the third portion is parallel to described first, and second generation
Bending；And
Sintering step is sintered the flexible base board, forms monoxide gel layer.
7. the preparation method of display panel as claimed in claim 6, which is characterized in that
It further include following steps before the oxide gel application step；
Oxide gel preparation step, prepares oxide gel；
The oxide gel preparation step includes:
First reaction solution preparation step holds nitric acid solution of indium and the acetylacetone,2,4-pentanedione solution addition of value 1/50~1/65 in molar ratio one
In device, one first reaction solution is formed；
Heating stepses, heating water bath stir first reaction solution；
Tin tetrachloride solution is dissolved in ethanol solution, forms one second reaction solution by the second reaction solution preparation step；
Step is shaken, is shaken second reaction solution 10~20 minutes；
Third reaction solution preparation step pours into first reaction solution, second reaction solution and ethanolamine solutions in a reservoir,
Form a third reaction solution；
Oxide sol preparation step, third reaction solution described in 60 DEG C~100 DEG C heating water baths, heating time are 20~40 points
Clock obtains oxide sol；And
The oxide sol is set in the paraffin that temperature is 100 DEG C~150 DEG C by oxide gel forming step, and reaction 2~
3 hours, form oxide gel.
8. the preparation method of display panel as claimed in claim 6, which is characterized in that
Further include following steps after the sintering step:
Flexible circuit board bonding step, one flexible circuit board of bonding to partial oxide gel corresponding with the third portion
Layer, the flexible circuit board are equipped with an integrated circuit unit.
9. the preparation method of display panel as claimed in claim 6, which is characterized in that
In the sintering step,
It is sintered in an oven, the oven straight air or oxygen；
Sintering range in the oven is 300 DEG C~500 DEG C；And/or
Sintering time in the oven is 1~2 hour.
10. a kind of preparation method of display panel, which comprises the steps of:
Flexible base board setting steps provide a flexible base board, are divided into sequentially connected first, second and third portion；
Tft layer and electrode preparation step prepare a film crystal in first upper surface of the flexible base board
Tube layer and an electrode；
Metal carbonyl conducting layer preparation step prepares a plain conductor in second of the flexible base board and third portion upper surface
Layer, and it is electrically connected to the electrode；
Oxide gel application step is coated with oxide gel in the upper surface of the metal carbonyl conducting layer；
Step is bent, the flexible base board is bent, so that the third portion is parallel to described first, and second generation
Bending；And
Sintering step is sintered the flexible base board, forms monoxide gel layer.
11. the preparation method of display panel as claimed in claim 10, which is characterized in that
It further include following steps before the oxide gel application step；
Oxide gel preparation step, prepares oxide gel；
The oxide gel preparation step includes:
First reaction solution preparation step holds nitric acid solution of indium and the acetylacetone,2,4-pentanedione solution addition of value 1/50~1/65 in molar ratio one
In device, one first reaction solution is formed；
First reaction solution is placed on magnetic stirring apparatus and carries out heating water bath by heating stepses；
Tin tetrachloride solution is dissolved in suitable ethanol solution, forms one second reaction solution by the second reaction solution preparation step；
Step is shaken, the second reaction solution 10~20 minutes described in ultrasonic oscillation are utilized；
Third reaction solution preparation step pours into first reaction solution, second reaction solution and ethanolamine solutions in a reservoir,
Form a third reaction solution；
The third reaction solution is placed in 80 DEG C~100 DEG C water and heats by oxide sol preparation step, heating time be 20~
40 minutes, obtain oxide sol；And
The oxide sol is set in the paraffin that temperature is 100 DEG C~150 DEG C by oxide gel forming step, and reaction 2~
3 hours, form oxide gel.
12. the preparation method of display panel as claimed in claim 10, which is characterized in that
Further include following steps after the sintering step:
Flexible circuit board bonding step, one flexible circuit board of bonding to partial oxide gel corresponding with the third portion
Layer, the flexible circuit board are equipped with an integrated circuit unit.
13. the preparation method of display panel as claimed in claim 10, which is characterized in that
In the sintering step,
It is sintered in an oven, the oven straight air or oxygen；
Sintering range in the oven is 300 DEG C~500 DEG C；And/or
Sintering time in the oven is 1~2 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910113925.XA CN109873000B (en) | 2019-02-14 | 2019-02-14 | Display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910113925.XA CN109873000B (en) | 2019-02-14 | 2019-02-14 | Display panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109873000A true CN109873000A (en) | 2019-06-11 |
| CN109873000B CN109873000B (en) | 2021-03-23 |
Family
ID=66918737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910113925.XA Active CN109873000B (en) | 2019-02-14 | 2019-02-14 | Display panel and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109873000B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021058009A1 (en) * | 2019-09-29 | 2021-04-01 | 歌尔股份有限公司 | Conductive film for sound production device and sound production device |
| WO2021068413A1 (en) * | 2019-10-12 | 2021-04-15 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN113270039A (en) * | 2021-05-20 | 2021-08-17 | 昆山国显光电有限公司 | Display module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9455421B2 (en) * | 2013-11-21 | 2016-09-27 | Atom Nanoelectronics, Inc. | Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays |
| CN107274793A (en) * | 2017-08-23 | 2017-10-20 | 合肥同诺文化科技有限公司 | Flexible display screen and the electronic equipment with the display screen |
| CN107935408A (en) * | 2017-12-16 | 2018-04-20 | 西安理工大学 | A kind of cladding electrochomeric films and preparation method thereof |
| CN107977116A (en) * | 2017-12-15 | 2018-05-01 | 武汉华星光电半导体显示技术有限公司 | Flexible contact panel, touching display screen and touch control display apparatus |
| CN108231800A (en) * | 2018-02-02 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of flexible display panels and preparation method thereof, display device |
| CN108681123A (en) * | 2018-05-21 | 2018-10-19 | 京东方科技集团股份有限公司 | Liquid crystal display substrate and display device |
| US20180335659A1 (en) * | 2017-05-22 | 2018-11-22 | Asahi Glass Company, Limited | Transparent substrate with antifouling film and capacitance in-cell touch panel-type liquid crystal display device |
-
2019
- 2019-02-14 CN CN201910113925.XA patent/CN109873000B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9455421B2 (en) * | 2013-11-21 | 2016-09-27 | Atom Nanoelectronics, Inc. | Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays |
| US20180335659A1 (en) * | 2017-05-22 | 2018-11-22 | Asahi Glass Company, Limited | Transparent substrate with antifouling film and capacitance in-cell touch panel-type liquid crystal display device |
| CN107274793A (en) * | 2017-08-23 | 2017-10-20 | 合肥同诺文化科技有限公司 | Flexible display screen and the electronic equipment with the display screen |
| CN107977116A (en) * | 2017-12-15 | 2018-05-01 | 武汉华星光电半导体显示技术有限公司 | Flexible contact panel, touching display screen and touch control display apparatus |
| CN107935408A (en) * | 2017-12-16 | 2018-04-20 | 西安理工大学 | A kind of cladding electrochomeric films and preparation method thereof |
| CN108231800A (en) * | 2018-02-02 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of flexible display panels and preparation method thereof, display device |
| CN108681123A (en) * | 2018-05-21 | 2018-10-19 | 京东方科技集团股份有限公司 | Liquid crystal display substrate and display device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021058009A1 (en) * | 2019-09-29 | 2021-04-01 | 歌尔股份有限公司 | Conductive film for sound production device and sound production device |
| WO2021068413A1 (en) * | 2019-10-12 | 2021-04-15 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| US11778872B2 (en) | 2019-10-12 | 2023-10-03 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel |
| CN113270039A (en) * | 2021-05-20 | 2021-08-17 | 昆山国显光电有限公司 | Display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109873000B (en) | 2021-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109873000A (en) | Display panel and preparation method thereof | |
| JP6440756B2 (en) | Sheet glass provided with electrical connection member and compensation plate, method for producing sheet glass, and use of sheet glass | |
| CN110277018A (en) | Display panel and preparation method thereof | |
| CN1316509C (en) | Conductor composition and method for production thereof | |
| ES2294554T3 (en) | FUNCTIONAL PASTE | |
| JP3873478B2 (en) | Liquid crystal display device, electronic device, and method of manufacturing liquid crystal display device | |
| TW200524503A (en) | Electronic device and method for producing the same | |
| JP2006348160A (en) | Electrically-conductive ink | |
| CN102394179A (en) | Solid Electrolytic Capacitor | |
| CN106475702A (en) | A kind of limit for height type preformed soldering | |
| CN105723506A (en) | Through electrode and method for producing multilayer substrate using through electrode | |
| CN105367128B (en) | It is a kind of to be suitable for the preparation technology that alumina ceramic face applies copper metallization | |
| WO2001044373A1 (en) | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module | |
| CN108289390A (en) | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument | |
| CN108886871A (en) | Wiring body component, Wiring structure body and touch sensor | |
| CN104049390B (en) | Display module and display device | |
| CN107876934A (en) | Solder(ing) paste agitating device is used in a kind of computer motherboard production | |
| CN111040691B (en) | Multi-component metal conductive adhesive based on different melting points and preparation method thereof | |
| CN113341601B (en) | Preparation method of display panel and display panel | |
| JP2000094180A (en) | Activated brazing filler metal paste capable of screen printing, manufacture of the same, manufacture of activated brazing filler metal-bonding, and method for brazing with activated brazing filler metal | |
| US20130242244A1 (en) | Methods and apparatus for electrically connecting a substrate and electrically conductive glass | |
| JPH09182189A (en) | Piezoelectric diaphragm | |
| CN207642454U (en) | A kind of computer motherboard production solder(ing) paste agitating device | |
| CN107179099A (en) | Sensor construction and preparation method thereof | |
| JPH0512916A (en) | Conductive particle of anisotropic conductive adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |