CN109872685A - Display panel and its manufacturing method, display device - Google Patents

Display panel and its manufacturing method, display device Download PDF

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Publication number
CN109872685A
CN109872685A CN201910273195.XA CN201910273195A CN109872685A CN 109872685 A CN109872685 A CN 109872685A CN 201910273195 A CN201910273195 A CN 201910273195A CN 109872685 A CN109872685 A CN 109872685A
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China
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sub
pix
luminescence unit
conducting wire
equivalent resistance
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CN201910273195.XA
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CN109872685B (en
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马玲玲
刘祺
刘亮亮
彭利满
蒙晓东
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Abstract

This application discloses a kind of display panel and its manufacturing methods, display device, belong to field of display technology.The display panel includes: multiple pixel regions of array arrangement, multiple sub-pixes are formed in each pixel region, the luminescent color of multiple sub-pixes is different, sub-pix includes: luminescence unit and pixel circuit, pixel circuit includes driving element, and driving element is used to provide driving luminescence unit luminous driving current to luminescence unit;Sub-pix is electrically connected with power end, and driving current is obtained based on the power supply signal that power end provides, and the equivalent resistance accounting of driving element and the material emission service life of the material of luminescence unit in same sub-pix are negatively correlated in sub-pix.Present application addresses shorten the service life of luminescence unit, and then influence the service life of display device when the driving current for driving transistor to provide to luminescence unit is lower.The application is for showing image.

Description

Display panel and its manufacturing method, display device
Technical field
This application involves field of display technology, in particular to a kind of display panel and its manufacturing method, display device.
Background technique
Organic electroluminescent LED (organic light emitting diode;OLED) display device has spontaneous The features such as light and low-power consumption, therefore it is widely used in display field.
In the related technology, OLED display includes multiple sub-pixes.Each sub-pix generally includes: luminescence unit and drive Dynamic transistor.Wherein, driving transistor is electrically connected with power end and luminescence unit respectively by conducting wire.Power end is used for driving Transistor provides voltage;Transistor is driven to be used to provide driving current to luminescence unit, to drive luminescence unit to shine.
When the driving current for driving transistor to provide to luminescence unit is lower, the aging of luminescence unit can be accelerated, shortened The service life of luminescence unit, influences the service life of display device.
Summary of the invention
This application provides a kind of display panel and its manufacturing methods, display device, can solve the relevant technologies when driving It is described the problem of the problem of influencing the service life of display device when the driving current that transistor is provided to luminescence unit is lower Technical solution is as follows:
In a first aspect, providing a kind of display panel, the display panel includes: multiple pixel regions of array arrangement, Multiple sub-pixes are formed in each pixel region, the luminescent color of the multiple sub-pix is different, and the sub-pix includes: hair Light unit and pixel circuit, the pixel circuit include driving element, and the driving element is used to provide to the luminescence unit The driving current for driving the luminescence unit luminous;
The sub-pix is electrically connected with power end, and the driving current is obtained based on the power supply signal that the power end provides Arrive, and in the sub-pix in the equivalent resistance accounting of driving element and same sub-pix the material of luminescence unit material emission Service life is negatively correlated, and the equivalent resistance accounting is the equivalent resistance of driving element and the ratio of total equivalent resistance in the sub-pix Value, total equivalent resistance are the equivalent resistance of connecting path between luminescence unit and the power end in the sub-pix.
Optionally, the display panel further include: the conducting wire in the connecting path, the equivalent resistance and mesh of the conducting wire It marks luminescent lifetime to be positively correlated, the target luminescent lifetime is the material emission service life of the luminescence unit of conducting wire connection.
Optionally, the cross-sectional area of the conducting wire and the target luminescent lifetime are negatively correlated.
Optionally, the width of the conducting wire and the target luminescent lifetime are negatively correlated, the direction at the wide place of the conducting wire It is parallel to the cross section of the conducting wire.
Optionally, the resistivity of the conducting wire and the target luminescent lifetime are positively correlated.
Optionally, which is characterized in that the equivalent resistance of driving element is identical in the multiple sub-pix.
Optionally, the amplitude for the power supply signal that the power end that the multiple sub-pix is connected provides is identical.
It optionally, include: the first sub-pix, the second sub-pix and third sub-pix in each pixel region, it is described The luminescent color of first sub-pix, second sub-pix and the third sub-pix is different;
The first object parameter of conducting wire in the power end and first sub-pix between luminescence unit, the power supply The first object parameter of conducting wire in end and second sub-pix between luminescence unit and the power end and the third The ratio of the first object parameter of conducting wire in sub-pix between luminescence unit are as follows: 2:3:4;The first object parameter is described The cross-sectional area or width of conducting wire;
Alternatively, the second target component of the conducting wire in the power end and first sub-pix between luminescence unit, institute State the second target component and the power end and the institute of the conducting wire in power end and second sub-pix between luminescence unit State the ratio of the second target component of the conducting wire in third sub-pix between luminescence unit are as follows: 4:3:2;Second target component For the equivalent resistance or resistivity of the conducting wire.
Second aspect provides a kind of manufacturing method of display panel, for manufacturing display panel described in first aspect, The described method includes:
Multiple pixel regions of array arrangement are determined on underlay substrate, each pixel region includes multiple subpixel areas Domain, the subpixel regions are for being arranged luminescence unit and pixel circuit;
Pixel circuit is formed on the underlay substrate, the pixel circuit includes: driving element, and the driving element is used In the power supply signal provided based on power end to luminescence unit provide driving current, and in the sub-pix driving element it is equivalent The material emission service life of luminescence unit is negatively correlated in resistance accounting and same sub-pix, and the equivalent resistance accounting is the driving The ratio of the equivalent resistance of device and total equivalent resistance, total equivalent resistance is between the driving element and the power end The equivalent resistance of connecting path;
Luminescence unit is formed on the underlay substrate for being formed with the pixel circuit.
The third aspect, provides a kind of display device, and described device includes: display panel described in first aspect.
Technical solution bring beneficial effect provided by the present application includes at least:
In the application, sub-pix includes luminescence unit and pixel circuit, and pixel circuit includes driving element, the driving element Equivalent resistance accounting and same sub-pix in luminescence unit the material emission service life it is negatively correlated, compared to the relevant technologies, shine The service life and the luminescence unit that unit is determined by driving current are rendered as negatively correlated pass by the service life that material determines System enables the service life of the sub-pix of different colours in same pixel region identical as far as possible, ensure that display device Service life.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing.
Fig. 1 is a kind of structural schematic diagram of pixel region provided in an embodiment of the present invention;
Fig. 2 is a kind of structural schematic diagram of display panel provided in an embodiment of the present invention;
Fig. 3 is the structural schematic diagram of another pixel region provided in an embodiment of the present invention;
Fig. 4 is a kind of sectional view of conducting wire provided in an embodiment of the present invention;
Fig. 5 is the structural schematic diagram of another pixel region provided in an embodiment of the present invention;
Fig. 6 is a kind of flow chart of the manufacturing method of display panel provided in an embodiment of the present invention;
Fig. 7 is the flow chart of the manufacturing method of another display panel provided in an embodiment of the present invention;
Fig. 8 is a kind of partial structural diagram of display panel provided in an embodiment of the present invention;
Fig. 9 is a kind of structural schematic diagram of mask plate provided in an embodiment of the present invention;
Figure 10 is the partial structural diagram of another display panel provided in an embodiment of the present invention.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with attached drawing to the application embodiment party Formula is described in further detail.
In sub-pix the service life of luminescence unit by manufacture luminescence unit material the material emission service life and Xiang Faguang The driving current that unit provides codetermines.Wherein, the material emission service life of luminescence unit is the manufacture material by the luminescence unit The luminescence unit that the property of material is determined is capable of the duration of normal luminous, i.e., by the different luminescence units of same material manufacture The material emission service life is identical.Influence of the driving current to luminescence unit service life is showed themselves in that when to by same material system At different luminescence units different driving currents are provided respectively when, provided driving current is closer to keeping luminescence unit normal When luminous current reference value, corresponding luminescence unit is longer by the service life that driving current determines.The list correspondingly, this shines Member is longer by the service life that material and driving current codetermine.This makes the current reference value of luminescence unit normal luminous can Think a numerical value, or a numberical range, the embodiment of the present invention is to it without distinguishing.
Wherein, driving current influences the principle of the service life of luminescence unit are as follows: when the driving electricity provided to luminescence unit It, can accelerated luminescence units age when stream is not equal to current reference value.When its aging to a certain degree when, luminescence unit can not be normal It shines, i.e., the light emission luminance of the luminescence unit can not reach desired brightness.It that is to say, when the driving electricity provided to luminescence unit When stream is not equal to current reference value, the total duration that luminescence unit is capable of normal luminous can be reduced, i.e. shortening luminescence unit is by electric current The service life of decision.Herein, when current reference value is numberical range, driving current refers to not equal to current reference value Driving current is not located in the numberical range.
Display device may include multiple pixel regions, as shown in Figure 1, each pixel region may include: red sub- picture Element, green sub-pixels and blue subpixels.Each sub-pix includes: driving transistor M and luminescence unit 121.Drive transistor M Grid connect with control signal end 15, driving transistor M the first order connect with power end 13, drive transistor M second Grade is connect with one end of luminescence unit 121, and the other end of the luminescence unit 121 is connect with ground terminal 16.Wherein, transistor is driven M and power end 13, and driving transistor M are connect by conducting wire 14 with luminescence unit 121.
In the related technology, the resistance of the conducting wire of different driving transistor connection is identical, is used for the driving transistor and hair The conducting wire of light unit connection, and for the driving transistor is identical as the all-in resistance for the conducting wire that power end connects.Work as power end When the voltage provided to each sub-pix is identical, the voltage drop on the corresponding conducting wire of each sub-pix is identical, so that each Asia picture Drive the voltage drop of transistor also identical in element.At this point, the driving current size phase that driving transistor provides in different sub-pixes Together, correspondingly, the service life that luminescence unit is determined by driving current in different sub-pixes is identical.
And in the related art, the material emission that red sub-pixel, green sub-pixels and blue subpixels are determined by material Service life is different, and the material emission service life that blue subpixels are determined by material is most short, at this point, the service life of pixel unit is by this Blue subpixels are determined by the material emission service life that material determines, are unable to fully utilize red sub-pixel and green in display device Sub-pix causes the service life of display device shorter.
The embodiment of the invention provides a kind of display panels, are able to solve the above problem.Fig. 2 provides for the embodiment of the present invention A kind of display panel structural schematic diagram, as shown in Fig. 2, display panel 1 may include: multiple pixel regions of array arrangement 11, multiple sub-pixes 12 are formed in each pixel region 11, the luminescent color of multiple sub-pixes 12 is different.
Sub-pix 12 may include: luminescence unit 121 and pixel circuit 122, and pixel circuit 122 may include driving element 1221, driving element 1221 is used to provide driving luminescence unit 121 luminous driving current to luminescence unit 121.
Sub-pix is electrically connected with power end 13.For example, as shown in Fig. 2, the driving element 1221 in sub-pix can pass through Conducting wire 14 is electrically connected with the power end 13 and luminescence unit 121 respectively.Power end is used to provide power supply letter to driving element 1221 Number, the driving current which provides to luminescence unit 121 can be obtained based on the power supply signal.Illustratively, electric Source signal can be voltage.
Also, the equivalent resistance accounting of driving element 1221 and luminescence unit 121 in same sub-pix 12 in sub-pix 12 The material emission service life it is negatively correlated.Wherein, which is the equivalent resistance and total equivalent resistance of driving element 1221 Ratio.The equivalent resistance of total equivalent resistance connecting path between luminescence unit 121 and power end 13.For example, total equivalent Resistance can be equal to the equivalent resistance of the equivalent resistance of conducting wire 14 and driving element 1221 between luminescence unit 121 and power end 13 Sum.
The equivalent resistance accounting of driving element 1221 and the material of luminescence unit 121 in same sub-pix are sent out in sub-pix 12 The light service life is negatively correlated, that is to say, in same sub-pix 12, the material emission service life of luminescence unit 121 is smaller, driving element 1221 equivalent resistance accounting is bigger.When the equivalent resistance accounting of driving element 1221 is bigger, on the driving element 1221 Voltage drop accounting is also bigger, and the speed of 1221 aging of driving element is just relatively slower, enable the driving element 1221 to The total duration that luminescence unit provides the driving current for being equal to current reference value is longer.
When the total duration that driving element 1221 provides the driving current for being equal to current reference value to luminescence unit 121 is longer When, the total duration that luminescence unit 121 is capable of normal luminous is longer, correspondingly, the use that luminescence unit is determined by driving current Service life is longer.It can release: the service life that luminescence unit is determined by driving current and driving element in same sub-pix Equivalent resistance accounting is rendered as positively related relationship.
Since the equivalent resistance accounting of driving element in the material emission service life of luminescence unit and same sub-pix is negatively correlated, So that the service life presentation that the service life that luminescence unit is determined by driving current is determined with the luminescence unit by material is negative Relevant relationship.Also, since the service life of luminescence unit is from the material emission service life of manufacture luminescence unit and to luminous list The driving current that member provides codetermines, therefore, for same sub-pix, influence of the material to service life and driving current pair The influence of service life can compensate mutually, and the service life of the sub-pix of different colours in same pixel region is use up It measures identical, and the luminescence unit lasted a long time by the material emission that material determines can be efficiently used.
In conclusion sub-pix includes luminescence unit and pixel circuit in the embodiment of the present invention, pixel circuit includes driving Device, the equivalent resistance accounting of the driving element and the material emission service life of luminescence unit in same sub-pix are negatively correlated, compare In the relevant technologies, the service life that luminescence unit is determined by driving current is in by the service life that material determines with the luminescence unit Now be negative relevant relationship, enables the service life of the sub-pix of different colours in same pixel region identical as far as possible, protects The service life of display device is demonstrate,proved.
Optionally, driving element 1221 can be driving transistor, and driving transistor can be polysilicon transistors.Such as figure Shown in 2, display panel 1 can also include: control signal end 15 and ground terminal 16.At this point, grid and the control of driving transistor Signal end 15 is electrically connected, and the source electrode of transistor is driven to be electrically connected with power end 13, drives drain electrode and the luminescence unit 121 of transistor One end electrical connection, the other end of luminescence unit 121 is electrically connected with ground terminal 16.Wherein, the power supply that different sub-pixes are connected End can be identical or different, and when different sub-pixes are even connect with different electrical power end, what the power end respectively connected provided Power supply signal can also be identical or different.Wherein, the different schematic diagram of the power end that Fig. 1 and Fig. 2 is connected by different sub-pixes.
Optionally, in sub-pix in the equivalent resistance accounting of driving element and same sub-pix luminescence unit material emission The achievable mode of service life negative correlation can have a variety of.In a kind of achievable mode, driving element etc. in different sub-pixes Imitate resistance accounting difference, can by power end and the sub-pix between luminescence unit and power end conducting wire equivalent resistance It embodies.For example, the equivalent resistance of conducting wire can be with target luminescent lifetime just between luminescence unit in power end and any sub-pix It is related.The target luminescent lifetime is the material emission service life of the luminescence unit of conducting wire connection.
The equivalent resistance of conducting wire and target luminescent lifetime are positively correlated between luminescence unit and power end.At this point, in same Asia In pixel, the material emission service life of luminescence unit is smaller, and the equivalent resistance of conducting wire is smaller between luminescence unit and power end, driving The equivalent resistance of device is just relatively bigger, correspondingly, the equivalent resistance accounting of driving element is bigger.It is thereby achieved that In same sub-pix, the material emission service life of driving element equivalent resistance accounting and luminescence unit is negatively correlated.
Further, be positively correlated can be with for the equivalent resistance of the conducting wire between power end and luminescence unit and target luminescent lifetime There are many situation, the embodiment of the present invention is illustrated by taking following several situations as an example.
In the first case, the positive correlation of the equivalent resistance of conducting wire and target luminescent lifetime, can be by conducting wire Cross-sectional area and target luminescent lifetime negative correlation show.
The equivalent resistance R of conducting wire and the cross-sectional area S of conducting wire 14 meet: R=(ρ × l)/S, wherein the electricity of ρ expression conducting wire Resistance rate, l indicate the length of conducting wire.Can be seen that resistivity and length one timing when conducting wire from the relational expression, conducting wire it is equivalent The cross-sectional area of resistance and conducting wire is negatively correlated, i.e. the cross-sectional area of conducting wire is bigger, and the equivalent resistance of conducting wire is with regard to smaller.Therefore, when When the cross-sectional area and target luminescent lifetime negative correlation of conducting wire, the equivalent resistance and target luminescent lifetime of conducting wire are positively correlated.
Illustratively, Fig. 3 is a kind of structural schematic diagram of pixel region provided in an embodiment of the present invention, as shown in figure 3, the picture Plain region 11 may include: the first sub-pix 12a, the second sub-pix 12b and third sub-pix 12c, and the first sub-pix 12a, The luminescent color of second sub-pix 12b and third sub-pix 12c are different.The material of luminescence unit in first sub-pix 12a In luminescent lifetime, the second sub-pix 12b in the material emission service life of luminescence unit and third sub-pix 12c luminescence unit material Material luminescent lifetime is sequentially reduced.Cross-sectional area, the power supply of conducting wire 14 in power end and the first sub-pix 12a between luminescence unit It shines in the cross-sectional area of conducting wire 14 in end and the second sub-pix 12b between luminescence unit, power end and third sub-pix 12c The cross-sectional area of conducting wire 14 between unit is sequentially increased, at this point, in power end and the first sub-pix 12a between luminescence unit Resistance, power end and the third of conducting wire 14 in the resistance of conducting wire 14, power end and the second sub-pix 12b between luminescence unit are sub- The resistance of conducting wire 14 in pixel 12c between luminescence unit is sequentially reduced, therefore, what luminescence unit 121 was determined by driving current Service life and the luminescence unit 121 are rendered as negatively correlated relationship by the service life that material determines, so that the pixel The service life of three kinds of sub-pixes can be identical as far as possible in region 11, and can effectively utilize the first sub-pix 12a and second Sub-pix 12b.
Further, the relationship of the cross-sectional area of conducting wire and target luminescent lifetime negative correlation, can by conducting wire width with The performance of target luminescent lifetime negative correlation.
Wherein, as shown in figure 4, conducting wire 14 has certain a width W and thickness H, the cross-sectional area of conducting wire be the width with The product of thickness.When forming conducting wire, usually first on underlay substrate (or on the underlay substrate for being formed with other film layers) Forming one layer has certain thickness conductive layer, is then handled using patterning processes the conductive layer, certain to obtain having The conducting wire of pattern.At this point, direction where the width of conducting wire can it is parallel with the contact surface of underlay substrate (or other film layers) and Perpendicular to conducting wire extending direction, correspondingly, the thickness of conducting wire can be the thickness of conductive layer.The width of the conducting wire is referred to as The line width of conducting wire.
Since conducting wire is formed by a patterning processes in display device, the corresponding conducting wire of different sub-pixel units Thickness it is identical, therefore, the width W of the cross-sectional area of conducting wire and conducting wire 14 is positively correlated.Therefore, as the width W and mesh of conducting wire 14 When marking luminescent lifetime negative correlation, the cross-sectional area and target luminescent lifetime of conducting wire 14 are negatively correlated.
Alternatively, the cross-sectional area and target of conducting wire shine when the thickness difference of the corresponding conducting wire of different sub-pixel units The negative correlativing relation in service life can also be showed by the thickness and target luminescent lifetime negative correlation of conducting wire.For example, in the width of conducting wire In the case where certain, when the thickness of conducting wire and target luminescent lifetime negative correlation, the cross-sectional area and target of conducting wire may be implemented Luminescent lifetime is negatively correlated.
Optionally, the first object parameter of the conducting wire 14 in power end and the first sub-pix 12a between luminescence unit, power supply The first object parameter and power end and third sub-pix of conducting wire 14 in end and the second sub-pix 12b between luminescence unit The ratio of the first object parameter of conducting wire 14 in 12c between luminescence unit can be 2:3:4.Wherein, first object parameter can Think the cross-sectional area, width or thickness of conducting wire 14.
Illustratively, the first sub-pix can be red sub-pixel, and the second sub-pix can be green sub-pixels, third Asia picture Element can be blue subpixels.At this point, the width of the conducting wire 14 in power end and red sub-pixel between luminescence unit can be 0.2 millimeter;The width of conducting wire 14 in power end and green sub-pixels between luminescence unit can be 0.3 millimeter;Power end with The width of conducting wire 14 in blue subpixels between luminescence unit can be 0.4 millimeter.
In second situation, the equivalent resistance of conducting wire and the positive correlation of target luminescent lifetime can be by conducting wires Resistivity and target luminescent lifetime, which are positively correlated, to be showed.
The equivalent resistance R of conducting wire 14 and the electricalresistivityρ of conducting wire 14 meet: R=(ρ × l)/S.It can from the relational expression Out, when one timing of the cross-sectional area of conducting wire and length, the equivalent resistance of conducting wire and the resistivity of conducting wire are positively correlated, i.e. the electricity of conducting wire Resistance rate is bigger, and the equivalent resistance of conducting wire is bigger.Therefore, when the resistivity of conducting wire and target luminescent lifetime are positively correlated, conducting wire Equivalent resistance and target luminescent lifetime be positively correlated.
Further, it is determined due to the resistivity of conducting wire by the material of conducting wire, at this point, the sub-pix of different colours is corresponding Conducting wire is made from a different material, correspondingly, the resistivity of the corresponding conductors of the sub-pix of different colours is different.Illustratively, The first sub-pix, the second sub-pix and the third sub-pix being sequentially reduced for the material emission service life of luminescence unit, first is sub- Resistivity, the resistivity and third sub-pix of the material of the corresponding conducting wire of the second sub-pix of the material of the corresponding conducting wire of pixel The resistivity of corresponding conductor material can be sequentially reduced, so that service life that luminescence unit is determined by driving current and the hair Light unit is rendered as negatively correlated relationship by the service life that material determines, so that the service life energy of three kinds of sub-pixes It is enough identical as far as possible, and the first sub-pix and the second sub-pix can effectively be utilized.Wherein, the corresponding conducting wire of sub-pix refers to electricity Conducting wire in source and the sub-pix between luminescence unit.
In the third situation, the equivalent resistance of conducting wire and the positive correlation of target luminescent lifetime can be by conducting wires Length and target luminescent lifetime, which are positively correlated, to be showed.
The equivalent resistance R of conducting wire and the length l of conducting wire 14 meet: R=(ρ × l)/S.It can be seen that and work as from the relational expression One timing of cross-sectional area and resistivity of conducting wire, the equivalent resistance of conducting wire and the length of conducting wire are positively correlated, i.e. the length of conducting wire is got over Long, the equivalent resistance of conducting wire is bigger.Therefore, when conductor length and target luminescent lifetime are positively correlated, the equivalent resistance of conducting wire It is positively correlated with target luminescent lifetime.
Illustratively, guaranteeing to be electrically connected power end and driving element and driving element with luminescence unit Under the premise of, the first sub-pix, the second sub-pix and the third sub-pix being sequentially reduced for the material emission service life of luminescence unit, In the length of conducting wire in power end and the first sub-pix between luminescence unit, power end and the second sub-pix between luminescence unit The length of conducting wire, the length of conducting wire in power end and third sub-pix between luminescence unit can be sequentially reduced.Such one Come, the service life that luminescence unit can be made to be determined by driving current is in by the service life that material determines with the luminescence unit Now be negative relevant relationship, so that the service life of three kinds of sub-pixes can be identical as far as possible, and can effectively utilize First sub-pix and the second sub-pix.
Illustratively, the second target component of the conducting wire 14 in power end and the first sub-pix 12 between luminescence unit, power supply The second target component and power end and third sub-pix 12 of conducting wire 14 in end and the second sub-pix 12 between luminescence unit The ratio of second target component of the conducting wire 14 between middle luminescence unit can be 4:3:2.Wherein, the second target component can be Equivalent resistance, resistivity or the length of conducting wire 14.
Wherein, when the equivalent resistance of conducting wire and target luminescent lifetime be just between luminescence unit in power end and any sub-pix When related, the equivalent resistance of the driving element in multiple sub-pixes can be identical or different.Also, it is driven in multiple sub-pixes When the equivalent resistance of device is identical, the equivalent accounting of driving element can be by the equivalent electricity of conducting wire between power end and luminescence unit Resistance determines.I.e. the equivalent resistance of conducting wire is got over hour between power end and luminescence unit, and the equivalent accounting of driving element is bigger.
Further, when the equivalent resistance of driving element in multiple sub-pixes is identical, driver in multiple sub-pix The construction of part can be identical, so, can be in the manufacturing process of display device, while drive in multiple sub-pix The manufacturing process of dynamic transistor, can simplify the manufacturing process of display device.
Optionally, as shown in figure 5, pixel circuit 122 can also include: switching transistor 1222, at this point, sub-pix 12 Total equivalent resistance can be equal in sub-pix 12 equivalent resistance of conducting wire 14 between luminescence unit 121 and power end 13, driving crystalline substance The sum of the equivalent resistance of the equivalent resistance and switching transistor 1222 of body pipe 1221.The first order of driving transistor 1221 can lead to Switching transistor 1222 is crossed to be electrically connected with power end.Illustratively, the grid of switching transistor 1222 is electrically connected with control signal end 15 It connects, the first order of switching transistor 1222 is electrically connected with power end 13, the second level of switching transistor 1222 and driving transistor 1221 first order electrical connection.Switching transistor 1222 has turn-on and turn-off two states.When switching transistor 1222 is in When on state, the power supply signal of power end 13 can be input to the first of driving transistor 1221 by switching transistor 1222 Grade, to provide power supply signal for driving transistor 1221;When the state that switching transistor 1222 is off, power end 13 Power supply signal can not be input to the first order of driving transistor 1221 by switching transistor 1222, and drive transistor without normal direction 1221 provide power supply signal.Wherein, the first order for driving transistor 1221 can be the source electrode of driving transistor 1221, and driving is brilliant The second level of body pipe 1221 can be the drain electrode of driving transistor 1222;The first order of switching transistor can be the transistor that opens the light Source electrode, the second level of switching transistor can be the drain electrode of transistor of opening the light.
It, can be first to the grid of switching transistor 1222 and driving transistor when needing to control luminescence unit 121 and shining 1221 gate input control signal is connected with control switch transistor 1222 and driving transistor 1221, at this point, power end 13 Power supply signal can be input to by switching transistor 1222 driving transistor 1221 the first order, and by driving transistor 1221 the second pole inputs driving current to luminescence unit, so that luminescence unit 121 shines under the action of the driving current.
Optionally, with continued reference to FIG. 5, can have two switching transistors in pixel circuit, at this point, two switches are single Member is connected between power end and luminescence unit, and the grid of two switching transistors is electrically connected with the same control signal end 18 It connects, the same control signal end is different from the control signal end 15 that the grid of driving transistor is connected.
In conclusion sub-pix includes luminescence unit and pixel circuit in the embodiment of the present invention, pixel circuit includes driving Device, and the equivalent resistance accounting of driving element and the material emission service life of luminescence unit in same sub-pix are negatively correlated, compare In the relevant technologies, the service life that luminescence unit is determined by driving current is in by the service life that material determines with the luminescence unit Now be negative relevant relationship, enables the service life of the sub-pix of different colours in same pixel region identical as far as possible, protects The service life of display device is demonstrate,proved.
Fig. 6 is a kind of flow chart of the manufacturing method of display panel provided in an embodiment of the present invention.The system of the display panel Method is made for manufacturing display panel provided by the embodiments of the present application.As shown in fig. 6, the manufacturing method of the display panel can wrap It includes:
Step 601, multiple pixel regions that array arrangement is determined on underlay substrate, each pixel region includes multiple Asias Pixel region, the subpixel regions are for being arranged luminescence unit and pixel circuit.
Step 602 forms pixel circuit on underlay substrate, and pixel circuit includes: driving element, which is used for Driving current is provided to luminescence unit based on the power supply signal that power end provides, and the equivalent resistance of driving element accounts in sub-pix It is more negatively correlated than with the luminescence unit material emission service life in same sub-pix.
Wherein, equivalent resistance accounting is the equivalent resistance of driving element and the ratio of total equivalent resistance, and total equivalent resistance is The equivalent resistance of connecting path between driving element and power end.
Step 603 forms luminescence unit on the underlay substrate for be formed with pixel circuit.
In conclusion determining the multiple of array arrangement in the manufacturing method of display panel provided in an embodiment of the present invention After pixel unit, pixel circuit is formed on underlay substrate, is formed shine on the underlay substrate for be formed with pixel circuit later Unit obtains the sub-pix being made of luminescence unit and pixel circuit, which includes driving element, and driving element The material emission service life of luminescence unit is negatively correlated in equivalent resistance accounting and same sub-pix, compared to the relevant technologies, shines single The service life and the luminescence unit that member is determined by driving current are rendered as negatively correlated relationship by the service life that material determines, Enable the service life of the sub-pix of different colours in same pixel region identical as far as possible, ensure that the use of display device Service life.
Fig. 7 is the flow chart of the manufacturing method of another display panel provided in an embodiment of the present invention, as shown in fig. 7, should The manufacturing method of display panel may include:
Step 701, multiple pixel regions that array arrangement is determined on underlay substrate.
As shown in figure 8, multiple pixel regions 11 can be determined on underlay substrate 17 according to actual needs.
Step 702 is formed conductive layer on underlay substrate using conductive material, and carried out at patterning to the conductive layer Reason, to form conducting wire.
Magnetron sputtering, thermal evaporation or plasma enhanced chemical vapor deposition method (plasma enhanced can be used Chemical vapor deposition, PECVD) the methods of on underlay substrate deposit one layer have certain thickness conduction Material obtains conductive layer, is then handled by patterning processes conductive layer to obtain conducting wire.Wherein, patterning processes can wrap It includes: photoresist coating, exposure, development, etching and photoresist lift off.The thickness of the conductive material can carry out according to actual needs Adjustment, such as: the thickness range of the conductive material can be 3000 angstroms~5000 angstroms.
When carrying out processing formation conducting wire to conductive layer by patterning processes, photoresist can be exposed using mask plate Light, and develop to the photoresist after exposure, and conductive layer is performed etching using the photoresist after development, and stripping photolithography Glue, to obtain conducting wire.Wherein, multiple openings be can have on mask plate, multiple opening can be used for being formed on underlay substrate Conducting wire.Also, when conducting wire to be formed on underlay substrate it is of same size when, the openings of sizes for being used to form conducting wire is identical. When conducting wire to be formed it is of different size when, the corresponding openings of sizes of the conducting wire of different in width is different, and the openings of sizes with lead The width of line is positively correlated.Such as the width of conducting wire can be equal to the width of opening.
Optionally, when conducting wire it is of different size when, step 702 can have a variety of achievable modes, the embodiment of the present invention It will be illustrated in following several achievable modes as an example.
In a kind of achievable mode, the conducting wire that a mask plate formation width can be used different, and an exposure mask Version has multiple openings of different sizes.At this point it is possible to which the conducting wire different using a patterning processes formation width, can simplify The manufacturing process of display panel.
Illustratively, when display panel includes the conducting wire of three kinds of different in width shown in Fig. 3, as shown in figure 9, mask plate Y On can have opening M1, opening M2 and opening M3, and be open M1, opening M2 and be open M3 openings of sizes be sequentially increased.Its In, for opening M1 for manufacturing the smallest conducting wire of width, the conducting wire obtained according to its manufacture can be conducting wire most narrow in Figure 10 For manufacturing the biggish conducting wire of width, the conducting wire obtained according to its manufacture can lead for width is biggish in Figure 10 by 141, opening M2 Line 142, for opening M3 for manufacturing the widest conducting wire of width, the conducting wire obtained according to its manufacture can be the conducting wire 143 in Figure 10.
In the achievable mode of another kind, the conducting wire that multiple mask plate formation widths can be used different, each mask plate It is upper that there are multiple openings, and the size of same mask plate split shed is identical, different mask plate split sheds it is of different sizes.At this point, Each mask plate is used to form a kind of conducting wire of width, and the maximum mask plate that is such as open can be used for that formation width is widest to be led Line can be respectively formed multiple conducting wires of different size using multiple mask plates.
Illustratively, as shown in Figure 10, display panel includes the conducting wire of three kinds of different in width, respectively most narrow conducting wire 141, Wider conducting wire 142 and widest conducting wire 143.Photoresist is exposed three times at this point it is possible to which three mask plates are respectively adopted, And develop to the photoresist after exposure, and conductive layer is performed etching using the photoresist after development, to obtain three kinds not With the conducting wire of width.For example, exposure process may include: first to be exposed using the smallest mask plate that is open to photoresist three times Then light carries out re-expose to photoresist using biggish mask plate is open, using the maximum mask plate that is open to photoetching Glue is exposed three times.
It should be noted that driving element can be driving transistor, driving transistor may include grid, gate insulation Layer, active layer, source-drain electrode figure.Wherein, grid, gate insulation layer and active layer can be formed before manufacturing conducting wire, source-drain electrode Figure can be formed in a patterning processes with conducting wire.
Step 703 forms luminescence unit on the underlay substrate for be formed with conducting wire.
After the driving element formed in pixel circuit, luminescence unit can be formed, on underlay substrate to be shown Panel.Wherein, luminescence unit may include: anode, luminescent layer and cathode etc..Luminescent layer may include: hole injection layer, hole Transport layer, luminous material layer, electron transfer layer and electron injecting layer etc..
In conclusion determining the multiple of array arrangement in the manufacturing method of display panel provided in an embodiment of the present invention After pixel unit, pixel circuit is formed on underlay substrate, is formed shine on the underlay substrate for be formed with pixel circuit later Unit obtains the sub-pix being made of luminescence unit and pixel circuit, which includes driving element, and driving element The material emission service life of luminescence unit is negatively correlated in equivalent resistance accounting and same sub-pix, compared to the relevant technologies, shines single The service life and the luminescence unit that member is determined by driving current are rendered as negatively correlated relationship by the service life that material determines, Enable the service life of the sub-pix of different colours in same pixel region identical as far as possible, ensure that the use of display device Service life.
It should be noted that the sequencing of the manufacturing method step of display panel provided in an embodiment of the present invention can be into Row appropriate adjustment, step according to circumstances can also accordingly be increased and decreased.Anyone skilled in the art is in this hair In the technical scope of bright exposure, the method that can readily occur in variation be should be covered by the protection scope of the present invention, therefore not It repeats again.
The embodiment of the invention provides a kind of display device, which may include: the display in above-described embodiment Panel 1.
Optionally, which can be with are as follows: liquid crystal display panel, Electronic Paper, mobile phone, tablet computer, television set, display, Any products or components having a display function such as laptop, Digital Frame, navigator.
The foregoing is merely the alternative embodiments of the application, not to limit the application, it is all in spirit herein and Within principle, any modification, equivalent replacement, improvement and so on be should be included within the scope of protection of this application.

Claims (10)

1. a kind of display panel, which is characterized in that the display panel includes: multiple pixel regions of array arrangement, each picture Multiple sub-pixes are formed in plain region, the luminescent color of the multiple sub-pix is different, and the sub-pix includes: luminescence unit And pixel circuit, the pixel circuit include driving element, the driving element is used to provide driving institute to the luminescence unit State the luminous driving current of luminescence unit;
The sub-pix is electrically connected with power end, and the driving current is obtained based on the power supply signal that the power end provides, and The material emission service life of the equivalent resistance accounting of driving element and the material of luminescence unit in same sub-pix in the sub-pix Negative correlation, the equivalent resistance accounting are the ratio of the equivalent resistance of driving element and total equivalent resistance in the sub-pix, institute State the equivalent resistance that total equivalent resistance is connecting path between luminescence unit and the power end in the sub-pix.
2. display panel according to claim 1, which is characterized in that the display panel further include: the connecting path In conducting wire, the equivalent resistance of the conducting wire and target luminescent lifetime be positively correlated, and the target luminescent lifetime is that the conducting wire connects The material emission service life of the luminescence unit connect.
3. display panel according to claim 2, which is characterized in that the cross-sectional area of the conducting wire and the target shine Service life is negatively correlated.
4. display panel according to claim 3, which is characterized in that the width of the conducting wire and the target luminescent lifetime Negative correlation, the cross section for being oriented parallel to the conducting wire at the wide place of the conducting wire.
5. display panel according to claim 2, which is characterized in that the resistivity of the conducting wire and the target shine the longevity Life is positively correlated.
6. display panel according to any one of claims 1 to 5, which is characterized in that driving element in the multiple sub-pix Equivalent resistance it is identical.
7. display panel according to any one of claims 1 to 5, which is characterized in that the electricity that the multiple sub-pix is connected The amplitude for the power supply signal that source provides is identical.
8. according to any display panel of claim 2 to 5, which is characterized in that include: the in each pixel region One sub-pix, the second sub-pix and third sub-pix, first sub-pix, second sub-pix and the third sub-pix Luminescent color it is different;
The first object parameter of conducting wire in the power end and first sub-pix between luminescence unit, the power end with The first object parameter of conducting wire in second sub-pix between luminescence unit and the power end and third Asia picture The ratio of the first object parameter of conducting wire in element between luminescence unit are as follows: 2:3:4;The first object parameter is the conducting wire Cross-sectional area or width;
Alternatively, the second target component of the conducting wire in the power end and first sub-pix between luminescence unit, the electricity Second target component of the conducting wire in source and second sub-pix between luminescence unit and the power end and described the The ratio of second target component of the conducting wire in three sub-pixes between luminescence unit are as follows: 4:3:2;Second target component is institute State the equivalent resistance or resistivity of conducting wire.
9. a kind of manufacturing method of display panel, which is characterized in that for any display surface of manufacturing claims 1 to 8 Plate, which comprises
Multiple pixel regions of array arrangement are determined on underlay substrate, each pixel region includes multiple subpixel regions, institute Subpixel regions are stated for luminescence unit and pixel circuit to be arranged;
Pixel circuit is formed on the underlay substrate, the pixel circuit includes: driving element, and the driving element is used for base In power end provide power supply signal to luminescence unit provide driving current, and in the sub-pix driving element equivalent resistance The material emission service life of luminescence unit is negatively correlated in accounting and same sub-pix, and the equivalent resistance accounting is the driving element Equivalent resistance and total equivalent resistance ratio, total equivalent resistance connects between the driving element and the power end The equivalent resistance of access;
Luminescence unit is formed on the underlay substrate for being formed with the pixel circuit.
10. a kind of display device, which is characterized in that the display device includes: any display surface of claim 1 to 8 Plate.
CN201910273195.XA 2019-04-04 2019-04-04 Display panel, manufacturing method thereof and display device Active CN109872685B (en)

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CN101262007A (en) * 1999-06-23 2008-09-10 株式会社半导体能源研究所 El display device and electronic device
TW200802858A (en) * 2006-06-26 2008-01-01 Tatung Co Ltd Structure of semiconductor with low heat carrier effect
CN103545450A (en) * 2012-07-13 2014-01-29 海洋王照明科技股份有限公司 Organic electroluminescence device and manufacturing method thereof
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