CN109870873B - Wavelength conversion device, light source device and projection system - Google Patents
Wavelength conversion device, light source device and projection system Download PDFInfo
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- CN109870873B CN109870873B CN201711269595.0A CN201711269595A CN109870873B CN 109870873 B CN109870873 B CN 109870873B CN 201711269595 A CN201711269595 A CN 201711269595A CN 109870873 B CN109870873 B CN 109870873B
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Abstract
The application discloses a wavelength conversion device, a light source device and a projection system. The wavelength conversion device comprises a wavelength conversion layer and a first surface and a second surface of the wavelength conversion layer, wherein the wavelength conversion layer is used for being excited by exciting light to generate excited light, the first surface is an incident surface of the exciting light, the second surface is an emergent surface of the exciting light and the excited light or a reflecting surface of the exciting light and the excited light, and at least one of the first surface and the second surface is provided with a plurality of microstructures; the middle parts of the plurality of microstructure bodies are in a convex object shape, and the middle parts of the microstructure bodies are in a concave shape; or the plurality of microstructures are all in a convex object shape or a concave object shape; the plurality of microstructures are arranged continuously and irregularly.
Description
Technical Field
The present invention relates to the field of projection technologies, and in particular, to a wavelength conversion device, a light source device, and a projection system.
Background
In the light emitting device of the illumination system or the projection system in the prior art, the wavelength conversion material is often excited by the excitation light to generate stimulated light. In general, the wavelength conversion material is formed on a substrate as a coating layer by mixing an organic paste, and the substrate may be a metal material, a transparent glass material, or a sheet shape formed by mixing a phosphor and an inorganic material.
The conversion efficiency of the wavelength converting material is related to a large number of factors, such as temperature or thermal effects, and therefore wavelength converting devices are usually provided with a heat sink. The formation of the thermal effect has various reasons, for example, if the utilization rate or excitation efficiency of the laser is low, part of light is converted into heat energy, and if the heat energy accumulation cannot be dissipated in time, the heating temperature of the component itself rises.
In addition, the conversion efficiency is also related to the optical excitation power. Within a certain range, the optical excitation power is increased, and the conversion efficiency of the wavelength conversion material is increased accordingly. However, when the optical power density of the excitation light reaches a certain range, the light conversion efficiency of the wavelength conversion material is reduced; when the optical power of the excitation light reaches a certain level, the wavelength converting material may also experience a quenching effect, i.e. the light conversion efficiency of the wavelength converting material drops sharply.
Furthermore, if the light collecting member in the optical path of the wavelength conversion device is low in collecting efficiency, the light extraction efficiency, that is, the wavelength conversion efficiency, is low in the entire wavelength conversion device.
Therefore, how to improve the light conversion efficiency of the wavelength conversion device is a problem to be researched and solved urgently in the industry.
Disclosure of Invention
The embodiment of the application provides a wavelength conversion device, a light source device and a projection system, which are used for improving the light conversion efficiency of the wavelength conversion device.
In a first aspect, a wavelength conversion device is provided, comprising:
the wavelength conversion device comprises a wavelength conversion layer and a first surface and a second surface of the wavelength conversion layer, wherein the wavelength conversion layer is used for being excited by exciting light to generate excited light, the first surface is an incident surface of the exciting light, the second surface is an emergent surface of the exciting light and the excited light, and at least one of the first surface and the second surface is provided with a plurality of microstructures;
the middle parts of the plurality of microstructure bodies are in a convex object shape, and the middle parts of the microstructure bodies are in a concave shape; or the plurality of microstructures are all in a convex object shape or a concave object shape;
the plurality of microstructures are arranged continuously and irregularly.
Optionally, the distribution density of the plurality of microstructures is sequentially reduced in a direction extending outward along the surface where the plurality of microstructures are located with the incident point of the excitation light as a center.
Optionally, the distribution density of the plurality of microstructures may be changed from small to large and then small along the rotation direction of the wavelength conversion device.
Optionally, at least 2 of the plurality of microstructures are different in size and/or shape.
Optionally, a heat sink is welded on the wavelength conversion device, and the heat sink is welded on the metal heat dissipation plate; or a metal substrate is welded on the second surface.
Optionally, the wavelength conversion device is welded to a metal substrate, the metal substrate is connected to a driving device, the driving device is configured to drive the wavelength conversion device to rotate, and the driving device is connected to a heat dissipation system; or, the wavelength conversion device is connected with a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected with the heat dissipation system.
Optionally, the plurality of microstructures has a shape including at least one of a truncated cone, a cylinder, a truncated pyramid, a sawtooth, and a wave.
Optionally, the wavelength converting material layer is made of a wavelength converting material and an inorganic material.
In a second aspect, there is provided a wavelength conversion device comprising:
the wavelength conversion device comprises a wavelength conversion layer and a first surface and a second surface of the wavelength conversion layer, wherein the wavelength conversion layer is used for being excited by exciting light to generate excited light, the first surface is an incident surface of the exciting light, the second surface is a reflecting surface of the exciting light and the excited light, and at least one of the first surface and the second surface is provided with a plurality of microstructures;
the middle parts of the plurality of microstructure bodies are in a convex object shape, and the middle parts of the microstructure bodies are in a concave shape; or the plurality of microstructures are all in a convex object shape or a concave object shape;
the plurality of microstructures are arranged continuously and irregularly.
Optionally, the distribution density of the plurality of microstructures is sequentially reduced in a direction extending outward along the surface where the plurality of microstructures are located with the incident point of the excitation light as a center.
Optionally, the distribution density of the plurality of microstructures may be changed from small to large and then small along the rotation direction of the wavelength conversion device.
Optionally, at least 2 of the plurality of microstructures are different in size and/or shape.
Optionally, a heat sink is welded on the wavelength conversion device, and the heat sink is welded on the metal heat dissipation plate; or a metal substrate is welded on the second surface.
Optionally, the wavelength conversion device is welded to a metal substrate, the metal substrate is connected to a driving device, the driving device is configured to drive the wavelength conversion device to rotate, and the driving device is connected to a heat dissipation system; alternatively, the first and second electrodes may be,
the wavelength conversion device is connected with a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected with a heat dissipation system.
Optionally, the plurality of microstructures has a shape including at least one of a truncated cone, a cylinder, a truncated pyramid, a sawtooth, and a wave.
Optionally, the wavelength converting material layer is made of a wavelength converting material and an inorganic material.
In a third aspect, there is provided a light source device, comprising: an excitation light source for generating excitation light, and a wavelength conversion device as described in any one of the above first aspects.
In a fourth aspect, there is provided a light source device comprising: an excitation light source for generating excitation light, and a wavelength conversion device as described in any one of the above second aspects.
In a fifth aspect, there is provided a projection system comprising: an optical engine, a lens, and the light source device according to the third or fourth aspect; the light source device provides illumination for the optical machine, and the optical machine modulates light source beams, outputs the light source beams to the lens for imaging, and projects the light source beams to a projection medium to form a projection picture.
In the above embodiments of the present application, the wavelength conversion device includes a wavelength conversion layer, and a first surface and a second surface of the wavelength conversion layer, the wavelength conversion layer is used for being excited by excitation light to generate excited light, the first surface is an incident surface of the excitation light, the second surface is an exit surface of the excitation light and the excited light or a reflection surface of the excitation light and the excited light, and at least one of the first surface and the second surface is provided with a plurality of microstructures. The middle parts of the plurality of microstructures are in a convex object shape, and the middle parts of the plurality of microstructures are in a concave shape, or the plurality of microstructures are in a convex object shape or a concave shape. The plurality of microstructures are arranged continuously and irregularly. Compared with a smooth surface, if a certain path of laser beam is reflected to the inside of the wavelength conversion device on the smooth surface and generates total reflection inside the wavelength conversion device, on one hand, the total reflection causes optical loss, which causes low light-emitting rate and affects optical conversion efficiency, and on the other hand, the total reflected light is converted into partial heat energy, so that the temperature is increased and the optical conversion efficiency is also affected; under the same condition, when the angle is reflected by the surface of the microstructure body provided with the laser beam, the reflection angle can be changed, so that the probability of total reflection generated by the laser in the wavelength conversion device can be reduced, the total reflection probability is reduced, on one hand, the optical loss can be reduced, the light extraction rate is improved due to the reduction of the optical loss, the optical conversion efficiency is improved, on the other hand, the generation of heat energy can be reduced, and the optical conversion efficiency is improved. Therefore, the above-described embodiments of the present application may improve the light conversion efficiency of the wavelength conversion device, as compared to the prior art wavelength conversion device with a coating or a layered smooth surface.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1A, fig. 1B, and fig. 1C are respectively schematic structural diagrams of a transmission type wavelength conversion device according to an embodiment of the present application;
fig. 2A and fig. 2B are schematic structural diagrams of a transmission type wavelength conversion device provided with a heat dissipation device according to an embodiment of the present disclosure, respectively;
fig. 3A, fig. 3B, and fig. 3C are schematic structural diagrams of a reflection type wavelength conversion device according to an embodiment of the present disclosure;
fig. 4A and 4B are schematic structural diagrams of a reflection-type wavelength conversion device provided with a heat dissipation structure according to an embodiment of the present disclosure, respectively;
fig. 5 is a schematic structural diagram of a light-emitting device according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a projection system according to an embodiment of the present application.
Detailed Description
Example one
Referring to fig. 1A, a schematic structural diagram of a transmission type wavelength conversion device according to an embodiment of the present application is shown. The wavelength conversion device 100 may be a sheet, and fig. 1 is a schematic sectional view of the sheet along the optical axis direction of the excitation light.
As shown, the wavelength conversion device 100 includes a first surface 101a and a second surface 101b with a layer of wavelength converting material 102 between the first surface 101a and the second surface 101 b. The wavelength conversion material layer 102 generates stimulated light L2 (indicated by a dotted line in the figure) for excitation by stimulated light L1 (indicated by a solid line in the figure). The first surface 101a is an incident surface of the excitation light L1, and the second surface 101b is an exit surface of the excitation light L1 and the excited light L2.
Optionally, an antireflection film (not shown in the figure) may be disposed on the surface of the second surface 101b to improve the light beam transmittance.
Alternatively, a dichroic film (not shown in the drawings) may be disposed on the surface of the first surface 101a, and the dichroic film may transmit the excitation light and reflect the stimulated light to reduce light loss.
The wavelength conversion material layer 102 may be made by mixing and sintering a wavelength conversion material and an inorganic material, and has a transparent or translucent shape. The organic material may be ceramic or glass, among others. The wavelength conversion material may be phosphor, or materials with wavelength conversion capability such as quantum dots, fluorescent dyes, and the like. Fig. 1 exemplarily shows wavelength converting material particles 103, such as phosphor particles, in a wavelength converting material layer 102.
On the other hand, since the wavelength conversion material layer 102 uses an inorganic material as a binder of the fluorescent material, it has a higher thermal conductivity than an organic material (such as an organic glue) and a strong thermal conductivity, and thus the wavelength conversion device in this form generates less heat and is resistant to high temperature. On the other hand, the combination body formed by firing the inorganic material and the wavelength conversion material has a certain hardness, is made of a transparent material, and can be formed without providing a substrate or a substrate, which simplifies the structure.
The second surface 101b is provided with a plurality of microstructures 104. The microstructures 104 are partially convex and partially concave, or the microstructures 104 are both convex or both concave, so that the second surface 101b is an uneven plane.
The shape of a microstructure may be a truncated cone, a cylinder, a truncated pyramid, a sawtooth, or a wave. Further, the shape may be irregular to achieve a scattering effect as diverse as possible for the excited light.
The microstructures 104 are adjacent to each other without any space, that is, the microstructures 104 are arranged continuously, so as to reduce the probability of total reflection of the received laser light inside the wavelength conversion device 100.
The microstructures 104 may be arranged irregularly, for example, at least some of the microstructures 104 have different shapes, and some of the microstructures 104 are truncated cones or truncated pyramids. For another example, at least some of the microstructures 104 have different sizes. For another example, the microstructures 104 have irregular distribution of microstructures having different shapes or sizes. Of course, any combination of the above features may be used to enhance the scattering effect on the received laser light, and further reduce the probability of total reflection of the received laser light in the wavelength conversion device 100.
The wavelength conversion device 100 may be a static device, i.e. fixed inside the light source device or the projection system, or a dynamic device, i.e. driven to move, such as a fluorescent wheel capable of being driven to rotate.
The distribution density of the microstructures 104 can be set according to the incident power or intensity of the excitation light and the gaussian distribution rule of the excitation light. Alternatively, if the wavelength conversion device 100 is a dynamic device, the distribution density of the microstructures 104 changes from small to large to small along the rotation direction of the wavelength conversion device. Alternatively, if the wavelength conversion device 100 is a static device, the distribution density of the microstructures 104 decreases in sequence in a direction extending outward from the incident point of the excitation light along the surface of the plurality of microstructures.
The microstructure 104 on the wavelength conversion device 100 may be realized by means of photolithography or a process. The specific process flow can comprise: first, a photoresist is applied to the smooth second surface 101b of the wavelength conversion device 100, the surface is exposed to light according to a mask (mask), etching is performed in an etching solution, the photoresist is removed, and finally, plating is performed, so that the microstructure 104 is produced on the second surface 101 b.
In the embodiment of the present application, the wavelength conversion device 100 can be classified into a diffraction type wavelength conversion device and a scattering type wavelength conversion device according to the size of the cross section of the microstructure 104 (the cross section is a cross section in the direction perpendicular to the incident direction of the excitation light). The scattering type wavelength conversion device has a microstructure having a larger cross-sectional diameter than the diffraction type wavelength conversion device. The microstructures provided on the diffraction type wavelength conversion device may be referred to as diffraction microstructures, and the microstructures provided on the scattering type wavelength conversion device may be referred to as scattering microstructures. The cross-sectional diameter of the diffraction microstructure is 1/4 times to 2 times of the excitation light wavelength, and the cross-sectional diameter of the scattering microstructure is 2 times to 200 times of the excitation light wavelength, for example, the cross-sectional diameter of the scattering microstructure may be 2 times to 10 times of the excitation light wavelength. Taking the excitation light as a blue laser beam as an example, if the wavelength of the blue laser beam is 445nm, the cross-sectional diameter of the scattering microstructure is within a range of 890nm to 4450nm, and if the wavelength of the blue laser beam is 467nm, the cross-sectional diameter of the scattering microstructure is within a range of 934nm to 4670 nm.
The diffraction type wavelength conversion device can enhance the diffraction effect of light and improve the light extraction efficiency of received laser through the diffraction microstructure. The scattering type wavelength conversion device can cause the received laser light to exhibit scattering and refraction effects by the scattering microstructure to improve the light extraction efficiency of the received laser light.
Taking the wavelength conversion device 100 as an example of a scattering type wavelength conversion device, the excitation light L1 is incident on the wavelength conversion device 100, and then irradiated onto the wavelength conversion material particles in the wavelength conversion material layer 102, so that the wavelength conversion material particles are excited to generate scattered multiple received laser light. The light reflection angle of the microstructure body irradiated by the laser changes compared with the light reflection angle of the smooth surface irradiated by the laser, so that under the same condition, if one path of the laser is irradiated by the laser to generate total reflection on the smooth surface, the reflection angle of the laser irradiated by the angle is different compared with the reflection angle of the laser irradiated by the smooth surface, and the total reflection is avoided. The total reflection probability reduces, can reduce the light loss on the one hand, and the light loss reduces and will promote the light-emitting rate, and then promotes light conversion efficiency, and on the other hand can also reduce the production of heat energy, and then promotes light conversion efficiency.
Example two
Referring to fig. 1B, a schematic structural diagram of a transmission type wavelength conversion device according to a second embodiment of the present application is shown. The wavelength conversion device 200 shown in fig. 1B differs from the wavelength conversion device 100 shown in fig. 1A in that: the microstructures 104 are not provided on the second surface 101b but on the first surface 101 a. The arrangement of the microstructures 104 on the first surface 101a in the wavelength conversion device 200 is similar to the arrangement of the microstructures 104 on the second surface 101b in the wavelength conversion device 100. A description of the remaining structure of the wavelength conversion device 200 may be found in the wavelength conversion device 100, and the same is not repeated.
As shown in fig. 1B, on the one hand, the excitation light L1 is irradiated to the wavelength conversion material particles 103 inside the wavelength conversion layer 102 of the wavelength conversion device 200, and after the excited light generated by the excitation of the wavelength conversion material particles 103 is irradiated to the second surface 101B, a part of the excited light is emitted and a part of the excited light is reflected. The incident angle when being shone the microstructure on first surface 101 by the laser that receives reflected compares with the incident angle when being shone smooth surface by the laser and has taken place the change, consequently under the same condition, if receive the laser all the way and shine smooth surface and produce the total reflection, then the total reflection can not take place after being shone the microstructure by the laser of this angle for the total reflection probability reduces, therefore can reduce the light loss on the one hand, the light loss reduces and will promote the light-emitting rate, and then promote light conversion efficiency, on the other hand can also reduce the production of heat energy, and then promote light conversion efficiency.
On the other hand, when the excitation light L1 is incident on the wavelength conversion device 200, the micro-structures 104 on the first surface 101a can scatter the excitation light L1 with strong central light intensity (according to the gaussian distribution rule) and make the excitation light homogenized. The wavelength conversion material particles 103 inside the wavelength conversion layer 102 are excited by the excitation light to generate excited light (only one conversion material particle excited to generate excited light is exemplarily shown in the figure). Because the exciting light is homogenized, the intensity distribution of the generated excited light is more uniform, and the reduction of the internal quantum efficiency during wavelength conversion caused by local heat concentration can be avoided.
If the microstructures 104 are not provided on the first surface 101a, the excitation light cannot be homogenized, which may result in some wavelength conversion material particles being irradiated and some not being irradiated, such that the range of the irradiated wavelength conversion material particles is not optimal, thereby affecting the light conversion efficiency. In addition, the wavelength conversion material absorbs the excitation light to convert the excitation light to emit stimulated light, the absorbed energy is in a range, and the excitation light which is not absorbed by the wavelength conversion material is converted into heat energy. The non-homogenized excitation light is likely to form thermal energy conversion at a high rate, and further influences the light conversion efficiency.
Although fig. 1B shows only one optical path L1 of the excitation light, there are actually a plurality of excitation lights that are perpendicular or nearly perpendicular (have an inclination angle) to the surface of the wavelength conversion device 100 incident to the wavelength conversion device 100. The wavelength conversion material particles distributed inside wavelength conversion layer 102 can scatter the excitation light, and the angle of the light path L1 of the excitation light may change with time, so that for the same path of excitation light, the wavelength conversion material particles distributed inside wavelength conversion layer 102 can scatter the path of excitation light to different degrees with time, and therefore, in a certain time range, the excitation light beam at the incident point position obtains different degrees of scattering when entering wavelength conversion device 100, the excitation energy is dispersed and homogenized, and the range of the wavelength conversion material excited by the excitation light is expanded.
EXAMPLE III
Referring to fig. 1C, a schematic structural diagram of a transmission type wavelength conversion device according to a third embodiment of the present application is shown. The wavelength conversion device 300 shown in fig. 1C differs from the wavelength conversion device 100 shown in fig. 1A in that: the first surface 101a is provided with a plurality of microstructures 104, i.e. both the first surface 101a and the second surface 101b are provided with microstructures 104. The arrangement of the microstructures 104 on the first surface 101a and the second surface 101b in the wavelength conversion device 300 is similar to the arrangement of the microstructures 104 on the second surface 101b in the wavelength conversion device 100. The description of the remaining structure of the wavelength conversion device 300 can be found in the wavelength conversion device 100 and the wavelength conversion device 200, and the same points are not repeated. By providing the microstructures on both surfaces, the conversion efficiency of the wavelength conversion device can be further improved compared to providing the microstructures on one of the surfaces.
Optionally, in the embodiment of the present application, a heat dissipation structure may be further disposed on the wavelength conversion device 100, the wavelength conversion device 200, or the wavelength conversion device 300, for dissipating heat accumulated inside the wavelength conversion device.
Fig. 2A illustrates a structure of a wavelength conversion device provided with a heat dissipation structure, taking the wavelength conversion device 100 as an example. The wavelength conversion device 100 is a static device. The wavelength conversion device 100 in fig. 2A may be replaced with the wavelength conversion device 200 or the wavelength conversion device 300.
As shown in fig. 2A, the wavelength conversion device 100 is soldered on the metal substrate p1 by a metal solder (the second surface 101b of the wavelength conversion device 100 is opposite to the metal plate p 1). The metal substrate p1 may be further provided with heat dissipating fins p2 or connected with a heat conducting system for dissipating heat. Optionally, a heat sink p3 is further soldered between the metal substrate p1 and the wavelength conversion device 100.
Alternatively, the heat sink p3 is a heat sink made of a semiconductor material, which has a thermal expansion coefficient similar to that of the wavelength conversion device 100 and can be selected to have a thermal expansion coefficient similar to that of the wavelength conversion device 100, and the long-time alternating of the cooling and heating can ensure the reliability of the solder layer between the wavelength conversion device 100 and the metal substrate p1, such as SiC (silicon carbide) or AlN (aluminum nitride). The material of the metal substrate p1 can be selected from metal materials with good thermal conductivity, such as copper, aluminum, etc. The metal solder may be a material with high thermal conductivity and strong adhesion, such as gold-tin or tin-silver-copper solder, so as to ensure good thermal conductivity of the wavelength conversion device 100 and ensure long-term durability.
When manufacturing, the wavelength conversion device 100 may be first soldered to the heat sink p3 by a metal solder, and then the heat sink and the wavelength conversion device 100 as a whole may be soldered to the metal substrate p1 by a solder.
Fig. 2B illustrates another structure of a wavelength conversion device provided with a heat dissipation structure, taking the wavelength conversion device 100 as an example. The wavelength conversion device 100 is a dynamic device, such as a fluorescent wheel, which may be a ring-shaped structure. The wavelength conversion device 100 in fig. 2B may be replaced with the wavelength conversion device 200 or the wavelength conversion device 300.
As shown in fig. 2B, the wavelength conversion device 100 is connected to a driving device d1, the driving device d1 is used for driving the wavelength conversion device 100 to rotate, and the driving device d1 is connected to the heat dissipation system s 1.
For example, when the wavelength conversion device 100 is a transmissive fluorescent wheel structure, the fluorescent wheel may be a ring-shaped structure (as shown in fig. 2B), the central portion is fixed to the driving device (motor) through a rivet r1 or a similar fixing structure for being driven to rotate, and the ring-shaped portion of the fluorescent wheel receives the laser irradiation. The fluorescent wheel can also be of a circular structure, and the center of the fluorescent wheel is welded or riveted with the motor.
Example four
Fig. 3A is a schematic structural diagram of a reflection-type wavelength conversion device according to a fourth embodiment of the present application. The wavelength conversion device 400 shown in fig. 3A differs from the wavelength conversion device 100 shown in fig. 1A in that: the second surface 101b is replaced with a second surface 101c, and the second surface 101c is a reflection surface of the excitation light L1 and the stimulated light L2. A surface such as the second surface 101c may be provided with a reflective film. The arrangement of the microstructures 104 on the second surface 101c in the wavelength conversion device 400 is similar to the arrangement of the microstructures 104 on the second surface 101b in the wavelength conversion device 100. A description of the remaining structure of the wavelength conversion device 400 may be found in the wavelength conversion device 100 and the same is not repeated.
As shown in fig. 3A, when a large-angle laser beam is irradiated from the inside of the wavelength conversion layer 102 to the second surface 101c having the reflective film, since the microstructure 104 is disposed on the second surface 101c, the surface is a rough surface, and thus, when the beam is irradiated to the rough surface, the angle condition of total reflection is no longer easily satisfied with respect to a smooth plane, so that the beam may be directly emitted after being reflected by the reflective film, and the situation that the beam is reflected back and forth between the upper and lower surfaces of the wavelength conversion material layer due to total reflection, cannot be emitted, and is consumed and converted into heat energy is reduced, thereby improving the conversion efficiency.
EXAMPLE five
Fig. 3B is a schematic structural diagram of a reflection-type wavelength conversion device according to a fifth embodiment of the present application. The wavelength conversion device 500 shown in fig. 3B differs from the wavelength conversion device 400 shown in fig. 3A in that: the microstructures 104 are not provided on the second surface 101c but on the first surface 101 a. The arrangement of the microstructures 104 on the first surface 101a in the wavelength conversion device 500 is similar to the arrangement of the microstructures 104 on the second surface 101c in the wavelength conversion device 400. A description of the remaining structure of the wavelength conversion device 500 may be found in the wavelength conversion device 400 and the same is not repeated.
As shown in fig. 3B, when the received laser light transmitted to the reflective film and reflected back and the received laser light directed to the first surface 101a exit from the first surface 101a, because the surface is provided with the microstructure, the microstructure changes the shape of the original plane, so that the total reflection angle is not easily satisfied, and thus there is a relatively high probability that the excitation light and the received laser light may exit to the outside of the wavelength conversion device without being reflected back, thereby increasing the ratio of the received laser light, especially the proportion of the received laser light that previously satisfies the total reflection angle, and increasing the proportion of the received laser light that actually exits, so that the light conversion efficiency of the wavelength conversion device as a whole is increased.
EXAMPLE six
Fig. 3C is a schematic structural diagram of another reflection-type wavelength conversion device according to a sixth embodiment of the present application. The wavelength conversion device 600 shown in fig. 3C differs from the wavelength conversion device 400 shown in fig. 3A in that: the first surface 101a is provided with a plurality of microstructures 104, i.e. both the first surface 101a and the second surface 101c are provided with microstructures 104. The arrangement of the microstructures 104 on the first surface 101a and the second surface 101c in the wavelength conversion device 600 is similar to the arrangement of the microstructures 104 on the first surface 101a in the wavelength conversion device 500. A description of the remaining structure of the wavelength conversion device 600 may be found in the wavelength conversion device 400 and the same is not repeated. By providing microstructures on both surfaces, the conversion efficiency of the wavelength conversion device can be further improved.
Optionally, in this embodiment of the application, a heat dissipation structure may be further disposed on the wavelength conversion device 400, the wavelength conversion device 500, or the wavelength conversion device 600, for dissipating heat accumulated inside the wavelength conversion device.
Fig. 4A illustrates a structure of a wavelength conversion device provided with a heat dissipation structure, taking the wavelength conversion device 400 as an example. The wavelength conversion device 400 is a static device. The wavelength conversion device 400 in fig. 4A may also be replaced with the wavelength conversion device 500 or the wavelength conversion device 600.
As shown in fig. 4A, the edge of the wavelength conversion device 400 is soldered to the metal substrate p4 (the second surface 101c of the wavelength conversion device 400 is opposite to the metal plate p 4) by a metal solder, which can be used for heat dissipation and can also serve as a fixing support. The metal substrate p4 may be further provided with heat dissipating fins p5 or connected with a heat conducting system for dissipating heat. Optionally, a heat sink p6 is further soldered between the metal substrate p4 and the wavelength conversion device 400.
Fig. 4B illustrates another structure of a wavelength conversion device provided with a heat dissipation structure, taking the wavelength conversion device 400 as an example. The wavelength conversion device 400 is a dynamic device such as a fluorescent wheel, which may be a ring-shaped structure. The wavelength conversion device 400 in fig. 4B may also be replaced with the wavelength conversion device 500 or the wavelength conversion device 600.
As shown in fig. 4B, the wavelength conversion device 400 is soldered to the metal substrate p7 by metal solder, the metal substrate p7 is connected to the driving device d2, the driving device d2 is used for driving the wavelength conversion device 400 to rotate, and the driving device d2 is connected to the heat dissipation system.
Alternatively, the metal substrate p4 may be made of a high thermal conductivity metal material, such as an aluminum alloy. The metal substrate p7 is directly connected to the driving device d2, so that heat generated by the wavelength conversion device 400 can be conducted to the driving device d2 through the metal substrate p7, and the driving device d2 radiates the heat to the air through a heat radiation system.
The embodiment of the application also provides a light source device.
Fig. 5 is a schematic structural diagram of a light source device according to an embodiment of the present application. The light source device may include: an excitation light source 501 for generating excitation light, and a wavelength conversion device 502. The wavelength conversion device 502 may be one of the various wavelength conversion devices provided in the embodiments of the present application.
The embodiment of the application also provides a projection system.
Referring to fig. 6, a schematic structural diagram of a projection system provided in an embodiment of the present application is shown. As shown in fig. 6, the system may include: the light source device 601, the optical machine 602 and the lens 603.
The light source device 601 may be any one of the light source devices provided in the embodiments of the present application, and reference may be made to the foregoing embodiments specifically, which will not be described herein again.
Specifically, the light source device 601 provides illumination for the optical engine 602, and the optical engine 602 modulates a light source beam, outputs the modulated light source beam to the lens 603 for imaging, and projects the modulated light source beam onto a projection medium 604 (such as a screen or a wall) to form a projection image.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A wavelength conversion device is characterized by comprising a wavelength conversion layer and a first surface and a second surface of the wavelength conversion layer, wherein the wavelength conversion layer is used for being excited by exciting light to generate excited light, the first surface is an incident surface of the exciting light, the second surface is an emergent surface of the exciting light and the excited light, and at least one of the first surface and the second surface is provided with a plurality of microstructures;
the middle parts of the plurality of microstructure bodies are in a convex object shape, and the middle parts of the microstructure bodies are in a concave shape; or the plurality of microstructures are all in a convex object shape or a concave object shape;
the plurality of microstructures are continuously and irregularly arranged;
the distribution density of the plurality of microstructures is changed from small to large and then small along the rotation direction of the wavelength conversion device.
2. The wavelength conversion device according to claim 1, wherein at least 2 of the plurality of microstructures are different in size and/or different in shape.
3. The wavelength conversion device according to any one of claims 1 to 2, wherein a heat sink is welded on the wavelength conversion device, the heat sink being welded on a metal heat dissipation plate; or a metal substrate is welded on the second surface.
4. The wavelength conversion device according to any one of claims 1 to 2, wherein the wavelength conversion device is soldered to a metal substrate, the metal substrate is connected to a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected to a heat dissipation system; alternatively, the first and second electrodes may be,
the wavelength conversion device is connected with a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected with a heat dissipation system.
5. A wavelength conversion device is characterized by comprising a wavelength conversion layer and a first surface and a second surface of the wavelength conversion layer, wherein the wavelength conversion layer is used for being excited by exciting light to generate excited light, the first surface is an incidence surface of the exciting light, the second surface is a reflection surface of the exciting light and the excited light, and a plurality of microstructures are arranged on at least one of the first surface and the second surface;
the middle parts of the plurality of microstructure bodies are in a convex object shape, and the middle parts of the microstructure bodies are in a concave shape; or the plurality of microstructures are all in a convex object shape or a concave object shape;
the plurality of microstructures are continuously and irregularly arranged;
the distribution density of the plurality of microstructures is changed from small to large and then small along the rotation direction of the wavelength conversion device.
6. The wavelength conversion device according to claim 5, wherein at least 2 of the plurality of microstructures are different in size and/or different in shape.
7. The wavelength conversion device according to any one of claims 5 to 6, wherein a heat sink is welded on the wavelength conversion device, the heat sink being welded on a metal heat dissipation plate; or a metal substrate is welded on the second surface.
8. The wavelength conversion device according to any one of claims 5 to 6, wherein the wavelength conversion device is welded to a metal substrate, the metal substrate is connected to a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected to a heat dissipation system; alternatively, the first and second electrodes may be,
the wavelength conversion device is connected with a driving device, the driving device is used for driving the wavelength conversion device to rotate, and the driving device is connected with a heat dissipation system.
9. A light source device, comprising: an excitation light source for generating excitation light, and a wavelength conversion device according to any one of claims 1 to 4.
10. A light source device, comprising: an excitation light source for generating excitation light, and a wavelength conversion device according to any one of claims 5 to 8.
11. A projection system, comprising: an optical engine, a lens, and the light source device according to claim 9 or 10;
the light source device provides illumination for the optical machine, and the optical machine modulates light source beams, outputs the light source beams to the lens for imaging, and projects the light source beams to a projection medium to form a projection picture.
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