CN109866348A - A kind of silicon wafer located slices machine - Google Patents
A kind of silicon wafer located slices machine Download PDFInfo
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- CN109866348A CN109866348A CN201910269107.9A CN201910269107A CN109866348A CN 109866348 A CN109866348 A CN 109866348A CN 201910269107 A CN201910269107 A CN 201910269107A CN 109866348 A CN109866348 A CN 109866348A
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- fixedly connected
- driving motor
- silicon wafer
- cabinet
- side plate
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Abstract
The invention discloses a kind of silicon wafer located slices machines, it is related to silicon wafer manufacture field, including cabinet, the side of the cabinet is fixedly connected with side plate, the other side of cabinet is fixedly connected with the second driving motor, the top of second driving motor is equipped with initiative compression roller and driven rollers, second driving motor and initiative compression roller are sequentially connected, the top side of the side plate be fixed with driving mechanism with, the other end of side plate is fixedly connected with Rotational Cylindrical, Rotational Cylindrical is rotatablely connected rotating disc far from one end of side plate, rotating disc is fixedly connected with motor rack far from the side of Rotational Cylindrical, the first driving motor is fixedly connected on motor rack, driving wheel is fixedly connected on the output shaft of first driving motor, the present invention drives multiple cutting blades to carry out automatic cutting to silicon rod by the way that driving mechanism and the first driving motor are arranged on cabinet, the silicon wafer thickness being cut into unanimously is cut uniformly , high degree of automation can effectively reduce the workload of staff.
Description
Technical field
The present invention relates to silicon wafer manufacture field, specifically a kind of silicon wafer located slices machine.
Background technique
Bipolar transistor is made of two back-to-back PN junctions to obtain the crystal three of voltage, electric current or signal gain
Pole pipe.It is i.e. now so-called to develop into junction type triode the beginning of the fifties for point contact transistor originating from invention in 1948
Bipolar junction transistor.There are two types of basic structures for bipolar junction transistor: positive-negative-positive and NPN type.It is one layer intermediate in this 3 layers of semiconductors
Claim base area, two layers of outside claims emitter region and collecting zone respectively.When a small amount of electric current is injected in base area, between emitter region and collecting zone
It just will form biggish electric current, here it is the enlarge-effects of transistor.
The production of bipolar transistor needs silicon wafer, and silicon wafer needs are cut into one by one, and the thickness degree of silicon wafer is that have
Certain specification, if cutting is unevenly very troublesome to the detection of later period silicon wafer, the work of staff is caused certain
It influences, to aggravate the workload of staff, thereby reduces working efficiency.
Therefore silicon wafer can be sliced uniformly by needing to research and develop one kind, and be capable of the bipolar transistor production of labour-saving slice
With silicon wafer slicing device, to overcome, silicon wafer slice is uneven in the prior art and is sliced not laborsaving disadvantage.
In the Chinese invention patent file of Publication No. CN107622942A, a kind of bipolar transistor production silicon is disclosed
Piece slicing device can make blade constantly to silicon body dicing, to complete by setting pushing mechanism and cutting mechanism
Work to silicon body slice is provided with belt pulley and flat belt, does not need manually to push silicon body, so that silicon wafer cutting is more smart
Carefully, more uniform, and then improve work efficiency, it is provided with briquetting, silicon body can be pushed down in time, be prevented under the action of inertia
Silicon body is moved to the left again, is provided with placing box and strainer, be can be convenient and clean in time to the silicon wafer of well cutting, strainer can be to silicon wafer
Work as a buffer, be provided with stirring rod, the Wafer Cleaning on strainer it is more clean.But the device using blade come to silicon wafer
It is cut, cutting is more difficult, and the silicon wafer cut out is easily deformed, and the quality of silicon wafer is caused to reduce.
Summary of the invention
The purpose of the present invention is to provide a kind of silicon wafer located slices machines, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the invention provides the following technical scheme:
A kind of silicon wafer located slices machine, including cabinet, the side of the cabinet are fixedly connected with side plate, and the other side of cabinet is solid
Surely the second driving motor is connected, the top of the second driving motor is equipped with initiative compression roller and driven rollers, the second driving motor and master
Dynamic pressure roller transmission connection, the top side of the side plate are fixed with driving mechanism, and the other end of side plate is fixedly connected with Rotational Cylindrical,
Rotational Cylindrical is rotatablely connected rotating disc far from one end of side plate, and rotating disc is fixedly connected with motor rack, motor far from the side of Rotational Cylindrical
It is fixedly connected with the first driving motor on frame, driving wheel is fixedly connected on the output shaft of the first driving motor, is consolidated on the rotating disc
Surely multiple first rotating bars are connected, driven wheel, driving wheel and driven wheel are fixedly connected in the first rotating bar by belt and is driven company
It connects, cutting blade is fixedly connected in first rotating bar, the top of the cabinet is equipped with fixing seat, and the side of fixing seat is equipped with
Grooving, the side in grooving are equipped with end block.
As a further solution of the present invention: the driving mechanism includes device housings, and is fixedly connected in device housings
Three driving motors, the output shaft of third driving motor are fixedly connected with pinion gear, run through in the Rotational Cylindrical and be fixedly connected with second
Rotating bar, one end of second rotating bar are placed in device housings and are fixedly connected with gear wheel, the gear wheel and pinion gear
Engagement connection.
As a further solution of the present invention: offering putting hole in the fixing seat, be placed with silicon rod in putting hole.
As a further solution of the present invention: the side of the end block offers limiting slot.
As a further solution of the present invention: being offered on the initiative compression roller and driven rollers corresponding with silicon rod
Indent.
As a further solution of the present invention: the cabinet inside is equipped with storage bin, and storage bin is connected with grooving.
As a further solution of the present invention: the rotating disc is equipped with multiple first rotating bars, multiple first rotating bars
The equal distance annular setting on rotating disc.
Compared with prior art, the beneficial effects of the present invention are: the present invention on cabinet by being arranged driving mechanism and the
One driving motor drives multiple cutting blades to carry out automatic cutting to silicon rod, and the silicon wafer thickness being cut into unanimously cuts uniformly, oneself
Dynamicization degree is high, can effectively reduce the workload of staff.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of silicon wafer located slices machine.
Fig. 2 is the structural schematic diagram of driving mechanism in silicon wafer located slices machine.
Fig. 3 is the structural schematic diagram in silicon wafer located slices machine in cabinet.
Fig. 4 is the structural schematic diagram of end block in silicon wafer located slices machine.
In figure: 1- cabinet, 2- side plate, 3- driving mechanism, 4- Rotational Cylindrical, 5- rotating disc, 6- motor rack, 7- first drive electricity
Machine, 8- driving wheel, the first rotating bar of 9-, 10- driven wheel, 11- cutting blade, the second driving motor of 12-, 13- initiative compression roller,
14- driven rollers, 15- device housings, the second rotating bar of 16-, 17- gear wheel, 18- third driving motor, 19- pinion gear, 20-
Fixing seat, 21- storage bin, 22- grooving, 23- end block, 24- limiting slot.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It should be noted that term " center ", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outside" etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore be not considered as limiting the invention.In addition, term " first ", " second ", " third " are only used for description mesh
, it is not understood to indicate or imply relatively importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Embodiment 1
Fig. 1-4, a kind of silicon wafer located slices machine, including cabinet 1 are please referred to, the side of the cabinet 1 is fixedly connected with side plate
2, the other side of cabinet 1 is fixedly connected with the second driving motor 12, the top of the second driving motor 12 be equipped with initiative compression roller 13 and from
Dynamic pressure roller 14, the second driving motor 12 are sequentially connected with initiative compression roller 13, and the top side of the side plate 2 is fixed with driving machine
Structure 3, the other end of side plate 2 are fixedly connected with Rotational Cylindrical 4, and Rotational Cylindrical 4 is rotatablely connected rotating disc 5, rotating disc far from one end of side plate 2
5 sides far from Rotational Cylindrical 4 are fixedly connected with motor rack 6, and the first driving motor 7, the first driving motor are fixedly connected on motor rack 6
It is fixedly connected with driving wheel 8 on 7 output shaft, is fixedly connected with multiple first rotating bars 9 on the rotating disc 5, in the first rotating bar 9
It is fixedly connected with driven wheel 10, driving wheel 8 and driven wheel 10 to be sequentially connected by belt, be fixedly connected in first rotating bar 9
Cutting blade 11, the top of the cabinet 1 are equipped with fixing seat 20, and the side of fixing seat 20 is equipped with grooving 22, and one in grooving 22
Side is equipped with end block 23.
The driving mechanism 3 includes device housings 15, and third driving motor 18 is fixedly connected in device housings 15, and third is driven
The output shaft of dynamic motor 18 is fixedly connected with pinion gear 19, runs through and be fixedly connected the second rotating bar 16 in the Rotational Cylindrical 4, described
One end of second rotating bar 16 is placed in device housings 15 and is fixedly connected with gear wheel 17, and the gear wheel 17 is nibbled with pinion gear 19
Close connection.
Putting hole is offered in the fixing seat 20, silicon rod is placed in putting hole, and the side of the end block 23 offers
Limiting slot 24 offers indent corresponding with silicon rod on the initiative compression roller 13 and driven rollers 14.
Embodiment 2
Fig. 1-4 is please referred to, other contents of the present embodiment are same as Example 1, the difference is that: in the cabinet 1
Portion is equipped with storage bin 21, and storage bin 21 is connected with grooving 22, and the rotating disc 5 is equipped with multiple first rotating bars 9, Duo Ge
The equal distance annular setting on rotating disc 5 of one rotating bar 9.
Silicon rod will be first mounted in fixing seat 20 by the present invention in implementation process, then start the first driving motor 7,
Second driving motor 12 and third driving motor 18, the second driving motor 12 drive initiative compression roller 13 to rotate before making silicon rod
Into the first driving motor 7 drives cutting blade 11 to rotate, and third driving motor 18 drives Rotational Cylindrical 4 to rotate, to make multiple cut
Cutting blade 11 cuts silicon rod with certain frequency.
The present invention drives multiple cutting blades 11 right by the way that driving mechanism 3 and the first driving motor 7 are arranged on cabinet 1
Silicon rod carries out automatic cutting, and the silicon wafer thickness being cut into unanimously is cut uniformly, and high degree of automation can effectively reduce work people
The workload of member.
Claims (7)
1. the side of a kind of silicon wafer located slices machine, including cabinet (1), the cabinet (1) is fixedly connected side plate (2), cabinet (1)
The other side be fixedly connected the second driving motor (12), the top of the second driving motor (12) is equipped with initiative compression roller (13) and driven
Pressure roller (14), the second driving motor (12) and initiative compression roller (13) are sequentially connected, which is characterized in that the top of the side plate (2)
Side is fixed with driving mechanism (3), and the other end of side plate (2) is fixedly connected Rotational Cylindrical (4), and Rotational Cylindrical (4) is far from side plate (2)
One end be rotatablely connected rotating disc (5), rotating disc (5) is fixedly connected with motor rack (6), motor rack far from the side of Rotational Cylindrical (4)
(6) it is fixedly connected the first driving motor (7), is fixedly connected on the output shaft of the first driving motor (7) driving wheel (8) on, it is described
It is fixedly connected with multiple first rotating bars (9) on rotating disc (5), is fixedly connected with driven wheel (10), driving wheel in the first rotating bar (9)
(8) it is sequentially connected with driven wheel (10) by belt, is fixedly connected cutting blade (11) on first rotating bar (9), it is described
The top of cabinet (1) is equipped with fixing seat (20), and the side of fixing seat (20) is equipped with grooving (22), and the side in grooving (22) is equipped with
End block (23).
2. silicon wafer located slices machine according to claim 1, which is characterized in that the driving mechanism (3) includes outside equipment
Shell (15), device housings (15) are interior to be fixedly connected third driving motor (18), and the output shaft of third driving motor (18) is fixed to be connected
It connects pinion gear (19), runs through and be fixedly connected the second rotating bar (16) on the Rotational Cylindrical (4), second rotating bar (16)
One end is placed in device housings (15) and is fixedly connected gear wheel (17), the gear wheel (17) and pinion gear (19) company of engagement
It connects.
3. silicon wafer located slices machine according to claim 1, which is characterized in that offer placement on the fixing seat (20)
Hole is placed with silicon rod in putting hole.
4. silicon wafer located slices machine according to claim 1, which is characterized in that the side of the end block (23) opens up limited
Position slot (24).
5. silicon wafer located slices machine according to claim 3, which is characterized in that the initiative compression roller (13) and driven rollers
(14) indent corresponding with silicon rod is offered on.
6. silicon wafer located slices machine according to claim 4 or 5, which is characterized in that be equipped with storage inside the cabinet (1)
Case (21), storage bin (21) are connected with grooving (22).
7. silicon wafer located slices machine according to claim 1, which is characterized in that the rotating disc (5) is equipped with multiple the
One rotating bar (9), multiple first rotating bars (9) are in the first-class distance annular setting of rotating disc (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910269107.9A CN109866348A (en) | 2019-04-04 | 2019-04-04 | A kind of silicon wafer located slices machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910269107.9A CN109866348A (en) | 2019-04-04 | 2019-04-04 | A kind of silicon wafer located slices machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109866348A true CN109866348A (en) | 2019-06-11 |
Family
ID=66922115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910269107.9A Pending CN109866348A (en) | 2019-04-04 | 2019-04-04 | A kind of silicon wafer located slices machine |
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| Country | Link |
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| CN (1) | CN109866348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113263637A (en) * | 2020-09-29 | 2021-08-17 | 连云港睿晶石英材料有限公司 | Cutting device for quartz bar processing and using method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04141396A (en) * | 1990-09-28 | 1992-05-14 | Disco Abrasive Syst Ltd | Cutting method and cutting device |
| DE4217228C1 (en) * | 1992-05-20 | 1993-11-04 | Steinbearbeitungs Maschinenfab | Sepg. machine for natural stone - has number of circular sawing tools arranged rotatably on bearer arms of a rotary support |
| CN104441277A (en) * | 2013-09-12 | 2015-03-25 | 赵立平 | Multi-knife cutting machine |
| CN105729641A (en) * | 2014-12-10 | 2016-07-06 | 陕西子竹电子有限公司 | Cutting device of optical part cutting machine |
| CN106696102A (en) * | 2016-12-05 | 2017-05-24 | 无锡明珠增压器制造有限公司 | Precisely controlled silicon wafer slicing device |
-
2019
- 2019-04-04 CN CN201910269107.9A patent/CN109866348A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04141396A (en) * | 1990-09-28 | 1992-05-14 | Disco Abrasive Syst Ltd | Cutting method and cutting device |
| DE4217228C1 (en) * | 1992-05-20 | 1993-11-04 | Steinbearbeitungs Maschinenfab | Sepg. machine for natural stone - has number of circular sawing tools arranged rotatably on bearer arms of a rotary support |
| CN104441277A (en) * | 2013-09-12 | 2015-03-25 | 赵立平 | Multi-knife cutting machine |
| CN105729641A (en) * | 2014-12-10 | 2016-07-06 | 陕西子竹电子有限公司 | Cutting device of optical part cutting machine |
| CN106696102A (en) * | 2016-12-05 | 2017-05-24 | 无锡明珠增压器制造有限公司 | Precisely controlled silicon wafer slicing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113263637A (en) * | 2020-09-29 | 2021-08-17 | 连云港睿晶石英材料有限公司 | Cutting device for quartz bar processing and using method thereof |
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Application publication date: 20190611 |