CN109862688B - Wearable device - Google Patents
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- CN109862688B CN109862688B CN201811646096.3A CN201811646096A CN109862688B CN 109862688 B CN109862688 B CN 109862688B CN 201811646096 A CN201811646096 A CN 201811646096A CN 109862688 B CN109862688 B CN 109862688B
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- crystal oscillator
- printed circuit
- circuit board
- wearable device
- mounting area
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Abstract
The application provides a wearable device, comprising a printed circuit board and a temperature compensation type crystal oscillator; the printed circuit board comprises a crystal oscillator mounting area and a first printed circuit partially positioned in the crystal oscillator mounting area; the orthographic projection of the crystal oscillator on the printed circuit board is positioned in the crystal oscillator mounting area; the pins of the crystal oscillator are in electrical communication with the first printed circuit within the crystal oscillator mounting area; the body of the crystal oscillator and the printed circuit board are arranged in a separated mode; the printed circuit board further includes a second printed circuit for electrically connecting other electrical components, and the second printed circuit passes through the crystal mounting region. So set up, can simplify the design degree of difficulty of wearable equipment electrical component part printed circuit.
Description
Technical Field
The application relates to the technical field of electronic products, in particular to a wearable device.
Background
Most wearable equipment has the characteristics of small size of a printed circuit board and high integration level of parts. Because the printed circuit board is small in size, the processing chip and the crystal oscillator are arranged in the wearable device at a small distance.
In order to ensure the stability of the frequency reference of the crystal oscillator and avoid the frequency change of the crystal oscillator exceeding the predetermined requirement caused by the rapid conduction of heat, the problem of the layout of the printed circuit in the printed circuit board needs to be considered. The existing method for reducing the heat from being quickly conducted to the crystal oscillator is as follows: the crystal oscillator mounting area of the printed circuit board for mounting the crystal oscillator is only provided with a first printed circuit connected with the crystal oscillator pins, and no other printed circuit is arranged. In the case of a printed circuit board with limited size and space, the foregoing method further increases the complexity of the design of the printed circuit board and the difficulty of the arrangement of other electronic components.
Disclosure of Invention
The present application provides a wearable device that utilizes a new structural design to overcome the problems mentioned in the background.
The application provides a wearable device, comprising a printed circuit board and a temperature compensation type crystal oscillator;
the printed circuit board comprises a crystal oscillator mounting area and a first printed circuit partially positioned in the crystal oscillator mounting area;
the orthographic projection of the crystal oscillator on the printed circuit board is positioned in the crystal oscillator mounting area;
the pin of the crystal oscillator is electrically communicated with one end of the first printed circuit in the crystal oscillator mounting area; the body of the crystal oscillator and the printed circuit board are arranged in a separated mode;
the printed circuit board further includes a second printed circuit for making electrical connection of other electrical components, and the second printed circuit passes through the crystal mounting region.
Optionally, the wearable device comprises a solid thermal insulation piece fixed at the crystal mounting region;
the body of crystal oscillator with the printed circuit board separates the setting, specifically is:
the body of the crystal oscillator is fixed on a solid heat insulation piece, and the crystal oscillator is separated from the printed circuit board through the solid heat insulation piece.
Optionally, a relay printed circuit is disposed in the solid heat insulation member;
the pin of crystal oscillator with first printed circuit is located the one end electricity intercommunication in the crystal oscillator installing zone specifically is:
the crystal oscillator is attached to the solid heat insulation piece, and a pin of the crystal oscillator is electrically communicated with one end, located in the crystal oscillator installation area, of the first printed circuit through the relay printed circuit.
Optionally, the printed circuit board is a multilayer printed circuit board;
the printed circuit board is provided with the second printed circuit on each layer of the crystal oscillator mounting area;
the thickness of the solid heat insulation piece is H, the heat conductivity coefficient is K, and the K and the H enable the heat change delta Q of the crystal oscillator in unit time to be smaller than the maximum heat change delta Q of the crystal oscillator for maintaining stable work.
Optionally, the crystal oscillator includes a heat conduction layer disposed outside the body and configured to accelerate rapid heat transfer at various locations of the body.
Optionally, an orthographic projection area of the solid heat insulation piece in the crystal oscillator mounting area is smaller than an area of the crystal oscillator mounting area and/or smaller than an orthographic projection area of the crystal oscillator in the crystal oscillator mounting area.
Optionally, the wearable device is a smart watch or a smart bracelet.
Optionally, the printed circuit board is a multilayer circuit board;
the printed circuit board is positioned in the crystal oscillator mounting area, and the second printed circuit is not arranged close to the continuous N layers of the solid heat insulation piece;
the continuous N layers and the solid heat insulation piece enable the heat change delta Q of the crystal oscillator in unit time to be smaller than the maximum heat change delta Q of the crystal oscillator for maintaining stable operation.
Optionally, the crystal oscillator includes a heat conduction layer disposed outside the body and configured to accelerate rapid heat transfer at various locations of the body.
Optionally, the pins of the crystal oscillator extend out of the body;
the body of crystal oscillator with the printed circuit board separates the setting, specifically is:
the body is spaced from the printed circuit board by the pin support.
In the wearable device provided by the application, except that the pin of the crystal oscillator is electrically connected with the first printed circuit in the printed circuit board, the body of the crystal oscillator is arranged at a distance from the printed circuit board, so that the heat transfer rate between the crystal oscillators of the printed circuit board is reduced due to the limitation of the separation space.
Because the heat conduction rate is slowed down, when the heat conducted to the crystal oscillator is conducted to the crystal oscillator everywhere, the temperature of the crystal oscillator is not increased too fast, the problem that the temperature difference between a crystal oscillation source and a compensation circuit in the crystal oscillator is large is avoided as much as possible, and the problem that the output frequency is changed too much due to mismatching of the crystal oscillation source and the compensation circuit caused by the increase of the temperature difference is avoided.
The problem is solved, and the second printed circuit connected with other electrical components can be arranged in the crystal oscillator mounting area, so that the design difficulty of the printed circuit of the wearable device is reduced.
Drawings
Fig. 1 is a top view of a portion of a component in a wearable device provided by an embodiment;
3 FIG. 3 2 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 A 3- 3 A 3 of 3 FIG. 31 3; 3
Wherein: 11-printed circuit board, 111-first printed circuit, 112-second printed circuit, 12-crystal oscillator, 13-solid insulation, 131-relay printed circuit, 14-first chip, 15-second chip.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
3 fig. 31 3 is 3 a 3 top 3 view 3 of 3 a 3 part 3 of 3 a 3 component 3 in 3 a 3 wearable 3 device 3 provided 3 in 3 an 3 embodiment 3, 3 and 3 fig. 3 2 3 is 3 a 3 schematic 3 sectional 3 view 3 a 3- 3 a 3 in 3 fig. 31 3. 3 As shown in fig. 1 and 2, a wearable device provided by an embodiment of the present application includes a printed circuit board 11, a crystal oscillator 12, and other electrical components; other electronic components include the first chip 14 and the second chip 15 for illustration, but of course, other electronic components may be components such as capacitors, inductors, display devices, etc.
The aforementioned crystal oscillator 12, first chip 14 and second chip 15 are mounted on the printed circuit board 11, the first chip 14 and the crystal oscillator 12 are electrically connected by a first printed circuit 111, and the first chip 14 and the second chip 15 are connected by a second printed circuit 112.
It should be noted that, in order to facilitate displaying the overlapping relationship of the components and the routing of the printed circuits, the shielded portions of the first printed circuit 111 and the second printed circuit 112 are embodied in the form of broken lines, so as to facilitate understanding of the technical solution of the present embodiment.
In the embodiment of the present application, the crystal Oscillator 12 is a Temperature compensated crystal Oscillator (TCXO) having a Temperature compensation circuit therein; when the ambient temperature around the crystal oscillator changes more stably, the temperature compensation circuit of the crystal oscillator 12 can have the same temperature as the crystal oscillator source therein, and the voltage for driving the crystal oscillator source can be adjusted according to the temperature change, so that the output frequency of the crystal oscillator 12 is within a stable range.
Referring to fig. 1 and fig. 2, in the wearable device provided in the embodiment of the present application, the printed circuit board 11 includes a crystal mounting region and other regions, wherein the orthographic projection of the crystal oscillator 12 is located in the crystal mounting region, that is, the crystal oscillator 12 is mounted in the crystal mounting region.
However, unlike the prior art, the crystal oscillator 12 is not directly mounted on the printed circuit board 11, but is mounted on a solid heat insulator 13 fixedly connected to the printed circuit board 11, and is spaced apart from the printed circuit board 11 by the solid heat insulator 13.
With continued reference to fig. 1 and 2, in the embodiment of the present application, the second printed circuit 112 for connecting the first chip 14 and the second chip 15 passes through the crystal mounting region. Compared with the prior art, the second printed circuit 112 for connecting the first chip 14 and the second chip 15 provided in the embodiment of the present application does not bypass the crystal mounting region on the printed circuit board 11, but directly passes through the crystal mounting region.
The reason why the foregoing structure can be achieved by the embodiment of the present application is explained below by a heat conduction process.
Taking as an example that the other electrical components (such as the first chip 14 and the second chip 15) in the printed circuit board 11 work to generate heat, and the heat is conducted to the crystal oscillator 12 through the other electrical components and the printed circuit board 11, so as to raise the temperature of the crystal oscillator 12: after the heat generated by other electrical components is transferred to the printed circuit board 11 through the corresponding pins, the heat is quickly dispersed mainly through the printed circuit because the printed circuit in the printed circuit board 11 is a metal circuit and the heat conduction performance of the metal circuit is higher than that of the substrate of the printed circuit board 11; after the heat is transferred to the crystal oscillator mounting area through the first printed circuit 111 and the second printed circuit 112, the heat needs to be transferred to the crystal oscillator 12 through the solid heat insulator 13.
In the embodiment of the present invention, the solid thermal insulation member 13 is a poor thermal conductor, which has the characteristic of slow heat conduction rate, so that the rate of heat conduction to the crystal oscillator 12 through the crystal oscillator mounting region and the solid thermal insulation member 13 is slow. Because the heat conduction rate is slow, when the heat conducted to the crystal oscillator 12 through the solid heat insulation member 13 is conducted to all places of the crystal oscillator 12, the temperature of the local area of the crystal oscillator 12 does not rise too fast, and the problem that the temperature difference between the crystal oscillator source and the compensation circuit in the crystal oscillator 12 is large is avoided, so that the problem that the output frequency is changed too much due to mismatching of the crystal oscillator source and the compensation circuit caused by the increase of the temperature difference is avoided.
That is, the wearable device in the embodiment of the present application slows down the heat conduction by using the solid heat insulator 13, and ensures the operation stability of the crystal oscillator 12.
Since the solid heat insulating member 13 is provided as a member for reducing heat conduction, a corresponding region for reducing heat conduction may not be provided on the board body of the printed circuit board 11, that is, a region for reducing heat conduction may not be provided in the crystal oscillator mounting region; in this manner, the second printed circuit 112 to which other electrical components are connected can be provided in the crystal mounting region.
It should be noted that in order to realize the connection of the crystal oscillator 12 and the corresponding electrical components in the printed circuit board 11, a clock frequency signal is output, and the aforementioned first printed circuit 111 directly connected to the crystal oscillator 12 must be provided.
The second printed circuit 112 is arranged in the crystal oscillator mounting area, so that the limited space on the board in the wearable device can be fully utilized, the printed circuit and other electrical components can be optimally arranged in the limited space, and the design difficulty of the printed circuit of the wearable device is further reduced.
With continued reference to fig. 1 and fig. 2, the crystal oscillator 12 provided in the embodiment of the present application is a chip-type crystal oscillator, that is, the pins of the crystal oscillator 12 are directly disposed on the body, and the crystal oscillator 12 is fixed on the solid heat insulation member 13 in a mounting manner. In order to electrically connect the crystal oscillator 12 and the first printed circuit 111, in the embodiment of the present application, the relay printed circuit 131 is provided on the solid heat insulator 13 to connect the crystal oscillator 12 and the first printed circuit 111 by using the relay printed circuit 131.
In another embodiment, a conductive member having the function of the relay printed circuit 131 and capable of connecting the crystal oscillator 12 and the first printed circuit 111 may be provided outside the solid heat insulator 13; for example, corresponding wires may be provided outside the solid thermal shield 13 to connect the pins of the crystal oscillator 12 and the first printed circuit 111.
In other embodiments, the wearable device may also be a crystal oscillator with pins protruding from the body, so as to directly connect the pins of the crystal oscillator 12 to the first printed circuit 111 and fix the body of the crystal oscillator 12 on the solid thermal insulation member 13.
In the embodiment of the present application, the printed circuit board 11 may be a multilayer printed circuit board 11. I.e. the layers of the printed circuit board 11 may be provided with printed circuits in practice.
In practical applications, the thickness H of the solid thermal insulator 13 may be set according to the number of the second printed circuits 112 to be used, the characteristics (e.g., the thermal conductivity K) of the solid thermal insulator 13 itself, and the thickness requirement of the wearable device.
For example, in the case where the number of second printed circuits 112 is large and it is necessary to provide them at each layer of the printed circuit board 11, the thickness H and the thermal conductivity K of the solid heat insulator 13 should be such that the amount of change Δ Q of heat per unit time of the crystal oscillator 12 is smaller than the minimum amount of change Δ Q of heat per unit time of the crystal oscillator 12 in stable operation. Of course, this also applies to the case where at least one second printed circuit 112 is disposed on the printed circuit board 11 in a layer adjacent to the solid thermal insulation member 13.
For another example, in the case where the number of the second printed circuits 112 is small, the second printed circuits 112 passing through the crystal mounting region are each disposed at a position away from the solid heat insulator 13; in this case, if the second printed circuit 112 is not provided in the continuous N layers of the printed circuit board 11 adjacent to the solid heat insulator 13, the thickness H and the thermal conductivity K of the solid heat insulator 13 can be adjusted so that the heat insulating region formed by the heat insulator and the continuous N layers satisfies a condition that the heat change Δ Q per unit time of the crystal oscillator 12 is smaller than the minimum heat change Δ Q at which the crystal oscillator 12 maintains stable operation.
In the present embodiment, in order to reduce the production cost, the solid heat insulation member 13 is made of the substrate of the printed circuit board 11; in actual product design, the thickness of the solid heat insulating member 13 to be used can be quickly determined based on historical experience. In other embodiments, for example, in the case that the thickness of the wearable device needs to be considered and the increase of the thickness of the wearable device needs to be avoided, the solid heat insulation member 13 can be made of a material with a lower thermal conductivity, and the thickness of the solid heat insulation member 13 can be reduced.
Referring to fig. 2, in the embodiment of the present application, the forward projection area of the solid heat shield 13 on the printed circuit board 11 in the crystal mounting area is the same as the forward projection area of the crystal oscillator 12 on the printed circuit board 11; i.e., the solid heat shield 13 has a cross-sectional dimension smaller than that of the crystal oscillator 12. In some embodiments, the orthographic area of the solid thermal shield 13 in the crystal mounting area of the printed circuit board 11 may also be smaller than the orthographic area of the crystal oscillator 12 on the printed circuit board 11, or smaller than the area of the crystal mounting area on the printed circuit board 11.
In the embodiment of the present application, the crystal oscillator 12 may be configured accordingly to increase the uniformity of heat throughout the crystal oscillator. Specifically, the crystal oscillator 12 may include a heat conducting layer disposed outside the body thereof, and the heat conducting layer may rapidly conduct heat from a high temperature region to a low temperature region, so that the temperature of the crystal oscillator 12 is rapidly uniform.
While the wearable device shown in fig. 1 and 2 has been described above, in other embodiments of the present application, the crystal oscillator may also be a crystal oscillator with pins protruding from the body, the pins of the crystal oscillator are soldered to the first printed circuit and support the body to be spaced apart from the printed circuit board 11; i.e. the aforementioned solid insulation 13 is provided as a hollow insulation layer.
The wearable device is specifically products such as intelligent wrist-watch, intelligent bracelet, intelligent glasses to the application does not do special restriction.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the invention. For example, the above features may be interchanged with other features disclosed in this application, but not limited to those having similar functions.
Claims (10)
1. A wearable device includes a printed circuit board and a temperature compensated crystal oscillator;
the printed circuit board comprises a crystal oscillator mounting area and a first printed circuit partially positioned in the crystal oscillator mounting area;
the orthographic projection of the crystal oscillator on the printed circuit board is positioned in the crystal oscillator mounting area;
the pin of the crystal oscillator is electrically communicated with one end of the first printed circuit in the crystal oscillator mounting area; the method is characterized in that:
the body of the crystal oscillator and the printed circuit board are arranged in a separated mode;
the printed circuit board further includes a second printed circuit for making electrical connection of other electrical components, and the second printed circuit passes through the crystal mounting region.
2. The wearable device of claim 1, wherein:
the solid heat insulation piece is fixed at the crystal oscillator installation area;
the body of crystal oscillator with the printed circuit board separates the setting, specifically is:
the body of the crystal oscillator is fixed on a solid heat insulation piece, and the crystal oscillator is separated from the printed circuit board through the solid heat insulation piece.
3. The wearable device of claim 2, wherein:
a relay printed circuit is arranged in the solid heat insulation piece;
the pin of crystal oscillator with first printed circuit is located the one end electricity intercommunication in the crystal oscillator installing zone specifically is:
the crystal oscillator is attached to the solid heat insulation piece, and a pin of the crystal oscillator is electrically communicated with one end, located in the crystal oscillator installation area, of the first printed circuit through the relay printed circuit.
4. A wearable device according to any of claims 2-3, characterized in that:
the printed circuit board is a multilayer printed circuit board;
the printed circuit board is provided with the second printed circuit on each layer of the crystal oscillator mounting area;
the thickness of the solid heat insulation piece is H, the heat conductivity coefficient is K, and the K and the H enable the heat change delta Q of the crystal oscillator in unit time to be smaller than the minimum heat change delta Q of the crystal oscillator for maintaining stable work.
5. The wearable device of claim 4, wherein:
the crystal oscillator comprises a heat conduction layer which is arranged on the outer side of the body and used for accelerating the rapid heat transmission at each position of the body.
6. The wearable device of claim 4, wherein:
the orthographic projection area of the solid heat insulation piece in the crystal oscillator mounting area is smaller than the area of the crystal oscillator mounting area and/or smaller than the orthographic projection area of the crystal oscillator in the crystal oscillator mounting area.
7. The wearable device of claim 4, wherein:
the wearable equipment is a smart watch or a smart bracelet.
8. A wearable device according to any of claims 2-3, characterized in that:
the printed circuit board is a multilayer circuit board;
the printed circuit board is positioned in the crystal oscillator mounting area, and the second printed circuit is not arranged close to the continuous N layers of the solid heat insulation piece;
the continuous N layers and the solid heat insulation piece enable the heat change delta Q of the crystal oscillator in unit time to be smaller than the minimum heat change delta Q of the crystal oscillator for maintaining stable operation.
9. The wearable device of claim 8, wherein:
the crystal oscillator comprises a heat conduction layer which is arranged on the outer side of the body and used for accelerating the rapid heat transmission at each position of the body.
10. The wearable device of claim 1, wherein:
the pins of the crystal oscillator extend out of the body;
the body of crystal oscillator with the printed circuit board separates the setting, specifically is:
the body is spaced from the printed circuit board by the pin support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811646096.3A CN109862688B (en) | 2018-12-29 | 2018-12-29 | Wearable device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811646096.3A CN109862688B (en) | 2018-12-29 | 2018-12-29 | Wearable device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109862688A CN109862688A (en) | 2019-06-07 |
| CN109862688B true CN109862688B (en) | 2020-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811646096.3A Active CN109862688B (en) | 2018-12-29 | 2018-12-29 | Wearable device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109862688B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202385383U (en) * | 2011-11-16 | 2012-08-15 | 华为终端有限公司 | Printed circuit board |
| CN105578761A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and mobile terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69316692T2 (en) * | 1992-10-02 | 1998-08-27 | Hitachi Ltd | Inverters for electrical equipment |
| KR101095100B1 (en) * | 2010-06-14 | 2011-12-16 | 삼성전기주식회사 | Heat-radiating substrate and manufacturing method thereof |
-
2018
- 2018-12-29 CN CN201811646096.3A patent/CN109862688B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202385383U (en) * | 2011-11-16 | 2012-08-15 | 华为终端有限公司 | Printed circuit board |
| CN105578761A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Rigid-flex board and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109862688A (en) | 2019-06-07 |
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