CN109869428A - A kind of Anti-bubble ridge structure - Google Patents
A kind of Anti-bubble ridge structure Download PDFInfo
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- CN109869428A CN109869428A CN201711254466.4A CN201711254466A CN109869428A CN 109869428 A CN109869428 A CN 109869428A CN 201711254466 A CN201711254466 A CN 201711254466A CN 109869428 A CN109869428 A CN 109869428A
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- China
- Prior art keywords
- silicagel pad
- bottom case
- equipment bottom
- bubble
- glue hole
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 116
- 239000000741 silica gel Substances 0.000 claims abstract description 116
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 116
- 229960001866 silicon dioxide Drugs 0.000 claims abstract description 116
- 239000003292 glue Substances 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 230000006872 improvement Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Silicon Compounds (AREA)
Abstract
The present invention relates to a kind of Anti-bubble ridge structures, relate to industrial machine and electronic product field, including equipment bottom case and silicagel pad, and the silicagel pad is bonded on the first binding face of the equipment bottom case；It is machined at least two location holes on first binding face of the equipment bottom case, positioning column is machined on the second binding face of the silicagel pad, the positioning column correspondence is assemblied in the location hole；It is also processed on first binding face of the equipment bottom case fluted, no glue hole is also machined on second binding face of the silicagel pad, the groove and the no glue hole are used to improve the combination of the equipment bottom case and the silicagel pad, enhance the bonding degree between the equipment bottom case and the silicagel pad, and reduces the protuberance rate between the equipment bottom case and the silicagel pad.Structure described in the present embodiment reduces the generation of bubble between the equipment bottom case and the silicagel pad, and reduces the protuberance rate between the equipment bottom case and the silicagel pad.
Description
Technical field
The present invention relates to industrial machines and electronic product field, more particularly to a kind of Anti-bubble ridge structure.
Background technique
For traditional silicagel pad and equipment bottom case applying method (especially big face during being bonded and in use process
The patch silicagel pad of product full coverage type), typically directly in the silicagel pad of the back side of equipment bottom case patch single side back double-sided adhesive；The party
Method not only easily generates bubble during fitting, but also with the extension of working time and the change of working environment, in conjunction with
Face is also easy to gassing and protuberance phenomenon, due to faying face seal it is very tight, when product continues to use, bubble and grand
Rising, to cause the damage of silicagel pad and fall off, will seriously affect product service life and use towards contact surface edge-diffusion
Family experience effect.
Summary of the invention
It is an object of the invention to be directed to technical problem of the existing technology, a kind of Anti-bubble ridge structure is provided, it is main
Solve traditional silicagel pad be bonded with workpiece bottom case easily generated in process and later period use process bubble and protuberance
Problem.
In order to solve posed problems above, the technical solution adopted by the present invention are as follows:
A kind of Anti-bubble ridge structure provided by the present invention, including equipment bottom case and silicagel pad, the silicagel pad bonding
On the first binding face of the equipment bottom case；
At least two location holes, the second binding face of the silicagel pad are machined on first binding face of the equipment bottom case
On be machined with the positioning column to match with the location hole, the positioning column correspondence is assemblied in the location hole, the positioning
Hole and the positioning column are used to position the installation site of the equipment bottom case and the silicagel pad；
It also processes fluted on first binding face of the equipment bottom case, is also processed on the second binding face of the silicagel pad
Whether there is or not glue hole, the groove and the no glue hole are used to improve the combination of the equipment bottom case and the silicagel pad,
Enhance the bonding degree between the equipment bottom case and the silicagel pad, and reduce the equipment bottom case and the silicagel pad it
Between protuberance rate.
As a further improvement of the present invention, the groove is cross bath.
As a further improvement of the present invention, increasing on the groove has a matrix pattern slot, and in the matrix pattern slot
The heart is overlapped with the center of the equipment bottom case.
As a further improvement of the present invention, the groove width of the groove is 2mm, groove depth 0.5mm, and the depth of the groove
Degree is less than the thickness of the equipment bottom case.
As a further improvement of the present invention, the diameter in the no glue hole is 3mm.
As a further improvement of the present invention, the diameter in the no glue hole is 4mm.
As a further improvement of the present invention, the hole depth in the no glue hole is 0.3mm, and the depth in the no glue hole is less than
The thickness of the silicagel pad.
As a further improvement of the present invention, the no glue hole is equipped with multiple, one of them described no glue hole is arranged in institute
The center of silicagel pad is stated, remaining described no glue hole is equally spaced the silica gel using the center of the silicagel pad as the center of circle
The peripheral position of pad.
As a further improvement of the present invention, the multiple no glue hole be set to the silicagel pad center without glue hole
It is equally spaced for the center of circle as two circle concentric circles.
As a further improvement of the present invention, the first lap concentric circles and the silicagel pad centre bit of the no glue hole composition
The distance set is 15mm；
The second of the no glue hole composition encloses concentric circles
15mm。
Compared with prior art, the beneficial effects of the present invention are:
In an embodiment of the present invention, by processing groove on the equipment bottom case, and in the silicagel pad plus
Work makes the way of contact of the equipment bottom case and silicagel pad become full coverage type by full coverage type void-free contact and has time without glue hole
Gap contact, to enhance the bonding degree between the equipment bottom case and the silicagel pad, and reduce the equipment bottom case with
Protuberance rate between the silicagel pad, secondly, avoiding in the later period use process of the equipment bottom case and silicagel pad part such as
Fruit generates silicagel pad caused by bubble is spread because of bubble and falls off.
Detailed description of the invention
Fig. 1 is the explosive view of Anti-bubble ridge structure described in the embodiment of the present invention；
Fig. 2 is the cross-sectional view in one direction of Anti-bubble ridge structure described in the embodiment of the present invention；
Fig. 3 is the cross-sectional view in another direction of Anti-bubble ridge structure described in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of equipment bottom case described in one embodiment of the invention；
Fig. 5 is the structural schematic diagram of equipment bottom case described in another embodiment of the present invention；
Fig. 6 be Fig. 4 in along the sectional view of A-A；
Fig. 7 is the structural schematic diagram of silicagel pad described in one embodiment of the invention；
Fig. 8 is the cross-sectional view in Fig. 7 along B-B；
Fig. 9 is the structural schematic diagram of silicagel pad described in another embodiment of the present invention.
Description of symbols:
| 100 | Device housings |
| 110 | Location hole |
| 120 | Groove |
| 200 | Silicagel pad |
| 210 | Positioning column |
| 220 | Without glue hole |
| a | First binding face |
| b | Second binding face |
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
It respectively refers to shown in Fig. 1-3, for the embodiment of the invention discloses a kind of Anti-bubble ridge structures, including equipment bottom case
100 are bonded on the first binding face a of the equipment bottom case 100 with silicagel pad 200, the silicagel pad 200；
Be machined at least two location holes 110 on first binding face a of the equipment bottom case 100, the silicagel pad 200 with
It is machined on second binding face b of the first binding face a contact of the equipment bottom case 100 and matches with the location hole 110
Positioning column 210, the correspondence of positioning column 210 are assemblied in the location hole 110, the location hole 110 and the positioning column
210 for positioning the installation site of the equipment bottom case 100 and the silicagel pad 200, and the location hole 110 and described fixed
Position column 210 cooperates and can limit the displacement of the silicagel pad 200；Second fitting of silicagel pad 200 described in the present embodiment
It is provided with double-sided adhesive on the b of face, when the positioning column 210 is assemblied in the location hole 110, the second patch of the silicagel pad 200
The double-sided adhesive of conjunction face b setting fits closely the first binding face a of itself and the equipment bottom case 100 together.In some implementations
In example, at least two location hole 110 is the different hole of size, and is matched with the positioning column 210, to rise
To the effect of fool proof；Therefore if it is location hole 110 He different including multiple sizes in remaining embodiment
Positioning column 210, which matches, plays foolproof function, is considered to be the simple change to the location hole 110 or the positioning column 210
Shape also belongs to the protection scope of the application.
Fluted 120 are also processed on first binding face a of the equipment bottom case 100, the second patch of the silicagel pad 200
No glue hole 220 is also machined on the b of conjunction face, the groove 120 and the no glue hole 220 are used to improve the equipment bottom case
100 with the combination of the silicagel pad 200, enhance the bonding journey between the equipment bottom case 100 and the silicagel pad 200
Degree, and reduce the protuberance rate between the equipment bottom case 100 and the silicagel pad 200.
The present embodiment on the first binding face a of the equipment bottom case 100 by processing groove 120 and in the silica gel
Second binding face b of pad 200 is processed without glue hole 220, improves contact conditions and the contact of equipment bottom case 100 and silicagel pad 200
Mode, so that the double faced adhesive tape for avoiding the second binding face b of the silicagel pad 200 from being arranged is the first of the equipment bottom case 100
Bubble is generated during binding face a, that is, enhances the bonding degree between the equipment bottom case 100 and the silicagel pad 200；And
And if part generates bubble in the later period use process of equipment bottom case 100 and silicagel pad 200, which can also be smooth
Into in the groove 120 or the no glue hole 220, avoiding bubble from expanding to equipment bottom case 100 and the contact surface of silicagel pad 200
Scattered chain reaction phenomenon, so as to avoid being spread because of bubble caused by silicagel pad 200 fall off.In addition, the equipment bottom case
By the way that groove 120 is arranged and optimizes contact area without glue hole 220 between 100 and silicagel pad 200, i.e., by the equipment bottom case
100, which become full coverage type by full coverage type void-free contact with the way of contact of silicagel pad 200, void contacts, avoids equipment
Discontinuity or temperature humidity variation cause to swell when surface in the later period use process of bottom case 100 and silicagel pad 200, that is, drop
Protuberance rate between the low equipment bottom case 100 and the silicagel pad 200.
In some embodiments, the groove 120 is processed into cross bath (as shown in Figure 4), and in the cross bath
The heart is overlapped with the center of the equipment bottom case 100, and the cross bath is for enhancing the equipment bottom case 100 and the silicagel pad
Bonding degree between 200, and the protuberance rate between the equipment bottom case 100 and the silicagel pad 200 is reduced, secondly, keeping away
It is led if having exempted from part in the later period use process of the equipment bottom case 100 and silicagel pad 200 and having generated bubble because of bubble diffusion
The silicagel pad 200 of cause falls off.Or increase has a matrix pattern slot (as shown in Figure 5) on the basis of groove 120, and
The center of the matrix pattern slot is overlapped with the center of the equipment bottom case 100, the function of the matrix pattern slot function and cross bath
Unanimously, it is not repeating in this application.In addition, those skilled in the art it is to be appreciated that the groove 120 also according to specific
Demand is processed into other shapes of slot, and this Shen all should belong to for realizing the groove 120 of effect in the application in any one
Protection scope please, therefore, if it is the Pocket Machining at other arbitrary shapes in remaining embodiment, it will be understood that
It is that the protection scope of the application is still fallen within to the simple deformation of the groove 120.Relative to the groove of remaining arbitrary shape,
The groove of the cross bath and the matrix pattern slot in process, manufacturing process is relatively simple, depanning speed more
Fastly.
In the present embodiment, as shown in connection with fig. 6, the groove width h1 of the groove 120 is 2mm, and groove depth h2 is 0.5mm, and institute
The depth h2 for stating groove 120 is less than the thickness d 1 of the equipment bottom case 100；Wherein, it is set described in the Edge Distance of the groove 120
The distance d2 of standby bottom case 100 is 6mm.When the equipment bottom case 100 generates bubble with the silicagel pad 200 in use
When, which can spread in the groove 120, avoid the bubble be diffused into the equipment bottom case 100 edge cause it is described
Silicagel pad 200 falls off.In some embodiments, the groove width and groove depth of the groove 120 can be processed into other sizes, not
It is defined in the groove width and groove depth of the present embodiment further groove.
In some embodiments, the diameter r1 in the no glue hole 220 referring to shown in Fig. 7 is 3mm, or the institute referring to shown in Fig. 9
The diameter r2 for stating no glue hole 220 is 4mm.The no glue hole 220 can by the equipment bottom case 100 and the silicagel pad 200 it
Between full coverage type void-free contact changed into void contacts, that is, change the way of contact of equipment bottom case 100 and silicagel pad 200,
To enhance the bonding degree between the equipment bottom case 100 and the silicagel pad 200, and reduce the equipment bottom case 100
With the protuberance rate between the silicagel pad 200, secondly, the later period for avoiding the equipment bottom case 100 and silicagel pad 200 used
If part generates silicagel pad 200 caused by bubble is spread because of bubble and falls off in journey.In addition, those skilled in the art answers
Work as understanding, the no glue hole 220 also according to specific demand be processed into other sizes without glue hole, and it is any for realizing
The protection scope that the application all should belong to without glue hole 220 of effect in the application, therefore, in remaining embodiment if
It is the no glue hole machined into other arbitrary dimensions, is considered to be the simple deformation to no glue hole 220, still falls within the application
Protection scope.
In the present embodiment, referring to shown in Fig. 7-8, the hole depth h3 in the no glue hole 220 is 0.3mm, and the no glue hole
220 depth is less than the thickness d 2 of the silicagel pad 200.When the equipment bottom case 100 and the silicagel pad 200 are in use process
When middle generation bubble, which be can spread in the no glue hole 220, and the bubble is avoided to be diffused into the equipment bottom case 100
Edge causes the silicagel pad 200 to fall off.
In some embodiments, the no glue hole 220 is equipped with multiple, and manufacturing process is simple and depanning speed is fast to make,
One of them described no glue hole 220 is arranged in the center of the silicagel pad 200, remaining described no glue hole 220 is with described
The center of silicagel pad 200 is that the center of circle is equally spaced the peripheral position of the silicagel pad 200.Specifically, the multiple no glue
Hole 220 is that the center of circle is equally spaced as two circle concentric circles without glue hole 220 be set to 200 center of silicagel pad.To make
It states no glue hole 220 to be evenly distributed in the silicagel pad 200 and beautiful, wherein the first lap that the no glue hole 220 forms is same
The heart round with the 200 center distance s1 of silicagel pad is 15mm, the second circle concentric circles that the no glue hole 220 forms and
The distance s2 for the first lap concentric circles that the no glue hole 220 forms is 15mm.In addition, the numerical value of s1, s2 are not limited to 15mm,
It can be arranged in the remaining embodiments according to the specific area of the silicagel pad 200, such as: s1=s2 > 15mm, s1=s2 <
15mm etc., in the present embodiment not to being defined.Those skilled in the art is it is to be appreciated that be based on above-mentioned multiple embodiments
And the application all should belong in the change for the unsubstantiality made according to the common knowledge and/or conventional techniques of this field
Protection scope.
The groove 120 and the gross area in the no glue hole 220 are respectively as follows: the groove 120 and are in the present embodiment
Gross area when cross bath is the 4.83% of 100 gross area of equipment bottom case, total when the groove 120 is matrix pattern slot
Area is the 9.32% of 100 gross area of equipment bottom case；The gross area in the no glue hole 220 that diameter is 3mm is the silicon
The 3.69% of 200 gross area of rubber mat, gross area when the no glue hole 220 that diameter is 4mm is the total face of the silicagel pad 200
Long-pending 6.06%, wherein include the area of the positioning column 210 in the gross area in the no glue hole 200.
In some embodiments, in order to can preferably avoid generate bubble or prevent bubble spread and avoid the occurrence of grand
It rises, area ratio shared by the groove 120 or the no glue hole 220 can be changed, and area shared by the groove 120
Than that can be changed according to the groove width etc. for changing groove, area ratio shared by the no glue hole 220 can be according to change without glue hole
Diameter etc. is changed, and is limited in the present embodiment and to area ratio shared by the groove 120 or the no glue hole 220
It is fixed.
Equipment bottom case described in the present embodiment 100 and the silicagel pad 200 in use, due to environment temperature and
The influence of humidity generates bubble and protuberance phenomenon occurs, therefore, in conjunction with the type of above-mentioned groove 120 and no glue hole 220, and will
It is divided into the reliability demonstration that four kinds of schemes carry out temperature and humidity experiment condition respectively, as follows:
Cross bath is processed in scheme one, equipment bottom case, the design of silica gel mat structure is constant；
Matrix pattern slot is processed in scheme two, equipment bottom case, the design of silica gel mat structure is constant；
Scheme three, equipment bottom case structure are constant, and it is 3mm without glue hole that diameter is processed in silicagel pad；
Scheme four, equipment bottom case structure are constant, and it is 4mm without glue hole that diameter is processed in silicagel pad；
Each scheme respectively makes nine samples, and the reliability for carrying out 74 hours temperature and humidity experiment conditions respectively is tested
Card, and the range of temperature and humidity is respectively -5 °~55 ° and -20 °~50 °；Observation device bottom case and silicon after the completion of test
The bond state of rubber mat, i.e., whether there is or not generating bubble and protuberance phenomenon occur between observation device bottom case and silicagel pad, experiment is surveyed
Test result is as follows:
| Experimental program | Sample number | It is qualified | It is unqualified | Qualification rate |
| Scheme one | 9 | 9 | 0 | 100% |
| Scheme two | 9 | 9 | 0 | 100% |
| Scheme three | 9 | 9 | 0 | 100% |
| Scheme four | 9 | 9 | 0 | 100% |
As can be known from the above table, four kinds of schemes in the embodiment of the present invention can effectively reduce bubble rate and protuberance phenomenon,
Especially when equipment bottom case needs large area full coverage type to paste silicagel pad, effect is more significant, and can greatly be promoted
The service life and service life of equipment bottom case and silicagel pad.
Compared with prior art, the embodiment of the present invention has the advantage that
1, it is processed respectively on the second binding face b by the first binding face a and silicagel pad 200 to equipment bottom case 100 recessed
Slot and without glue hole, and on the basis of not influencing function, reduce the usage amount of material and double-sided adhesive, to reduce production system
Cause this.
2, enhance the bonding degree between the equipment bottom case 100 and the silicagel pad 200, and reduce the equipment bottom
Protuberance rate between shell 100 and the silicagel pad 200, secondly, avoiding the later period of the equipment bottom case 100 and silicagel pad 200
If part generates silicagel pad 200 caused by bubble is spread because of bubble and falls off in use process.
3, by the reliability demonstration of temperature and humidity experiment condition, to engagement groove in the embodiment of the present invention and without glue
Four kinds of schemes in hole are tested, and test result shows that four kinds of schemes can effectively reduce bubble rate and protuberance phenomenon,
Especially when equipment bottom case needs large area full coverage type to paste silicagel pad, effect is more significant, and can greatly be promoted
The service life and service life of equipment bottom case and silicagel pad.
In an embodiment of the present invention, by the processing groove 120 on the equipment bottom case 100, and in the silica gel
Processing makes the way of contact of the equipment bottom case 100 with silicagel pad 200 by full coverage type tight without glue hole 220 on pad 200
Contact, which becomes full coverage type, void contacts, to enhance the bonding journey between the equipment bottom case 100 and the silicagel pad 200
Degree, and the protuberance rate between the equipment bottom case 100 and the silicagel pad 200 is reduced, secondly, avoiding the equipment bottom case
If 100 and silicagel pad 200 later period use process in part generate bubble because caused by bubble diffusion silicagel pad 200 it is de-
It falls.
In the present embodiment, those skilled in the art will be appreciated that the terms "include", "comprise" or its it is any its
He is intended to non-exclusive inclusion by variant, in addition to comprising those of listed element, but also may include being not explicitly listed
Other element；The nouns of locality such as related front, rear, top, and bottom are to be located in figure with structure in attached drawing and structure is mutual
Position define, only for the purpose of expressing the technical solution clearly and conveniently.It should be appreciated that the use of the noun of locality is not answered
Limit the claimed range of the application.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
Apply each technical characteristic in example it is all can with combination be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of Anti-bubble ridge structure, it is characterised in that: including equipment bottom case and silicagel pad, the silicagel pad is bonded in described
On first binding face of equipment bottom case；
It is machined at least two location holes on first binding face of the equipment bottom case, adds on the second binding face of the silicagel pad
Work has a positioning column to match with the location hole, and the positioning column correspondence is assemblied in the location hole, the location hole with
And the positioning column is used to position the installation site of the equipment bottom case and the silicagel pad；
It also processes fluted on first binding face of the equipment bottom case, is also machined with nothing on the second binding face of the silicagel pad
Glue hole, the groove and the no glue hole are used to improve the combination of the equipment bottom case and the silicagel pad, enhancing
Bonding degree between the equipment bottom case and the silicagel pad, and reduce between the equipment bottom case and the silicagel pad
Protuberance rate.
2. Anti-bubble ridge structure according to claim 1, it is characterised in that: the groove is cross bath.
3. Anti-bubble ridge structure according to claim 2, it is characterised in that: increasing on the groove has a matrix pattern
Slot, and the center of the matrix pattern slot is overlapped with the center of the equipment bottom case.
4. Anti-bubble ridge structure according to claim 3, it is characterised in that: the groove width of the groove is 2mm, and groove depth is
0.5mm, and the depth of the groove is less than the thickness of the equipment bottom case.
5. Anti-bubble ridge structure according to claim 1, it is characterised in that: the diameter in the no glue hole is 3mm.
6. Anti-bubble ridge structure according to claim 1, it is characterised in that: the diameter in the no glue hole is 4mm.
7. Anti-bubble ridge structure according to claim 1, it is characterised in that: the hole depth in the no glue hole is 0.3mm, and
The depth in the no glue hole is less than the thickness of the silicagel pad.
8. Anti-bubble ridge structure according to claim 7, it is characterised in that: the no glue hole be equipped with it is multiple, wherein one
The center of the silicagel pad is arranged in a no glue hole, remaining described no glue hole is with the center of the silicagel pad
The center of circle is equally spaced the peripheral position of the silicagel pad.
9. Anti-bubble ridge structure according to claim 8, it is characterised in that: the multiple no glue hole is to be set to the silicon
Rubber mat center is that the center of circle is equally spaced as two circle concentric circles without glue hole.
10. Anti-bubble ridge structure according to claim 9, it is characterised in that: the first lap of the no glue hole composition is same
Heart circle is 15mm at a distance from the silicagel pad center；
Second circle concentric circles of the no glue hole composition is 15mm at a distance from the first lap concentric circles of the no glue hole composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711254466.4A CN109869428A (en) | 2017-12-01 | 2017-12-01 | A kind of Anti-bubble ridge structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711254466.4A CN109869428A (en) | 2017-12-01 | 2017-12-01 | A kind of Anti-bubble ridge structure |
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| CN109869428A true CN109869428A (en) | 2019-06-11 |
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| CN201711254466.4A Pending CN109869428A (en) | 2017-12-01 | 2017-12-01 | A kind of Anti-bubble ridge structure |
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Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2524918Y (en) * | 2002-02-01 | 2002-12-11 | 北京市科海龙华工业自动化仪器有限公司 | Bubble-free film sticking plate |
| CN101269595A (en) * | 2008-05-04 | 2008-09-24 | 卢心东 | Apertured plastic film |
| TWM363338U (en) * | 2009-04-29 | 2009-08-21 | Pin-Yu Liao | Heat-melting glue film with gas exhausting structure |
| CN201907227U (en) * | 2010-10-25 | 2011-07-27 | 苏州佳值电子工业有限公司 | Silica gel protection film assembly |
| CN102729529A (en) * | 2012-06-28 | 2012-10-17 | 昆山市诚泰电气股份有限公司 | Anti-bubble protection film |
| CN202656523U (en) * | 2012-06-28 | 2013-01-09 | 昆山市诚泰电气股份有限公司 | Anti-bubble protective film |
| CN202990366U (en) * | 2013-01-09 | 2013-06-12 | 深圳市维业装饰集团股份有限公司 | Anti-deformation rubber plate |
| CN203004436U (en) * | 2012-12-13 | 2013-06-19 | 黄杨 | Protective film for mobile phone screen |
| JP2013218188A (en) * | 2012-04-11 | 2013-10-24 | Nec Casio Mobile Communications Ltd | Display panel protective film |
| CN203698721U (en) * | 2014-01-24 | 2014-07-09 | 京东方科技集团股份有限公司 | Flexible device carrier |
| CN204474578U (en) * | 2015-03-11 | 2015-07-15 | 上海浙港广告器材有限公司 | A kind of wide cut can move double faced adhesive tape |
| CN204547255U (en) * | 2015-04-03 | 2015-08-12 | 浙江翔宇纸塑制品有限公司 | Novel bubble-free pastes leaching membrane paper |
| CN204622699U (en) * | 2015-01-07 | 2015-09-09 | 西门子公司 | The surface texture that film resistant bubbles |
| CN204622610U (en) * | 2015-01-12 | 2015-09-09 | 山景雷特乐橡塑科技（苏州）有限公司 | The gluing cutting device of silica gel part and PET sheet |
| CN205667048U (en) * | 2016-06-06 | 2016-10-26 | 太仓市同维电子有限公司 | Gas -tight bubble produces wheat pulling -on piece |
| CN205841746U (en) * | 2016-07-29 | 2016-12-28 | 北京经纬恒润科技有限公司 | A kind of sealing structure and automobile controller |
| CN205929729U (en) * | 2016-08-10 | 2017-02-08 | 苏州明浩电子有限公司 | Gum laminating equipment |
| CN206109274U (en) * | 2016-07-15 | 2017-04-19 | 广东欧珀移动通信有限公司 | Ventilative type double -faced adhesive film |
| CN107116887A (en) * | 2017-04-28 | 2017-09-01 | 合肥联宝信息技术有限公司 | Method for producing shell |
| CN206624045U (en) * | 2017-04-13 | 2017-11-10 | 蓝思科技（长沙）有限公司 | A kind of film joint tool |
| CN206690631U (en) * | 2017-05-03 | 2017-12-01 | 东莞市智坤电子材料有限公司 | A kind of high temperature resistant silica gel diaphragm |
| CN207750421U (en) * | 2017-12-01 | 2018-08-21 | 广西三诺数字科技有限公司 | A kind of Anti-bubble ridge structure |
-
2017
- 2017-12-01 CN CN201711254466.4A patent/CN109869428A/en active Pending
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2524918Y (en) * | 2002-02-01 | 2002-12-11 | 北京市科海龙华工业自动化仪器有限公司 | Bubble-free film sticking plate |
| CN101269595A (en) * | 2008-05-04 | 2008-09-24 | 卢心东 | Apertured plastic film |
| TWM363338U (en) * | 2009-04-29 | 2009-08-21 | Pin-Yu Liao | Heat-melting glue film with gas exhausting structure |
| CN201907227U (en) * | 2010-10-25 | 2011-07-27 | 苏州佳值电子工业有限公司 | Silica gel protection film assembly |
| JP2013218188A (en) * | 2012-04-11 | 2013-10-24 | Nec Casio Mobile Communications Ltd | Display panel protective film |
| CN102729529A (en) * | 2012-06-28 | 2012-10-17 | 昆山市诚泰电气股份有限公司 | Anti-bubble protection film |
| CN202656523U (en) * | 2012-06-28 | 2013-01-09 | 昆山市诚泰电气股份有限公司 | Anti-bubble protective film |
| CN203004436U (en) * | 2012-12-13 | 2013-06-19 | 黄杨 | Protective film for mobile phone screen |
| CN202990366U (en) * | 2013-01-09 | 2013-06-12 | 深圳市维业装饰集团股份有限公司 | Anti-deformation rubber plate |
| CN203698721U (en) * | 2014-01-24 | 2014-07-09 | 京东方科技集团股份有限公司 | Flexible device carrier |
| CN204622699U (en) * | 2015-01-07 | 2015-09-09 | 西门子公司 | The surface texture that film resistant bubbles |
| CN204622610U (en) * | 2015-01-12 | 2015-09-09 | 山景雷特乐橡塑科技（苏州）有限公司 | The gluing cutting device of silica gel part and PET sheet |
| CN204474578U (en) * | 2015-03-11 | 2015-07-15 | 上海浙港广告器材有限公司 | A kind of wide cut can move double faced adhesive tape |
| CN204547255U (en) * | 2015-04-03 | 2015-08-12 | 浙江翔宇纸塑制品有限公司 | Novel bubble-free pastes leaching membrane paper |
| CN205667048U (en) * | 2016-06-06 | 2016-10-26 | 太仓市同维电子有限公司 | Gas -tight bubble produces wheat pulling -on piece |
| CN206109274U (en) * | 2016-07-15 | 2017-04-19 | 广东欧珀移动通信有限公司 | Ventilative type double -faced adhesive film |
| CN205841746U (en) * | 2016-07-29 | 2016-12-28 | 北京经纬恒润科技有限公司 | A kind of sealing structure and automobile controller |
| CN205929729U (en) * | 2016-08-10 | 2017-02-08 | 苏州明浩电子有限公司 | Gum laminating equipment |
| CN206624045U (en) * | 2017-04-13 | 2017-11-10 | 蓝思科技（长沙）有限公司 | A kind of film joint tool |
| CN107116887A (en) * | 2017-04-28 | 2017-09-01 | 合肥联宝信息技术有限公司 | Method for producing shell |
| CN206690631U (en) * | 2017-05-03 | 2017-12-01 | 东莞市智坤电子材料有限公司 | A kind of high temperature resistant silica gel diaphragm |
| CN207750421U (en) * | 2017-12-01 | 2018-08-21 | 广西三诺数字科技有限公司 | A kind of Anti-bubble ridge structure |
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